CN104346644A - Paste card structure of intelligent card and manufacturing method thereof - Google Patents
Paste card structure of intelligent card and manufacturing method thereof Download PDFInfo
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- CN104346644A CN104346644A CN201310320238.8A CN201310320238A CN104346644A CN 104346644 A CN104346644 A CN 104346644A CN 201310320238 A CN201310320238 A CN 201310320238A CN 104346644 A CN104346644 A CN 104346644A
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Abstract
The invention provides a paste card structure of an intelligent card and a manufacturing method thereof. The paste card comprises a flexible circuit board and a chip with a preset use function. The surface of the flexible circuit board is provided with multiple convex points for electrical connection, and the convex points are used for one-to-one electrical connection with multiple contacts arranged on the intelligent card according to a designated specification so that the preset use function of the paste card can be achieved via the intelligent card when the paste card is pasted on the intelligent card to use. The chip is arranged on the same surface of the flexible circuit board with the multiple convex points, and the chip is arranged in the center area between the multiple convex points arranged according to the designated specification. The manufacturing method of the paste card comprises the steps that the chip is arranged in the center area of one surface of the flexible circuit board by utilizing a surface mounting technology, and then formation work of the multiple convex points for electrical connection is performed on one surface of the flexible circuit board so that the requirements for thinning and miniaturization of the paste card are achieved, the technology is simplified, manufacturing cost is reduced and application range of the paste card is enhanced.
Description
Technical field
The present invention relates to subsides card structure and the manufacture method thereof of a kind of smart card (SIM card), espespecially one first utilize surface then technology (SMT) chip is located at multiple electric connection salient point on a flexible circuit board be predetermined to be in the zone line of shaped position, the plurality of Bumping Process is made to be predetermined to be shaped position in this again, make in this chip energy and the plurality of salient point zone line on the same surface of soft circuit and between the plurality of in type salient point, use and make this subsides card reach slimming and miniature requirement, and Simplified flowsheet, reduce manufacturing cost and promote the range of application of this subsides card.
Background technology
The mobile phone (mobile phone) of current use is all provided with a smart card, i.e. user's identity module (Subscriber Identity Module, SIM), or be called SIM card, it is the smart card of user's identification data of preserving mobile phone service, this smart card (SIM card) can also store note data and telephone number, and smart card (SIM card) is mainly used in gsm system, but compatible module is also for the UE(USIM of UMTS) and IDEN phone.
The universalness used along with mobile phone (mobile phone) and the convenience carried with, cause other chip cards with various function to be desired most ardently to be combined with smart card (SIM card), person capable of reducing using often carries with the number of various difference in functionality chip card on the one hand, on the one hand can be directly as easy to use in cellular phone power supplies by the outfit that mobile phone is existing; Have on the market at present to paste for the subsidiary function be combined with smart card (SIM card) and blocked, as multiple different using function such as cash card, bank finance card or credits card, and this subsides card be in use be directly covered in mobile phone smart card (SIM card) on the multiple contact electrically connects making this subsides card can arrange with the upper set specification of the smart card of mobile phone (SIM card), and then reach the using function that this subsides card presets.In addition, general subsides card comprises a circuit board (PC) as flexible circuit board (FPC) and a chip (Chip), wherein one of this chip be provided with multiple contact exposed on the surface, recycle multiple contacts exposed of this chip to be electrically connected with this circuit board (PC) and to be fixed on this circuit board (PC), wherein one of this circuit board (PC) be provided with multiple electric connection on the surface with salient point (Bump) for can electrotropism be connected in pairs with multiple contacts that this smart card (SIM card) arranges with set specification, smart card (SIM card) such as used at present comprises Mini SIM card (as shown in Figure 3 40a), or advanced Micro SIM card (micro-SIM card) (as shown in Figure 3 40b), even Nano SIM(nanometer SIM card) (as shown in Figure 3 40c), and multiple contacts set on it remain at present and arrange with set specification, as have 6 contacts and in 2x3 mode arrange (as shown in Figure 3) but and be not used to limit the present invention, so when this subsides sticker overlay on this smart card (SIM card) uses time, this subsides card namely by smart card (SIM card) and interior of mobile phone element connection relationship (as by SIM card the power supply that is connected) reach the using function set of this subsides card
But, there is its own shortcomings in existing subsides card structure: one in technique and/or practical application, with subsides card structure known at present, no matter be that chip utilizes metal wire (gold thread) to link (wire bounding) mode to be electrically connected with this circuit board (PC) and to fix, or chip first makes standard packaging (as QFP) recycling surface then technology (SMT afterwards, Surface Mount Technology) to be electrically connected with this circuit board (PC) and to fix, there is camber due to gold thread and separately must increase envelope (molding) thickness of this chip, relatively cause the thickness pasting card larger, the demand of slimming and miniaturization cannot be reached, so that be unfavorable for pasting the fit applications between card and smart card (SIM card), as comparatively large in thickness or the larger-size subsides card of length and width or not easily cannot be covered in the upper use of smart card (SIM card), especially the smart card (SIM card) used at present is advanced to Micro SIM card (micro-SIM card) even Nano SIM(nanometer SIM card by Mini SIM card (mini SIM card)) time, more can make the fit applications degree of adding to the difficulties between subsides card and smart card (SIM card), they are two years old, no matter be that chip utilizes metal wire (gold thread) to link (wire bounding) mode to be electrically connected with this circuit board (PC) and to fix, or chip first to do after standard packaging (as QFP) recycling surface then technology (SMT) to be electrically connected with this circuit board (PC) and to fix, capital additionally increases an envelope (molding) technique, this envelope (molding) is mainly used for protecting gold thread surely, but the manufacturing cost of subsides card can be made relatively to improve, be unfavorable for mass production and the application of pasting card.
For the shortcoming of existing subsides card structure in technique and/or practical application, inventor's then in addition Improvement, especially the circuit board pasting card is changed into and use flexible circuit board (FPC), and adopt wafer-level packaging (CSP) technique with avoid increase envelope (molding) technique, and utilize surface then technology (SMT) chip is electrically connected and is fixed on this flexible circuit board (FPC).But in actual fabrication process, inventor find above-mentioned surface then technology (SMT) technique still there is shortcoming, illustrate for Fig. 9 at this, when utilize surface then technology (SMT) chip (Chip) is electrically connected and is fixed on this flexible circuit board (FPC) and be provided with one of multiple salient point (Bump) on the surface and (or be called salient point side, Bump side), wherein the plurality of salient point (Bump) is in order to can electrotropism be connected in pairs with multiple contacts that this smart card (SIM card) arranges with set specification, then so the step of technique comprises: first carry out raising point (dimple) step at a flexible circuit board (FPC) 90, make to be shaped multiple salient point (Bump) 92 on same surperficial 91 of this flexible circuit board (FPC) 90, be formed with 6 salient points (Bump) and arrange in 2x3 mode for can correspondence be connected to smart card (SIM card) on 6 contacts (as shown in Figure 3) that identical and set specification arranges one to one on same surperficial 91 of this flexible circuit board (FPC) 90 with current technology, in only arranging in 2x3 mode in fig .9 two salient points (Bump) 92 represent but and be not used to limit the present invention, carry out print tin operation (solder print) afterwards again, namely in each default electric connection point of this flexible circuit board (FPC) 90, print a tin convex 93 respectively, carry out follow-up surface then chip operation (SMT chip) afterwards again, namely utilize surface then technology (SMT) chip is electrically connected and be fixed on this flexible circuit board (FPC) 90 correspond to this chip surface on, afterwards increase by an encapsulating operation (under-fill) again but and be not used to limit the present invention, namely in the space through surface then between technology (SMT) post-job chip (figure do not show, can with reference to figure 1) with flexible circuit board (FPC) 90, colloid is poured in order to strengthen surperficial quality then between chip and flexible circuit board (FPC) 90, so in above-mentioned print tin operation (solder print), generally to carry out the operation of print tin on utilize one to be preset with surface 91 that the print tin steel plate 95 corresponding to multiple perforation 94 of each electric connection point of flexible circuit board (FPC) 90 overlays on flexible circuit board (FPC) 90 with lid, but owing to this surface 91 being formed with the salient point (Bump) 92 of a multiple height (as 300 μm) protruding upward, therefore when printing tin steel plate 94 and covering on the surface 91 of flexible circuit board (FPC) 90, the bottom surface of print tin steel plate 94 first can be pressed on the plurality of salient point (Bump) 92 and cannot directly be covered on the surface 91 of flexible circuit board (FPC) 90, so not only easily cause the distortion of the plurality of salient point (Bump) 92, and then to affect between the upper multiple contact of the plurality of salient point (Bump) 92 and this smart card (SIM card) quality that electrotropism is in pairs connected, and there is a protrusion height (as 300 μm) because of the plurality of salient point (Bump) 92, the gap 96 of formation between the surface 91 of the bottom surface of print tin steel plate 94 and flexible circuit board (FPC) 90 also can be strengthened, the tin amount printing tin operation is caused to be difficult to control, convex 93 height of tin as shown in Figure 9 just highly at least have more the tin amount of gap 96 height than the perforation 94 of print tin steel plate 95 and are difficult to control, as can be seen here, use flexible circuit board (FPC) and utilize surface then technology (SMT) chip to be electrically connected and the technique be fixed on this flexible circuit board (FPC) still has the space of further improvement.
Summary of the invention
The object of the invention is to overcome above-mentioned defect of the prior art, a kind of subsides card structure meeting slimming and miniature requirement is provided, and Simplified flowsheet, reduction manufacturing cost and promote the relative manufacturing process of range of application of this subsides card.
For reaching above-mentioned purpose, first the present invention provides the subsides card structure of a kind of smart card (SIM card), this subsides card comprises the chip (Chip) of a flexible circuit board (FPC) and the predetermined using function of a tool, wherein one of this flexible circuit board (FPC) be provided with multiple electric connection on the surface with salient point (Bump) for can electrotropism be connected in pairs with multiple contacts that institute's set specification of setting tool on smart card (SIM card) joined together arranges, the predetermined function reaching this subsides card when smart card (SIM card) is upper to be used by this smart card (SIM card) is overlayed on to make this subsides sticker, wherein this chip is located at this flexible circuit board to be provided with on the same surface of the plurality of salient point, and in the zone line that this chip is located between these multiple salient points (Bump) arranged with set specification.
The present invention also provides the subsides card producing method method of a kind of smart card (SIM card) simultaneously, comprise the following step: step 1: for the size of a SIM card, there is provided a flexible circuit board for being covered in this SIM card, wherein one of this flexible circuit board there will be a known multiple salient point on the surface be predetermined to be shaped position, the plurality of salient point system, in order to can electrotropism be connected in pairs with multiple contacts set in this SIM card, forms a zone line between the shaping position of wherein the plurality of salient point; Step 2: the chip matched again utilize surface then technology (SMT, Surface Mount Technology) be located on this flexible circuit board by the zone line formed between the shaping position of the plurality of salient point; Step 3: carry out raising point (dimple) operation again with the plurality of salient point (Bump) that the same surface being provided with chip at this flexible circuit board (FPC) is shaped, to make in the zone line of this chip between the plurality of multiple salient points be shaped; By this, make the subsides card made can reach slimming miniature requirement to promote the range of application of this subsides card, and Simplified flowsheet is to reduce the manufacturing cost of pasting card.
Subsides card structure of the present invention and manufacture method thereof compared with prior art, at least have following advantages: subsides card can be made to reach slimming and miniature requirement, Simplified flowsheet, reduce manufacturing cost, and promote the range of application of this subsides card.
Accompanying drawing explanation
Fig. 1 side cross-sectional schematic of pasting card of the present invention.
Fig. 2 is that one of flexible circuit board in the subsides card of Fig. 1 amplifies upper schematic diagram.
Fig. 3 be of the present invention paste card chip position relative to Mini SIM card (40a), Micro SIM card (40b) and Nano SIM(40c) upper schematic diagram.
Fig. 4 is again with the side cross-sectional schematic that SMT mode is connected with flexible circuit board (FPC) after the chip pasting card of the present invention encapsulates with wafer scale (CSP).
Fig. 5 be of the present invention paste card and a smart card (SIM card) with the use of the side cross-sectional schematic (and indicating part height dimension use for reference) of an embodiment.
Fig. 6 be of the present invention paste card and a smart card (SIM card) with the use of the side cross-sectional schematic (and indicating part height dimension use for reference) of another embodiment (there is Kato).
Fig. 7 is the side cross-sectional schematic (and indicating part height dimension use for reference) that the embodiment (having Kato) of Fig. 6 inserts intelligent draw-in groove (sim card slot).
Print tin steel plate first covers in subsides clipping technique of the present invention after carrying out printing tin operation (solder print), to go up the side cross-sectional schematic forming multiple salient point (Bump) again in flexible circuit board (FPC) on the surface of flexible circuit board by Fig. 8.
Fig. 9 is that print tin steel plate first covers on the surface of flexible circuit board to carry out printing the side cross-sectional schematic of tin operation (solder print) by the of the present invention card that pastes in process after flexible circuit board (FPC) the multiple salient point of upper formation (Bump) again.
Description of reference numerals: 10-pastes card; 20-flexible circuit board; 21-surface; 22-salient point (Bump); 23-zone line; 24-electric connection point; 25-tin is convex; 26-outer peripheral areas; 261-outer peripheral areas (not establishing circuit); 262-outer peripheral areas (being provided with circuit); 30-chip; 31-connection gasket (contact); 40-smart card (SIM card); 40a-Mini SIM card; 40b-Micro SIM card (micro-SIM card); 40c-Nano SIM(nanometer SIM card); 50-viscose glue; 60-Kato; 70-intelligence draw-in groove (sim card slot); 71-shell fragment; 80-prints tin steel plate; 81-bores a hole; 82-tin is convex; 90-flexible circuit board (FPC); 91-surface; 92-salient point (Bump); 93-tin is convex; 94-bores a hole; 95-prints tin steel plate.
Embodiment
For making the present invention definitely full and accurate, hereby enumerating preferred embodiment and coordinating following schemes, structure of the present invention and technical characteristic thereof are described in detail as rear:
Referring to figs. 1 to Fig. 3, it is respectively one of side cross-sectional schematic, the wherein flexible circuit board of card that paste of the present invention and amplifies upper schematic diagram and chips position thereof the upper schematic diagram relative to Mini SIM card, Micro SIM card and Nano SIM.The subsides card 10 of smart card of the present invention (SIM card) comprises the chip (Chip) 30 of a flexible circuit board (FPC) 20 and the predetermined using function of a tool, wherein a surface 21 of this flexible circuit board (FPC) 20 is provided with multiple electric connection salient point (Bump) 22, the plurality of salient point (Bump) 22 in order to smart card (SIM card) 40(of use joined together as shown in Figure 3) upper set multiple contacts 41 can electrotropism be connected in pairs; When deployed, this subsides card 10 is covered in the upper use (as illustrated in figs. 5-7) of this 40 smart card (SIM card), makes this subsides card 10 reach the predetermined function different using function preset with using needs as multiple in cash card, bank finance card or credit card etc. of this subsides card 10 by this smart card (SIM card) 40; Wherein this chip 30 is located at this flexible circuit board 20 to be provided with on same surperficial 21 of the plurality of salient point 22, and in zone line 23 between the plurality of salient point (Bump) 22 this chip 30 being located at arrange with set specification; By this, make this subsides card reach slimming and miniature requirement and promote the range of application of this subsides card.
Shown in Fig. 2, Fig. 3, the development of the using function of smart card (SIM card) 40 is considerably quick, its size is but increasingly compact, by larger-size Mini SIM card 40a as shown in Figure 3, the advanced Micro SIM card less to size (micro-SIM card) 40b as shown in Figure 3, the Nano SIM(nanometer SIM card that even size is less) 40c as shown in Figure 3, but with multiple contacts 41 of current smart card (SIM card), arrangement is set, various smart card (SIM card) 40(40a, 40b, 40c) upper set multiple contacts 41 are still at present and are arranged in a set specification specific location that this smart card (SIM card) 40 blocks, as shown in Figure 3, various smart card (SIM card) 40(40a, 40b, 6 contacts are provided with altogether and the arrangement in 2x3 (i.e. 2 row x3 row) 40c), but be not used to limit the present invention, therefore a zone line 42 can be formed as shown in Figure 3 between 3 contacts 41 that 3 contacts 41 and the 2nd arranged the 1st are arranged.Due to 6 salient point (Bump) 22(set on a surface 21 of this flexible circuit board (FPC) 20 of the present invention as shown in Figure 2) in order to smart card (SIM card) 40(of use joined together as shown in Figure 3) upper 6 set contacts 41 can electrotropism be connected in pairs, therefore with the surface 21 of this flexible circuit board (FPC) 20, also a zone line 23(can be had as Fig. 1 between 3 salient points (Bump) 22 that 3 salient points (Bump) the 22 and the 2nd of the 1st row are arranged, shown in Fig. 2), and namely this chip (Chip) 30 is correspondingly with this flexible circuit board (FPC) 20 connect and be fixed among this zone line 23 as Fig. 1, shown in Fig. 2.
With reference to figure 4, for of the present invention paste card chip with wafer scale (CSP) encapsulation after again with the side cross-sectional schematic that SMT mode is connected with flexible circuit board (FPC).Chip of the present invention (Chip) 30 be adopt wafer-level packaging (CSP) technique, and utilize surface then technology (SMT) this chip 30 is electrically connected and is fixed on this flexible circuit board (FPC) 20; Wherein, this flexible circuit board (FPC) 20 need according to design and is preset with multiple electric connection point 24, being provided with 4x4 totally 16 electric connection point 24 as shown in Figure 2, and only represent 4 electric connection point 24 wherein in the diagram but be not used to limit the present invention; Need to print respectively a tin convex 25 in each electric connection point 24 for carrying out surface then chip operation (SMT chip) according to design again, namely utilize surface then technology (SMT) this chip 30 is connected and to be fixed on this flexible circuit board (FPC) 20 and to make multiple connection gasket (contact) 31(exposed set on this chip 30 as shown in Figure 2 16) can in pairs electrotropism be connected to multiple electric connection point 24(that this flexible circuit board (FPC) 20 is provided with as shown in Figure 2 16).As from the foregoing, this flexible circuit board (FPC) 20 is need according to design and be preset with multiple electric connection point 24, be provided with 4x4 totally 16 electric connection point 24 as shown in Figure 2, therefore this 16 electric connection point 24 unrestrictedly must be located at centre place among this zone line 23 as shown in Figure 1 and Figure 2, if the anon-normal centre 30a be as shown in Figure 3 located among this zone line 23 is also permissible.
With reference to figure 5, it is of the present inventionly paste card 10(20,30) with a smart card (SIM card) 40 with the use of the side cross-sectional schematic (and indicating part height dimension use for reference) of an embodiment; Wherein at this subsides card 10(20,30) outer peripheral areas 26 place of flexible circuit board (FPC) 20, adhesive-layer 50 can be utilized further as shown in Figure 1 (as the viscose glue of Minnesota Mining and Manufacturing Company, thickness about 50 μm) but do not limit, to make this subsides card 10(20,30) can be covered on regularly on smart card (SIM card) 40 to reach using state as shown in Figure 5; Wherein the usable range of this adhesive-layer 50 can extend out to about be equal to smart card (SIM card) 40 pasted the size in face, the size being namely equal to smart card (SIM card) 40 is as shown in Figure 5 but do not limit; Again with the thickness of the outer peripheral areas 26 of flexible circuit board (FPC) 20, if this outer peripheral areas 26 is the outer peripheral areas 261 of not establishing circuit, then thickness is less 42 μm according to appointment, if this outer peripheral areas 26 is the outer peripheral areas 262 being provided with circuit, then and relatively large 90 μm according to appointment of thickness.
In addition, subsides card 10(20 of the present invention, 30) after actual fabrication, its gross dimensions can be controlled to size as shown in Figure 1 but be not used to limit the present invention, wherein: the overall height (being counted by the bottom surface of flexible circuit board 20) of salient point (Bump) 22 is 300 μm, the thickness of chip (Chip) 30 is 175 μm, the thickness of viscose glue 50 is 50 μm, the overall height of chip (Chip) 30 on flexible circuit board 20 (being counted by the bottom surface of flexible circuit board 20) is 250 μm-275 μm, the thickness that flexible circuit board (FPC) 20 is provided with the region (as outer peripheral areas 262) of circuit is 90 μm, the thickness that flexible circuit board (FPC) 20 is not provided with the region (as outer peripheral areas 261) of circuit is 42 μm, as from the foregoing, distance (300-275=25) space of 25 μm is still had between the end face of chip (Chip) 30 and the summit of salient point (Bump) 22.And as subsides card 10(20 of the present invention, 30) with a smart card (SIM card) 40 reality with the use of time, its each portion relative dimensions can be controlled to size as shown in Figure 5 (but being not used to limit the present invention), wherein: the thickness of smart card (SIM card) 40 is 800 μm, the region (as outer peripheral areas 261) that smart card (SIM card) 40 and flexible circuit board (FPC) 20 are not provided with circuit adhere after gross thickness be 892 μm, gross thickness after the region (as outer peripheral areas 261) that smart card (SIM card) 40 and flexible circuit board (FPC) 20 are provided with circuit and chip (Chip) 30 combines is 1120 μm, as from the foregoing, of the present invention paste card 10(20,30) actual fabrication size and with a smart card (SIM card) 40 reality with the use of time size, all can control in an acceptable scope, therefore really can reach desired slimming and miniature requirement, and then the range of application of this subsides card can be promoted.
With reference to figure 6, be of the present inventionly paste card 10(20,30) with a smart card (SIM card) 40 with the use of the side cross-sectional schematic (and indicating part height dimension use for reference) of another embodiment (there is Kato 60); The present embodiment from embodiment illustrated in fig. 5 different be in: the subsides card 10 of the present embodiment is after being fixedly covered on smart card (SIM card) 30, first to put among a Kato 60 as shown in Figure 6 again, according to actual fabrication and make same state, now the end face about 77 μm of Kato 60 can be protruded in the upper limb face of this smart card (SIM card) 40, but does not affect original using function of this smart card (SIM card) 40.
Referring again to Fig. 7, it is the side cross-sectional schematic (and indicating part height dimension use for reference) that the embodiment (having Kato 60) of Fig. 6 inserts intelligent draw-in groove (sim card slot) 70.When subsides card 10 of the present invention is after being fixedly covered on smart card (SIM card) 30 and put into a Kato 60 again (as shown in Figure 6), insert again in an intelligent draw-in groove (sim card slot) 70 and use as shown in Figure 7, wherein, the inner bottom surface of this intelligent draw-in groove (sim card slot) 70 can arrange at least one shell fragment 71, three shell fragments 71 as shown in Figure 7 but do not limit, are supported on the appropriate location, bottom surface of the flexible circuit board 20 of this subsides card 10 in order to upwards elasticity; According to applicant's actual fabrication and make same state, now the upper limb face of this smart card (SIM card) 20 lower than the end face about 20 μm of draw-in groove (sim card slot) 70, so can not affect original using function of this smart card (SIM card) 20.
The manufacture method of subsides card 10 of the present invention comprises the following step:
Step 1: for a smart card (SIM card) 40, the flexible circuit board 20 providing one to match and a chip 30 for can be covered on this smart card (SIM card) 40 with the use of, one surface 21 of wherein this flexible circuit board 20 there will be a known the precalculated position of multiple electric connection salient point 22 for forming, correspondingly with multiple contacts 41 set on this smart card (SIM card) 40 can be electrically connected after those precalculated positions are shaped for the plurality of electric connection salient point 22, wherein form a zone line 23 between the plurality of shaping precalculated position.
Step 2: the recycling surface chip 30 that then this matches by technology (SMT, Surface Mount Technology) is electrically connected and is installed among this zone line 23 on this flexible circuit board 20.
Step 3: be shaped in the shaping precalculated position of the plurality of salient point 22 the plurality of salient point 22 again, make this chip 30 among the zone line 23 between the plurality of in type salient point 22, and a subsides card 10 be made up of a flexible circuit board 20 and a chip 30 must be completed.
With the actual structure made of subsides card 10 of the present invention as shown in Figure 1, owing to still there being distance (300-275=25) space of 25 μm between the end face of this chip (Chip) 30 and the summit of this salient point (Bump) 22, namely the height of height a little less than this salient point (Bump) 22 of (Chip) 30 is somebody's turn to do, and should be provided among the zone line 23 between the plurality of salient point (Bump) 22 by (Chip) 30, if when therefore carrying out the operation of print tin (solder print) according to technique described in [0005] section and step (as shown in Figure 9), namely the tin amount as described in [0005] section that easily occurs is difficult to control and salient point holds yielding shortcomings.But, with the manufacture method of subsides card 10 of the present invention, it first utilizes the surface chip 30 that then this matches by technology (SMT) to be electrically connected in step 2 and is installed among this zone line 23 on this flexible circuit board 20 especially, just carry out the forming operation of the plurality of salient point 22 afterwards in step 3 again, therefore when the technique of subsides card 10 of the present invention when carrying out the operation of print tin (solder print) as shown in Figure 8, namely to carry out the operation of print tin on utilize one to be preset with surface that the print tin steel plate 80 corresponding to multiple perforation 81 of each electric connection point of flexible circuit board (FPC) 20 overlays on flexible circuit board (FPC) 20 with lid, surface due to this flexible circuit board (FPC) 20 is not yet shaped the plurality of protruding upward one height (as 300 μm) salient point (Bump) 22, therefore this print tin steel plate 80 can directly closely to cover on the surface of this flexible circuit board (FPC) 20 as shown in Figure 8, therefore print the convex 82(of tin of tin operation as shown in Figure 8) tin amount be also effectively controlled, therefore can effectively solve and avoid [0005] section described tin amount be difficult to control and salient point hold yielding shortcomings.
In brief, the technique disclosed in [0005] section sequentially comprises following job procedure: first carry out raising point (dimple) operation at a flexible circuit board (FPC), carry out print tin operation (solder print) afterwards again, carry out surface then chip operation (SMT chip) afterwards again to be electrically connected by chip and to be fixed on the surface corresponding to this chip of this flexible circuit board (FPC), carry out encapsulating operation (under-fill) more afterwards.So, disclosed technique sequentially comprises following job procedure: first carry out print tin operation (solder print) at a flexible circuit board (FPC), carry out surface then chip operation (SMT chip) afterwards to be electrically connected by chip and to be fixed on the surface corresponding to this chip of this flexible circuit board (FPC), carry out encapsulating operation (under-fill) afterwards, finally just on this flexible circuit board (FPC), carry out raising point (dimple) operation.
As from the foregoing, subsides card structure of the present invention and manufacture method thereof are compared with the prior art, at least there is following advantages: subsides card can be made to reach slimming and miniature requirement, can Simplified flowsheet, can manufacturing cost be reduced, and the range of application promoting this subsides card as can with Nano SIM(nanometer SIM card) (as shown in Figure 3) with the use of.
The foregoing is only the preferred embodiments of the present invention, is only illustrative for the purpose of the present invention, and nonrestrictive; Those of ordinary skill in the art understand, and can carry out many changes in the spirit and scope that the claims in the present invention limit to it, amendment, and even equivalence is changed, but all will fall within the scope of protection of the present invention.
Claims (11)
1. a subsides card structure for smart card, one of this smart card is provided with on the surface and uses with the electron-donating connection of multiple contacts of a set specification arrangement, and this subsides card comprises a flexible circuit board and a chip, it is characterized in that:
This flexible circuit board, surface thereof is provided with to be electrically connected uses multiple salient point, the plurality of salient point with the set specification arrangement being same as multiple contact set by this smart card on a surface for and multiple contacts set on this smart card in pairs electrotropism is connected, wherein between the plurality of salient point, formation one more the plurality of salient point is low zone line;
This chip, the using function that its setting tool is predetermined, utilize surface then technology be electrically connected and be installed in being provided with on the same surface of the plurality of salient point of this flexible circuit board, and among the zone line formed between the plurality of salient point arranged with set specification;
During use, this subsides sticker overlays on this smart card and uses, make multiple salient point of this flexible circuit board and multiple contacts set on this smart card in pairs electrotropism be connected, reach these subsides to make this subsides card by this smart card and block predetermined using function.
2. the subsides card structure of smart card as claimed in claim 1, it is characterized in that, this smart card comprises mini smart card, micro-smart card, nana intelligent card.
3. the subsides card structure of smart card as claimed in claim 1, it is characterized in that, this smart card is provided with six contacts and is arranged on the surface of this smart card with the set specification of 2x3, and this flexible circuit board is provided with six salient points and to be arranged on the surface of this flexible circuit board for can electrotropism be connected in pairs with six contacts set on this smart card with the set specification of identical 2x3, wherein formed between these six salient points a position comparatively these six salient points be low zone line.
4. the subsides card structure of smart card as claimed in claim 1, it is characterized in that, when this chip utilizes surface then technology is electrically connected and is fixedly arranged among the zone line that formed between the plurality of salient point that arranges with set specification, the end face of this chip is lower than the distance on 25 μm, the summit of the plurality of salient point.
5. the subsides card structure of smart card as claimed in claim 1, it is characterized in that, this flexible circuit board, at the outer peripheral areas place of this chip position, utilizes an adhesive-layer to be overlying on this smart card to make these subsides stick with fastening to reach using state further.
6. the subsides card structure of smart card as claimed in claim 5, is characterized in that, the usable range of this adhesive-layer extends out to or near the periphery of this smart card.
7. the subsides card structure of smart card as claimed in claim 1, is characterized in that, after these subsides fasten and are covered on this smart card, this subsides card and this smart card must be put among a Kato, makes this Kato press from both sides the periphery of holder at this subsides card and this smart card.
8. the subsides card structure of smart card as claimed in claim 1, is characterized in that, these subsides are stuck in the space between this chip and this flexible circuit board the colloid that is provided with and pours in order to strengthen surface quality then between chip and flexible circuit board.
9. a manufacture method for the subsides card of smart card, is characterized in that, comprise step as follows:
Step 1: for a smart card, the flexible circuit board providing one to match and a chip for can be covered on this smart card with the use of, wherein one of this flexible circuit board precalculated position that there will be a known multiple electric connection salient point for forming on the surface, can correspondingly with multiple contacts set on this smart card be electrically connected after those precalculated positions are shaped for the plurality of electric connection salient point, wherein formed between the plurality of shaping precalculated position a position be comparatively shaped after the plurality of salient point be low zone line;
Step 2: the recycling surface chip that then this matches by technology is electrically connected and is installed among this zone line of this flexible circuit board.
Step 3: the plurality of salient point that is shaped, in the shaping precalculated position of the plurality of salient point, among the zone line that the position that this chip must be formed between the plurality of in type salient point is lower, and completes a subsides card be made up of a flexible circuit board and a chip.
10. the manufacture method of the subsides card of smart card as claimed in claim 9, it is characterized in that, a print tin operation is comprised further in this step 2, a print tin steel plate is utilized closely to cover to carry out the operation of print tin on the surface of this flexible circuit board, convex so that each electric connection point set on this flexible circuit board to form an electric connection tin respectively accordingly.
The manufacture method of the subsides card of 11. smart cards as claimed in claim 8, it is characterized in that, an encapsulating operation is comprised further between this step 2 and step 3, it utilizes surface chip that then this matches by technology to be electrically connected and after being installed among this zone line of this flexible circuit board, pours into colloid in order to strengthen surperficial quality then between chip and flexible circuit board in the space further between chip and flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310320238.8A CN104346644A (en) | 2013-07-26 | 2013-07-26 | Paste card structure of intelligent card and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310320238.8A CN104346644A (en) | 2013-07-26 | 2013-07-26 | Paste card structure of intelligent card and manufacturing method thereof |
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| CN104346644A true CN104346644A (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310320238.8A Pending CN104346644A (en) | 2013-07-26 | 2013-07-26 | Paste card structure of intelligent card and manufacturing method thereof |
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| CN102709253A (en) * | 2012-05-14 | 2012-10-03 | 奈电软性科技电子(珠海)有限公司 | Process for manufacturing integrated circuit board |
| CN203376774U (en) * | 2013-07-26 | 2014-01-01 | 茂邦电子有限公司 | Sticker card of subscriber identity module (SIM) |
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| JPH1139451A (en) * | 1997-07-24 | 1999-02-12 | Tokin Corp | Ic packaging component |
| US20090310318A1 (en) * | 2008-06-16 | 2009-12-17 | Cisco Technology, Inc. | Attaching a lead-free component to a printed circuit board under lead-based assembly conditions |
| CN201904315U (en) * | 2010-08-12 | 2011-07-20 | 全宏科技股份有限公司 | Integrated circuit patch and mobile communication device comprising same |
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