CN201927537U - Sealing structure of ceramic holes and oxygen-free copper expanded holes of ceramic vacuum relay - Google Patents

Sealing structure of ceramic holes and oxygen-free copper expanded holes of ceramic vacuum relay Download PDF

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Publication number
CN201927537U
CN201927537U CN2010206715325U CN201020671532U CN201927537U CN 201927537 U CN201927537 U CN 201927537U CN 2010206715325 U CN2010206715325 U CN 2010206715325U CN 201020671532 U CN201020671532 U CN 201020671532U CN 201927537 U CN201927537 U CN 201927537U
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CN
China
Prior art keywords
ceramic
oxygen
holes
free copper
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206715325U
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Chinese (zh)
Inventor
汪国富
郭炼
徐联芳
胡爱民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGXI WANPING VACUUM ELECTRICAL APPLIANCE Co Ltd
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JIANGXI WANPING VACUUM ELECTRICAL APPLIANCE Co Ltd
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Application filed by JIANGXI WANPING VACUUM ELECTRICAL APPLIANCE Co Ltd filed Critical JIANGXI WANPING VACUUM ELECTRICAL APPLIANCE Co Ltd
Priority to CN2010206715325U priority Critical patent/CN201927537U/en
Application granted granted Critical
Publication of CN201927537U publication Critical patent/CN201927537U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a sealing structure of ceramic holes and oxygen-free copper expanded holes of a ceramic vacuum relay. The sealing structure comprises a vacuum ceramic housing (1) provided with the ceramic holes, and oxygen-free copper contact points (2), and is characterized in that all oxygen-free copper contact points (2) adopt thin wall structures, wherein, blind holes are formed in the thin wall structures; the blind holes are expanded and deformed in the radial direction; and after the blind holes are fixed with the ceramic holes in a packed manner, solder is clamped on the blind holes and is soldered. The technology is applied to vacuum relays, and has the advantages that the product structure can be simplified, and the production efficiency and the qualified rate can be increased.

Description

The bloated hole of ceramic vacuum relay ceramic hole and oxygen-free copper sealing structure
Technical field
The utility model belongs to the electric vacuum technology field, has to relate to a kind of ceramic vacuum relay ceramic hole and the bloated hole of oxygen-free copper sealing structure.
Background technology
In electric vacuum technology, the vacuum ceramic shell is widely used because pottery is bigger with the thermal expansion metal difference of coefficients of the overwhelming majority, concerning needs carry out the product of nearly 800 ℃ of high-temperature soldering, thermal stress be one than distinct issues.For the metal to ceramic sealing of end face, have more way to solve thermal stress issues from sealing structure at present, since using in particular for the controlled expansion alloy 4J33 material that adapts to ceramicto-metal seal, there has not been too big problem in the metal to ceramic sealing of end face; And, still have more problem for metalwork and ceramic endoporus sealing-in.What present employing was more is the transition part that increases the 4J33 material between metal and ceramic endoporus, and to guarantee the air-tightness of welding, still, this just causes problems such as probability increase of Welding Structure complexity, part increase, sealing weld increase, gas leakage; Particularly this welding manner is higher to the required precision of ceramic endoporus; with the fit clearance of 4J33 transition part can not be excessive; otherwise cause gas leakage easily; and pottery processing relates to the shrinkage problem, and it is difficult to want accurate controlling dimension precision, and this Welding Structure mode need be made more high-precision welding clamp simultaneously; the process batch of welding is little; thermal capacity is big, and heating and cooling are slow, has seriously restricted the large-scale production of product.
Summary of the invention
The purpose of this utility model provides the ceramic vacuum relay ceramic hole and the bloated hole of oxygen-free copper sealing structure that a kind of stress influence that is not heated, product structure are simplified, reliability is high.
The purpose of this utility model is achieved in that a kind of ceramic vacuum relay ceramic hole and the bloated hole of the oxygen-free copper sealing structure that the utility model provides, comprise vacuum ceramic shell and the oxygen-free copper contact point of being with ceramic hole, it is characterized in that: described oxygen-free copper contact point has the thin-wall construction of blind hole in being, the blind hole place produces the bore deformation that radially expands, fix with the ceramic hole jam-packed, scolder is welded between oxygen-free copper contact point and the ceramic hole.
The utility model utilization hole hand riveter that expands stretches into distortion and the ceramic hole jam-packed that staking produces in the blind hole of oxygen-free copper contact point and fixes, and produces following beneficial effect:
1, the oxygen-free copper contact point of thin-wall construction can not consider and the thermal stress issues of ceramic package that the plastic deformation of its thin-wall construction is enough to compensate the distortion that its stress produces after welding;
2, cancelled 4J33 transition part in traditional structure and the technology, product structure is simplified, and sealing weld reduces, and rate of finished products improves;
3, because the location is to be realized by the oxygen-free copper distortion that the hole of expanding causes, thus lower to the required precision of ceramic hole, before breaking through, the ceramic-like part process improved rate of finished products greatly;
4, owing to need not complicated positioning fixture when advancing stove, batch improves greatly, and the thermal capacity of heating and cooling process is less, has improved production efficiency greatly;
5, use this structure, assembling process is simple, can not influence the precision of parts during welding because of the high temperature deformation of anchor clamps, has well guaranteed the quality of finished product.
Description of drawings
Fig. 1 is a front view of the present utility model.
The attached TV structure figure of Fig. 2 traditional welding assembly.
Fig. 3 is the attached TV structure figure of weld assembly of the present utility model.
Has execution mode
Weld assembly structure of the present utility model as shown in Figure 3, it is softening that the oxygen-free copper contact point that will have a blind hole advances furnace annealing; Ceramic package 1 is put into the hole anchor clamps that expand, in the hole of ceramic package, load onto oxygen-free copper contact point 2 again; Stretch in the endoporus of oxygen-free copper contact point with bloated hole hand riveter, the pulling hand riveter makes oxygen-free copper contact dilatancy be fixed in ceramic endoporus 3, and fixes with the abundant jam-packed of ceramic hole; Assembly withdraws from positioning fixture; Directly card is gone up the scolder stove welding of going forward side by side, and need not to adopt the 4J33 transition part 5 in the traditional handicraft, can produce the vacuum relay product of the bloated hole of ceramic hole and oxygen-free copper sealing structure.

Claims (1)

1. ceramic vacuum relay ceramic hole and the oxygen-free copper hole sealing structure that expands, comprise vacuum ceramic shell (1) and the oxygen-free copper contact point (2) of being with ceramic hole, it is characterized in that: described oxygen-free copper contact point (2) has the thin-wall construction of blind hole in being, the blind hole place produces the bore deformation that radially expands, fix with the ceramic hole jam-packed, scolder is welded between oxygen-free copper contact point and the ceramic hole.
CN2010206715325U 2010-12-21 2010-12-21 Sealing structure of ceramic holes and oxygen-free copper expanded holes of ceramic vacuum relay Expired - Fee Related CN201927537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206715325U CN201927537U (en) 2010-12-21 2010-12-21 Sealing structure of ceramic holes and oxygen-free copper expanded holes of ceramic vacuum relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206715325U CN201927537U (en) 2010-12-21 2010-12-21 Sealing structure of ceramic holes and oxygen-free copper expanded holes of ceramic vacuum relay

Publications (1)

Publication Number Publication Date
CN201927537U true CN201927537U (en) 2011-08-10

Family

ID=44431374

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206715325U Expired - Fee Related CN201927537U (en) 2010-12-21 2010-12-21 Sealing structure of ceramic holes and oxygen-free copper expanded holes of ceramic vacuum relay

Country Status (1)

Country Link
CN (1) CN201927537U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110810

Termination date: 20151221

EXPY Termination of patent right or utility model