TWM467960U - Adhesion card for smart card - Google Patents

Description

Smart card sticker

The present invention relates to a smart card (SIM card) card, in particular, a plurality of bumps of a chip and a soft circuit are located on the same surface of the soft circuit and are located in an intermediate region between the plurality of bumps, thereby The card is thinned and miniaturized, and the application range of the card is improved.

The smart phone currently used in the mobile phone (mobile phone) is a Subscriber Identity Module (SIM), or SIM card, which is the wisdom of saving the user identification data of the mobile phone service. The card, the smart card (SIM card) can also store the newsletter data and phone number, the smart card (SIM card) is mainly used for the GSM system, but the compatible module is also used for the UMTS UE (USIM) and the IDEN phone.

With the popularization of mobile phones (mobile phones) and the convenience of carrying them, other chip cards with various functions are combined with smart cards (SIM cards), which can reduce the users to carry various functions with them. The number of wafer cards can be easily used by the existing equipment such as mobile phone power supply. Currently, there are already auxiliary function cards for use with smart cards (SIM cards), such as cash cards. , a bank financial card or a credit card and other different use functions, and the card is directly attached to the smart card of the mobile phone when used (SIM The card is electrically connected to a plurality of contacts arranged in a predetermined size on the smart card (SIM card) of the mobile phone, thereby achieving the function of the preset setting of the card. In addition, a general card includes a circuit board (PC) such as a flexible circuit board (FPC) and a chip, wherein a surface of one of the wafers is provided with a plurality of exposed contacts, and a plurality of exposed portions of the wafer are utilized. The contact is electrically connected to the circuit board (PC) and fixed on the circuit board (PC); wherein a surface of one of the circuit boards (PC) is provided with a plurality of bumps for electrical connection. The plurality of contacts arranged on the smart card (SIM card) in a predetermined specification can be electrically connected one-to-one. For example, the smart card (SIM card) currently used includes a Mini SIM card (as shown in FIG. 3, 40a). , or an advanced Micro SIM card (micro SIM card) (such as 40b shown in Figure 3), or even a Nano SIM (nano SIM card) (such as 40c shown in Figure 3), and multiple The contacts are still arranged in the specified specifications, such as a total of 6 contacts and arranged in 2x3 format (as shown in Figure 3) but not for limiting the new type, so when the card is attached to the smart card (SIM When the card is used, the card can be connected to the internal components of the mobile phone (such as the power source connected by the SIM card) to achieve the set function of the card.

However, the conventional card structure has the following disadvantages in the process and/or practical application: First, in the currently known card structure, whether the wafer is wired with wire bonding. The circuit board (PC) is electrically connected and fixed, or the chip is first used as a standard package (such as QFP) and then surface mount technology (SMT, Surface Mount Technology) is used to electrically connect and fix the circuit board (PC). Since the gold wire has an arc height and needs to increase the thickness of the outer casing of the wafer, the thickness of the card is relatively large, and the need for thinning and miniaturization cannot be achieved, which is disadvantageous for the card and the smart card (SIM). Matching applications between cards), such as cards with large thickness or large length and width, cannot or are not easily attached to smart cards (SIM Used on the card), especially when the smart card (SIM card) currently used has been upgraded from Mini SIM card (mini SIM card) to Micro SIM card (micro SIM card) or even Nano SIM (nano SIM card) The application between the card and the smart card (SIM card) increases the difficulty; secondly, the wafer is electrically connected and fixed to the circuit board (PC) by means of a wire-bounding method. Or the chip is first used as a standard package (such as QFP) and then surface mount technology (SMT) is used to electrically connect and fix the circuit board (PC), and an additional sealing process is added, the outer seal The molding is mainly used to protect the gold wire, but the manufacturing cost of the card is relatively increased, which is not conducive to the mass production and application of the card.

In view of the shortcomings of the conventional card structure in the process and / or practical application, the new type of research in this case has been researched and improved, especially the circuit board of the card is changed to use a flexible circuit board (FPC), and the wafer level package (CSP) is adopted. The process is to avoid adding an outer molding process and electrically attach and fix the wafer to the flexible circuit board (FPC) by surface mount technology (SMT). However, in the actual production process, the novelty of the present invention found that the above surface-to-surface technology (SMT) process still has shortcomings. Here, FIG. 9 is taken as an example, when the chip is electrically connected by surface-mounting technology (SMT). And being fixed on a surface of one of a plurality of bumps (or a bump side) on the flexible circuit board (FPC), wherein the plurality of bumps are used to The plurality of contacts arranged on the smart card (SIM card) in a predetermined specification can be electrically connected one-to-one. The process of the process includes: performing a dimple step on a flexible circuit board (FPC) 90. A plurality of bumps 92 are formed on the same surface 91 of the flexible circuit board (FPC) 90, and in the present technology, six are formed on the same surface 91 of the flexible circuit board (FPC) 90. Bumps are arranged in a 2x3 manner for one-to-one correspondence to a smart card (SIM card) with 6 contacts arranged in the same and predetermined specifications (as shown in Figure 3), at ninth In the figure, only two bumps 92 are arranged in a 2x3 manner, but are not intended to limit the present invention; then a solder print is performed, that is, in the soft circuit board (FPC) 90 A tin bump 93 is printed on the electrical connection point; and then a subsequent surface tandem wafer operation (SMT chip) is performed, that is, the wafer is electrically connected and fixed on the flexible circuit board by surface surface bonding technology (SMT) (FPC) ) 90 corresponds to the surface of the wafer; then an additional under-fill is added but is not intended to limit the novel, ie, after surface-subsequent (SMT) operation (not shown, The gap between the wafer and the flexible circuit board (FPC) 90 can be reinforced by referring to the gap between the first board and the flexible printed circuit board (FPC) 90; however, in the above-mentioned soldering operation (solder) In print, a tin-plated steel plate 95 pre-posed with a plurality of perforations 94 corresponding to respective electrical connection points of a flexible circuit board (FPC) 90 is used to cover the surface 91 of the flexible circuit board (FPC) 90. To perform tinning work, but since the surface 91 has been formed with a plurality of upwardly protruding heights (such as 300 μm) Bump 92, so when the tin plate 94 is pressed over the surface 91 of the flexible circuit board (FPC) 90, the bottom surface of the tin plate 94 is first pressed against the plurality of bumps 92. The upper surface of the flexible circuit board (FPC) 90 cannot be directly attached to the surface 91 of the flexible circuit board (FPC) 90, so that the deformation of the plurality of bumps 92 is easily caused, thereby affecting the plurality of bumps 92 and the smart card. (SIM card) the quality of the one-to-one correspondence between the plurality of contacts, and because the plurality of bumps 92 have a protruding height (for example, 300 μm), the bottom surface of the tin plate 94 is The gap 96 formed between the surface 91 of the flexible circuit board (FPC) 90 is also increased, which makes it difficult to control the amount of tin in the tin printing operation. For example, the tin convex 93 height shown in Fig. 9 is more perforated than the tin printed steel plate 95. 94 height is at least more than the gap 96 height of the tin amount and is difficult to control; it can be seen that the flexible circuit board (FPC) and the surface bonding technology (SMT) are used to electrically connect and fix the wafer on the flexible circuit board (FPC). There is still room for further improvement in the process.

The main purpose of the present invention is to provide a smart card (SIM card) card comprising a flexible circuit board (FPC) and a chip with a predetermined function, wherein one surface of the flexible circuit board (FPC) A plurality of electrical connection bumps are disposed on the plurality of contacts arranged in a predetermined size on the smart card (SIM card) to be electrically connected in a one-to-one correspondence, so that the stickers are When the card is overlaid on the smart card (SIM card), the predetermined function of the card can be achieved by using the smart card (SIM card); wherein the chip is disposed on the flexible circuit board and the plurality of bumps are disposed On the same surface, the wafer is disposed in an intermediate portion between the plurality of bumps arranged in a predetermined size; thereby, the card is thinned and miniaturized, and the card is raised. Application range.

Another object of the present invention is to provide a smart card (SIM card) card, the method for manufacturing the card includes the following steps: Step 1: For a size of a SIM card, a soft circuit board is provided for attaching to the card The SIM card is used, wherein a predetermined forming position of a plurality of bumps is known on one surface of the flexible circuit board, and the plurality of bumps are used to be one-to-one with the plurality of contacts provided on the SIM card. Corresponding to the electrical connection, wherein an intermediate portion is formed between the forming positions of the plurality of bumps; Step 2: further matching a matched wafer to the flexible circuit board by using Surface Mount Technology (SMT) Forming an intermediate portion between the forming positions of the plurality of bumps; Step 3: performing a dimple operation to form the plurality of convexities on the same surface of the flexible circuit board (FPC) on which the wafer is provided Bumping, so that the wafer is located in an intermediate region between the plurality of formed plurality of bumps; thereby, the finished card can be thinned and miniaturized to enhance the application of the card Scope and simplify the process to reduce the manufacturing cost of the card

10‧‧‧ Sticker

20‧‧‧Soft circuit board

21‧‧‧ surface

22‧‧‧Bump

23‧‧‧Intermediate area

24‧‧‧Electrical connection point

25‧‧‧ tin convex

26‧‧‧ peripheral area

261‧‧‧ Peripheral area (no line)

262‧‧‧ Peripheral area (with lines)

30‧‧‧ wafer

31‧‧‧Connecting pads (contacts)

40‧‧‧Smart Card (SIM Card)

40a‧‧‧Mini SIM card

40b‧‧‧Micro SIM card (micro SIM card)

40c‧‧‧Nano SIM (Nami SIM Card)

50‧‧‧Viscos

60‧‧‧Cato

70‧‧‧Smart card slot (SIM card slot)

71‧‧‧Shrap

80‧‧‧Printed tin plate

81‧‧‧Perforation

82‧‧‧ tin convex

90‧‧‧Soft Board (FPC)

91‧‧‧ surface

92‧‧‧Bump

93‧‧‧ tin convex

94‧‧‧Perforation

95‧‧‧Printed tin plate

Figure 1 is a side cross-sectional view of one of the new types of stickers.

Figure 2 is an enlarged top plan view of one of the flexible circuit boards in the card of Figure 1.

Figure 3 is a top plan view of the wafer position of the present invention relative to the Mini SIM card (40a), the Micro SIM card (40b), and the Nano SIM (40c).

Fig. 4 is a side cross-sectional view showing the wafer of the present invention packaged in a wafer level (CSP) and then connected in a SMT manner to a flexible circuit board (FPC).

Figure 5 is a side cross-sectional view of one embodiment of the present invention in conjunction with a smart card (SIM card) (and indicating partial height dimensions for reference).

Figure 6 is a side cross-sectional view (also indicating a partial height dimension for reference) of yet another embodiment (with a card tray) for use with the smart card (SIM card) of the present invention.

Fig. 7 is a side cross-sectional view showing the embodiment of Fig. 6 (with a card tray) inserted into a smart card slot (SIM card slot) (and indicating a part of the height dimension for reference).

Fig. 8 is a drawing process in which the tin-plated steel plate is first pressed on the surface of the flexible circuit board to perform a solder print, and then a plurality of bumps are formed on the flexible circuit board (FPC). Bump) is a side cross-sectional view.

Figure 9 is a new type of card in the process of first forming a plurality of bumps on a flexible circuit board (FPC) and then stamping the tin plate on the surface of the flexible circuit board for printing tin ( Solder print) One side cross-sectional view.

In order to make the present invention more clear and detailed, the preferred embodiment and the following diagrams are used to describe the structure and technical features of the present invention as follows: Referring to Figures 1, 2, and 3, respectively, a side cross-sectional view of one of the cards of the present invention, wherein one of the flexible circuit boards is enlarged and a schematic view of the wafer relative to the Mini SIM card, the Micro SIM card, and the Nano SIM. The top view is schematic. The smart card (SIM card) sticker 10 of the present invention comprises a flexible circuit board (FPC) 20 and a chip 30 having a predetermined function, wherein one surface 21 of the flexible circuit board (FPC) 20 is provided. There are a plurality of bumps 22 for electrical connection, and the plurality of bumps 22 are used for the smart card (SIM card) 40 (shown in FIG. 3) used together. The plurality of contacts 41 can be electrically connected one-to-one; when used, the card 10 is attached to the 40 smart card (SIM card) (as shown in Figures 5-7), so that the sticker The card 10 can achieve a predetermined function of the card 10 by using the smart card (SIM card) 40, such as a cash card, a bank financial card or a credit card, and various different functions that are preset according to the use requirements; wherein the chip 30 is provided The flexible circuit board 20 is provided on the same surface 21 of the plurality of bumps 22, and the wafer 30 is disposed in the intermediate portion 23 between the plurality of bumps 22 arranged in a predetermined specification; Therefore, the card is thinned and miniaturized, and the application range of the card is improved.

Referring to Figures 2 and 3, the use of the smart card (SIM card) 40 is relatively fast, and its size is becoming thinner and lighter. The Mini SIM card has a larger size, as shown in Figure 3, 40a. Advanced to a smaller micro SIM card (micro SIM card) as shown in Figure 3, 40b, or even a smaller Nano SIM (nano SIM card) as shown in Figure 3, 40c; In terms of the arrangement of the plurality of contacts 41 of the smart card (SIM card), the plurality of contacts 41 provided on the various smart cards (SIM cards) 40 (40a, 40b, 40c) are still in a predetermined specification. Arranged at a specific position on the smart card (SIM card) 40 card, as shown in FIG. 3, a total of six contacts are provided on various smart cards (SIM cards) 40 (40a, 40b, 40c). 2x3 arrangement (ie 2 rows x 3 columns), but not limited to the new type, so there will be between the three contacts 41 of the first row and the three contacts 41 of the second row An intermediate region 42 is formed as shown in FIG. The six bumps 22 (shown in FIG. 2) provided on one surface 21 of the flexible circuit board (FPC) 20 of the present invention are used for the smart card (SIM card) used together. The six contacts 41 provided on the 40 (shown in FIG. 3) can be electrically connected one-to-one, so that in the surface 21 of the flexible circuit board (FPC) 20, three in the first row The bump 22 and the 3 bumps of the second row 22 also have an intermediate region 23 (as shown in FIGS. 1 and 2), and the chip 30 is The flexible circuit board (FPC) 20 is connected and fixedly disposed in the intermediate portion 23 as shown in Figs.

Referring to FIG. 4, it is a side cross-sectional view showing the wafer of the present invention packaged in a wafer level (CSP) and then connected in a SMT manner to a flexible circuit board (FPC). The chip 30 of the present invention is a wafer level package (CSP) process, and the wafer 30 is electrically connected and fixed on the flexible circuit board (FPC) 20 by surface mount technology (SMT); A plurality of electrical connection points 24 are pre-configured on the flexible circuit board (FPC) 20 as required by the design. As shown in FIG. 2, there are a total of 16 electrical connection points 24 of 4x4, and only FIG. 4 shows only The four electrical connection points 24 are not limited to the present invention; and a tin bump 25 is printed on each of the electrical connection points 24 for surface-to-wafer operation (SMT chip), that is, the surface is subsequently used. The technology (SMT) connects and fixes the wafer 30 to the flexible circuit board (FPC) 20 and causes a plurality of exposed connection pads (contacts) 31 provided on the wafer 30 (as shown in FIG. 2). One-to-one correspondence can be electrically connected to a plurality of electrical connection points 24 (such as 16 shown in FIG. 2) provided on the flexible circuit board (FPC) 20. As can be seen from the above, the flexible circuit board (FPC) 20 is provided with a plurality of electrical connection points 24 according to the design requirements. As shown in FIG. 2, there are 4 electrical connection points 24 of 4×4, so the 16 The electrical connection points 24 are not limited to be disposed at the center of the intermediate portion 23 as shown in FIGS. 1 and 2, and are disposed at the non-central center of the intermediate portion 23 30a as shown in Fig. 3 is also tolerable.

Referring to FIG. 5, it is a side cross-sectional view of an embodiment of the present invention in which a card 10 (20, 30) is used in conjunction with a smart card (SIM card) 40 (and a part of the height dimension is used for reference); At the peripheral region 26 of the flexible circuit board (FPC) 20 of the card 10 (20, 30), the adhesive layer 50 can be further utilized as shown in FIG. 1 (such as the adhesive of 3M Company of the United States, the thickness is about 50 μm). However, it is not limited, so that the card 10 (20, 30) can be fixedly attached to the smart card (SIM card) 40 to achieve the use state as shown in FIG. 5; wherein the adhesive layer 50 can be used in a range of Extending outwardly to a size equivalent to the surface of the smart card (SIM card) 40, that is, equal to the size of the smart card (SIM card) 40 as shown in FIG. 5 but not limited; and a soft circuit board (FPC) In the thickness of the peripheral region 26 of the 20, if the peripheral region 26 is the peripheral region 261 where the line is not provided, the thickness is as small as about 42 μm, and if the peripheral region 26 is the peripheral region 262 provided with the line, the thickness is relatively Larger as about 90 μm.

In addition, after the card 10 (20, 30) of the present invention is actually produced by the applicant, its general size can be controlled to the size as shown in FIG. 1 but is not intended to limit the novel, wherein: Bump The total height of 22 (calculated from the bottom of the flexible circuit board 20) is 300 μm, the thickness of the chip 30 is 175 μm, the thickness of the adhesive 50 is 50 μm, and the total height of the chip 30 on the flexible circuit board 20. (from the bottom of the flexible circuit board 20) is 250 μm to 275 μm, and the area of the flexible circuit board (FPC) 20 where the wiring is provided (for example, the peripheral region 262) has a thickness of 90 μm, and the flexible circuit board (FPC) 20 is not provided. The area of the line (e.g., the peripheral area 261) has a thickness of 42 μm. As can be seen from the above, there is a distance of 25 μm between the top surface of the chip 30 and the apex of the bump 22 (300-275 = 25). space. When the card 10 (20, 30) of the present invention is actually used in conjunction with a smart card (SIM card) 40, the relevant dimensions of each part can be controlled to the size shown in FIG. 5 (but It is not intended to limit the present invention), wherein: the thickness of the smart card (SIM card) 40 is 800 μm, and the smart card (SIM card) 40 and the soft circuit board (FPC) 20 are not provided with a line (such as the peripheral area 261). The total thickness after bonding is 892 μm, and the total thickness of the smart card (SIM card) 40 and the area of the flexible circuit board (FPC) 20 on which the circuit and the chip 30 are disposed (such as the peripheral region 261) is 1120 μm; It can be seen that the size of the actual card 10 (20, 30) and the size of the smart card (SIM card) 40 can be controlled within an acceptable range, so it is indeed acceptable. Achieving the desired thinning and miniaturization requirements, thereby increasing the range of applications for the card.

Referring to FIG. 6, a side cross-sectional view (also indicating a partial height) of another embodiment (with a card holder 60) of the present type of card 10 (20, 30) and a smart card (SIM card) 40 is used. The size is for reference. The difference between this embodiment and the embodiment shown in FIG. 5 is that the card 10 of the embodiment is placed on the smart card (SIM card) 30, and then a card is inserted. As shown in Fig. 6, the top 60 of the smart card (SIM card) 40 protrudes from the top surface of the card 60 by about 77 μm, as shown in Fig. 6 It does not affect the original use function of the smart card (SIM card) 40.

Referring again to FIG. 7, which is a side cross-sectional view of the embodiment of FIG. 6 (with the card tray 60) inserted into the smart card slot (SIM card slot) 70 (and indicates a portion of the height dimension for reference). When the card 10 of the present invention is fixedly attached to the smart card (SIM card) 30 and then placed in a card holder 60 (as shown in FIG. 6), a smart card slot (SIM card slot) is placed. The use of 70 is as shown in FIG. 7, wherein at least one elastic piece 71 can be disposed on the bottom surface of the smart card slot (SIM card slot) 70, such as the three elastic pieces 71 shown in FIG. It is used to elastically support the bottom surface of the flexible circuit board 20 of the card 10 at an appropriate position; according to the actual production and the same state of the applicant, the smart The upper edge of the smart card (SIM card) 20 will be lower than the top surface of the card slot (SIM card slot) 70 by about 20 μm, so that the original function of the smart card (SIM card) 20 is not affected.

The manufacturing method of the card 10 of the present invention comprises the following steps:

Step 1: For a smart card (SIM card) 40, a matching flexible circuit board 20 and a chip 30 for being used on the smart card (SIM card) 40 for use in conjunction with the soft card board 20 are provided. A predetermined position on the surface 21 for forming a plurality of electrical connection bumps 22 is known, and the plurality of electrical connection bumps 22 can be formed with the smart card (SIM card) after being formed at the predetermined positions. The plurality of contacts 41 provided on the 40 are electrically connected, wherein an intermediate portion 23 is formed between the plurality of predetermined positions for forming.

Step 2: The mated wafer 30 is electrically connected and fixed in the intermediate region 23 on the flexible circuit board 20 by using Surface Mount Technology (SMT).

Step 3: forming the plurality of bumps 22 at a predetermined position of the plurality of bumps 22 so that the wafer 30 is located in the intermediate portion 23 between the plurality of formed bumps 22, and completing one A card 10 consisting of a flexible circuit board 20 and a wafer 30.

As shown in FIG. 1 , the structure of the card 10 of the present invention is as shown in FIG. 1 because there is a distance of 25 μm between the top surface of the chip 30 and the apex of the bump 22 ( 300-275=25) space, that is, the height of the (Chip) 30 is slightly lower than the height of the bump 22, and the (Chip) 30 is disposed between the plurality of bumps 22 In the middle area 23, if the process and the steps described in paragraph [0005] are performed on the solder print (as shown in Fig. 9), it is easy to occur as described in paragraph [0005]. Control and bumps are easily deformed. However, in the manufacturing method of the card 10 of the present invention, it is particularly step by step. In step 2, the matched wafer 30 is electrically connected and fixed in the intermediate region 23 on the flexible circuit board 20 by surface mount technology (SMT), and then the plurality of the wafers 30 are further performed in step 3. The forming operation of the bumps 22, therefore, when the process of the card 10 of the present invention is performed as shown in FIG. 8 in the case of performing a solder print, a pre-set corresponding to the soft circuit board (FPC) 20 is used. The tin plate 80 of the plurality of perforations 81 of the electrical connection point is overlaid on the surface of the flexible circuit board (FPC) 20 for printing, since the surface of the flexible circuit board (FPC) 20 has not been formed yet. a bump 22 of a height (for example, 300 μm) is protruded upward, so that the tin-plated steel sheet 80 can be directly and tightly pressed on the surface of the flexible circuit board (FPC) 20 as shown in FIG. The tin content of the tin bump 82 (as shown in Fig. 8) of the tin-printing operation is also effectively controlled, so that the disadvantages of the difficulty in controlling the amount of tin and the easy deformation of the bumps in the paragraph [0005] can be effectively solved and avoided.

In short, the process disclosed in paragraph [0005] sequentially includes the following operating procedures: first performing a dimple operation on a flexible circuit board (FPC), and then performing a solder print, after which A surface tandem wafer operation (SMT chip) is further performed to electrically connect and fix the wafer on the surface of the flexible circuit board (FPC) corresponding to the wafer, and then perform an under-filling operation. However, the process disclosed in the present invention sequentially includes the following operating procedures: first, a solder print is performed on a flexible circuit board (FPC), and then a surface-on-chip operation (SMT chip) is performed to electrically connect the wafers and It is fixed on the surface of the flexible circuit board (FPC) corresponding to the wafer, and then subjected to under-filling, and finally a dimple operation is performed on the flexible circuit board (FPC).

As can be seen from the above, the card mounting structure and the manufacturing method thereof have at least the following advantages: the card can be thinned and miniaturized, the process can be simplified, the manufacturing cost can be reduced, and the card can be improved. Applications range from Nano SIM (nano SIM card) (As shown in Figure 3).

The above description is only a preferred embodiment of the present invention, and is intended to be illustrative, and not restrictive; it will be understood by those of ordinary skill in the art Many changes, modifications, and even equivalent changes are made, but they fall within the scope of this new type of protection.

10‧‧‧ Sticker

20‧‧‧Soft circuit board

21‧‧‧ surface

22‧‧‧Bump

23‧‧‧Intermediate area

30‧‧‧ wafer

26‧‧‧ peripheral area

261‧‧‧ Peripheral area (no line)

262‧‧‧ Peripheral area (with lines)

50‧‧‧Viscos

Claims (8)

A smart card card having a plurality of contact power supply connections arranged on a surface of a smart card, the card comprising a flexible circuit board and a chip, wherein: the flexible circuit board, One surface is provided with a plurality of bumps for electrical connection, and the plurality of bumps are arranged on the surface in the same specification as the plurality of contacts provided by the smart card for being provided on the smart card. The plurality of contacts can be electrically connected in a one-to-one correspondence, wherein the plurality of bumps form an intermediate region lower than the plurality of bumps; the wafer is provided with a predetermined use function, and the surface is utilized Then, the technology (SMT) is electrically connected and fixed on the same surface of the flexible circuit board on which the plurality of bumps are disposed, and is located in an intermediate region formed between the plurality of bumps arranged in a predetermined specification. When the card is used, the card is attached to the smart card, so that the plurality of bumps of the flexible circuit board are electrically connected to the plurality of contacts disposed on the smart card in a one-to-one correspondence. Enabling the card to achieve the intended use of the card by the smart card . The card of the smart card as claimed in claim 1, wherein the smart card comprises a mini smart card (mini SIM card), a micro smart card (micro SIM card), and a nano smart card (Nano SIM card). The card of the smart card according to claim 1, wherein the smart card is provided with six contacts and arranged on the surface of the smart card in a predetermined size of 2x3, and the flexible circuit board is provided with six convex portions. Pointing and arranging on the surface of the flexible circuit board in the same 2x3 format for one-to-one electrical connection with the six contacts provided on the smart card, wherein a position is formed between the six bumps The middle region is lower than the six bumps. The card of the smart card of claim 1, wherein when the wafer is electrically connected by a surface and then fixed in an intermediate region formed between the plurality of bumps arranged in a predetermined specification, The top surface of the wafer is less than a distance of about 25 μm from the apex of the plurality of bumps. The card of the smart card of claim 1, wherein the flexible circuit board further utilizes an adhesive layer at a peripheral region of the wafer position to enable the card to be fixedly attached to the smart card to achieve status of use. The smart card of claim 5, wherein the adhesive layer can extend outward to or near the periphery of the smart card. The card of the smart card according to claim 1, wherein after the card is fixedly attached to the smart card, the card and the smart card are placed in a card holder, so that the card holder is placed On the periphery of the card and the smart card. The card of the smart card of claim 1, wherein the card is provided with a glue in the gap between the chip and the flexible circuit board for enhancing the quality of the surface between the chip and the flexible circuit board. .