CN201904315U - Integrated circuit patch and mobile communication device comprising same - Google Patents
Integrated circuit patch and mobile communication device comprising same Download PDFInfo
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- CN201904315U CN201904315U CN2010205886798U CN201020588679U CN201904315U CN 201904315 U CN201904315 U CN 201904315U CN 2010205886798 U CN2010205886798 U CN 2010205886798U CN 201020588679 U CN201020588679 U CN 201020588679U CN 201904315 U CN201904315 U CN 201904315U
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- integrated circuit
- electric contact
- group
- contact mat
- smart card
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Abstract
The utility model relates to an integrated circuit patch and a mobile communication device comprising same, in particular to an integrated circuit patch attached to an intelligent card (such as a Micro SIM (subscriber identity module) card or a Mini UICC (Universal Integrated Circuit Card)). The integrated circuit patch comprises a soft circuit board, a first group of electric contacting pads, a second group of electric contacting pads and an integrated circuit chip, wherein the first group of electric contacting pads is arranged on the first surface of the soft circuit board and comprises at least two electric contacting pads; the second group of electric contacting pads is arranged on the second surface of the soft circuit board; and the integrated circuit chip is arranged on the first surface of the soft circuit board and in a region between at least two electric contacting pads, and is electrically connected with a contact pin of the soft circuit board by jointing. Furthermore, the utility model also relates to an integrated circuit path with a flexible part; and when being attached to the intelligent card, the integrated circuit patch can be bent to be C-shaped by the flexible part so as to be arranged at two opposite sides of the intelligent card.
Description
Technical field
The utility model relates to a kind of device for mobile communication that is attached at the integrated circuit paster on the smart card and comprises it.
Background technology
In the prior art, whether function that mobile phone can use or Communications service (for example mobile network's bank service) normally rely on the employed smart card of mobile phone (for example SIM/USIM card) and can support and decide.Taiwan number of patent application 94106675 " dual universal integrated circuit card (uicc) system that is used for portable apparatus " that proposed for this reason, " the double integrated circuit card system " that Taiwan number of patent application 94217529 is proposed, " the Functional module improvement structure for expanded and enhanced SIM card " that U.S. Patent Application Publication No. US2007/0262156 proposed, " the Multiple Interface Card in A Mobile Phone " that U.S. Patent Application Publication No. US2009/0061933 proposed proposes certain methods and breaks through the restriction that traditional SIM/USIM card is caused.
In addition, the employed SIM/USIM card paster of mobile phone (film) is arranged also on the market, for example the Wei Tongka that can be released with reference to the VIBO company in Taiwan (http://www.vibo.com.tw/CWS/Consumer_05_08_08,,, .html).Wei Tongka and this type of paster are a diaphragm type paster basically, and the user can be attached at this paster traditional SIM card, and inserts mobile phone simultaneously, via mobile phone STK option, and function or the application program that can use original SIM card not provide.About this type of diaphragm type paster, also can or belong in applicant's the Taiwan number of patent application 98144154 explanation together with reference to United States Patent (USP) 7198199,7303137 about this adhesive integrated circuit paster.
The utility model content
One of characteristics of integrated circuit paster are among the utility model embodiment: integrated circuit (IC) chip is integrated and to be arranged on the integrated circuit paster one side between at least two electric contact mats, therefore can reduce the employed area of integrated circuit paster.In addition, integrated circuit (IC) chip is positioned between electric contact mat, therefore can be subjected to the protection of electric contact mat on every side, avoids wearing and tearing.
Another characteristics are that the integrated circuit paster has flexible portion, when the integrated circuit paster is attached on the smart card, this flexible circuit board is converted into the C font by this flexible portion, and integrated circuit (IC) chip and the electric contact mat that is used for being connected with smart card are positioned at the relative both sides of this smart card.Therefore the employed area of circuit can not be subjected to the restriction of smart card area on the integrated circuit paster.Further, the thickness of integrated circuit (IC) chip can have bigger elasticity.
According to the utility model one embodiment, the integrated circuit paster that is used to be attached at smart card comprises flexible circuit board, first group of electric contact mat, second group of electric contact mat and integrated circuit (IC) chip.Flexible circuit board has relative first and second; First group of electric contact mat is arranged at first, and first group of electric contact mat comprises at least two electric contact mats; Second group of electric contact mat is arranged at second; Integrated circuit (IC) chip is arranged on first on this flexible circuit board, and engages (bonding) with the pin (lead) of flexible circuit board and form and electrically connect.Preferably, first group of electric contact mat has salient point electrically connecting this smart card, and the setting of first group of electric contact mat meets ISO7816-2.In addition, among another embodiment of the utility model, device for mobile communication have smart card and with as above-mentioned integrated circuit paster, wherein the integrated circuit paster is attached on the smart card.For instance, smart card is one of them of SIM/USIM/UIM/RUIM/micro SIM card.
According to another embodiment of the utility model, the integrated circuit paster that is used to be attached at smart card comprises flexible circuit board, first group of electric contact mat, second group of electric contact mat and integrated circuit (IC) chip.Flexible circuit board has relative first and second, and tool one flexible portion and the first and the second portion that are positioned at these flexible portion both sides, wherein, when the integrated circuit paster is attached on the smart card, flexible circuit board is converted into the C font by flexible portion, and first and second portion are positioned at the relative both sides of smart card; First group of electric contact mat is arranged at first, and is positioned at first; Second group of electric contact mat is arranged at second, and is positioned at first; Integrated circuit (IC) chip is arranged on first on this flexible circuit board, and is positioned at second portion, and engages with the pin of flexible circuit board and form electric connection.
The execution mode of the present utility model as hereinafter being carried with reference to following explanation or utilization can be understood these characteristics of the present utility model and advantage more.
Description of drawings
In order to understand advantage of the present utility model immediately, please refer to certain specific embodiments as shown in drawings, it describes above the utility model of brief narration in detail.Only describe typical specific embodiment of the present utility model and therefore it be not considered as limiting under the situation of the utility model category understanding these diagrams, with extra definition and details the utility model is described with reference to the accompanying drawings, graphic in:
Fig. 1 a is the front schematic view according to the integrated circuit paster of the utility model one specific embodiment;
Fig. 1 b is the reverse side schematic diagram according to the integrated circuit paster of the utility model one specific embodiment;
Fig. 2 a is according to the integrated circuit paster of the utility model one specific embodiment and the schematic diagram of smart card;
Fig. 2 a is the schematic diagram according to another angle of the integrated circuit paster of the utility model one specific embodiment and smart card;
Fig. 3 a is according to the end view before the attaching of the integrated circuit paster of the utility model one specific embodiment and smart card;
Fig. 3 b is according to the end view after the attaching of the integrated circuit paster of the utility model one specific embodiment and smart card;
Fig. 4 is the decomposing schematic representation according to the device for mobile communication of the utility model one specific embodiment;
Fig. 5 a is the front schematic view according to the integrated circuit paster of another specific embodiment of the utility model;
Fig. 5 b is the reverse side schematic diagram according to the integrated circuit paster of another specific embodiment of the utility model;
Fig. 6 a is according to the integrated circuit paster of another specific embodiment of the utility model and the schematic diagram of smart card;
Fig. 6 b is the schematic diagram according to another angle of the integrated circuit paster of another specific embodiment of the utility model and smart card;
Fig. 7 a is according to the end view before the attaching of the integrated circuit paster of another specific embodiment of the utility model and smart card;
Fig. 7 b is according to the end view after the attaching of the integrated circuit paster of another specific embodiment of the utility model and smart card;
Fig. 8 is the device for mobile communication according to another specific embodiment of the utility model.
The primary clustering symbol description
100,150 integrated circuit pasters
102,152 flexible circuit boards
103,153 pins
104,154 integrated circuit (IC) chip
200,250 smart cards
300,350 device for mobile communication
302,352 smart card slots
304,354 battery covers
C1, C2, Pin1-8 electric contact mat
The face of S1, S2 flexible circuit board
The part of P1, P2 flexible circuit board
The flexible portion of F flexible circuit board
Embodiment
Following examples will illustrate the utility model with the integrated circuit paster that is used to be attached on the micro SIM card." Micro SIM card " is to belong to a kind of Mini-UICC smart card, its size is about 12mm X 15mm, further can (European Telecommunications Standards Institute be ETSI) for Smart Cards with reference to ETSI about other details of Mini-UICC card; UICC-Terminal interface; The standard (ETSI-TS-102-221) of Physical and logical characteristics, and the utility model also can be applicable to general UICC smart card.
Fig. 1 a and Fig. 1 b are the positive and negative views of the utility model embodiment integrated circuit paster 100.Integrated circuit paster 100 comprise flexible circuit board 102, first group of electric contact mat C1, second group of electric contact mat C2, with integrated circuit (IC) chip 104.Flexible circuit board (flexible print circuit board) 102 has relative first S1 and second S2; First group of electric contact mat C1 is arranged at first S1, and second group of electric contact mat C2 is arranged at second S2.In this embodiment, first group of electric contact mat C1 of first S1 has bump structure, and be used to electrically connect smart card 200 (being shown in Fig. 2 a to Fig. 3 b), second group of electric contact mat C2 of second S2 then has the concave point structure, and this bump structure and concave point structure are positioned at corresponding position on the flexible circuit board 102.In this embodiment, integrated circuit (IC) chip 104 is arranged at first S1 of flexible circuit board 102, and engages (bonding) with the pin (lead) 103 of flexible circuit board 102 and form and electrically connect.But in other not shown embodiment, integrated circuit (IC) chip 104 also can be arranged at second S2 of flexible circuit board 102.
But in other not shown embodiment, as long as electric contact mat C1 can electrically contact with the smart card that will attach, and electric contact mat C2 can electrically contact with the access device (not icon) of general intelligence card, then electric contact mat C1 and second group of electric contact mat C2 can lay respectively at different positions, or having different shape and structures, the utility model is not desired to be limited.
Preferably, shown in Fig. 1 a and Fig. 1 b, position and the structure of first group of electric contact mat C1 meet ISO7816-2, therefore electrically connect the smart card under the ISO7816 standard, position and the structure of second group of electric contact mat C2 also meet ISO7816-2 simultaneously, therefore electrically connect the smart card access device (for example SIM/USIM card slot in the mobile phone or smart card card reading machine) under the ISO7816 standard.
In addition, in order to reduce the area of integrated circuit paster 100, particularly for less smart card (for example Micro SIM card), preferable integrated circuit (IC) chip 104 is arranged on certain zone between powering on property contact mat simultaneously of integrated circuit paster 100, in general this zone also is more difficult abridged part in the integrated circuit paster 100.With Fig. 1 a and Fig. 1 b is example, according to ISO7816-2, first group of electric contact mat C1 on first S1 has 8 electric contact mats (Pin 1-8), and the zone of integrated circuit (IC) chip 104 between contact mat Pin 1-4 and contact mat Pin 5-8, its size is about 7.62mm X 9.32mm, and the zone beyond contact mat Pin 1-4 and the contact mat Pin 5-8 can depending on the circumstances or the needs of the situation and in addition reduce or cut off.Particularly when smart card 200 is Micro SIM card or Mini UICC card, the area of smart card 200 approximately only has 12mm X 15mm, deduction is the needed area of contact electrically, and remaining area is quite limited, and the foregoing description promptly provides a kind of effective solution.It should be noted that, only an embodiment shown in Fig. 1 a and Fig. 1 b, the utility model is only required on integrated circuit paster 100 certain one side has plural contact mat, and being arranged on contact mat zone therebetween, integrated circuit (IC) chip 104 gets final product, in addition, the number of the utility model and indefinite contact mat, or the contact mat function that will provide.
Shown in Fig. 2 a to Fig. 3 b, integrated circuit (IC) chip 104 is preferable to be arranged at first S1, just towards the face of smart card 200.First S1 has double faced adhesive tape, and 3M film VHB adhesive tape F-9460PC for example is in order to be attached at the surface of smart card 200.When integrated circuit paster 100 attached smart card 200, integrated circuit (IC) chip 104 integral body were positioned at outside the surface of smart card 200.Therefore integrated circuit (IC) chip 104 covers even without the Encapsulation Moulds material, but also can utilize smart card 200 and flexible circuit board 102, and the protection of electric contact mat C1 on every side.But as previously mentioned, integrated circuit (IC) chip 104 also can be arranged at second S2, and the utility model is not desired to be limited.
Integrated circuit (IC) chip 104 is by anisotropic conductive film (ACF, Anisotropic Conductive Film) directly engages with the pin 103 of flexible circuit board 102, perhaps integrated circuit (IC) chip 104 engages with the pin 103 of flexible circuit board 102 gold connection (GGI, Gold to Gold Interconnect) by gold.In this embodiment, integrated circuit (IC) chip 104 does not cover Encapsulation Moulds material (molding) (for example epoxy resin); Relatively, can only be coated with one deck UV glue on the integrated circuit (IC) chip 104 and strengthen fixing effect, therefore can significantly reduce the thickness of integrated circuit (IC) chip 104, and when being attached at smart card 200, with regard to the step that can on smart card 200, not dig a hole or cut card.But what must illustrate is, integrated circuit (IC) chip 104 also can be coated with the Encapsulation Moulds material, the utility model is not desired this to be limited, and if integrated circuit (IC) chip 104 is coated with the Encapsulation Moulds material, then can utilize solder ball array and flexible circuit board 102 to electrically conduct, and need not use above-mentioned anisotropic conductive film (ACF) or gold golden ways of connecting.
Fig. 4 shows a kind of device for mobile communication 300 among the utility model embodiment, device for mobile communication 300 has smart card slot 302, battery cover 304, and shown in Fig. 2 a to Fig. 3 b the smart card (for example SIM/USIM/UIM/RUIM/micro SIM) 200 and the integrated circuit paster 100 that attaches on it of device for mobile communication 300.Smart card 200 can together be put into slot 302 with the integrated circuit paster 100 that attaches on it, and by 302 accesses of slot; At this moment via STK option in the device for mobile communication 300, function or the Communications service that can use integrated circuit paster 100 additionally to provide.The function or the Communications service that are provided about integrated circuit paster 100 can be with reference to the explanations of each file of prior art, do not add at this and give unnecessary details.
Fig. 5 a and Fig. 5 b are the positive and negative views of another embodiment integrated circuit paster 150 of the utility model.Integrated circuit paster 150 comprise flexible circuit board 152, first group of electric contact mat C1, second group of electric contact mat C2, with integrated circuit (IC) chip 154.Flexible circuit board (flexible print circuit board) 152 has relative first S1 and second S2, in addition flexible circuit board 152 P1 of first and the second portion P2 that also have a F of flexible portion and be positioned at flexible portion F both sides.First group of electric contact mat C1 is arranged at first S1 and is positioned at the P1 of first, and second group of electric contact mat C2 is arranged at second S2 and also is positioned at the P1 of first, and relative with first group of electric contact mat C1.
In this embodiment, first group of electric contact mat C1 of first S1 has bump structure, and be used to electrically connect smart card 250 (being shown in Fig. 6 a to Fig. 7 b), second group of electric contact mat C2 of second S2 then has the concave point structure, and this concave point structure and bump structure are positioned at corresponding position on the flexible circuit board 152.
In this embodiment, integrated circuit (IC) chip 154 is arranged at first S1 of flexible circuit board 152 and is positioned at second portion P2, and engages (bonding) with the pin (1ead) 153 of flexible circuit board 152 and form and electrically connect.
But in other not shown embodiment, as long as electric contact mat C1 can electrically contact with the smart card that will attach, and electric contact mat C2 can electrically contact with the access device (not icon) of general intelligence card, then electric contact mat C1 and second group of electric contact mat C2 can lay respectively at positions different among the P1 of first, or having different shape and structures, the utility model is not desired to be limited.
Preferably, shown in Fig. 5 a and Fig. 5 b, position and the structure of first group of electric contact mat C1 meet ISO7816-2, therefore electrically connect the smart card under the ISO7816 standard, position and the structure of second group of electric contact mat C2 also meet ISO7816-2 simultaneously, therefore electrically connect the smart card access device (for example SIM/USIM card slot in the mobile phone or smart card card reading machine) under the ISO7816 standard.
Shown in Fig. 6 a to Fig. 7 b, integrated circuit (IC) chip 154 preferably is arranged at first S1, just towards the face of smart card 250, and be positioned at second portion P2, separated by the F of flexible portion with the P1 of first at first group of electric contact mat C1 and second group of electric contact mat C2 place.
First S1 has double faced adhesive tape, and 3M film VHB adhesive tape F-9460PC for example is in order to be attached at the upper and lower surface of smart card 250.And further shown in Fig. 7 a and Fig. 7 b, flexible circuit board 152 is converted into the C font by the F of flexible portion, and the P1 of first and second portion P2 are positioned at the relative both sides of smart card 250, and successfully put into slot (for example slot 352 of Fig. 8) in order not influence smart card 250, the size of P1 of first and second portion P2 all is not more than smart card 250, shown in Fig. 6 a to Fig. 7 b.
When integrated circuit paster 150 attached smart card 250, integrated circuit (IC) chip 154 integral body were positioned at outside the surface of smart card 250.Therefore integrated circuit (IC) chip 154 covers even without the Encapsulation Moulds material, but also can utilize smart card 250 and flexible circuit board 152 to be protected.
Integrated circuit (IC) chip 154 directly engages with the pin 153 of flexible circuit board 152 by anisotropic conductive film (ACF), and perhaps integrated circuit (IC) chip 154 engages with the pin 153 of flexible circuit board 152 gold connection (GGI) by gold.In one embodiment, integrated circuit (IC) chip 154 does not cover Encapsulation Moulds material (molding) (for example epoxy resin); Relatively, can only be coated with one deck UV glue on the integrated circuit (IC) chip 154 and strengthen fixing effect, therefore can significantly reduce the thickness of integrated circuit (IC) chip 154, and when being attached at smart card 250, with regard to the step that can on smart card 250, not dig a hole or cut card.But what must illustrate is, integrated circuit (IC) chip 154 also can be coated with the Encapsulation Moulds material, the utility model is not desired this to be limited, and if integrated circuit (IC) chip 154 is coated with the Encapsulation Moulds material, then can utilize solder ball array and flexible circuit board 152 to electrically conduct, and need not use above-mentioned anisotropic conductive film (ACF) or gold golden ways of connecting.
But in another embodiment, when integrated circuit paster 150 attaches smart card 250, integrated circuit (IC) chip 154 is positioned at smart card 250 relative both sides with first group of electric contact mat C1, and smart card 250 is in the face of this side of integrated circuit (IC) chip 154, electrically do not contact because do not need, can allow bigger space, therefore the thickness for integrated circuit (IC) chip 154 can have bigger tolerance, even may allow integrated circuit (IC) chip 154 to be coated with the Encapsulation Moulds material.
Fig. 8 shows a kind of device for mobile communication 350 among the utility model embodiment, device for mobile communication 350 has smart card slot 352, battery cover 354, and shown in Fig. 6 a to Fig. 7 b the smart card (for example SIM/USIM/UIM/RUIM/micro SIM) 250 and the integrated circuit paster 100 that attaches on it of device for mobile communication 350.Smart card 250 can together be put into slot 352 with the integrated circuit paster 150 that attaches on it, and by 352 accesses of slot; At this moment via STK option in the device for mobile communication 350, function or the Communications service that can use integrated circuit paster 150 additionally to provide.The function or the Communications service that are provided about integrated circuit paster 150 can be with reference to the explanations of each file of prior art, do not add at this and give unnecessary details.
It should be noted that additionally smart card comprises the integrated circuit card that meets under the ISO7816 standard in this specification, can (European Telecommunications Standards Institute be ETSI) for Smart Cards with reference to ETSI; UICC-Terminal interface; The standard (ETSI-TS-102-221) of Physical and logical characteristics is not limited to the employed SIM/USIM/UIM/RUIM/Micro SIM card of mobile phone; And about the exemplary applications of smart card, can be with reference to http://www.smartcardalliance.org, and the utility model is not desired to be limited.
Under the situation that does not break away from the utility model spirit or necessary characteristic, can other particular form embody the utility model.Described specific embodiment each side only should be considered as illustrative and non-limiting.Therefore, category of the present utility model is shown in claim but not as described above shown in the explanation.All drop on the equivalent meaning of claim and the change in the scope should be considered as dropping in the category of claim.
Claims (10)
1. an integrated circuit paster is used to be attached at a smart card, and described integrated circuit paster comprises:
One flexible circuit board has relative one first and one second;
One first group of electric contact mat is arranged at described first, and wherein said first group of electric contact mat comprises at least two electric contact mats;
One second group of electric contact mat is arranged at described second; And
One integrated circuit (IC) chip, be arranged on described first, and be arranged at the zone between at least two electric contact mats, and engage with the pin of described flexible circuit board and form with described first group of electric contact mat and described second group of electric contact mat and to electrically connect.
2. integrated circuit paster according to claim 1, wherein, described first group of electric contact mat has the structure that meets the ISO7816-2 standard, and be provided with according to the ISO7816-2 standard, and described first group of electric contact mat has 8 electric contact mats, and be denoted as Pin 1-8, and in the zone of described integrated circuit (IC) chip between contact mat Pin 1-4 and contact mat Pin 5-8.
3. an integrated circuit paster is used to be attached at a smart card, and described integrated circuit paster comprises:
One flexible circuit board, has relative one first and one second, and tool one flexible portion and the first and the second portion that are positioned at described flexible portion both sides, wherein, when described integrated circuit paster is attached on the described smart card, described flexible circuit board is converted into the C font by described flexible portion, and described first and described second portion are positioned at the relative both sides of described smart card;
One first group of electric contact mat is arranged at described first, and is positioned at described first;
One second group of electric contact mat is arranged at described second, and is positioned at described first; And
One integrated circuit (IC) chip is arranged at described first, and is positioned at described second portion, and engages with the pin of described flexible circuit board and form with described first group of electric contact mat and described second group of electric contact mat and to electrically connect.
4. integrated circuit paster according to claim 3, wherein, described first group of electric contact mat has the structure that meets the ISO7816-2 standard, and is provided with according to the ISO7816-2 standard.
5. according to claim 3 or 4 described integrated circuit pasters, wherein, described second group of electric contact mat has the structure that meets the ISO7816-2 standard, and is provided with according to the ISO7816-2 standard.
6. according to claim 3 or 4 described integrated circuit pasters, wherein, described first group of electric contact mat has salient point to electrically connect described smart card.
7. device for mobile communication, have a smart card and with according to each described integrated circuit paster in the claim 1 to 4, described integrated circuit paster is attached on the described smart card.
8. device for mobile communication according to claim 7, wherein, described integrated circuit (IC) chip integral body is positioned at outside the surface of described smart card.
9. device for mobile communication according to claim 7, wherein, described smart card is one of them of SIM/USIM/UIM/RUIM/micro SIM card.
10. device for mobile communication according to claim 7, wherein, the size of described smart card is not more than 12mm X 15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205886798U CN201904315U (en) | 2010-08-12 | 2010-11-01 | Integrated circuit patch and mobile communication device comprising same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020292083 | 2010-08-12 | ||
| CN201020292083.3 | 2010-08-12 | ||
| CN2010205886798U CN201904315U (en) | 2010-08-12 | 2010-11-01 | Integrated circuit patch and mobile communication device comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201904315U true CN201904315U (en) | 2011-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205886798U Expired - Fee Related CN201904315U (en) | 2010-08-12 | 2010-11-01 | Integrated circuit patch and mobile communication device comprising same |
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| CN (1) | CN201904315U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104346644A (en) * | 2013-07-26 | 2015-02-11 | 茂邦电子有限公司 | Paste card structure of intelligent card and manufacturing method thereof |
| CN104778492A (en) * | 2014-01-13 | 2015-07-15 | 全宏科技股份有限公司 | Intelligent patch-mounted card and mounting method using same |
| CN107491804A (en) * | 2016-06-13 | 2017-12-19 | 英飞凌科技奥地利有限公司 | Chip card module and the method for manufacturing chip card module |
-
2010
- 2010-11-01 CN CN2010205886798U patent/CN201904315U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104346644A (en) * | 2013-07-26 | 2015-02-11 | 茂邦电子有限公司 | Paste card structure of intelligent card and manufacturing method thereof |
| CN104778492A (en) * | 2014-01-13 | 2015-07-15 | 全宏科技股份有限公司 | Intelligent patch-mounted card and mounting method using same |
| CN104778492B (en) * | 2014-01-13 | 2018-03-23 | 全宏科技股份有限公司 | Intelligent paster installation card and apply its installation method |
| CN107491804A (en) * | 2016-06-13 | 2017-12-19 | 英飞凌科技奥地利有限公司 | Chip card module and the method for manufacturing chip card module |
| CN107491804B (en) * | 2016-06-13 | 2020-09-29 | 英飞凌科技奥地利有限公司 | Chip card module and method for producing a chip card module |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20181101 |
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| CF01 | Termination of patent right due to non-payment of annual fee |