CN206118176U - Gong groove positioner - Google Patents
Gong groove positioner Download PDFInfo
- Publication number
- CN206118176U CN206118176U CN201620888910.2U CN201620888910U CN206118176U CN 206118176 U CN206118176 U CN 206118176U CN 201620888910 U CN201620888910 U CN 201620888910U CN 206118176 U CN206118176 U CN 206118176U
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- CN
- China
- Prior art keywords
- gong
- plate body
- lamination
- treat
- groove positioner
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Abstract
The utility model provides a gong groove positioner. Gong groove positioner follows closely, treats gong lamination and operation platform including the location, treat that the gong lamination passes through the location nail fixing in operation platform, gong groove positioner still includes first plate body, second plate body, adhesive tape and a plurality of banking pin, first plate body with second plate body centre gripping treat the gong lamination, and the three passes through adhesive tape fixed connection, through connection is in proper order followed closely to the location treat that the gong lamination reaches the second plate body in operation platform, a plurality of the banking pin is located treat the outer peripheral edges of gong lamination. The utility model provides a gong groove positioner has solved among the prior art technical problem that gong groove positioner failed effectively to prevent the cuttings's that gong groove off normal and gong groove produced influence.
Description
Technical field
This utility model is related to printed circuit board manufacture technology field, more particularly to one kind applies to printed circuit board processing
Gong groove positioner.
Background technology
Printed circuit board, i.e. PCB.It is the supplier of electronic devices and components electrical connection, using printed circuit board
Major advantage be greatly reduce wiring and assemble mistake, improve the gentle generation work rate of Automated water.
With electronic devices and components packing density in electronic product and integrated level more and more higher, power is increasing, if printing
The substrate thermal diffusivity of circuit board is not good enough, and components and parts on printed circuit board will be caused overheated, so that whole aircraft reliability declines, is
The thermal diffusivity of substrate is improved, height radiating copper base arises at the historic moment.
Height radiating buries copper coin thermal diffusivity better than aluminum-based copper-clad plate, and it can carry high current, for manufacturing electric power and automobile etc.
The printed circuit board of high-power circuit purposes.The high radiating of processing is buried during copper coin, need the high radiating insulating layer to substrate and
Central layer gong goes out to bury copper groove, to be embedded in cuprio.
In correlation technique, typically high radiating insulating layer and central layer are positioned using shop bolt during gong groove, this kind of gong groove is determined
Position device is excessively simple and crude, easily causes gong groove off normal, has influence on the quality of substrate, and for the powder of parameter improper generation during gong groove
Bits are easily caused after substrate pressing because break flour affects the quality of itself without prophylactico-therapeutic measuress.
Therefore, it is necessary to provide a kind of new gong groove positioner solve the above problems.
Utility model content
It is fixed that the technical problem that this utility model is solved is to provide a kind of gong groove for effectively preventing gong groove off normal and break flour from affecting
Position device.
To solve above-mentioned technical problem, the gong groove positioner includes locating pin, treats gong lamination and operating platform, described
Treat that gong lamination is fixed on the operating platform by the locating pin, the gong groove positioner also include the first plate body, second
Plate body, gummed paper and several banking pins, first plate body treats gong lamination with described in second plate body clamping, and three passes through
The gummed paper is fixedly connected, and the locating pin is sequentially passed through treats that gong lamination and second plate body are flat in the operation described in connection
Platform, several described banking pins are located at the outer peripheral edge for treating gong lamination.
Preferably, the quantity of the banking pin is four, and four banking pins are around the gong lamination and described treated
Second plate body is arranged.
Preferably, it is characterised in that the quantity of the locating pin is four, and four locating pins are two-by-two located at described
Treat gong lamination.
Preferably, the gummed paper in the first plate body described in the outer peripheral edge bonding for treating gong lamination, it is described treat gong lamination and
Second plate body.
Preferably, first plate body and the central layer that second plate body is etching off Copper Foil.
Preferably, it is described to treat that gong lamination is formed by medium laminated the setting of central layer and/or high heat conductive insulating.
Compared with correlation technique, the gong groove positioner that this utility model is provided has the advantages that：
First, the gong groove positioner include the first plate body, treat gong lamination, the second plate body, gummed paper and several banking pins,
First plate body treats gong lamination with described in second plate body clamping, and three is fixedly connected by the gummed paper, several
The banking pin is located at the outer peripheral edge for treating gong lamination.The setting of first plate body prevents the powder produced during gong groove
Bits treat gong lamination so as to affect the quality and quality of substrate, the setting of second plate body to be effectively prevented institute described in falling into
The deformation for treating gong lamination during gong groove is stated, the off normal when setting of the banking pin more effectively limits gong groove improves gong
The precision of groove.
2nd, the gummed paper is adhered to first plate body, four corner edges for treating gong lamination and second plate body, institute
State the setting of gummed paper effectively by first plate body, it is described treat that gong lamination and second plate body are fixed as one, so as to anti-
Stopped it is described treat gong lamination slide, further improve the precision of gong groove.
3rd, the gong groove positioner effectively prevents gong groove off normal and break flour from affecting by simple structure, greatly carries
Rise precision, the quality of substrate and the quality of gong groove.
Description of the drawings
The structural representation of the gong groove positioner that Fig. 1 is provided for this utility model；
Fig. 2 is the part-structure exploded view of the gong groove positioner shown in Fig. 1.
Specific embodiment
Below in conjunction with the accompanying drawings the utility model is described in further detail with embodiment.
Fig. 1 and Fig. 2 is please referred to, wherein, the structural representation of the gong groove positioner that Fig. 1 is provided for this utility model
Figure.Fig. 2 is the part-structure exploded view of the gong groove positioner shown in Fig. 1.The gong groove positioner 1 includes the first plate body
11st, gong lamination 12, the second plate body 13, operating platform 14, banking pin 15, gummed paper 16 and locating pin 17, first plate body 11 are treated
And second plate body 13 clamp it is described treat gong lamination 12, second plate body 13 is supported in the operating platform 14, described the
One plate body 11, described treat that gong lamination 12 and second plate body 13 are fixedly connected.
First plate body 11, it is described treat that gong lamination 12 and second plate body 13 are rectangular, and three's shape is identical.
The quantity of the banking pin 15 is 4, and 4 banking pins 15 treat gong lamination 12 and second plate around described
Body 13 is arranged, and 4 banking pins 15 are abutted respectively with the midpoint on four sides of second plate body 13.The banking pin 15
Setting effectively prevent gong groove off normal.
The gummed paper 16 is adhered to first plate body 11, four arms of angle for treating gong lamination 12 and second plate body 13
Edge, effectively by first plate body 11, it is described treat that gong lamination 12 and second plate body 13 are fixed as one, so as to effective
Prevent slip when 12 gong groove of gong lamination.
The quantity of the locating pin 17 is 4, and one group of opposite side for treating gong lamination 12 is respectively equipped with 2 locating pins
17, the locating pin 17 is fixedly connected sequentially and described treats gong lamination 12 and second plate body 13 in the operating platform 14.
In the present embodiment, first plate body 11 and second plate body 13 for etching off Copper Foil central layer, it is described to treat that gong is folded
Plate 12 is formed by medium laminated the setting of central layer and/or high heat conductive insulating, and the locating pin 17 is pin with the banking pin 15.
Compared with correlation technique, the gong groove positioner 1 that this utility model is provided has the advantages that：
First, the gong groove positioner 1 includes the first plate body 11, treats gong lamination 12, the second plate body 13, gummed paper 16 and some
Individual banking pin 15, first plate body 11 and second plate body 13 clamp it is described treat gong lamination 12, and three passes through the glue
Paper 16 is fixedly connected, and several described banking pins 15 are located at the outer peripheral edge for treating gong lamination 12.First plate body 11 sets
Put prevent the break flour produced during gong groove fall into it is described treat gong lamination 12 so as to affect the quality and quality of substrate, described the
The setting of two plate bodys 13, be effectively prevented it is described treat deformation of the gong lamination 12 during gong groove, the banking pin 15 sets
Off normal when more effectively limit gong groove is put, the precision of gong groove is improve.
2nd, the gummed paper 16 is adhered to first plate body 11, described treats the four of gong lamination 12 and second plate body 13
Corner edge, the setting of the gummed paper 16 effectively by first plate body 11, described treat gong lamination 12 and second plate body 13
Be fixed as one, so as to prevent it is described treat that gong lamination 12 slides, further improve the precision of gong groove.
3rd, the gong groove positioner 1 effectively prevents gong groove off normal and break flour from affecting, greatly by simple structure
Lift precision, the quality of substrate and the quality of gong groove.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure made using this utility model description and accompanying drawing content or equivalent flow conversion, or be directly or indirectly used in
Other related technical fields, are included in the same manner in scope of patent protection of the present utility model.
Claims (6)
1. a kind of gong groove positioner, it includes locating pin, treats gong lamination and operating platform, described to treat gong lamination by described fixed
Position nail is fixed on the operating platform, it is characterised in that the gong groove positioner also includes the first plate body, the second plate body, glue
Paper and several banking pins, the clamping of first plate body and second plate body is described to treat gong lamination, and three by the glue
Paper is fixedly connected, and the locating pin to be sequentially passed through and treat gong lamination and second plate body in the operating platform described in connection, if
The dry banking pin is located at the outer peripheral edge for treating gong lamination.
2. gong groove positioner according to claim 1, it is characterised in that the quantity of the banking pin is four, and four
The individual banking pin treats that gong lamination and second plate body are arranged around described.
3. gong groove positioner according to claim 1, it is characterised in that the quantity of the locating pin is four, and four
The individual locating pin treats gong lamination located at described two-by-two.
4. gong groove positioner according to claim 1, it is characterised in that the gummed paper is in the periphery for treating gong lamination
First plate body described in edge bonding, described treat gong lamination and second plate body.
5. gong groove positioner according to claim 1, it is characterised in that first plate body is with second plate body
The central layer of etching off Copper Foil.
6. gong groove positioner according to claim 1, it is characterised in that described to treat that gong lamination is led by central layer and/or height
Medium laminated the setting of heat insulation forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620888910.2U CN206118176U (en) | 2016-08-16 | 2016-08-16 | Gong groove positioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620888910.2U CN206118176U (en) | 2016-08-16 | 2016-08-16 | Gong groove positioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206118176U true CN206118176U (en) | 2017-04-19 |
Family
ID=58512818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620888910.2U Active CN206118176U (en) | 2016-08-16 | 2016-08-16 | Gong groove positioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206118176U (en) |
-
2016
- 2016-08-16 CN CN201620888910.2U patent/CN206118176U/en active Active
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