CN201937981U - Convenient and re-adhesive composite heat conduction and heat dissipation structure - Google Patents

Abstract

A composite heat conduction and dissipation structure convenient for re-adhesion is composed of a layer of ceramic powder composition with diameter not more than 30 μm; a metal substrate with thermal conductivity (lambda) not less than 50W/m □ K and thickness not more than 2mm, a layer of thermosetting adhesive filled between the ceramic powder composition and the metal substrate, a layer of silica gel with proper self-viscosity for bonding the metal substrate and the heating workpiece, the cohesion of the thermosetting adhesive coats the crystal gap of the ceramic powder composition to bond the ceramic powder to each other and to the metal substrate, and the range and thickness of the thermosetting adhesive for bonding the ceramic powder are reduced, so that the part of the ceramic powder far away from the metal substrate is still exposed in the air. The utility model discloses can tear easily and leave metal substrate and the work piece that generates heat noninjuringly, do not have to glue the sediment completely and remain, clean again heavily pastes portably to not sticky hand makes to paste and glues to the work piece that generates heat more appropriate, can lead the heat dissipation rapidly, makes to adhere very firmly.

Description

Convenient and re-adhesive composite heat conduction and heat dissipation structure

technical field

The utility model relates to a composite conduction and heat dissipation structure which is convenient and heavy-glued.

Background technique

Physical movement or chemical reaction will generate heat, and it is inevitable that there will be heat output when work is done, but for electronic equipment, how to deal with heat is more important, because compared with other heat-generating workpieces in various industrial components, electronic components The heat-generating workpieces are more likely to be burned out by heat, so that the electrical appliance-related production and sales companies pay attention to the heat dissipation of electrical appliances.

And some electric heating elements in electrical appliances such as electric blankets and electric stoves use heat as a necessary function, and some circuit components such as light bulbs, high-efficiency LEDs, and computer CPUs do not use heat as a necessary function. It uses other functions such as lighting and computing as its own utility, but when it does work, it will produce heat. Regardless of whether it takes work and heat as its own necessary utility, it will generate heat, but the tolerance to heat is different. Different, if the heat generated is too much, the temperature around the working area exceeds the temperature required to maintain normal work, which will burn the working element itself and reduce the service life. , it is necessary to install a cooling device to help conduct heat dissipation.

As we all know, there are three ways to transfer heat: conduction, convection, and radiation, and conduction is the easiest to control and implement. Therefore, at present, copper or aluminum materials are mostly used to make heat sinks with multiple heat sinks. Its heat-absorbing material and increased surface area enhance the conduction and heat dissipation effect of heat accumulation in the circuit. However, the power efficiency of electronic components such as computer CPUs and high-efficiency LEDs is improved, and a greater amount of heat is generated. Aluminum, made of heat dissipation blocks with multiple heat dissipation fins is not enough to meet the needs of faster heat dissipation.

Existing heat sinks made of copper or aluminum only have heat dissipation capabilities limited to the heat transfer and heat dissipation capabilities of a single copper or aluminum material. For copper materials that dissipate heat better than aluminum, copper absorbs heat quickly, There are many, but the heat dissipation is still not ideal. There are still other composite materials that can absorb heat quickly and more, and the heat dissipation performance is better than copper. Therefore, the author found that ceramics have the characteristics of good heat absorption and heat dissipation. Ceramics, the surface of the ceramics in contact with the air is granulated, and the heat dissipation can be faster.

In view of the development of the need for structures with faster heat transfer and heat dissipation, the creator actively researched ways to improve it, and finally developed the utility model after some arduous creation process.

Utility model content

The main technical problem to be solved by this utility model is to overcome the above-mentioned defects existing in the prior art, and provide a convenient and heavy-bonded composite conduction and heat dissipation structure. There is no glue residue on metal substrates and heating parts, and it is easy to clean and reapply, and it is not sticky, so that it is more appropriate to stick to the heating parts. It can quickly conduct heat and make the adhesion extremely stable, and will not interfere with the paste due to dust. Attached, or a large number of air cells (big bubbles) are generated due to dust.

The technical scheme that the utility model solves its technical problem adopts is:

A convenient and heavy-bonded composite conduction and heat dissipation structure is characterized in that it is composed of a layer of ceramic powder with a diameter of no more than 30 μm; a metal base with a thermal conductivity (λ) ≥ 50W/m K and a thickness of no more than 2mm material, a layer of thermosetting adhesive filled between the ceramic powder composition and the metal substrate, and a layer of silica gel with an appropriate self-viscosity for bonding the metal substrate and the heating workpiece, which is covered by the cohesive force of the layer of thermosetting adhesive The gap between the crystals of the layered ceramic powder composition allows the ceramic powders to bond to each other and to the metal substrate, and reduces the range and thickness of the thermosetting adhesive to wrap the ceramic powder, so that the part of the ceramic powder far away from the metal substrate is still directly exposed in the air.

In the above-mentioned convenient and heavy-bonding composite heat conduction and heat dissipation structure, the self-viscosity of the silica gel is 1-300 g/inch.

In the aforementioned convenient and heavy-bonded composite conduction and heat dissipation structure, the ceramic powder composition is silicon carbide.

In the aforementioned convenient and heavy-bonded composite conduction and heat dissipation structure, the ceramic powder composition is aluminum nitride.

In the aforementioned convenient and heavy-bonded composite conduction and heat dissipation structure, the composition of the ceramic powder is zinc oxide.

In the aforementioned convenient and heavy-bonded composite conduction and heat dissipation structure, the composition of the ceramic powder is alumina.

The aforementioned convenient and heavy-bonded composite conduction and heat dissipation structure, wherein the ceramic powder composition is graphite.

In the above-mentioned convenient and heavy-bonded composite conduction and heat dissipation structure, the metal base material is copper.

In the aforementioned convenient and heavy-bonded composite conduction and heat dissipation structure, the metal base material is aluminum.

The aforementioned convenient and heavy-bonded composite heat conduction and heat dissipation structure, wherein the metal substrate is tin foil.

In the aforementioned convenient and heavy-glued composite heat conduction and heat dissipation structure, the thermosetting glue is resin.

The utility model is a convenient and heavy-bonded composite conduction and heat dissipation structure, which is composed of a layer of ceramic powder with a diameter of no more than 30um, a metal base material with a thermal conductivity (λ) ≥ 50W/m·K and a thickness of no more than 2mm. It is composed of a layer of thermosetting adhesive filled between the ceramic powder composition and the metal substrate, and a layer of adhesive used to bond the metal substrate and the heating workpiece. The ceramic powder composition is covered by the cohesive force of the thermosetting adhesive The gap between the crystals makes the ceramic powder bond to each other and the metal substrate, and reduces the range and thickness of the thermosetting adhesive to wrap the ceramic powder, so that the part of the ceramic powder far away from the metal substrate is still directly exposed to the air. The surface of the metal substrate is lapped on the heat-gathering part of the circuit (the heat-gathering place of the heat-generating workpiece), so that heat can be quickly dissipated.

And the author himself found that if the commonly used resin colloid is used as the adhesive of the present utility model, it will be temporarily removed for circuit maintenance, and the adhesive surface must be torn off and re-adhesive, etc., because the resin colloid is solidified It is bonded to the metal substrate and the heating workpiece, and if it is torn apart a little, it will tear the thin metal substrate. Regardless of whether it has been trimmed and re-attached, the heat dissipation effect after re-bonding will not be obvious. In addition, Regardless of whether it is a heat-generating workpiece or the torn surface on the metal substrate, there will be glue residue left, which must be removed so that the re-pasted surface can be smooth and the heat dissipation effect will not be affected. Correspondingly, the creator has developed the following The silica gel with proper self-viscosity is the back adhesive of the above structure. Since the silica gel with proper self-viscosity will cause a pressure difference due to its own electrostatic force, there will be a phenomenon of wall adhesion between the copper foil and the heating workpiece. The air bubbles between the adhesive surfaces make the adhesion extremely stable.

Furthermore, the convenient and heavy-glued composite conduction and heat-dissipating structure of the utility model is mostly used in electronic products, and electronic products are more installed in clean rooms. Dust interferes with attachment, or a large number of air cells (big bubbles) are generated due to dust.

In addition, the utility model has a convenient and re-adhesive composite heat-conducting and heat-dissipating structure. Because the silica gel does not solidify, it can be easily torn off the metal substrate and the heating workpiece without any damage, and there is no glue residue. hand, making it more secure to stick to the heat-generating workpiece.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Fig. 1 is a schematic structural view of the convenient and heavy-glued composite conduction and heat dissipation structure of the present invention.

Fig. 2 is the sectional view of the test position of the small lamp with or without coating the utility model's convenient and heavy-bonded composite conduction and heat dissipation structure.

Fig. 3 is a comparative graph of the coating effect test of the small lamp with or without coating the convenient and heavy-glued composite conduction and heat dissipation structure of the utility model.

Figure 4 is a graph showing the effect of particle size and heat conduction on the convenient and heavy-bonded composite heat-conducting and heat-dissipating structural porcelain powder of the utility model.

Fig. 5 is a graph showing the influence of solid content on heat conduction and strength of the convenient and heavy-bonded composite heat conduction and heat dissipation structure of the present invention.

Explanation of symbols in the figure:

1....Metal substrate 10, 11, 12....Ceramic powder composition

2....Aluminum lampshade 20....Metal substrate

3, 4, 5....Temperature measuring wire sensor head 30....Thermosetting glue

6....Heating workpiece 40....Silica gel

Detailed ways

Figure 1 is a schematic structural view of the convenient and heavy-bonded composite heat conduction structure of the present invention. As can be seen from the figure, the convenient and heavy-bonded composite heat conduction structure of the present invention consists of a layer of ceramic powder with a diameter of no more than 30um Compositions 10, 11, 12, a metal substrate 20 with a thermal conductivity (λ) ≥ 50 W/m·K and a thickness not exceeding 2 mm, and filled between the ceramic powder compositions 10, 11, 12 and the metal substrate 20 A layer of thermosetting adhesive 30, and a layer of silica gel 40 with an appropriate self-viscosity for bonding the metal substrate and the heating workpiece. The layer of ceramic powder composition 10, 11 is covered by the cohesive force of the layer of thermosetting adhesive 30, The crystal gap of 12 allows the ceramic powder to connect with each other and bond with the metal substrate 20, and reduces the range and thickness of the ceramic powder wrapped in the thermosetting adhesive 30, so that the part of the ceramic powder far away from the metal substrate 20 is still directly exposed to the air Among them, the tested ceramic powder composition 10, 11, 12 can be silicon carbide, aluminum nitride, zinc oxide, aluminum oxide or graphite, and the metal substrate 20 can be copper foil, aluminum plate, tin foil, or even General metal materials such as the aluminum reflective cup of the lamp housing, as for the layer of thermosetting adhesive 30 is resin, -61 and the self-viscosity of silica gel 40 is between 1 and 300g/inch, which is the peeling strength (tear strength) ) between 1 and 300 g/inch.

To test this structure, the method steps are as follows:

1. The ceramic powder composition 10, 11, 12 is fully mixed with the thermosetting adhesive 30, and then coated on the surface of the metal substrate 20, and first measured by a temperature measuring device to confirm the heat conduction and heat dissipation effects.

2. In accordance with the product requirements for thermal conductivity and strength, adjust the powder particles and solid content (the proportion of ceramic powder composition 10, 11, 12 to the overall proportion of ceramic powder composition 10, 11, 12 mixed thermosetting adhesive 30) corresponding to each strength requirement Simulate construction, test and record one by one.

3. Analyze and compare to find out the best conditions.

The heat conduction test (ASTM D5470) of the American Standards for Testing Materials (ASTM) is used as the test standard to carry out the experiment, and the metal substrate 20 of the aluminum plate is coated with the ceramic powder composition 10, 11, 12 with a particle size of d50=1～100 μm, thus in the environment After 20, 40, 80, and 100 minutes of working on the circuit at a temperature of 28°C, taking the experiment of detecting and shooting the temperature with an infrared camera as an example, the following comparison table is compiled:

This is corresponding to the actual measurement of the first step above:

1-1. After being detected and photographed by an infrared camera, the sprayed material can effectively spread heat evenly to the entire metal substrate 20, and the metal substrate 20 of the utility model is formed by coating ceramics with a composite heat conduction and heat dissipation structure that is convenient and reattachable. The captured luminance is proportional to the heat temperature, no matter on the front or back side, compared with the existing metal substrate 1 without ceramic coating, the light and heat are weaker and more uniformly dispersed.

1-2. When the difference between the heat source and the room temperature is 18.4°C (46.4°C-28°C, the relative field data in the above table after 100 minutes), the lamp source without spraying and spraying after steady state is 3.5°C (46.4°C-42.9°C) The gap; the cooling efficiency is about 19% (3.5°C/18.4°C).

1-3. The temperature difference between the front and back heat sources and room temperature is 12.6°C (40.6°C-28°C, the data in the relative field data after 100 minutes in the above table), and the difference between those without spraying and those with spraying after steady state is 3.9°C (40.6°C-28°C ) gap; the cooling efficiency of the sprayed metal substrate 1 shell is about 30.9% (3.9°C/12.6°C).

It has been proved that the convenient and heavy-glued composite conduction and heat-dissipating structure of the utility model can indeed reduce the temperature of the circuit more quickly and effectively, and then further test whether the inner side of the small lamp is sprayed or not, and the convenient and heavy-glued composite conductor of the utility model is obtained. The heat dissipation effect of the heat dissipation structure, as shown in the cross-sectional view of the test position of the small lamp in Figure 2, is attached to the appropriate position outside the aluminum lamp housing 2 of the inner small lamp with spraying and without spraying the aforementioned ceramic powder composition 10, 11, 12 Line sensor head 3, a temperature measuring line sensor head 4 attached to an appropriate position on the inner side, and at least one temperature measuring line sensor head 5 attached to an appropriate position next to the light source. During the test process, the inner side of the aluminum lamp housing 2 was kept to have 5~ 7°C temperature difference, the test results, as shown in Figure 3, the small lamp coating effect test comparison curve, as the lighting time is long, the temperature lines L1 and L2 generated by the light source continue to fluctuate, and the entire point During the lighting process, the temperature line L3 produced by spraying on the inner side of the aluminum lamp housing 2 is lower than the temperature line L4 produced by the unsprayed inner side of the aluminum lamp housing 2, that is, the cooling effect is better, and the average cooling efficiency is 18.5%. ~25.9%, proving once again the superiority of the laminated composite heat conduction and heat dissipation structure of the present invention for rapid heat dissipation.

Go deeper into the aforementioned second step for actual measurement operations, and use the American Standards for Testing Materials (ASTM) to conduct hardness tests (ASTM D3363), hundred-grid tests (ASTM D3002 D3359), peel strength tests (ASTM D413), and heat conduction tests (ASTM D5470 ) phase cross analysis, while testing the difference in heat dissipation effect caused by different particle sizes of the aforementioned ceramic powder compositions 10, 11, and 12, and controlling the aforementioned ceramic powder compositions 10, 11, and 12 under a certain fixed particle size to change the solid content (the aforementioned The ceramic powder composition 10, 11, 12 accounts for the overall proportion of the ceramic powder composition 10, 11, 12 mixed with thermosetting adhesive 30), produces a heat conduction performance that can withstand the peel strength, and checks and records one by one to obtain the ceramic powder composition in Figure 4 The influence curve of particle size and heat conduction is the same as the influence curve of solid content on heat conduction and strength in Figure 5.

Observing these statistical curves, you can enter the third step to find the optimal conditions. From Figure 5, you can find out the relationship between solid content, heat conduction and strength, and the optimal conditions are as follows:

3-1. The heat conduction is effectively improved with the increase of solid content, but the strength also decreases accordingly.

3-2. If the solid content exceeds 67%, the thermal conductivity can reach 50W/m.K, and if the solid content exceeds 92%, the strength will drop below 1Kg/cm, so the ideal value should be between 70-90W%.

From Figure 5, it can be found that the relationship between the particle size of the porcelain powder composition and the heat conduction and the optimal conditions are as follows:

3-3. The ideal thermal conductivity value can be obtained when the particle size of the aforementioned porcelain powder composition 10, 11, and 12 is above 10 μm, and it is very stable after 30 μm.

In addition, considering the heat conduction effect of copper and aluminum as the metal substrate 20, it has been proven and universally recognized, and the heat absorption and strength are proportional to the thickness, area, and volume. Only adjustments are required to match product flexibility and cost. Foil , The ideal thickness of the sheet is within 1mm.

To sum up, the convenient and heavy-glued compound conduction and heat dissipation structure of the present invention can indeed conduct and dissipate heat more quickly to the parts of the heat-generating workpiece that are prone to heat accumulation. The utility model fully meets the needs of industrial development in terms of structural design, practicability and cost-effectiveness, and the disclosed structure also has an unprecedented innovative structure, novelty, creativity and practicability, and meets the requirements of the relevant new patent requirements stipulations, so the application is filed in accordance with the law.

The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model, All still belong to within the scope of the technical solution of the utility model.

Claims (11)

1. the heavily glutinous appropriate compound radiating structure of convenience is characterized in that, by

One deck diameter is no more than the ceramic powders constituent of 30 μ m;

One pyroconductivity (λ) 〉=50W/m K and thickness be no more than 2mm metal base,

One deck is filled in the thermosetting cement between ceramic powders constituent and the metal base,

One deck is as binding metal base and heating workpiece, having suitable silica gel from viscosity constitutes, coat the crystal gap of this layer ceramic powders constituent by the cohesive force of this layer thermosetting cement, make the mutual gluing of ceramic powders, and with this metal base gluing, and reduce scope and thickness that the thermosetting gluing is wrapped up in ceramic powders, allow the part ceramic powder away from metal base still directly be exposed in the air.

2. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1 is characterized in that: described silica gel be 1～300g/ inch from viscosity.

3. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is a carborundum.

4. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is an aluminium nitride.

5. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is a zinc oxide.

6. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is an aluminium oxide.

7. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described ceramic powders constituent is a graphite.

8. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described metal base is a copper.

9. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described metal base is an aluminium.

10. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described metal base is a tinfoil paper.

11. the heavily glutinous appropriate compound radiating structure of convenience according to claim 1, it is characterized in that: described thermosetting cement is a resin.

Images