CN105506724A - Plating solution adding method and device - Google Patents
Plating solution adding method and device Download PDFInfo
- Publication number
- CN105506724A CN105506724A CN201510865705.4A CN201510865705A CN105506724A CN 105506724 A CN105506724 A CN 105506724A CN 201510865705 A CN201510865705 A CN 201510865705A CN 105506724 A CN105506724 A CN 105506724A
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- CN
- China
- Prior art keywords
- plating solution
- control device
- level control
- slide block
- fluid level
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a plating solution adding device. The plating solution adding device consists of an added solution slot device, a plastic hose, a liquid level control device, a slide block, a locking bolt, two threaded rods with reverse thread directions, a variable-frequency motor, a transmission device and a base, wherein a solution inlet of the plastic hose is connected to the added solution slot device and the liquid level control device; the liquid level control device is inserted into the slide block, and is fixed through the locking bolt; the slide block is connected to the threaded rods; the threaded rods are connected to the transmission device; the transmission device is connected to the variable-frequency motor; and the whole device is fixed to the base. The plating solution adding device regulates the motor frequency according to the calculated plating solution adding amount, the motor drives the transmission device, the transmission device drives the threaded rods to rotate, the rotating threaded rods drive the slide block to descend, the descending slide block drives the liquid level control device to descend, and the liquid level control device descends so as to generate liquid level difference between a liquid outlet and the plating solution in the added solution slot, so that the plating solution naturally flows out, and is supplemented into a working slot through the liquid outlet of the plastic hose. The plating solution adding device can realize small-flow, continuous and stable supplementing of solution addition.
Description
Technical field
The present invention relates to a kind of plating solution addition means and device, belong to metal products technical field of processing equipment.
Background technology
At present, domestic interpolation plating solution adopts under meter or volume pump control flow, can not realize in production plating high-tin bronze Tyre Bead Wire process, low discharge, continuous, stable interpolation replenisher in coating bath.Usually when producing, per hour continuously, to stablize the plating solution volume supplemented in coating bath be 0.5-2L, magnitude of recruitment is very little, and require continuous, stable interpolation, because stannous sulfate is very easily oxidized in the plating solution, is hydrolyzed, the device of the particulate matter very easily occlusion adjustments uninterrupted that oxidation, hydrolysis are produced, causes realizing low discharge, continuously, stablely to add.For improving the quality of products, guarantee that in coating bath, solution composition is stablized, the Tyre Bead Wire Coating composition of production is stablized, therefore need realize low discharge, continuously, stablizes and add replenisher in coating bath.Device of the present invention can meet production and application requirement completely, can effectively solve when low discharge adds because plating solution liquid level change in the particulate matter blocking in plating solution, supplemental tank causes the situation of fluctuations in discharge, and this equipment safety is reliable, convenient operation, energy low discharge, continuous, stable interpolation replenisher, significantly improve steel wire product quality.
Summary of the invention
The object of this invention is to provide a kind of plating solution addition means and device, realize low discharge, continuously, stablize and add plating solution, solve plating solution in adding procedure, be subject to annex solution liquid level change, the impact of plating solution endoparticle thing causes adding plating solution fluctuations in discharge, even block situation about cannot add, thus meet production requirement, improve the quality of products.
Plating solution adding set of the present invention is made up of annex solution slot device, plastic hose, fluid level control device, slide block, securing bolt, threaded rod that 2 hand of spirals are contrary, variable-frequency motor, transmission mechanism, base, fluid inlet plastic hose connects annex solution slot device and fluid level control device, fluid level control device is inserted slide block and is fixed by securing bolt, slide block is connected with threaded rod, threaded rod is connected with transmission mechanism, transmission mechanism is connected with variable-frequency motor, and whole device is fixed on base.Described annex solution slot device is made up of adding trough, locating dowel, sealing pad; Described fluid level control device is made up of three-limb tube and pipe connecting base.
Plating solution addition means of the present invention: according to the plating solution addition calculated, regulate electric machine frequency, driven by motor transmission mechanism, transmission mechanism drives threaded rod to rotate, the threaded rod band movable slider rotated declines, and the slide block of decline drives fluid level control device to decline, and fluid level control device declines and causes liquid outlet to produce liquid level difference with the plating solution added in liquid bath, plating solution flows out naturally, is added in work nest by liquid outlet plastic hose.When one group of fluid level control device drops to bottom time, the annex solution added in liquid bath has supplemented, now close down motor, loosen securing bolt, fluid level control device is moved on high-order slide block, supplement annex solution to interpolation liquid bath simultaneously, when in interpolation liquid bath, plating solution liquid level, with when plating solution liquid level is parallel in fluid level control device, opens motor reverser, motor reversal, high-order slide block drives fluid level control device to decline, add replenisher, low level slide block rises, and recovers high-end trim, circulation like this, can realize low discharge, continuously, stablize and add replenisher.This device is by regulating variable-frequency motor frequency control fluid level control device lowering speed, thus control replenisher flow, be not limited by the impact of the impact of connecting pipeline size, not restricted interpolation liquid level of liquid tank height, add the high stability of mechanism, thus realize low discharge, continuous, stable interpolation replenisher.
The present invention is easy to operate, improves the stability that process of producing product controls, drastically increases quality product.
Accompanying drawing explanation
The structural representation of Fig. 1 a kind of plating solution adding set of the present invention;
In figure: 1-variable-frequency motor, 2-transmission mechanism, 3-threaded rod, 4-slide block, 5-securing bolt, 6-plastic hose, 7-fluid level control device, 8-base, 9-annex solution slot device, 10-work nest, 91-adding trough, 92-locating dowel, 93-sealing pad, 94-plating solution.
Embodiment
Plating solution adding set of the present invention, embodiment presses Fig. 1, it is by annex solution slot device 9, plastic hose 6, fluid level control device 7, slide block 4, securing bolt 5, 2 threaded rods 3 that hand of spiral is contrary, variable-frequency motor 1, transmission mechanism 2, base 8 is formed, fluid inlet plastic hose 6 connects annex solution slot device 9 and fluid level control device 7, fluid level control device 7 is inserted slide block 4 and is fixed by securing bolt 5, slide block 4 is connected with threaded rod 3, threaded rod 3 is connected with transmission mechanism 2, transmission mechanism 2 is connected with variable-frequency motor 1, whole device is fixed on base 8, described annex solution slot device 9 is made up of adding trough 91, locating dowel 92, sealing pad 93, described fluid level control device 7 is made up of three-limb tube and pipe connecting base.
Plating solution addition means of the present invention: according to the plating solution addition calculated, regulate motor 1 frequency, motor 1 drives transmission mechanism 2, transmission mechanism 2 drives threaded rod 3 to rotate, the threaded rod 3 rotated is with movable slider 4 to decline, and the slide block 4 of decline drives fluid level control device 7 to decline, and fluid level control device 7 declines and causes the plating solution in liquid outlet and annex solution slot device 9 to produce liquid level difference, plating solution flows out naturally, is added in work nest 10 by liquid outlet plastic hose 6.When one group of fluid level control device 7 drops to bottom time, the annex solution in annex solution slot device 9 has supplemented, and now closes down motor 1, loosens securing bolt 5,
Fluid level control device 7 is moved on high-order slide block 4, supplement annex solution to annex solution slot device 9 simultaneously, when plating solution liquid level in annex solution slot device 9 is parallel with plating solution liquid level in fluid level control device 7, open motor reverser, motor 1 reverses, high-order slide block 4 drives fluid level control device 7 to decline, add replenisher, low level slide block rises, and recovers high-end trim, circulation like this, can realize low discharge, continuously, stablize and add replenisher.
Claims (2)
1. a plating solution adding set, it is characterized in that: it is by annex solution slot device (9), plastic hose (6), fluid level control device (7), slide block (4), securing bolt (5), 2 threaded rods (3) that hand of spiral is contrary, variable-frequency motor (1), transmission mechanism (2), base (8) is formed, fluid inlet plastic hose (6) connects annex solution slot device (9) and fluid level control device (7), fluid level control device (7) is inserted slide block (4) and is fixed by securing bolt (5), slide block (4) is connected with threaded rod (3), threaded rod (3) is connected with transmission mechanism (2), transmission mechanism (2) is connected with variable-frequency motor (1), whole device is fixed on base (8), described annex solution slot device (9) is made up of adding trough (91), locating dowel (92), sealing pad (93), described fluid level control device (7) is made up of three-limb tube and pipe connecting base.
2. utilize the plating solution adding set described in claim 1 to carry out the method for plating solution interpolation, it is characterized in that: according to the plating solution addition calculated, regulate motor (1) frequency, motor (1) drives transmission mechanism (2), transmission mechanism (2) drives threaded rod (3) to rotate, the threaded rod (3) band movable slider (4) rotated declines, the slide block (4) declined drives fluid level control device (7) to decline, fluid level control device (7) declines and causes the plating solution in liquid outlet and annex solution slot device (9) to produce liquid level difference, plating solution flows out naturally, add in work nest (10) by liquid outlet plastic hose (6), when one group of fluid level control device (7) drops to bottom time, annex solution in annex solution slot device (9) has supplemented, now close down motor (1), loosen securing bolt (5), fluid level control device (7) is moved on high-order slide block (4), supplement annex solution to annex solution slot device (9) simultaneously, when plating solution liquid level in annex solution slot device (9) is parallel with plating solution liquid level in fluid level control device (7), open motor reverser, motor (1) reverses, high-order slide block (4) drives fluid level control device (7) to decline, add replenisher, low level slide block rises, recover high-end trim, circulation like this, low discharge can be realized, continuously, stable interpolation replenisher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510865705.4A CN105506724B (en) | 2015-12-02 | 2015-12-02 | A kind of plating solution adding method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510865705.4A CN105506724B (en) | 2015-12-02 | 2015-12-02 | A kind of plating solution adding method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105506724A true CN105506724A (en) | 2016-04-20 |
| CN105506724B CN105506724B (en) | 2017-06-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510865705.4A Active CN105506724B (en) | 2015-12-02 | 2015-12-02 | A kind of plating solution adding method and device |
Country Status (1)
| Country | Link |
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| CN (1) | CN105506724B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2074761U (en) * | 1990-07-14 | 1991-04-10 | 北京有色金属研究总院 | Automatic rationing liquid feeder |
| CN1166539A (en) * | 1996-01-31 | 1997-12-03 | 川崎制铁株式会社 | Method for controlling concentration of electroplating bath components in continuous electroplating |
| JP2002225993A (en) * | 2001-01-24 | 2002-08-14 | Tomoegawa Paper Co Ltd | Method and apparatus for feeding liquid |
| CN1786294A (en) * | 2004-12-11 | 2006-06-14 | 鸿富锦精密工业（深圳）有限公司 | Electroplating bath device and method of automatic supplementing liquid |
| CN200943108Y (en) * | 2006-08-18 | 2007-09-05 | 江西省江铜-耶兹铜箔有限公司 | Liquid make-up feeding device |
| JP2009249707A (en) * | 2008-04-09 | 2009-10-29 | Shigeo Hoshino | Trivalent chromium-plating liquid management device |
| CN201962401U (en) * | 2011-01-28 | 2011-09-07 | 四川立泰电子有限公司 | Solute adding device |
| CN202786488U (en) * | 2012-08-22 | 2013-03-13 | 深圳崇达多层线路板有限公司 | Automatic liquid adding device for PCB plating |
-
2015
- 2015-12-02 CN CN201510865705.4A patent/CN105506724B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2074761U (en) * | 1990-07-14 | 1991-04-10 | 北京有色金属研究总院 | Automatic rationing liquid feeder |
| CN1166539A (en) * | 1996-01-31 | 1997-12-03 | 川崎制铁株式会社 | Method for controlling concentration of electroplating bath components in continuous electroplating |
| JP2002225993A (en) * | 2001-01-24 | 2002-08-14 | Tomoegawa Paper Co Ltd | Method and apparatus for feeding liquid |
| CN1786294A (en) * | 2004-12-11 | 2006-06-14 | 鸿富锦精密工业（深圳）有限公司 | Electroplating bath device and method of automatic supplementing liquid |
| CN200943108Y (en) * | 2006-08-18 | 2007-09-05 | 江西省江铜-耶兹铜箔有限公司 | Liquid make-up feeding device |
| JP2009249707A (en) * | 2008-04-09 | 2009-10-29 | Shigeo Hoshino | Trivalent chromium-plating liquid management device |
| CN201962401U (en) * | 2011-01-28 | 2011-09-07 | 四川立泰电子有限公司 | Solute adding device |
| CN202786488U (en) * | 2012-08-22 | 2013-03-13 | 深圳崇达多层线路板有限公司 | Automatic liquid adding device for PCB plating |
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| CN105506724B (en) | 2017-06-23 |
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