201134933 四、指定代表圖： (一) 本案指定代表圖為··第（一）圖。 (二) 本代表圖之元件符號簡單說明： 陶瓷粉末組成物 20.. ..金屬基材 30.. ..熱固性膠 五、 t案若有化學式時，請揭示最能顯示發明特徵的化學式 六、 發明說明： 鲁 【發明所屬之技術領域】 本發明此_層式複合導散熱構造，係為熱固性膝將 陶竟粉末組成齡金屬紐，再由金屬紐搭齡電 路易聚熱雜’以迅速餘之創新導散熱結髓之技術者。 【先前技術】 任何電路只要-作功都會生熱，物理上對電器產生功 的大小就定義為電壓乘以電流，且電路一開動，產生出的 • 電流平方乘以該電路自身的電阻值再乘以作用時間，再乘 以選科位的-定調整係數，就是這段時間電路產生的總 熱量，因此電路做功與產生熱同在，作功越大產生的熱量 越多。 ▲好些如電毯、電爐等電器内的電熱元件，把作功發熱 當成本身必要的效用，也有些如電燈泡、高光效、電 制CPU等電路元件，不以發熱作為使用上必需的效用，而 是以其它諸如照明、運算等功能作為本身效用所在，但是 201134933 不論是=以作功發熱當成本身必要的效用，都會生熱產 生的熱量-多，使工作周圍溫度超過維持正常工作所需的 /皿度就反而會燒抽該作功元件本身，降低使用壽命，因 此對電路祕聚熱處加裝幫轉雜之散絲置是必要的。 而對熱的傳遞有傳導、對流、輻射三種方式，又以傳 導最容易控制實施’因此目前多以銅或練，製成多散熱 歧蕊之散熱塊貼疊電路聚熱部位，以其易吸酣質及增多 • 絲面積加強對電路聚熱的料散熱效果，然而，如_ CPU、強光效LED等電子元件的轉效能越被提高，產生 更大里熱度’使習見以銅或轉，製成多散賴蕊之散熱 塊已不足以應付更快速散熱的需求。 鑑於發展出對電路傳散熱更快的結構物需求，本人乃 積極研究改進之道，經過一番銀辛的發明過程，終於有本 發明產生。 • 【發明内容】 抑習見光以_鱗製成的雜塊，其錄能力會侷限 在早-銅或紹材本身的傳、散熱能力，就以散熱比紹更強 的銅材來說，銅吸熱快、多，但散熱仍不理想，仍有其他 複合材料能吸熱快、多，且散熱比鋼表現更佳，因此本發 明人研究發現喊即有吸散熱都良好的特性，將銅或其他 金屬附著陶:光，使喊與空氣細之表面顆粒化，散熱就 能更快。 201134933 由而發明出此種積層式複合導散熱構造，其係以直徑 不超過30um之一層陶瓷粉末組成物、一熱傳導率（λ)2 50W/m*K且厚度不超過2咖之金屬基材，及填充於陶竞粉末 組成物與金屬基材之間的—層個性膠所構成，藉由該層熱 固性膠之内聚力包覆該層陶瓷粉末組成物之晶體間隙，使陶 瓷籾末相互黏接，並與該金屬基材黏接，且減少熱固性膠黏 裹陶瓷粉末之範圍及厚度，讓遠離金屬基材之部分陶瓷粉 末仍直接暴露於空氣中，由此以金屬基材面搭接於電路易 聚熱部位，就能迅速導散熱，此為本發明之目的。 至於本發明之詳細構造、效能實驗、作用與功效，則 參照下列依附圖所作之說明即可得到完全的了解。 【實施方式】 第一圖為本發明積層式複合導散熱構造之結構示意 圖，由圖所示可知本發明此種積層式複合導散熱構造，由 直徑不超過30um之一層陶瓷粉末組成物1〇, u，12、一熱傳 導率（又）^5(^/111.1(且厚度不超過2伽1之金屬基材2(),及填 充於陶瓷粉末組成物10,11，12與金屬基材2〇之間的一層 熱固性膠30所構成’藉由該層熱固性膠3〇之内聚力包 覆該層陶瓷粉末組成物10,11，12之晶體間隙，使陶究粉 末相互接’並與該金屬基材20黏接’且減少熱固性膠勘 30裹陶竟粉末之範圍及厚度’讓遠離金屬基材2〇之部分 陶瓷粉末仍直接暴露於空氣中，經試驗該層陶曼粉末級 201134933 成物10,11’ 12 ’可為碳化石夕、氮化銘、氧化鋅、氧化叙或 石墨，而該金屬基材20則可為鋼羯、麵板、锡箱，甚或如 燈殼之铭質反光罩杯等-般金屬材料，至於該層熱固性移 30即為樹酉旨。 將此結構進行測試，方法步驟如下： 1. 先將陶錢末、喊物10,11，12與熱HJ性膠3Q充分混 合後’塗佈於金屬基材20表面’先經量測溫設備量測 ，確認導熱、散熱效果。 2. 配合產品對導熱及強度要求標準，調整粉末顆粒、固 含量（陶瓷粉末組成物10,11，12占陶瓷粉末組成物 10,11，12混合熱固性膠30總體之比例）對應各強度 要求進行模擬施工，逐一檢測紀錄。 3. 分析比較找出最佳條件。 以美國材料測試標準(ASTM)之熱傳導實驗（ASTM D5470)為測試標準進行實驗，將粒度d50=l~100ym陶瓷 粉末組成物10,11，12塗佈鋁板之金屬基材20，由此在環 境溫度28°C開啟電路作功經過20、40、80、1〇〇分鐘，各 以紅外線攝影機偵測拍攝測溫一次的實驗為例，整理出如 下比較表： 201134933201134933 IV. Designated representative map: (1) The representative representative of the case is the picture (1). (2) Brief description of the symbol of the representative figure: Ceramic powder composition 20.... Metal substrate 30.... thermosetting adhesive 5. If there is a chemical formula, please disclose the chemical formula 6 which best shows the characteristics of the invention.发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明Yu Zhixin is the technology leader of thermal conduction. [Prior Art] Any circuit that generates heat as long as it performs work, the size of the work that is physically generated for the appliance is defined as the voltage multiplied by the current, and the circuit is activated, and the square of the current is multiplied by the resistance of the circuit itself. Multiplying the action time and multiplying by the selected adjustment factor of the selected position is the total heat generated by the circuit during this time. Therefore, the work done by the circuit is the same as the heat generated, and the more work is generated, the more heat is generated. ▲There are some electric heating elements in electric appliances such as electric blankets and electric furnaces, which are necessary for the work of heating, but also some circuit components such as electric bulbs, high-efficiency effects, and electric CPUs, and do not use heat as a necessary function in use. Other functions such as lighting, computing, etc. are used as their own functions, but 201134933, whether it is the function of the heat of the work, the heat generated by the heat - the temperature around the work exceeds the temperature required to maintain normal work / Instead, the dish will burn the work element itself and reduce the service life. Therefore, it is necessary to install a loose wire for the circuit. There are three ways of conduction, convection and radiation to the heat transfer, and the conduction is the easiest to control. Therefore, at present, the heat-dissipating block of the heat-dissipating block is made of copper or plastic, and it is easy to suck. Tantalum and increase • The wire area enhances the heat dissipation effect of the heat collecting material of the circuit. However, the conversion efficiency of electronic components such as _CPU and strong light effect LED is improved, resulting in a larger heat degree, which makes it possible to use copper or turn. The heat sink block of Cheng Duo is not enough to cope with the need for faster heat dissipation. In view of the development of the structural requirements for faster heat dissipation from the circuit, I have actively studied the improvement. After some inventions, the invention was finally produced. • 【Contents】 Inhibition of the lumps made of _ scales, the recording ability will be limited to the transmission capacity of the early-copper or the material itself, and the copper is stronger than the heat. The heat absorption is fast and many, but the heat dissipation is still not ideal. There are still other composite materials that can absorb heat faster and more, and the heat dissipation is better than steel. Therefore, the inventors have found that the shouting has the characteristics of good heat dissipation, copper or other. Metal attached to the pottery: light, making the shouting and air fine surface granulate, heat dissipation can be faster. 201134933 Invented the laminated composite heat-conducting structure, which is a ceramic powder composition having a diameter of not more than 30um, a metal substrate having a thermal conductivity (λ) of 2 50W/m*K and a thickness of not more than 2 And a layer of individual glue filled between the ceramic composition of the ceramics and the metal substrate, and the crystal gap of the ceramic powder composition is coated by the cohesive force of the layer of the thermosetting glue to bond the ceramic ends to each other. And bonding with the metal substrate, and reducing the range and thickness of the thermosetting adhesive-coated ceramic powder, so that part of the ceramic powder away from the metal substrate is still directly exposed to the air, thereby overlapping the metal substrate surface with the circuit It is easy to heat the part, and it can quickly guide heat dissipation, which is the object of the invention. As for the detailed construction, performance experiment, function and efficacy of the present invention, a complete understanding can be obtained by referring to the following description made with reference to the accompanying drawings. [Embodiment] The first figure is a schematic structural view of a laminated composite heat conducting structure of the present invention. As shown in the figure, the laminated composite heat conducting structure of the present invention is composed of a ceramic powder composition having a diameter of not more than 30 um. u, 12, a thermal conductivity (again) ^ 5 (^ / 111.1 (and a thickness of no more than 2 gamma of metal substrate 2 (), and filled with ceramic powder composition 10,11,12 and metal substrate 2〇 A layer of thermosetting glue 30 is formed to cover the crystal gap of the layer of ceramic powder composition 10, 11, 12 by the cohesive force of the layer of thermosetting glue 3, so that the ceramic powder is connected to each other and the metal substrate 20 bonding 'and reduce the range and thickness of the thermosetting adhesive 30 wrapped ceramic powder 'Let the ceramic powder away from the metal substrate 2〇 is still directly exposed to the air, after testing the layer of Tauman powder grade 201134933 10 11' 12 ' can be carbon carbide, nitriding, zinc oxide, oxidized or graphite, and the metal substrate 20 can be a steel slab, a panel, a tin box, or even an inscription reflector cup such as a lamp housing. - As a general metal material, as for the thermosetting shift of the layer 30, it is a tree. Test this structure, the method steps are as follows: 1. First mix the Tao Qian, shouts 10,11,12 with hot HJ glue 3Q and then 'coat on the surface of metal substrate 20' first temperature measurement equipment Measurement, confirm the heat conduction and heat dissipation effect 2. Adjust the powder particle and solid content according to the product's requirements for heat conduction and strength (ceramic powder composition 10,11,12 accounts for ceramic powder composition 10,11,12 mixed thermosetting glue 30 The overall proportion) simulates the construction according to each strength requirement, and records the records one by one. 3. Analyze and compare to find the best conditions. Experiment with the American Material Testing Standard (ASTM) heat conduction test (ASTM D5470) as the test standard, the particle size d50 =l~100ym ceramic powder composition 10,11,12 coated metal substrate 20 of aluminum plate, thereby opening circuit work at ambient temperature of 28 ° C for 20, 40, 80, 1 minute, each with infrared camera As an example of detecting an experiment that takes a temperature measurement, the following comparison table is compiled: 201134933
20分鐘後 40分鐘後 80分鐘後 100分鐘後 正 面 無塗佈 45. 6°C 47. 2°C 46. 9°C 46.4°C 有塗佈 45. 5°C 一---- 溫 44. 5°C 44. 7°C 42. 9°C 背 面 無塗佈 44. 7°C -------- 42. 2°C 43. 2°C 40. 6°C 溫 有塗佈 41.2〇C 38. 5°C 40. 6°C 36. 7°C 此即對應前述第1.步驟之實測得出:After 40 minutes, after 40 minutes, after 80 minutes, after 100 minutes, the front side is not coated 45. 6 ° C 47. 2 ° C 46. 9 ° C 46.4 ° C coated 45. 5 ° C a ----- temperature 44. 5°C 44. 7°C 42. 9°C No coating on the back side 44. 7°C -------- 42. 2°C 43. 2°C 40. 6°C Temperature coated 41.2 〇C 38. 5°C 40. 6°C 36. 7°C This corresponds to the actual measurement of the above step 1.
卜1.經紅外線攝影機侧減’姆材概有效將熱均句 傳佈到整個金屬基材20，僅舉如圖二之電路作功1〇〇 分鐘後之紅外線測溫比較照所示，經塗佈喊形成本 創作積層式複合導散熱構造之金屬基材2Q，其與熱溫 成正比之攝得亮度’不論正面或反面均較習見未塗佈 陶变之金屬基材1’光熱度都更柔弱且更分散均勾。 1-2.在熱源與室溫相差18 4〇c(46.4(3c~28C)c，以上表 分鐘後之相對攔位數據），穩態後無噴塗與有喷塗者燈 源有3.5。(：（46.4。〇42.9。〇差距；降溫效率約19%( 3.5°C/18.4°C)。 卜3·正背面熱源與室溫溫差12· 6〇C(40. 6〇C-28°C，以上表 100分鐘後之相對欄位數據之數據），穩態後無噴塗與有 喷塗者有3. 9 C(40. 6°C~28〇C)差距；有喷塗之金屬基 201134933 材1谈降溫效率約30· 9 % (3. 9°C/12 6°C)。 得證本創作此_層纽合導散鱗造確實能更快速 更有效地降低電路溫度，再進—步測試小燈塗内侧有或無 喷塗出本鑛之積層式複合導賴構造之散熱絲，如第 二圖之小燈測試位置剖示圖所示，分別於内側小燈有喷塗 及無喷塗前述陶瓷粉末組成物10, U，丨2之鋁燈罩殼2外 側適當位置貼設測溫線感測頭3、内侧適當位置貼設測溫 • 、線感測頭4，以及在燈源旁適當位置貼設至少-只測溫線 感測頭5，測試過程保持赌罩殼2 _有5〜rc溫差，測 試得出的結果’-如細圖之小燈塗佈效果測試比較曲線 圖’隨著點党時間拉持長’燈源產生的溫度線U，L2不斷 起伏’而整&點冗過程中，铭燈罩殼2内側有喷塗產生的 溫度線L3都比鋁燈罩殼2内側未經喷塗處理產生的溫度 線L4更低溫’也就是降溫效果更好，平均算下來降溫效 • _在18· 5%〜25. 9%左右’再次證明本創作此種積層式複 合導散熱構造快速散熱的優越性。 更深入到前述第2.步驟進行實測操作，以美國材料測 試標準(ASTM)進行硬度測試（ASTM D3363)、百格測試（ ASTM D3002 D3359)、剝離強度實驗（ASTM D413)，與熱 傳導實驗USTM D5470)相交叉分析，同時測試前述陶究 粉末組成物10，11，12不同顆粒大小造成散熱效果的差異 ，以及控制前述陶瓷粉末組成物10, 1丨，12於一定固定粒 201134933 徑下’變細含量（前述喊粉末城物10,11，12占陶 莞私末、、且成物1 〇, 11，12混合熱固性膠3〇總體之比例）， 產生此承文剝離強度的熱傳導表現，逐一檢測紀錄，得出 第五圖之S)含量職料及強度影響曲線圖 ，跟第六圖之 £粉末組成物粒大小與熱傳導影響曲線圖。 觀察這些統計曲線圖，就可進入前述第3步驟找出最 佳條件，從第五目可吨丨时量與祕導及強度的關連 及最佳條件如下： 3-1.固含量增加熱傳導有效提升，但強度也隨之下降。 3-2·固含量超過67%以上熱導傳可達5〇w/m K，固含量超 過92%強度會下降到1Kg/cm以下，故理想值應在7〇〜 90 W%之間。 而從第/、圖可以找出瓷粉末組成物粒大小與熱傳導的關連 及最佳條件如下： 3-3.在前述瓷粉末組成物1〇, u，12粒徑1〇#m以上可得 到理想導熱值，30//m以後已經非常穩定。 另外考量金屬基材20使用銅、鋁金屬的導熱效果， 已獲貫證，普世認可，而吸熱量與強度均與厚度、面積、 體積壬正比，唯配合產品撓性與成本需要調整，箔、片材 理想厚度在1咖以内。 綜上所述’本發明此種積層式複合導散熱構造，確實 能對電路錢熱部位，更迅速導散熱功效，且未見諸公開Bu1. After the infrared camera side reduction, the material is spread to the entire metal substrate 20, as shown in the circuit of Figure 2, after 1 minute, the infrared temperature measurement is compared, as shown in the figure. The metal substrate 2Q, which forms the laminated composite heat-dissipating structure of the present invention, is obtained in proportion to the thermal temperature. The lightness of the metal substrate is not more than that of the uncoated ceramic substrate. Soft and more scattered. 1-2. The difference between the heat source and the room temperature is 18 4〇c (46.4(3c~28C)c, the relative block data after the above minute). After the steady state, there is no spray and the source of the sprayer has 3.5. (: (46.4. 〇 42.9. 〇 gap; cooling efficiency is about 19% (3.5 ° C / 18.4 ° C). Bu 3 · positive backside heat source and room temperature temperature difference 12 · 6 〇 C (40. 6 〇 C-28 ° C, the data of the relative field data after 100 minutes of the above table), after the steady state, there is no gap between the spray and the sprayer, 3. 9 C (40. 6 ° C ~ 28 ° C); 201134933 Material 1 talks about the cooling efficiency of about 30. 9 % (3. 9 ° C / 12 6 ° C). This certificate can be used to reduce the circuit temperature more quickly and effectively. - Step test on the inside of the small lamp with or without spraying the heat-dissipating wire of the laminated composite guide structure of the mine. As shown in the sectional view of the test position of the small lamp in the second figure, the inner small lamp is sprayed and The temperature sensing line sensor head 3 is attached to the outside of the aluminum lamp housing 2 of the above-mentioned ceramic powder composition 10, U, and 丨2, and the temperature measuring point, the line sensing head 4, and the lamp are disposed at the proper position on the inner side. Appropriate position next to the source is affixed at least - only the temperature sensing head 5, the test process keeps the gambling cover 2 _ there is a temperature difference of 5 ~ rc, the result of the test '- as a fine picture of the small lamp coating effect test comparison curve Figure 'with Point party time pulls the long temperature line U generated by the light source, L2 keeps undulating 'and the whole & point redundancy process, the temperature line L3 produced by the inside of the lamp housing 2 is lower than the inner side of the aluminum lamp housing 2 The temperature line L4 produced by the spraying process is lower temperature', that is, the cooling effect is better, and the average cooling temperature is reduced. _At 18·5%~25.9% or so' again proves that this laminated composite heat conduction structure is fast. Advantages of heat dissipation. Further in-depth to the above-mentioned step 2. Perform the test operation, and perform the hardness test (ASTM D3363), the hundred test (ASTM D3002 D3359), and the peel strength test (ASTM D413) by American Material Testing Standard (ASTM). Cross-analysis with the heat conduction experiment USTM D5470), and simultaneously test the difference in the heat dissipation effect caused by the different particle sizes of the above-mentioned ceramic powder compositions 10, 11, 12, and control the aforementioned ceramic powder composition 10, 1 丨, 12 in a certain fixed particle 201134933 Under the diameter of the 'thinning content (the above-mentioned shouting powder city 10,11,12 accounted for the end of Taowan, and the composition of 1 〇, 11,12 mixed thermosetting adhesive 3 〇 overall proportion), resulting in the strength of this article peeling Heat transfer Performance, detection records one by one, fifty FIG obtain the S) content of the functional materials and strength of a graph, with the sixth £ granulating FIG size of the powder composition and the thermal conductivity curves in FIG. Observing these statistical graphs, you can enter the above third step to find the best conditions. The correlation and optimal conditions of the fifth-order ton-ton 丨 与 与 与 秘 秘 及 及 及 及 及 及 及 及 及 及Ascension, but the strength also decreases. 3-2·The solid content exceeds 67% and the thermal conductivity reaches 5〇w/m K. If the solid content exceeds 92%, the strength will drop below 1Kg/cm, so the ideal value should be between 7〇~ 90 W%. From the /, the figure can find out the correlation between the particle size of the porcelain powder composition and the heat conduction and the optimal conditions are as follows: 3-3. In the above-mentioned porcelain powder composition, 1〇, u, 12 particle size 1〇#m or more can be obtained The ideal thermal conductivity is very stable after 30//m. In addition, considering the heat conduction effect of the metal substrate 20 using copper and aluminum metal, it has been certified, universally recognized, and the heat absorption and strength are proportional to the thickness, area, and volume, and only need to adjust the flexibility and cost of the product. The ideal thickness of the sheet is less than 1 coffee. In summary, the laminated composite heat-conducting heat-dissipating structure of the present invention can effectively guide the heat-dissipating effect on the hot part of the circuit, and has not been disclosed.
1—金屬基材 2·...鋁燈罩殼 3,4, 5....測溫線感測頭 201134933 使用’合於專觀之規定，麟賜准補，實為德便。 —員卩東$者，以上所述乃是本發明較佳具體的實施例， 右依本發明之構想所作之改變，或其產生之魏作用，仍 未超出_書朗柄涵紅精料，在本發明之範 圍内’合予陳明。 【圖式簡單說明】 第一圖為本發_層式複合導雜構造之結構示意圖。 紅圓為有無_轉_層歧合導賴構造之電路作 功100分鐘後之紅外線測溫比較照。 第三圖為有無塗佈本翻積層式複合導散熱騎之小燈測 試位置剖示圖。 第四圖為有無塗佈本翻·式複合導散熱構造之小燈塗 佈效果測試比較曲線圖。 第五圖為_本發·層式複合導散熱構造之固含量對熱 傳導及強度影響曲線圖。 第六圖之戦本發日频層式複合導散熱構造錄末組成物 粒大小與熱傳導影響曲線圖。 【主要元件符號說明】 瓜^’比…喊粉末組成物 20....金屬基材 30----熱固性膠1—Metal substrate 2·...Aluminum lamp housing 3,4, 5....Thermal line sensor head 201134933 The use of 'combined with the special rules, Lin is a quasi-replenishment, it is a virtue. - the member of the East, the above is a preferred embodiment of the present invention, the right according to the concept of the present invention, or the resulting Wei effect, has not exceeded the _ book Lang handle Han red concentrate, Within the scope of the present invention 'combined with Chen Ming. [Simple description of the diagram] The first figure is a schematic diagram of the structure of the _ layer composite composite structure. The red circle is a comparison of the infrared temperature measurement after 100 minutes of the circuit with or without the _transformation layer. The third figure is a cross-sectional view of the test position of the small lamp with or without the coated laminated composite heat sink. The fourth figure shows a comparative graph of the test results of the small lamp coating effect with or without the coated composite heat conduction structure. The fifth figure is a graph of the effect of solid content on heat transfer and strength of the constitutive layered composite heat transfer structure. The figure of the sixth figure is the graph of the particle size and heat conduction effect of the composition of the daily frequency layer composite heat conduction structure. [Main component symbol description] Gua ^' than... shouted powder composition 20....metal substrate 30----thermosetting adhesive