CN202175734U - Automatic adding device for electroplating solution - Google Patents
Automatic adding device for electroplating solution Download PDFInfo
- Publication number
- CN202175734U CN202175734U CN2011203048610U CN201120304861U CN202175734U CN 202175734 U CN202175734 U CN 202175734U CN 2011203048610 U CN2011203048610 U CN 2011203048610U CN 201120304861 U CN201120304861 U CN 201120304861U CN 202175734 U CN202175734 U CN 202175734U
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- China
- Prior art keywords
- electroplate liquid
- electroplating solution
- pump
- plc
- automatic adding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000009713 electroplating Methods 0.000 title abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 45
- 238000007747 plating Methods 0.000 abstract description 5
- 239000003814 drug Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to an automatic adding device for electroplating solution, which comprises a working tank and an electroplating solution temporary storage tank connected with the working tank through an adding pipeline. A quantitative pump used for controlling the adding amount of the electroplating solution and an electromagnetic valve used for controlling whether to add the electroplating solution are arranged on the adding pipeline. The quantitative pump and the electromagnetic valve are connected with a PLC (Programmable Logic Controller). An adding quantitative box is arranged on the adding pipeline between the quantitative pump and the electromagnetic valve. A liquid level sensor connected with the PLC is arranged on the adding quantitative box. The PLC is connected with a sensing counter. Scales are arranged on the adding quantitative box. The automatic adding device for the electroplating solution is used in the circuit board plating, so that the adding amount of the electroplating solution is controlled to be accurate, the plating quality of the circuit board is effectively improved, and the plating quality difference of different circuit boards can be avoided.
Description
Technical field
The utility model relates to the electroplating technology field in the wiring board processing procedure, the automatic adding set of especially a kind of electroplate liquid that in electroplating process, uses.
Background technology
The automatic adding set of electroplate liquid of widespread use during wiring board is produced; The modes of PLC control pump of constant delivery type that rely on realize the control to the electroplate liquid addition more; Adopting this mode to control the electroplate liquid addition exists following not enough: the production unit area of different classes of wiring board is different; Different to the liquid medicine consumption, so required electroplate liquid addition is also inequality, control addition with mode at regular time and quantity and have automatic adding set now; Can't ensure and all can accurately control, thereby be prone to cause the quality discrepancy of different classes of wiring board the electroplate liquid liquid medicine addition of wiring board of all categories.In addition; Rely on pump of constant delivery type control electroplate liquid addition; When pump of constant delivery type breaks down or the pump of constant delivery type power that causes long neglected and in disrepair diminishes, when perhaps the liquid medicine temporary tank adds pipe and stopped up by foreign matter, be prone to all make that the addition of pump of constant delivery type does not reach requirement; Finally cause the imbalance of liquid medicine addition, influence wiring board production quality.
Summary of the invention
In view of this, the utility model technical problem that will solve provides a kind of automatic adding set of electroplate liquid that can make electroplate liquid addition control more accurately, effectively raising wiring board electroplating quality.
For solving the problems of the technologies described above; The technical scheme that the utility model provides is: the automatic adding set of a kind of electroplate liquid; Comprise work nest and the electroplate liquid temporary tank that is connected with work nest through the interpolation pipeline; The interpolation pipeline is provided with and is used to control the pump of constant delivery type of electroplate liquid addition and the SV whether control adds electroplate liquid, and pump of constant delivery type is connected with the PLC unit with SV, and the interpolation pipeline between pump of constant delivery type and SV is provided with and adds quantitative box.
Also be provided with the level sensor that is connected with the PLC unit on the quantitative box of said interpolation.
Said PLC unit is connected with sense counter.
The quantitative box of said interpolation is provided with scale.
Compared with prior art, the utlity model has following advantage:
The utility model adds quantitative box through between pump of constant delivery type and SV, being provided with; Can monitor in real time the electroplate liquid addition of pump of constant delivery type; Thereby the electroplate liquid addition is accurately controlled; Guarantee all can accurately be controlled the electroplate liquid liquid medicine addition of wiring board of all categories, promotes the electroplating quality of wiring board and the electroplating quality difference of avoiding different classes of wiring board.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is described in further detail:
As shown in Figure 1; The automatic adding set of a kind of electroplate liquid; Comprise work nest and the electroplate liquid temporary tank that is connected with work nest through the interpolation pipeline; The interpolation pipeline is provided with and is used to control the pump of constant delivery type of electroplate liquid addition and the SV whether control adds electroplate liquid, and pump of constant delivery type is connected with the PLC unit with SV, and the interpolation pipeline between pump of constant delivery type and SV is provided with and adds quantitative box.Add quantitative box and be provided with the level sensor that is connected with the PLC unit, the PLC unit is connected with sense counter, adds quantitative box and is provided with scale.
During use; In the PLC unit, set by the fixing area of producing and carry out electroplate liquid and quantitatively add, when producing every type wiring board, first length and width input order hurdle with the type wiring board; The PLC unit is calculated the unit surface of waiting to produce wiring board automatically; The circuit board quantity that puts into production through sense counter statistics again, when the automatic arithmetic unit area of PLC unit multiply by the production area that production quantity equals to set, the PLC unit sent instruction specified rate pump and carries out electroplate liquid and add order.In the present embodiment, be equipped with between pump of constant delivery type and the SV and add quantitative box, and add quantitative box and be provided with scale and level sensor; When the PLC unit sends instruction specified rate pump execution liquid feeding; The electroplate liquid that pump of constant delivery type added enters into and adds quantitative box, after level sensor affirmation interpolation plating liquid measure satisfies standard, with message feedback to PLC unit; The PLC unit sends to instruct and opens to SV, accomplishes electroplate liquid and adds action.Adds the electroplate liquid quantity not sufficient when requiring and confirm institute when level sensor, with message feedback to PLC unit, the PLC unit sends instruction specified rate pump to be continued liquid feeding and after reaching requirement, stops, and controls electrovalve then to open, and the completion liquid feeding moves.Quantitative box of so many increase can be monitored the plating liquid measure that pump of constant delivery type adds, and guarantees the addition of electroplate liquid, promotes the electroplating quality of wiring board product greatly, effectively avoids the electroplating quality difference of different classes of wiring board simultaneously.
More than be some concrete implementation of the present invention, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be noted that; For the person of ordinary skill of the art; Under the prerequisite that does not break away from the present invention's design; Can also make some distortion and improvement, be not limited to above-mentioned giving an example for the form of the quantity of fixed bit, fixed bit and other fixed forms etc., these conspicuous replacement forms all belong to protection scope of the present invention.
Claims (4)
1. automatic adding set of electroplate liquid; Comprise work nest and the electroplate liquid temporary tank that is connected with work nest through the interpolation pipeline; The interpolation pipeline is provided with and is used to control the pump of constant delivery type of electroplate liquid addition and the SV whether control adds electroplate liquid; Pump of constant delivery type is connected with the PLC unit with SV, it is characterized in that: the interpolation pipeline between pump of constant delivery type and SV is provided with and adds quantitative box.
2. the automatic adding set of electroplate liquid according to claim 1 is characterized in that: the quantitative box of said interpolation is provided with the level sensor that is connected with the PLC unit.
3. the automatic adding set of electroplate liquid according to claim 1 and 2 is characterized in that: said PLC unit is connected with sense counter.
4. the automatic adding set of electroplate liquid according to claim 3 is characterized in that: the quantitative box of said interpolation is provided with scale.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203048610U CN202175734U (en) | 2011-08-22 | 2011-08-22 | Automatic adding device for electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203048610U CN202175734U (en) | 2011-08-22 | 2011-08-22 | Automatic adding device for electroplating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202175734U true CN202175734U (en) | 2012-03-28 |
Family
ID=45865628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203048610U Expired - Fee Related CN202175734U (en) | 2011-08-22 | 2011-08-22 | Automatic adding device for electroplating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202175734U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102553789A (en) * | 2012-03-06 | 2012-07-11 | 奇瑞汽车股份有限公司 | Automatic supplement and updating system of pretreatment meter adjusting slot liquid as well as operating method thereof |
| CN102995096A (en) * | 2012-11-05 | 2013-03-27 | 江苏三鑫电子有限公司 | Automatic electroplating solution feeding system and automatic electroplating solution feeding method |
| CN103334150A (en) * | 2013-07-10 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Automatic quantitative adding system |
| CN103710740A (en) * | 2013-12-30 | 2014-04-09 | 河南星光机械制造有限公司 | Novel automatic barrel plating device |
| CN105420802A (en) * | 2015-12-14 | 2016-03-23 | 东莞市希锐自动化科技股份有限公司 | High-precision electroplating liquid adding system |
| CN106133202A (en) * | 2014-03-26 | 2016-11-16 | 孙治镐 | There is the anodized system that the medicine utilizing electrolyte to automatically analyze puts into the metal of function |
| CN107385502A (en) * | 2017-08-14 | 2017-11-24 | 河钢股份有限公司邯郸分公司 | A kind of Electro-galvanizing Production Line plating solution means for feeding acid |
| CN114606559A (en) * | 2022-03-29 | 2022-06-10 | 汇钻实业（深圳）有限公司 | Electroplating pool-based dosing control method, automatic dosing equipment and storage medium |
| CN114959860A (en) * | 2022-05-30 | 2022-08-30 | 惠州市特创电子科技股份有限公司 | Circuit board medicine adding monitoring method and device |
| CN115094505A (en) * | 2022-08-01 | 2022-09-23 | 梨树全创科技有限公司 | Safety device capable of uniformly and quantitatively adding electroplating liquid medicine |
-
2011
- 2011-08-22 CN CN2011203048610U patent/CN202175734U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102553789A (en) * | 2012-03-06 | 2012-07-11 | 奇瑞汽车股份有限公司 | Automatic supplement and updating system of pretreatment meter adjusting slot liquid as well as operating method thereof |
| CN102995096A (en) * | 2012-11-05 | 2013-03-27 | 江苏三鑫电子有限公司 | Automatic electroplating solution feeding system and automatic electroplating solution feeding method |
| CN103334150B (en) * | 2013-07-10 | 2016-04-13 | 皆利士多层线路版(中山)有限公司 | Automatic ration add-on system |
| CN103334150A (en) * | 2013-07-10 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Automatic quantitative adding system |
| CN103710740A (en) * | 2013-12-30 | 2014-04-09 | 河南星光机械制造有限公司 | Novel automatic barrel plating device |
| CN106133202A (en) * | 2014-03-26 | 2016-11-16 | 孙治镐 | There is the anodized system that the medicine utilizing electrolyte to automatically analyze puts into the metal of function |
| CN105420802A (en) * | 2015-12-14 | 2016-03-23 | 东莞市希锐自动化科技股份有限公司 | High-precision electroplating liquid adding system |
| CN107385502A (en) * | 2017-08-14 | 2017-11-24 | 河钢股份有限公司邯郸分公司 | A kind of Electro-galvanizing Production Line plating solution means for feeding acid |
| CN107385502B (en) * | 2017-08-14 | 2023-06-30 | 河钢股份有限公司邯郸分公司 | Acid adding device for plating solution of electrogalvanizing production line |
| CN114606559A (en) * | 2022-03-29 | 2022-06-10 | 汇钻实业（深圳）有限公司 | Electroplating pool-based dosing control method, automatic dosing equipment and storage medium |
| CN114959860A (en) * | 2022-05-30 | 2022-08-30 | 惠州市特创电子科技股份有限公司 | Circuit board medicine adding monitoring method and device |
| CN114959860B (en) * | 2022-05-30 | 2024-07-09 | 惠州市特创电子科技股份有限公司 | Circuit board medicine adding monitoring method and device |
| CN115094505A (en) * | 2022-08-01 | 2022-09-23 | 梨树全创科技有限公司 | Safety device capable of uniformly and quantitatively adding electroplating liquid medicine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Xinqiao Village town of freshwater Cheng technology garden 516211 Guangdong province Huizhou city Huiyang District Patentee after: Victory Giant Technology (Huizhou) Co., Ltd. Address before: Xinqiao Village town of freshwater Cheng technology garden 516211 Guangdong province Huizhou city Huiyang District Patentee before: Victory Giant Technology(HuiZhou)Co.,Ltd. |
|
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Gong Jun Inventor after: Zeng Zhiming Inventor after: Liu Shifeng Inventor after: Zhou Dingzhong Inventor after: Chen Guanghong Inventor before: Gong Jun Inventor before: Zeng Zhiming Inventor before: Liu Shifeng |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: GONG JUN CENG ZHIMING LIU SHIFENG TO: GONG JUN CENG ZHIMING LIU SHIFENG ZHOU DINGZHONG CHEN GUANGHONG |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20190822 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |