CN201962401U

CN201962401U - Solute adding device

Info

Publication number: CN201962401U
Application number: CN2011200300421U
Authority: CN
Inventors: 邓波
Original assignee: SICHUAN LIPTAI ELECTRONIC CO Ltd
Current assignee: SICHUAN LIPTAI ELECTRONIC CO Ltd
Priority date: 2011-01-28
Filing date: 2011-01-28
Publication date: 2011-09-07
Anticipated expiration: 2021-01-28

Abstract

The utility model discloses a solute adding device which comprises a support, a funnel, and an upper fixing frame and a lower fixing frame, wherein the upper fixing frame and the lower fixing frame are arranged on the support and appear an annular shape, the funnel is directly arranged on a circular ring of the upper fixing frame and the lower fixing frame, and the upper fixing frame and the lower fixing frame are sleeved at the outside of the funnel; a master valve for controlling the flow rate of the solute is arranged at the outlet of the funnel, the outlet of the funnel is connected with a pipe, at least one control valve is arranged on the valve, and each control valve corresponds to an electroplating bath. The solute adding device can ensure that the concentration of the electroplating solution in the electroplating bath still keeps consistent to meet the required parameters in the Tin plating process for the surface treatment of pins of a semiconductor component; the homogeneity and consistency of the product pin coating are very high, thereby providing insurance for greatly improving the product quality; the solute is precisely added according to the process requirements and is not required to be added excessively, no residue exists in the solute conveying process, and the loss is low; the solute adding device has a simple structure, is convenient to operate and has low cost; the solute adding device is suitable for adding one or more solutes in one or more electroplating baths.

Description

The solute adding set

Technical field

The utility model relates to the surface treatment procedure of semiconductor components and devices Packaging Industry pin, especially for the adding set of electroplating solute.

Background technology

For strengthening the weldability of semiconductor components and devices, the semiconductor electronic components and parts have one surface treatment procedure in manufacturing processed be exactly the pin eleetrotinplate, this pin eleetrotinplate operation is exactly to put into the electroplate liquid that requirement in proportion dissolves after the device that needs are handled is fixed with anchor clamps, according to the electroplating time of technical papers prescribed product in electroplating solution.Be to guarantee the product thickness of coating, must guarantee that electroplating solution keeps normality, the method that adopts is size and the thickness of coating decision solute addition according to product lot quantity usually.

The staff can add in the electroplating solution according to required solute of time period, guarantee the thickness of latter products coating, needs to add than the more solute of conventional amount used.Two counter productives that this working method produces are: the first, and front and back batch product thickness of coating is inhomogeneous in per time period, and the entire block consistence is relatively poor, influences quality product; The second, for guaranteeing to criticize at last product plating thickness, added than the more solute of conventional amount used, thereby increased production cost and make with batch or the different batches product plating thickness before and after inhomogeneous.

Summary of the invention

The purpose of this utility model is to overcome above-mentioned defective, and a kind of simple and reasonable, simple to operate, economical and practical solute adding set is provided, and can fully guarantee the homogeneity and the consistence of product thickness of coating, has fully solved the twice difficult problem of this procedure.

The technical solution of the utility model is achieved in that

The solute adding set, it is characterized in that: comprise support, funnel, be installed on upper holder and lower fixed frame on the support, described upper holder and lower fixed frame all in the form of a ring, funnel directly is positioned on the annulus of upper holder and lower fixed frame, upper holder and lower fixed frame are placed in the funnel outside; The exit of funnel is provided with the main valve of control solute flow velocity, and the outlet of funnel is connected with pipeline, and pipeline is provided with at least one control valve, the corresponding plating tank of each control valve.

Described support comprises upper bracket, lower bracket and fixed base plate, and upper bracket is fixedlyed connected by arrangement for adjusting height with lower bracket, and lower bracket is fixed on the fixed base plate.

Described arrangement for adjusting height is the vertical altitude mixture control groove coupling formation that cooperates lower bracket by the adjusting bolt of upper bracket.

Described funnel upper end is a column, and the lower end is a taper, and the internal diameter size of upper holder cooperates with the funnel stylolitic part, and the internal diameter size of lower fixed frame partly cooperates with the taper of funnel lower end.

The outlet of described funnel and the junction of pipeline are provided with pipeline connection.

Described funnel also can be provided with filler cap.

Principle of work of the present utility model is as follows:

The container position of this device band funnel is the highest, and the outlet of pvc pipe solute is minimum relatively.When having dissolved the electroplate liquid of normality in the plating tank, the flow velocity that the accurate numerical evaluation of the solute that adds according to the every batch of product needed is set, solute at the uniform velocity adds in the solution, no longer excessive interpolation solute, strength of solution in the plating tank from start to finish all remains on prescribed value, is protected with the homogeneity and the consistence of different batches of product coating with criticizing; Container with funnel adds the slap-up noresidue of solute in the plating tank to simultaneously; Realize saving and reduced cost.

The beneficial effects of the utility model are:

The utility model can make that electroplating solution concentration remains the consistent regulation parameter that reaches in the semiconductor components and devices pin plating surface treatment tin operation plating tank; Very high with criticizing with all even consistence of different batches product pin coating, provide guarantee for significantly improving the quality of products; The solute that need add in the plating tank accurately adds by processing requirement, need not excessive adding, the noresidue of solute course of conveying, thus reduce the wastage and cost; This is simple and reasonable, and is simple to operation; The equipment input cost is cheap; Be widely used in one or more plating tanks, one or more solutes add.

Description of drawings

Fig. 1 is the structural representation of facing of the present utility model

Fig. 2 does not have the left TV structure synoptic diagram of filler cap for the utility model

Reference numeral is: 1 fixed base plate, 2 lower brackets, 3 are regulated bolt, 4 upper brackets, 5 filler caps, 6 funnels, 7 upper holders, 8 lower fixed frames, 9 main valves, 10 pipeline connections, 11 control valves, 12 pipelines.

Embodiment

Shown in Fig. 1-2, the solute adding set, it is characterized in that: comprise support, funnel 6, be installed on upper holder 7 and lower fixed frame 8 on the support, described upper holder 7 and lower fixed frame 8 are all in the form of a ring, funnel 6 directly is positioned on the annulus of upper holder 7 and lower fixed frame 8, and upper holder 7 and lower fixed frame 8 are placed in funnel 6 outsides.

In the actual installation process, the outlet of funnel 6 can be installed and be higher than 20 centimetres of plating tank oral areas, the exit is provided with the main valve 9 of control solute flow velocity, the conveying by main valve 9 control solutes and stopping.

Funnel 6 exits are connected with pipeline 12, and outlet is provided with pipeline connection 10 with the junction of pipeline 12, and pipeline 12 is provided with at least one control valve 11, each control valve 11 corresponding plating tank, and solute is transported in the plating tank by pipeline 12.As required the solute amount of Tian Jiaing and this batch workpiece for producing the time set flow velocity, solute is evenly added in the electroplate liquid of plating tank in the given time, and strength of solution is consistent, in a metastable scope that meets processing requirement.

Described support comprises upper bracket 4, lower bracket 2 and fixed base plate 1, and upper bracket 4 and lower bracket 2 are fixedlyed connected by arrangement for adjusting height, and lower bracket 2 is fixed on the fixed base plate 1.

Described arrangement for adjusting height is the vertical altitude mixture control groove coupling formation that cooperates lower bracket 2 by the adjusting bolt 3 of upper bracket 4.

Described funnel 6 upper ends are column, and the lower end is a taper, and the internal diameter size of upper holder 7 cooperates with funnel 6 stylolitic parts, and the internal diameter size of lower fixed frame 8 partly cooperates with the taper of funnel 6 lower ends.

For avoiding the slight volatilization situation of solute to take place, described funnel 6 also can be provided with filler cap 5, cooperates its sealing process with funnel 6.

Claims

1. solute adding set, it is characterized in that: comprise support, funnel (6), be installed on upper holder (7) and lower fixed frame (8) on the support, described upper holder (7) and lower fixed frame (8) are all in the form of a ring, funnel (6) directly is positioned on the annulus of upper holder (7) and lower fixed frame (8), and upper holder (7) and lower fixed frame (8) are placed in funnel (6) outside; The exit of funnel (6) is provided with the main valve (9) of control solute flow velocity, and the outlet of funnel (6) is connected with pipeline (12), and pipeline (12) is provided with at least one control valve (11).

2. solute adding set according to claim 1, it is characterized in that: described support comprises upper bracket (4), lower bracket (2) and fixed base plate (1), upper bracket (4) is fixedlyed connected by arrangement for adjusting height with lower bracket (2), and lower bracket (2) is fixed on the fixed base plate (1).

3. solute adding set according to claim 2 is characterized in that: described arrangement for adjusting height is the vertical altitude mixture control groove coupling formation that cooperates lower bracket (2) by the adjusting bolt (3) of upper bracket (4).

4. solute adding set according to claim 1, it is characterized in that: described funnel (6) upper end is column, the lower end is a taper, the internal diameter size of upper holder (7) cooperates with funnel (6) stylolitic part, and the internal diameter size of lower fixed frame (8) partly cooperates with the taper of funnel (6) lower end.

5. solute adding set according to claim 1 is characterized in that: the junction of the outlet of described funnel (6) and pipeline (12) is provided with pipeline connection (10).

6. solute adding set according to claim 1 is characterized in that: described funnel (6) also is provided with filler cap (5).