CN201937981U - Conveniently re-glued composite heat-conducting and heat-dissipating structure - Google Patents
Conveniently re-glued composite heat-conducting and heat-dissipating structure Download PDFInfo
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- CN201937981U CN201937981U CN2010205470509U CN201020547050U CN201937981U CN 201937981 U CN201937981 U CN 201937981U CN 2010205470509 U CN2010205470509 U CN 2010205470509U CN 201020547050 U CN201020547050 U CN 201020547050U CN 201937981 U CN201937981 U CN 201937981U
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Abstract
The utility model relates to a conveniently re-glued composite heat-conducting and heat-dissipating structure, which comprises a layer of ceramic powder composition with the diameter thereof less than 30 microns, a layer of metal substrate with the thermal conductivity ratio gamma more than or equal to 50W/mK and the thickness less than 2mm, a layer of thermosetting cement filled between the ceramic powder composition and the metal substrate, and a layer of silica gel for gluing the metal substrate and heating component and having a proper self-viscosity, wherein a crystal gap of the layer of ceramic powder composition is covered by the cohesion of the layer of thermosetting cement, thereby mutually sticking the ceramic powders and sticking with the metal substrate, reducing the scope and the thickness of the ceramic powder glued with the thermosetting cement, and still directly exposing the partial ceramic powder away from the metal substrate in the air. The conveniently re-glued composite heat-conducting and heat-dissipating structure can be easily separated from the metal substrate and a heating component without any damage and any glue residue, is conveniently cleaned and re-glued, is not sticky, can be properly glued with the heating component, can quickly conduct heat and dissipate heat, and is stable in adhesion.
Description
Technical field
The utility model relates to the heavily glutinous appropriate compound radiating structure of a kind of convenience.
Background technology
Physical motion or chemical reaction all can generate heat, there is work done just to have the heat output to be inevitable, but for electronic equipment, it is even more important how to handle heat, because compared with the heating workpiece in other multiple industrial spare part, easier being heated of heating workpiece of electronic component burns out, and makes the electrical equipment production and marketing dealer that is correlated with there's no one who doesn't or isn't to pay attention to electrical equipment row heat dissipation problem.
And it is quite a lot of as electrical blanket, electric heating element in the electrical equipment such as electric furnace, the effectiveness of work done heating as necessity own, also some is as bulb, high light efficiency LED, circuit elements such as computer CPU, do not go up essential effectiveness as using with heating, but with other such as illumination, functions such as computing are as effectiveness place own, but there is work done just to have the heat output, no matter whether with the effectiveness of work done heating as necessity own, heat is given birth in the capital, just different to the tolerance level of heat, the heat more than one that produces surpasses the work environment temperature and keeps the required temperature of operate as normal, just on the contrary can this work done element of scaling loss itself, reduce useful life, therefore, at various electrical equipment its internal circuit is easily gathered the heat place, it is necessary installing additional and helping the heat abstractor of biography heat radiation.
As everyone knows, transmission to heat has conduction, convection current, three kinds of modes of radiation, implement with the easiest control of conduction again, therefore many at present with copper or aluminium, the radiating block of making the divergent stamen of many heat radiations pastes folded circuit heat build-up position, with the heat loss through conduction effect of its easy surface area reinforcement of absorbing heat material and increasing to the circuit heat build-up, yet, the power usefulness of imitating electronic components such as LED as computer CPU, high light is enhanced more, produce the greater amount temperature, make to have now with copper or aluminium, the radiating block of making many heat radiating fins stamen has been not enough to deal with the more demand of quick heat radiating.
The radiating block that existing light is made with copper or aluminium; its heat-sinking capability can be confined to biography, the heat-sinking capability of single copper or aluminium itself; with regard to the heat radiation copper material stronger than aluminium, the copper heat absorption is fast, many, but it is still undesirable to dispel the heat; still have other composite material can absorb heat soon, many; and heat radiation is better than the copper performance, so this creator discovers that pottery promptly has all good characteristic of suction heat radiation, adheres to pottery with copper or other metal; the surface particlesization that pottery is contacted with air, heat radiation just can be faster.
Because develop circuit is passed the works demand faster of dispelling the heat, this creator is the road of active research improvement, through some hard production process, develops the utility model finally.
The utility model content
Technical problem underlying to be solved in the utility model is, overcome the above-mentioned defective that prior art exists, and provide a kind of convenience heavily glutinous appropriate compound radiating structure, the utility model does not solidify because of its silica gel, can not have easily and tear off metal base and heating workpiece with hindering, there is not the glue slag residual fully, cleaning is heavily pasted easy again, and it is tack-free, make and paste that to stick to the heating workpiece more appropriate, can lead heat radiation rapidly, make stick very firm, can be because of dust does not disturb attaching, or produce a large amount of air chambers (air pocket) because of dust.
The technical scheme that its technical problem that solves the utility model adopts is:
The heavily glutinous appropriate compound radiating structure of a kind of convenience is characterized in that, is the ceramic powders constituent that is no more than 30 μ m by one deck diameter; Metal base, one deck that one pyroconductivity (λ) 〉=50W/m K and thickness are no more than 2mm is filled in the thermosetting cement between ceramic powders constituent and the metal base, one deck is as binding metal base and heating workpiece, having suitable silica gel from viscosity constitutes, coat the crystal gap of this layer ceramic powders constituent by the cohesive force of this layer thermosetting cement, make the mutual gluing of ceramic powders, and with this metal base gluing, and reduce scope and thickness that the thermosetting gluing is wrapped up in ceramic powders, allow the part ceramic powder away from metal base still directly be exposed in the air.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein silica gel is 1～300g/ English inch from viscosity.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein the ceramic powders constituent is a carborundum.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein the ceramic powders constituent is an aluminium nitride.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein the ceramic powders constituent is a zinc oxide.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein the ceramic powders constituent is an aluminium oxide.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein the ceramic powders constituent is a graphite.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein metal base is a copper.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein metal base is an aluminium.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein metal base is a tinfoil paper.
The heavily glutinous appropriate compound radiating structure of aforesaid convenience, wherein thermosetting cement is a resin.
The convenient heavily glutinous appropriate compound radiating structure of the utility model, it is one deck ceramic powders constituent that is no more than 30um with diameter, one pyroconductivity (λ) 〉=50W/mK and thickness are no more than the metal base of 2mm, and be filled in one deck thermosetting cement between ceramic powders constituent and the metal base, and one deck constitutes as binding the gum of metal base with the heating workpiece, coat the crystal gap of this ceramic powders constituent by the cohesive force of this thermosetting cement, make the mutual gluing of ceramic powders, and with the metal base gluing, and reduce scope and thickness that the thermosetting gluing is wrapped up in ceramic powders, allow the part ceramic powders away from metal base still directly be exposed in the air, be able to the Metal Substrate face and be overlapped in the easy heat build-up of circuit position (heat build-up place of heating workpiece), just can lead heat radiation rapidly.
And this creator oneself finds, if with resinae colloid commonly used as gum of the present utility model, can to temporarily remove in for example circuit maintenance, must tear situations such as bond area heavily sticks, because of tying metal base and heating workpiece in resinae colloid solidification jail, will tear very thin metal base and tear slightly, heavily do not paste through pruning shaping again no matter have, all make the loses heat effect after heavily sticking clear, in addition and, no matter be the surface of tearing on heating workpiece or the metal base, also can stay the glue slag, must be removed, make again the binding face of pasting could be smooth, do not influence heat radiation function, corresponding this, it is the gum of said structure that this creator more works out to have suitable silica gel from viscosity, suitably can be poor owing to have because of electrostatic force build-up of pressure own from the silica gel of viscosity, make between Copper Foil and heating workpiece and produce attached wall phenomenon, attach naturally, slowly discharge to paste the bubble between sticking face voluntarily, make stick very firm.
Moreover the convenient heavily glutinous appropriate compound radiating structure of the utility model is used in electronic product more, and electronic product is more than installing in the dust free room, very close attachment can be because of dust disturb attaching on heating workpiece product can to make this kind silica gel, or produces a large amount of air chambers (air pocket) because of dust.
In addition, the convenient heavily glutinous appropriate compound radiating structure of the utility model because of its silica gel does not solidify, can have the ground of wound easily and does not tear off metal base and heating workpiece, does not have the glue slag residual fully, and cleaning is heavily pasted easyly, and tack-free again, makes and pastes that to stick to the workpiece that generates heat more appropriate.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the convenient heavily structural representation of glutinous appropriate compound radiating structure of the utility model.
Fig. 2 has or not the convenient heavily lampet test position cut-away view of glutinous appropriate compound radiating structure of coating the utility model.
Fig. 3 is the lampet coating measure of merit comparative graph that has or not the convenient heavily glutinous appropriate compound radiating structure of coating the utility model.
Test the utility model of Fig. 4 convenient heavily glutinous appropriate compound radiating structure porcelain powder constituent thing grain size and heat conduction influence curve figure.
Fig. 5 is that the convenient solid content of appropriate compound radiating structure that heavily sticks of test the utility model is to heat conduction and intensity effect curve chart.
The number in the figure explanation:
1.... metal base 10,11,12.... ceramic powders constituent
2.... aluminium Lamp housing 20.... metal base
3,4,5.... thermometric line sensing head 30.... thermosetting cement
6.... heating workpiece 40.... silica gel
Embodiment
Fig. 1 is the convenient heavily structural representation of glutinous appropriate compound radiating structure of the utility model, by shown in the figure as can be known, the heavily glutinous appropriate compound radiating structure of this kind of the utility model convenience, be no more than one deck ceramic powders constituent 10 of 30um by diameter, 11,12, one pyroconductivity (λ) 〉=50W/mK and thickness are no more than the metal base 20 of 2mm, and be filled in ceramic powders constituent 10,11,12 and metal base 20 between one deck thermosetting cement 30, and one deck is as binding metal base and heating workpiece, having suitable silica gel 40 from viscosity constitutes, cohesive force by this layer thermosetting cement 30 coats this layer ceramic powders constituent 10,11,12 crystal gap, make ceramic powders phase mutual connection, and with these metal base 20 gluings, and reduce scope and thickness that thermosetting gluing 30 is wrapped up in ceramic powders, allow the part ceramic powder away from metal base 20 still directly be exposed in the air, through testing this layer ceramic powders constituent 10,11,12, can be carborundum, aluminium nitride, zinc oxide, aluminium oxide or graphite, this metal base 20 then can be Copper Foil, aluminium sheet, tinfoil paper is even as the common metal materials such as the reflective cup of aluminium matter of lamp housing, be resin as for this layer thermosetting cement 30,-61 and silica gel 40 from viscosity between 1～300g/ English inch, just peeling intensity (tearing strength) is between 1～300g/ English inch.
This structure is tested, and method step is as follows:
Earlier with ceramic powders constituent 10,11,12 with after thermosetting cement 30 fully mixes, coat metal base 20 surfaces, measure affirmation heat conduction, radiating effect through measuring warm equipment earlier.
2. cooperate product to heat conduction and requirement of strength standard, adjust powder particle, solid content (ceramic powders constituent 10,11,12 account for ceramic powders constituent 10, the ratio that 11,12 hybrid thermosetting glue 30 are overall) corresponding each requirement of strength is carried out construction simulation, detects record one by one.
3. analyze and relatively find out optimum condition.
Heat conduction experiment (ASTM D5470) with american standard of testing material (ASTM) is that testing standard experimentizes, with granularity d50=1～100 μ m ceramic powders constituents 10,11, the metal base 20 of 12 coating aluminium sheets, thus in 28 ℃ of open circuit works done of ambient temperature through 20,40,80,100 minutes, each takes thermometric experiment once with the infrared camera detecting is example, puts out following comparison sheet in order:
The actual measurement of this promptly corresponding aforementioned the 1.th step draws:
1-1. take through the infrared camera detecting, sprayed on material can effectively evenly be spread heat whole metal base 20, form the convenient heavily metal base 20 of glutinous appropriate compound radiating structure of the utility model through being coated with pottery, it is directly proportional with hot temperature take the photograph brightness, no matter front or reverse side be all than the metal base 1 of existing uncoated pottery, the photo-thermal degree is all more weak and more be uniformly dispersed.
1-2. differ 18.4 ℃ (46.4 ℃-28 ℃, the relative field data behind the above table 100 minute) in thermal source and room temperature, do not have spraying after the stable state and have spraying person's lamp source that 3.5 ℃ of (46.4 ℃-42.9 ℃) gaps are arranged; About 19% (3.5 ℃/18.4 ℃) of cooling efficient.
1-3. positive back side thermal source and 12.6 ℃ of the room temperature temperature difference (40.6 ℃-28 ℃, the data of the relative field data behind the above table 100 minute) do not have spraying and have spraying person that 3.9 ℃ of (40.6 ℃-28 ℃) gaps are arranged after the stable state; About 30.9% (3.9 ℃/12.6 ℃) of metal base 1 shell cooling efficient that spraying is arranged.
The heavily glutinous appropriate compound radiating structure of this kind of the utility model convenience must be demonstrate,proved and circuit temperature can be more effectively reduced faster really, further testing lampet again is coated with the inboard and has or do not have the radiating effect that sprays out the heavily glutinous appropriate compound radiating structure of convenience of the present utility model, shown in the lampet test position cutaway view of Fig. 2, spraying is arranged and do not have the aforementioned ceramic powders constituent 10 of spraying respectively at inboard lampet, 11,12 appropriate location, aluminium Lamp housing 2 outside thermometric line sensing head 3 that is sticked, the inboard appropriate location thermometric line sensing head 4 that is sticked, and in the lamp source other appropriate location at least one the thermometric line sensing head 5 that be sticked, test process keeps aluminium Lamp housing 2 inboards that 5～7 ℃ of temperature difference are arranged, the result that test draws, lampet coating measure of merit comparative graph just like Fig. 3, along with the time of lighting pulls and supports length, the temperature line L1 that the lamp source produces, L2 constantly rises and falls, and whole section lighted in the process, there is more low temperature of temperature line L4 that temperature line L3 that spraying produces produces without spray treatment than aluminium Lamp housing 2 inboards aluminium Lamp housing 2 inboards, just cooling-down effect is better, the efficient of on average lowering the temperature through calculating proves the compound superiority of leading the heat-dissipating structure quick heat radiating of this kind of the utility model lamination type once more about 18.5%～25.9%.
More be deep into aforementioned the 2nd step and survey operation, carry out hardness test (ASTM D3363) with american standard of testing material (ASTM), hundred lattice tests (ASTM D3002 D3359), peel strength experiment (ASTM D413), with heat conduction experiment (ASTM D5470) analysis that intersects, test aforementioned ceramic powders constituent 10 simultaneously, 11,12 variable grain sizes cause the difference of radiating effect, and control aforementioned ceramic powders constituent 10,11,12 under certain fixedly particle diameter, change solid content (aforementioned ceramic powders constituent 10,11,12 account for the overall ratio of ceramic powders constituent 10,11,12 hybrid thermosetting glue 30), generation can be born the heat conduction performance of peel strength, detect record one by one, draw the porcelain powder constituent thing grain size and heat conduction influence curve figure of Fig. 4, the solid content of following Fig. 5 is to heat conduction and intensity effect curve chart.
Observe these statistic curves figure, just can enter aforementioned the 3rd step and find out optimum condition, connection and the optimum condition that can find out solid content and heat conduction and intensity from Fig. 5 are as follows:
Effectively promote 3-1. solid content increases heat conduction, but intensity also with decline.
Can reach 50W/m.K 3-2. solid content surpasses 67% above thermal conductance biography, solid content surpasses 92% intensity and can drop to below the 1Kg/cm, so ideal value should be between 70～90W%.
And it is as follows with heat conducting connection and optimum condition to find out porcelain powder constituent thing grain size from Fig. 5:
3-3. can obtain desirable thermal conductivity values more than aforementioned porcelain powder constituent thing 10,11,12 particle diameters 10 μ m, 30 μ m are highly stable later on.
Consider that in addition metal base 20 uses the heat-conducting effect of copper, aluminum metal, obtained real example, universal approval, and caloric receptivity and intensity are all proportional with thickness, area, volume only cooperates the flexible and cost of product to need adjustment, and paper tinsel, sheet material ideal thickness are in 1mm.
In sum, the heavily glutinous appropriate compound radiating structure of this kind of the utility model convenience really can be to the easy heat build-up of heating workpiece position, the rapider heat radiation function of leading.The utility model is on structural design, use practicality and cost benefit, it is required to meet industry development fully, and the structure that is disclosed also is to have unprecedented innovation structure, has novelty, creativeness, practicality, the regulation that meets relevant novel patent requirement is so mention application in accordance with the law.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.
Claims (11)
1. the heavily glutinous appropriate compound radiating structure of convenience is characterized in that, by
One deck diameter is no more than the ceramic powders constituent of 30 μ m;
One pyroconductivity (λ) 〉=50W/m K and thickness be no more than 2mm metal base,
One deck is filled in the thermosetting cement between ceramic powders constituent and the metal base,
One deck is as binding metal base and heating workpiece, having suitable silica gel from viscosity constitutes, coat the crystal gap of this layer ceramic powders constituent by the cohesive force of this layer thermosetting cement, make the mutual gluing of ceramic powders, and with this metal base gluing, and reduce scope and thickness that the thermosetting gluing is wrapped up in ceramic powders, allow the part ceramic powder away from metal base still directly be exposed in the air.
2. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1 is characterized in that: described silica gel be 1～300g/ inch from viscosity.
3. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is a carborundum.
4. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is an aluminium nitride.
5. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is a zinc oxide.
6. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is an aluminium oxide.
7. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is a graphite.
8. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described metal base is a copper.
9. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described metal base is an aluminium.
10. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described metal base is a tinfoil paper.
11. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described thermosetting cement is a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205470509U CN201937981U (en) | 2010-09-29 | 2010-09-29 | Conveniently re-glued composite heat-conducting and heat-dissipating structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010205470509U CN201937981U (en) | 2010-09-29 | 2010-09-29 | Conveniently re-glued composite heat-conducting and heat-dissipating structure |
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| CN201937981U true CN201937981U (en) | 2011-08-17 |
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| CN2010205470509U Expired - Fee Related CN201937981U (en) | 2010-09-29 | 2010-09-29 | Conveniently re-glued composite heat-conducting and heat-dissipating structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103373017A (en) * | 2012-04-25 | 2013-10-30 | 華廣光電股份有限公司 | Flexible ceramic base plate |
-
2010
- 2010-09-29 CN CN2010205470509U patent/CN201937981U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103373017A (en) * | 2012-04-25 | 2013-10-30 | 華廣光電股份有限公司 | Flexible ceramic base plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110817 Termination date: 20130929 |