CN102223781A - Laminated compound heat conducting and radiating structure - Google Patents
Laminated compound heat conducting and radiating structure Download PDFInfo
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- CN102223781A CN102223781A CN2010101480012A CN201010148001A CN102223781A CN 102223781 A CN102223781 A CN 102223781A CN 2010101480012 A CN2010101480012 A CN 2010101480012A CN 201010148001 A CN201010148001 A CN 201010148001A CN 102223781 A CN102223781 A CN 102223781A
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- dissipating structure
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Abstract
The invention discloses a laminated compound heat conducting and radiating structure, comprising a layer of ceramic powder composition, a metal substrate and a layer of thermosetting cement, wherein the diameter of the ceramic powder composition is not more than 30mum; the metal substrate has thermal conductivity (lambda) not less than 50W/m.K and thickness not more than 2mm; and the ceramic powder composition is filled between the ceramic powder composition and the metal substrate. A crystal clearance of the ceramic powder composition is coated by the cohesion of the thermosetting cement, so that ceramic powder is mutually bonded and bonded with the metal substrate; the range and the thickness for bonding the ceramic powder by the thermosetting cement are respectively narrowed and reduced; and part of ceramic powder away from the metal substrate is still directly exposed in the air, so that the meal substrate surface is lapped to the part of the circuit, at which heat is easy to collect, and the quickness in heat conduction and radiation can be realized.
Description
Technical field
The present invention relates to the compound heat-dissipating structure of leading of a kind of lamination type.
Background technology
Any circuit is as long as a work done all can be given birth to heat, physically the size that electrical equipment is produced merit just is defined as voltage and multiply by electric current, and circuit one starts, the resistance value that the current squaring that produces multiply by this circuit self multiply by action time again, multiply by certain adjustment coefficient of the unit of selecting for use again, be exactly the total amount of heat of circuit generation during this period of time, so circuit does work and generation heat coexists, the heat of the big more generation of work done is many more.
Quite a lot of as electrical blanket, electric heating element in the electrical equipment such as electric furnace, the effectiveness of work done heating as necessity own, also some is as bulb, high light efficiency LED, circuit elements such as computer CPU, do not go up essential effectiveness as using with heating, but with other such as illumination, functions such as computing are as effectiveness place own, no matter but whether with the effectiveness of work done heating as necessity own, heat is given birth in the capital, the heat more than one that produces, the work environment temperature is surpassed keep the required temperature of operate as normal, just on the contrary can this work done element of scaling loss itself, reduce useful life, therefore circuit is easily gathered the heat place and install that to help to pass the heat abstractor that dispels the heat be necessary additional.
And the transmission of heat is had conduction, convection current, three kinds of modes of radiation, implement with the easiest control of conduction again, therefore many at present with copper or aluminium, the radiating block of making the divergent stamen of many heat radiations pastes repeatedly circuit heat build-up position, with the heat loss through conduction effect of its easy surface area reinforcement of absorbing heat material and increasing to the circuit heat build-up, yet, the power usefulness of imitating electronic components such as LED as computer CPU, high light is enhanced more, produce the greater amount temperature, make to have now with copper or aluminium, the radiating block of making many heat radiating fins stamen has been not enough to deal with the more demand of quick heat radiating.
In view of developing circuit is passed the works demand faster of dispelling the heat, this creator is that active research is improved, and through some hard invention process, develops the present invention finally.
The radiating block that existing light is made with copper or aluminium; its heat-sinking capability can be confined to biography, the heat-sinking capability of single copper or aluminium itself; with regard to the heat radiation copper material stronger than aluminium, the copper heat absorption is fast, many, but it is still undesirable to dispel the heat; still have other composite material can absorb heat soon, many; and heat radiation is better than the copper performance, so the inventor discovers that pottery promptly has all good characteristic of suction heat radiation, adheres to pottery with copper or other metal; the surface particlesization that pottery is contacted with air, heat radiation just can be faster.
Summary of the invention
Technical problem underlying to be solved by this invention is, overcomes the above-mentioned defective that prior art exists, and provides a kind of lamination type the compound heat-dissipating structure of leading, and the present invention is overlapped in the easy heat build-up of circuit position with the Metal Substrate face, can lead heat radiation rapidly.
The technical solution adopted for the present invention to solve the technical problems is:
The compound heat-dissipating structure of leading of a kind of lamination type is characterized in that, comprising: one deck diameter is no more than the ceramic powders constituent of 30 μ m; One pyroconductivity (λ) 〉=50W/m.K and thickness are no more than the metal base of 2mm, and the thermosetting cement that one deck is filled between ceramic powders constituent and the metal base constitutes, coat the crystal gap of this layer ceramic powders constituent by the cohesive force of this layer thermosetting cement, make the mutual gluing of ceramic powders, and with this metal base gluing, and reduce scope and thickness that the thermosetting gluing is wrapped up in ceramic powders, allow the part ceramic powder away from metal base still directly be exposed in the air, be overlapped in the easy heat build-up of circuit position with its Metal Substrate face thus and lead heat radiation.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein the ceramic powders constituent is a carborundum.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein the ceramic powders constituent is an aluminium nitride.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein the ceramic powders constituent is a zinc oxide.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein the ceramic powders constituent is an aluminium oxide.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein the ceramic powders constituent is a graphite.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein metal base is a copper.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein metal base is an aluminium.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein metal base is a tinfoil paper.
The compound heat-dissipating structure of leading of aforesaid lamination type, wherein thermosetting cement is a resin.
The invention has the beneficial effects as follows that the present invention is overlapped in the easy heat build-up of circuit position with the Metal Substrate face, can lead heat radiation rapidly.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the compound structural representation of leading heat-dissipating structure of lamination type of the present invention.
Fig. 2 has or not the compound infrared thermometry comparison diagram of circuit work done after 100 minutes of leading heat-dissipating structure of coating lamination type of the present invention.
Fig. 3 has or not the compound lampet test position cutaway view of leading heat-dissipating structure of coating lamination type of the present invention.
Fig. 4 has or not the compound lampet coating measure of merit comparative graph of leading heat-dissipating structure of coating lamination type of the present invention.
Fig. 5 is that the compound solid content of heat-dissipating structure of leading of test lamination type of the present invention is to heat conduction and intensity effect curve chart.
Fig. 6 is compound heat-dissipating structure porcelain powder constituent thing grain size and the heat conduction influence curve figure of leading of test lamination type of the present invention.
The number in the figure explanation:
1.... metal base 10,11,12.... ceramic powders constituent
2.... aluminium Lamp housing 20.... metal base
3,4,5.... thermometric line sensing head 30.... thermosetting cement
Embodiment
Fig. 1 is the compound structural representation of leading heat-dissipating structure of lamination type of the present invention, by the compound heat-dissipating structure of leading of this kind of the present invention lamination type as can be known shown in the figure, be no more than one deck ceramic powders constituent 10 of 30um by diameter, 11,12, one pyroconductivity (λ) 〉=50W/m.K and thickness are no more than the metal base 20 of 2mm, and be filled in ceramic powders constituent 10,11,12 and metal base 20 between one deck thermosetting cement 30 constitute, cohesive force by this layer thermosetting cement 30 coats this layer ceramic powders constituent 10,11,12 crystal gap, make ceramic powders phase mutual connection, and with these metal base 20 gluings, and reduce scope and thickness that thermosetting gluing 30 is wrapped up in ceramic powders, allow the part ceramic powder away from metal base 20 still directly be exposed in the air, through testing this layer ceramic powders constituent 10,11,12, can be carborundum, aluminium nitride, zinc oxide, aluminium oxide or graphite, this metal base 20 then can be Copper Foil, aluminium sheet, tinfoil paper, even the common metal materials such as the reflective cup of aluminium matter as lamp housing are resin as for this layer thermosetting cement 30.
This structure is tested, and method step is as follows:
Earlier with ceramic powders constituent 10,11,12 with after thermosetting cement 30 fully mixes, coat metal base 20 surfaces, measure affirmation heat conduction, radiating effect through measuring warm equipment earlier.
2. cooperate product to heat conduction and requirement of strength standard, adjust corresponding each requirement of strength of powder particle, solid content (ceramic powders constituent 10,11,12 accounts for the overall ratio of ceramic powders constituent 10,11,12 hybrid thermosetting glue 30) and carry out construction simulation, detect record one by one.
3. analyze and relatively find out optimum condition.
Heat conduction experiment (ASTM D5470) with american standard of testing material (ASTM) is that testing standard experimentizes, metal base 20 with granularity d50=1～100 μ m ceramic powders constituents, 10,11,12 coating aluminium sheets, thus in 28 ℃ of open circuit works done of ambient temperature through 20,40,80,100 minutes, each takes thermometric experiment once with the infrared camera detecting is example, puts in order out following than commentaries on classics table:
The actual measurement of this promptly corresponding aforementioned the 1.th step draws:
1-1. take through the infrared camera detecting, sprayed on material can effectively evenly be spread heat whole metal base 20, only lift as the infrared thermometry of circuit work done after 100 minutes of Fig. 2 relatively according to shown in, form the compound metal base 20 of leading heat-dissipating structure of lamination type of the present invention through being coated with pottery, it is directly proportional with hot temperature take the photograph brightness, no matter front or reverse side be all than the metal base 1 of existing uncoated pottery, the photo-thermal degree is all more weak and more be uniformly dispersed.
1-2. differ 18.4 ℃ (46.4 ℃-28 ℃, the relative field data behind the above table 100 minute) in thermal source and room temperature, do not have spraying after the stable state and have spraying person's lamp source that 3.5 ℃ of (46.4 ℃-42.9 ℃) gaps are arranged; About 19% (3.5 ℃/18.4 ℃) of cooling efficient.
1-3. positive back side thermal source and 12.6 ℃ of the room temperature temperature difference (40.6 ℃-28 ℃, the data of the relative field data behind the above table 100 minute) do not have spraying and have spraying person that 3.9 ℃ of (40.6 ℃-28 ℃) gaps are arranged after the stable state; About 30.9% (3.9 ℃/12.6 ℃) of metal base 1 shell cooling efficient that spraying is arranged.
The compound heat-dissipating structure of leading of lamination type of the present invention can more effectively reduce circuit temperature really faster, further testing lampet again is coated with the inboard and has or do not have and spray out the compound radiating effect of leading heat-dissipating structure of lamination type of the present invention, shown in the lampet test position cutaway view of Fig. 3, spraying is arranged and do not have the aforementioned ceramic powders constituent 10 of spraying respectively at inboard lampet, 11,12 appropriate location, aluminium Lamp housing 2 outside thermometric line sensing head 3 that is sticked, the inboard appropriate location thermometric line sensing head 4 that is sticked, and in the lamp source other appropriate location at least one the thermometric line sensing head 5 that be sticked, test process keeps aluminium Lamp housing 2 inboards that 5～7 ℃ of temperature difference are arranged, the result that test draws, lampet coating measure of merit comparative graph just like Fig. 4, along with the time of lighting pulls and supports length, the temperature line L1 that the lamp source produces, L2 constantly rises and falls, and whole section lighted in the process, there is more low temperature of temperature line L4 that temperature line L3 that spraying produces produces without spray treatment than aluminium Lamp housing 2 inboards aluminium Lamp housing 2 inboards, just cooling-down effect is better, the efficient of on average lowering the temperature through calculating proves the compound superiority of leading the heat-dissipating structure quick heat radiating of lamination type of the present invention once more about 18.5%～25.9%.
More be deep into aforementioned the 2.th step and survey operation, carry out hardness test (ASTM D3363) with american standard of testing material (ASTM), hundred lattice tests (ASTM D3002 D3359), peel strength experiment (ASTM D413), with heat conduction experiment (ASTM D5470) analysis that intersects, test aforementioned ceramic powders constituent 10 simultaneously, 11,12 variable grain sizes cause the difference of radiating effect, and control aforementioned ceramic powders constituent 10,11,12 under certain fixedly particle diameter, change solid content (aforementioned ceramic powders constituent 10,11,12 account for ceramic powders constituent 10,11, the ratio that 12 hybrid thermosetting glue 30 are overall), generation can be born the heat conduction performance of peel strength, detect record one by one, the solid content that draws Fig. 5 is to heat conduction and intensity effect curve chart, with porcelain powder constituent thing grain size and the heat conduction influence curve figure of Fig. 6.
Observe these statistic curves figure, just can enter aforementioned the 3rd step and find out optimum condition, connection and the optimum condition that can find out solid content and heat conduction and intensity from Fig. 5 are as follows:
Effectively promote 3-1. solid content increases heat conduction, but intensity also descends thereupon.
Can reach 50W/m.K 3-2. solid content surpasses 67% above thermal conductance biography, solid content surpasses 92% intensity and can drop to below the 1Kg/cm, so ideal value should be between 70～90W%.
And it is as follows with heat conducting connection and optimum condition to find out porcelain powder constituent thing grain size from Fig. 6:
3-3. can obtain desirable thermal conductivity values more than aforementioned porcelain powder constituent thing 10,11,12 particle diameters 10 μ m, 30 μ m are highly stable later on.
Consider that in addition metal base 20 uses the heat-conducting effect of copper, aluminum metal, obtained real example, universal approval, and caloric receptivity and intensity are all proportional with thickness, area, volume only cooperates the flexible and cost of product to need adjustment, and paper tinsel, sheet material ideal thickness are in 1mm.
The compound heat-dissipating structure of leading of lamination type of the present invention really can be to the easy heat build-up of circuit position, the rapider heat radiation function of leading.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
In sum, the present invention is on structural design, use practicality and cost benefit, it is required to meet industry development fully, and the structure that is disclosed also is to have unprecedented innovation structure, have novelty, creativeness, practicality, the regulation that meets relevant patent of invention important document is so mention application in accordance with the law.
Claims (10)
1. the compound heat-dissipating structure of leading of lamination type is characterized in that, comprising:
One deck diameter is no more than the ceramic powders constituent of 30 μ m;
One pyroconductivity (λ) 〉=50W/m.K and thickness are no more than the metal base of 2mm, and the thermosetting cement that one deck is filled between ceramic powders constituent and the metal base constitutes, coat the crystal gap of this layer ceramic powders constituent by the cohesive force of this layer thermosetting cement, make the mutual gluing of ceramic powders, and with this metal base gluing, and reduce scope and thickness that the thermosetting gluing is wrapped up in ceramic powders, allow the part ceramic powder away from metal base still directly be exposed in the air, be overlapped in the easy heat build-up of circuit position with its Metal Substrate face thus and lead heat radiation.
2. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described ceramic powders constituent is a carborundum.
3. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described ceramic powders constituent is an aluminium nitride.
4. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described ceramic powders constituent is a zinc oxide.
5. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described ceramic powders constituent is an aluminium oxide.
6. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described ceramic powders constituent is a graphite.
7. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described metal base is a copper.
8. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described metal base is an aluminium.
9. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described metal base is a tinfoil paper.
10. the compound heat-dissipating structure of leading of lamination type according to claim 1 is characterized in that: described thermosetting cement is a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101480012A CN102223781A (en) | 2010-04-16 | 2010-04-16 | Laminated compound heat conducting and radiating structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101480012A CN102223781A (en) | 2010-04-16 | 2010-04-16 | Laminated compound heat conducting and radiating structure |
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| CN102223781A true CN102223781A (en) | 2011-10-19 |
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| CN2010101480012A Pending CN102223781A (en) | 2010-04-16 | 2010-04-16 | Laminated compound heat conducting and radiating structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103373017A (en) * | 2012-04-25 | 2013-10-30 | 華廣光電股份有限公司 | Flexible ceramic base plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2341603A (en) * | 1998-09-16 | 2000-03-22 | Jeffery Boardman | Method of applying glass ceramic dielectric layers to metal substrates |
| CN1717966A (en) * | 2002-05-16 | 2006-01-04 | 阿尔泰工程解决有限责任公司 | Retaining and heat dissipating structure for electronic equipment |
| CN101520287A (en) * | 2009-03-31 | 2009-09-02 | 北京科技大学 | Method for preparing radiator element with complicated shape |
-
2010
- 2010-04-16 CN CN2010101480012A patent/CN102223781A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2341603A (en) * | 1998-09-16 | 2000-03-22 | Jeffery Boardman | Method of applying glass ceramic dielectric layers to metal substrates |
| CN1717966A (en) * | 2002-05-16 | 2006-01-04 | 阿尔泰工程解决有限责任公司 | Retaining and heat dissipating structure for electronic equipment |
| CN101520287A (en) * | 2009-03-31 | 2009-09-02 | 北京科技大学 | Method for preparing radiator element with complicated shape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103373017A (en) * | 2012-04-25 | 2013-10-30 | 華廣光電股份有限公司 | Flexible ceramic base plate |
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Application publication date: 20111019 |