CN201904372U - 底接式整体散热功率led - Google Patents

底接式整体散热功率led Download PDF

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CN201904372U
CN201904372U CN201020653333.1U CN201020653333U CN201904372U CN 201904372 U CN201904372 U CN 201904372U CN 201020653333 U CN201020653333 U CN 201020653333U CN 201904372 U CN201904372 U CN 201904372U
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China
Prior art keywords
substrate
matrix
chip
electrode
power led
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Expired - Lifetime
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CN201020653333.1U
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English (en)
Inventor
刘树高
安建春
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Shandong Kaiyuan Electronic Co Ltd
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Shandong Kaiyuan Electronic Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

本实用新型公开了一种底接式整体散热LED，包括基体、芯片、键合线、电极、荧光粉和封装透镜，所述基体设有一体式尾柱，所述尾柱上设有外螺纹，基体顶面设有芯片；沿基体轴向设有贯通的电极引脚孔，电极贯穿引脚孔并与基体绝缘相接。本实用新型组装时基体直接旋拧在外散热器上，芯片热量经基体直接传到散热器上，导热好，热阻少，散热面积大，光衰低。连接线路在基体底部，表面无接线，不仅整体美观，而且省去了PCB板，省工省料，节约制作成本20-30%。

Description

底接式整体散热功率LED
技术领域
本实用新型属于LED照明技术领域，具体是涉及一种底端连接且整体散热的LED。
背景技术
白光LED的光衰与环境温度和散热条件密切相关。降低PN结至外界环境热路上的热阻，进而提高散热能力是实现大功率LED产业化亟待解决的关键技术难题之一。现有功率LED一般设有侧翼电极和散热基片，利用它做成的光源主要采用表面组装或板上芯片直装方式，将器件或者芯片粘贴、焊接在PCB板上。工作时，芯片结温依次通过散热基片、PCB板和外部热沉散发出去，各散热界面间还设有粘接材料，存在的不足是传热环节多，热阻大。LED侧翼电极焊接在PCB板表面上，焊点和连接线裸露在外，不美观。特别是当多个LED密集排列组成白光照明系统时，为了遮盖LED裸露的焊点接头，有的在PCB板表面加装面板，虽能对裸露的焊点起到一定的遮挡作用，但却使本来就难以解决的散热问题更加严重。同时这种表面贴装式LED在进行局部更换时，由于PCB板的导热性，焊点不容易熔化，更换困难。
发明内容
本实用新型要解决的技术问题是提供一种无需焊接、散热迅速、安装更换方便的功率LED。
为解决上述技术问题，本实用新型包括基体、芯片、键合线、电极、荧光粉和封装透镜，其结构特点是所述基体设有一体式尾柱，所述尾柱上设有外螺纹，基体顶面设有芯片；沿基体轴向设有贯通的电极引脚孔，电极贯穿引脚孔并与基体绝缘相接。
优选的是所述尾柱呈圆柱状，圆柱体上设有外螺纹，基体顶面设有凹穴，凹穴的底平面上设有2-9个芯片。
由于本实用新型基体为采用一体式封装框架，电极引脚设在基体底端，组装时基体直接旋拧在外散热器上，芯片热量经基体直接传到散热器上，导热好，热阻少，散热面积大，可有效降低光衰。同时，基体与外散热器螺纹连接，连接线路在基体底部，光源表面无连接线，也就不需焊接，不仅整体美观，而且省去了PCB板，省工省料，节约制作成本20-30%。而基体顶面设有凹穴，芯片封装在基体顶端的凹穴内，进一步提高了散热效果。
附图说明
图1是本实用新型侧剖视图；
图2是图1所示实施例顶部示意图；
图3是本实用新型与外散热器连接示意图。
具体实施方式
参照附图，该底接式整体散热功率LED包括由铜基镀银或铝基镀银材料整体加工而成的一体式基体1。基体1作为封装框架，它设有一体式尾柱12，基体1顶端设有凹穴7，凹穴7底面至基体1下端面设有2个贯通的引脚孔8，电极4贯穿引脚孔8并伸出到尾柱12外，电极4与基体1间设有绝缘层9。芯片2设在凹穴7底面上，芯片2通过键合线3与电极4电连接，凹穴7的底平面上芯片2可以单装也可以由多个芯片2集成封装，最好是2-9个芯片，图中所示的实施例中设有4个芯片，根据散热能力和功率要求，芯片2数量也可以更多；凹穴7底面和侧面为反光面。图中所示基体1呈螺栓状，其尾柱12呈圆柱状，圆柱体外均设有螺纹10。荧光粉5和封装工艺同常规，封装透镜6可设计成凹、凸或平型。图3所示为本实用新型安装在外散热器11上的状态。

Claims (4)

1.一种底接式整体散热功率LED，包括基体（1）、芯片（2）、键合线（3）、电极（4）、荧光粉（5）和封装透镜（6），其特征是所述基体（1）设有一体式尾柱（12），所述尾柱（12）上设有外螺纹（10），基体（1）顶面设有芯片（2）；沿基体（1）轴向设有贯通的电极引脚孔（8），电极（4）贯穿引脚孔（8）并与基体（1）绝缘相接。
2.按照权利要求1所述的底接式整体散热功率LED，其特征是所述尾柱（12）呈圆柱状，圆柱体上设有外螺纹（10），基体（1）顶面设有凹穴（7），凹穴（7）的底平面上设有2-9个芯片（2）。
3.按照权利要求1所述的底接式整体散热功率LED，其特征是所述基体（1）呈螺栓状，基体（1）上设有2个引脚孔（8）。
4.按照权利要求1所述的底接式整体散热功率LED，其特征是所述基体（1）由铜基镀银或铝基镀银材料整体加工而成。
CN201020653333.1U 2010-12-11 2010-12-11 底接式整体散热功率led Expired - Lifetime CN201904372U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208470A (zh) * 2012-03-30 2013-07-17 江苏汉莱科技有限公司 一种非介质嵌合导热方法及其应用
CN103956423A (zh) * 2014-05-28 2014-07-30 安徽红叶节能电器科技有限公司 一种功率led热电分离封装结构及方法
WO2018227648A1 (zh) * 2017-06-13 2018-12-20 湖南粤港模科实业有限公司 一种散热器与芯片封装一体化的光源结构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103208470A (zh) * 2012-03-30 2013-07-17 江苏汉莱科技有限公司 一种非介质嵌合导热方法及其应用
CN103956423A (zh) * 2014-05-28 2014-07-30 安徽红叶节能电器科技有限公司 一种功率led热电分离封装结构及方法
WO2018227648A1 (zh) * 2017-06-13 2018-12-20 湖南粤港模科实业有限公司 一种散热器与芯片封装一体化的光源结构

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Denomination of utility model: Bottom connection-type integrated power LED with heat dissipation effect

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