CN202857147U - Structure of PCB (printed circuit board) - Google Patents
Structure of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN202857147U CN202857147U CN 201220548433 CN201220548433U CN202857147U CN 202857147 U CN202857147 U CN 202857147U CN 201220548433 CN201220548433 CN 201220548433 CN 201220548433 U CN201220548433 U CN 201220548433U CN 202857147 U CN202857147 U CN 202857147U
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- China
- Prior art keywords
- pcb
- passive device
- circuit
- pcb substrate
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a structure of a PCB (printed circuit board), which comprises a PCB substrate and a passive device, wherein the passive device is embedded in the PCB substrate. The PCB welds and integrates the passive device to a PCB inner layer from the surface of the PCB, and the embedded passive device is protected by the PCB, thereby being free from impacts of external factors, and improving the working stability of components.
Description
Technical field
The utility model relates to a kind of PCB board structure of circuit, is applicable to that various form overcurrent protective devices, temperature monitor, temperature control open the light, automatic temperature-controlled locking device etc.
Background technology
21 century, the mankind entered advanced information society, and PCB is an indispensable mainstay in information industry.Simultaneously, electronic equipment requires high performance, high speed and compactization, and as multidisciplinary industry--PCB is high-end electronic devices most critical technology.No matter rigidity, flexible, Flex-rigid multi-layer sheet in the PCB product, and the module group substrates that is used for the IC base plate for packaging, for high-end electronic devices is made huge contribution, therefore, the PCB industry is occupied critical role in the electronic interconnection technology.
The PCB product is to high-level, high density, the development of signal high frequency, but a large amount of passive devices on the present PCB circuit board surface circuit have occupied a large amount of surface area of PCB, need simultaneously a large amount of wires, via and connection pad be connected waste a large amount of PCB spaces of a whole page and space, manufacture craft is loaded down with trivial details, and the abilities such as its opposing mechanical oscillation are impacted, made moist, pollution and etchant gas are low, greatly affect its machinery and electric property.
Summary of the invention
In order to overcome defects; the utility model provides a kind of PCB board structure of circuit, and this PCB circuit board is integrated into the PCB internal layer to passive device from the welding of pcb board face, and the passive device of potting is protected by PCB; avoid the extraneous factor impact, improve the element job stability.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of PCB board structure of circuit, comprise PCB substrate and passive device, and described passive device is embedded in the described PCB substrate.
As further improvement of the utility model, be respectively equipped with one deck insulating protective film in the upper and lower surface of described passive device.
As further improvement of the utility model, the surface of described PCB substrate is provided with circuit, and described PCB substrate is provided with via, and this via is communicated with the surface lines of described passive device and described PCB substrate.
As further improvement of the utility model, described passive device is thermistor.
The beneficial effects of the utility model are: reliability is high, because passive component is integrated in the pcb board with interior potting form. thereby reduced a large amount of via, wire and terminal pads that passive component connects (or welding) that are used for, reduced the quantity of a large amount of pads.Simultaneously, owing to there is not the existence of pcb board face connected with passive element, Gu and impact in mechanical oscillation, make moist, pollution, etchant gas etc. can avoid yet.So improve significantly the reliability of machinery and electric aspect; Effectively promoted the PCB densification, owing to being connect from pcb board face weldering (company), passive component is integrated into the PCB internal layer, thereby a large amount of the be necessary via of these passive components of welding, wire and terminal pads have been eliminated, Gu this has saved a large amount of pcb board face or space, cause dwindling the PCB size or reduce the number of plies, increased wiring, passage is favourable, has improved the PCB densification.
Description of drawings
Fig. 1 is the utility model structural representation.
By reference to the accompanying drawings, make the following instructions:
1---PCB substrate 2---passive device
3---insulating protective film 4---circuit
5---via
Embodiment
By reference to the accompanying drawings; the utility model is elaborated; but protection range of the present utility model is not limited to following embodiment, and the simple equivalence of namely in every case being done with the utility model claim and description changes and modifies, and all still belongs within the utility model patent covering scope.
A kind of PCB board structure of circuit comprises PCB substrate 1 and passive device 2, and described passive device is embedded in the described PCB substrate.Like this, bury in, the chips such as embedded, built-in, the passive device implanted such as electric capacity, resistance, inductance protect by PCB, avoid the extraneous factor impact, improve the element job stability.
Preferably, the upper and lower surface at described passive device is respectively equipped with one deck insulating protective film 3.
Preferably, the surface of described PCB substrate is provided with circuit 4, and described PCB substrate is provided with via 5, and this via is communicated with the surface lines of described passive device and described PCB substrate.
Preferably, described passive device is thermistor.
When this technology is applied to circuit excess-current excess-temperature protective device, have in the thermistor element potting and PCB of positive temperature coefficient, be connected in the circuit; When circuit worked, thermistor temp and room temperature were close, resistance is very little, were connected on can not hinder electric current in the circuit and pass through; And when overcurrent occurring when the circuit because fault, thermistor is because the heating power increase causes temperature to rise, and resistance moment can increase severely, and the electric current in the loop is reduced to rapidly safety value.
When this technology is applied to temperature detect switch (TDS), have the thermistor element of non-linear PTC effect, resistance presents non-linear narrow temperature and has to go to the toilet to increase severely and add several phenomenons to tens orders of magnitude in the curent change process; When variations in temperature arrived the thermistor element critical value, resistance sharply changes cut off electric current formation open circuit or closed circuit.
Claims (4)
1. a PCB board structure of circuit comprises PCB substrate (1) and passive device (2), and it is characterized in that: described passive device is embedded in the described PCB substrate.
2. PCB board structure of circuit according to claim 1, it is characterized in that: the upper and lower surface at described passive device is respectively equipped with one deck insulating protective film (3).
3. PCB board structure of circuit according to claim 1 and 2, it is characterized in that: the surface of described PCB substrate is provided with circuit (4), and described PCB substrate is provided with via (5), and this via is communicated with the surface lines of described passive device and described PCB substrate.
4. PCB board structure of circuit according to claim 1, it is characterized in that: described passive device is thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220548433 CN202857147U (en) | 2012-10-24 | 2012-10-24 | Structure of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220548433 CN202857147U (en) | 2012-10-24 | 2012-10-24 | Structure of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202857147U true CN202857147U (en) | 2013-04-03 |
Family
ID=47988287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220548433 Expired - Fee Related CN202857147U (en) | 2012-10-24 | 2012-10-24 | Structure of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202857147U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781277A (en) * | 2012-10-24 | 2014-05-07 | 昆山华扬电子有限公司 | PCB circuit board structure and manufacturing technology thereof |
-
2012
- 2012-10-24 CN CN 201220548433 patent/CN202857147U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781277A (en) * | 2012-10-24 | 2014-05-07 | 昆山华扬电子有限公司 | PCB circuit board structure and manufacturing technology thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: JIANGSU PUNUOWEI ELECTRONIC CO., LTD. Free format text: FORMER NAME: KUNSHAN HWAYUNG ELECTRONICS CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: Qiandeng Town Hongyang road Kunshan City, Suzhou City, Jiangsu Province, No. 322 215341 Patentee after: JIANGSU PUNUOWEI ELECTRONIC CO., LTD. Address before: Suzhou City, Jiangsu province 215341 Kunshan City Qiandeng Private Development Zone (South Village) Patentee before: Kunshan Hwayung Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20181024 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |