CN104778492A - Intelligent patch-mounted card and mounting method using same - Google Patents
Intelligent patch-mounted card and mounting method using same Download PDFInfo
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- CN104778492A CN104778492A CN201410014098.6A CN201410014098A CN104778492A CN 104778492 A CN104778492 A CN 104778492A CN 201410014098 A CN201410014098 A CN 201410014098A CN 104778492 A CN104778492 A CN 104778492A
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- intelligent paster
- paster
- groove
- recess
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Abstract
The invention discloses an intelligent patch-mounted card and a mounting method using the same. The intelligent patch-mounted card comprises a carrier plate, a first adhesive layer, an intelligent patch, and a second adhesive layer. The carrier plate has a concave part and a surface. The first adhesive layer is adhered to the surface of the carrier plate. The intelligent patch is adhered to the first adhesive layer, and the position of the intelligent patch corresponds to the concave part. The second adhesive layer is adhered to the intelligent patch.
Description
Technical field
The invention relates to a kind of intelligent paster installing card and apply its installation method, and relate to especially and a kind ofly there is the intelligent paster installing card of recess and apply its installation method.
Background technology
Mobile payment service has developed for many years, and can carry out business transaction through mobile phone is future trend.The wherein a kind of mode will adding mobile payment function on mobile phone is through replacing whole user discrimination module (Subscriber Identity Module, SIM) and has blocked.But this kind of substitute mode needs the software and hardware significantly revising SIM card, causes the waste on composition and design time.
Summary of the invention
The invention relates to a kind of intelligent paster installing card and apply its installation method, the problem of the software and hardware significantly revising SIM card can be improved.
According to one embodiment of the invention, a kind of intelligent paster installing card is proposed.Intelligent paster installing card comprises a support plate, one first bonding coat, an intelligent paster and one second bonding coat.Support plate has a recess and a first surface.First bonding coat is bonding on the first surface of support plate.Intelligent paster is bonding on the first bonding coat, and the position corresponding recess of intelligent paster.Second bonding coat is bonding on intelligent paster.
According to another embodiment of the present invention, a kind of installation method of intelligent paster is proposed.The installation method of intelligent paster comprises the following steps.One intelligent paster installing card is provided, wherein intelligent paster installing card comprises a support plate, one first bonding coat, an intelligent paster and one second bonding coat, support plate has a recess and a first surface, first bonding coat is bonding on the first surface of support plate, intelligent paster is bonding on the first bonding coat, and the position corresponding recess of intelligent paster; Second bonding coat is bonding on intelligent paster.Bind a SIM card and intelligent paster; And, be separated the first bonding coat and intelligent paster.
In order to have better understanding to above-mentioned and other aspect of the present invention, preferred embodiment cited below particularly, and coordinating institute's accompanying drawings, being described in detail below:
Accompanying drawing explanation
Figure 1A illustrates the cut-open view of the intelligent paster installing card according to one embodiment of the invention.
Figure 1B illustrates the side view of Figure 1A.
Fig. 2 A to Fig. 2 E illustrates the installation process figure of the intelligent paster of the intelligent paster installing card of SIM card and Figure 1A.
Fig. 3 illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.
Fig. 4 A illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.
Fig. 4 B illustrates the side view of the support plate of Fig. 4 A.
Fig. 5 A to Fig. 5 E illustrates the installation process figure of the intelligent paster of the intelligent paster installing card of SIM card and Fig. 4 A.
Fig. 6 A illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.
Fig. 6 B illustrates the side view of the support plate of Fig. 6 A.
Fig. 7 illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.
Fig. 8 A illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.
Fig. 8 B illustrates the side view of first bonding coat of Fig. 8 A.
Fig. 9 A to Fig. 9 D illustrates the installation process figure of the intelligent paster of the intelligent paster installing card of SIM card and Fig. 8 A.
[symbol description]
10:SIM card
11,131: electrical contact
10 ': intelligent SIM card
100,200,300,400,500,600: intelligent paster installing card
110,310,410,510: support plate
110s1,310s1,410s1,510s1: first surface
110s2,310s2,410s2,510s2: second surface
110r, 310r, 410r, 510r: recess
110w: sidewall
120,520: the first bonding coats
121,122: part
130,230: intelligent paster
140: the second bonding coats
140s2: the second bond area
140s1: the first bond area
140a: hollow-out parts
150: gum
160: cladding plate
160s: prism
310s3,310s4,510s3: groove bottom
310r1: the first sub-groove
310r2: the second sub-groove
410r1: the three sub-groove
5211: the first contraposition regions
5212: the second contraposition regions
5213: the three contraposition regions
Embodiment
Please refer to Figure 1A and Figure 1B, Figure 1A illustrates the cut-open view of the intelligent paster installing card according to one embodiment of the invention, and Figure 1B illustrates the side view (not illustrating cladding plate) of Figure 1A.Intelligent paster installing card 100 comprises support plate 110, first bonding coat 120, intelligent paster 130, second bonding coat 140, gum 150 and cladding plate 160.
Support plate 110 has recess 110r and relative first surface 110s1 and second surface 110s2.The recess 110r system perforation of the present embodiment, under this design, when after separation cladding plate 160 with support plate 110, intelligent paster 130 can expose from recess 110r, and SIM card can be made to be installed on intelligent paster 130 through recess 110r.
First bonding coat 120 is bonding on the first surface 110s1 of support plate 110, makes intelligent paster 130 be bonding on support plate 110 through the first bonding coat 120, and unlikely disengaging support plate 110.First bonding coat 120 is such as transparent adhesive layer, and it has first surface 120s1 and second 120s2, and wherein first surface 120s1 has stickiness and is bonding on support plate 110 and intelligent paster 130, and second 120s2 can not have a stickiness.In addition, the first bonding coat 120 is such as electrostatic paster, and it can avoid the intelligent paster 130 of electrostatic breakdown.
Intelligent paster 130 can be combined with SIM card, and is applied to the purposes such as mobile payment, bank transaction, communication.Intelligent paster 130 is bonding on the first bonding coat 120, and the position corresponding recess 110r of intelligent paster 130.Intelligent paster 130 is fixed on support plate 110 by the first bonding coat 120, use the relative position of fixing intelligent paster 130 and recess 110r, so, be installed in intelligent paster 130 process through recess 110r in SIM card, the contraposition precision of SIM card and intelligent paster 130 can be promoted.In the present embodiment, the specification of intelligent paster 130 meets the size of recess 110r haply, and specifically, the area of intelligent paster 130 is identical with the aperture area of recess 110r haply, and the shape of the similar recess 110r of the shape of intelligent paster 130.In another embodiment, the specification of intelligent paster 130 can be less than the size of recess 110r.In the present embodiment, the specification of intelligent paster 130 meets the specification of Normal SIM card, its area about 2.5 cm x 1.5 centimetres.In another embodiment, the specification of intelligent paster 130 can meet Micro SIM card specification or Nano SIM card specification, wherein specification area about 1.5 cm x 1.2 centimetres of Micro SIM card, specification area about 1.22 cm x 0.88 centimetre of Nano SIM card.With regard to specification area, the area of Normal specification is less than Micro specification, and the area of Micro specification is less than Nano specification.
Intelligent paster 130 can be installed on size with in its SIM card identical or larger haply.Specifically, when the specification of intelligent paster 130 meets Normal specification, intelligent paster 130 can be installed on the SIM card meeting Normal specification; When the specification of intelligent paster 130 meets Micro specification, intelligent paster 130 can be installed on the SIM card meeting Normal or Micro specification; When the specification of intelligent paster 130 meets Nano specification, intelligent paster 130 can be installed on the SIM card meeting Normal, Micro or Nano specification.
Second bonding coat 140 is bonding on intelligent paster 130.Such as, the second bonding coat 140 is double faced adhesive tapes, and the first bond area 140s1 of double faced adhesive tape is bonding on intelligent paster 130, and gum 150 is bonding on the second bond area 140s2 of the second bonding coat 140, avoids the second bond area 140s2 expose and polluted.In the present embodiment, the geometric configuration of gum 150 meets the geometric configuration of the second bonding coat 140 haply.Intelligent paster 130 comprises multiple electrical contact 131, second bonding coat 140 and has hollow-out parts 140a, and the hollow-out parts 140a of the second bonding coat 140 exposes the electrical contact 131 of intelligent paster 130.The quantity of electrical contact 131 can coordinate the quantity of the electrical contact of SIM card, such as, be six or eight, and so this is not used to limit the embodiment of the present invention.
The size of cladding plate 160 conforms to the size of recess 110r, and cladding plate 160 can be made to fill up recess 110r haply.Because cladding plate 160 fills up recess 110r, intelligent paster 130 is positioned at outside recess 110r.In another embodiment, a part for intelligent paster 130 can be positioned at recess 110r, make a part for cladding plate 160 be positioned at recess 110r, and another part is positioned at outside recess 110r.Because recess 110r is a perforation, and the position corresponding recess 110r of intelligent paster 130, therefore when after separation cladding plate 160 with support plate 110, the electrical contact 131 of intelligent paster 130 can expose from recess 110r, allow SIM card be located on the electrical contact 131 exposed of intelligent paster 130 through recess 110r, use and be electrically connected at intelligent paster 130.In addition, punching press can be carried out to a sheet material, to form cladding plate 160 and support plate 110.
In the present embodiment, recess 110r is a taper hole, and cladding plate 160 is conical plates, and so, cladding plate 160 engages through tapering with recess 110r.In addition, through tapering, avoid cladding plate 160 to drop from first surface 110s1 toward the direction of second surface 110s2, and engage through tapering with recess 110r due to cladding plate 160, avoid cladding plate 160 to drop from first surface 110s1 easily.The sidewall 110w of recess 110r inside contracts from first surface 110s1 toward the direction of second surface 110s2, make recess 110r become taper hole, and cladding plate 160 has the prism 160s of the sidewall 110w of a contoured fit recess 110r, makes cladding plate 160 become a conical plate.In another embodiment, the sidewall 110w of recess 110r extends out from first surface 110s1 toward the direction of second surface 110s2 system, and the profile of the prism 160s of cladding plate 160 can be designed to the profile coordinating sidewall 110w.
Please refer to Fig. 2 A to Fig. 2 E, it illustrates the installation process figure of the intelligent paster 130 of the intelligent paster installing card 100 of SIM card 10 and Figure 1A.
As shown in Figure 2 A, separated intelligent type paster 130 and cladding plate 160.Specifically, because support plate 110 has pliability, the mode therefore by bending support plate 110 releases cladding plate 160, and cladding plate 160 is separated with support plate 110.After cladding plate 160 is separated with support plate 110, the electrical contact 131 of intelligent paster 130 exposes from recess 110r.
As shown in Figure 2 B, be separated gum 150 and the second bonding coat 140, to expose the second bond area 140s2 of the second bonding coat 140, follow-up SIM card 10 (Fig. 2 C) can be bonding on the second bond area 140s2 via recess 110r.
As shown in Figure 2 C, bind SIM card 10 on the second bond area 140s2 of the second bonding coat 140, SIM card 10 is installed on intelligent paster 130.SIM card 10 comprises multiple electrical contact 11, and it is contacted with the electrical contact 131 of intelligent paster 130, to be electrically connected at intelligent paster 130.Because the relative position of intelligent paster 130 with recess 110r is fixed through the first bonding coat 120, make in SIM card 10 with intelligent paster 130 installation process, SIM card 10 increases the contraposition precision with the electrical contact 131 of intelligent paster 130 through recess 110r.
After installation, intelligent paster 130 becomes an intelligent SIM card 10 ' with SIM card 10.In the present embodiment, the specification of intelligent paster 130 and the specification of SIM card 10 all meet Normal specification.In another embodiment, the specification of intelligent paster 130 can meet Micro specification, because Micro specification is less than Norrnal specification, therefore, the specification of SIM card 10 can meet Normal specification or Micro specification, and intelligent paster 130 like this can be installed in SIM card 10.In another embodiment, the specification of intelligent paster 130 can meet Nano specification, because Nano specification is less than Norrnal and Micro specification, therefore, the specification of SIM card 10 can meet Normal, Micro or Nano specification, and intelligent paster 130 like this can be installed in SIM card 10.
As shown in Figure 2 D, separated intelligent type SIM card 10 ' and the first bonding coat 120, make to lose connection mechanism between intelligent SIM card 10 ' and support plate 110, and therefore intelligent SIM card 10 ' is in a separable state with support plate 110.
As shown in Figure 2 E, separated intelligent type paster 130 and support plate 110, to take out intelligent SIM card 10 '.Then, the intelligent SIM card 10 ' of Fig. 2 E can be installed on mobile phone, make mobile phone have mobile payment and functionality mobile communication simultaneously.
Fig. 3 illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.Intelligent paster installing card 200 comprises support plate 110, first bonding coat 120, intelligent paster 230, second bonding coat 140, gum 150 and cladding plate 160.With above-mentioned intelligent paster 130 unlike, the specification of the intelligent paster 230 of the present embodiment is less than the size of recess 110r.In one embodiment, the size of intelligent paster 230 can meet Micro specification, and under this design, the specification of SIM card 10 can meet Normal or Micro specification.Or the size of intelligent paster 230 can meet Nano specification, under this design, the specification of SIM card 10 can meet Normal, Micro or Nano specification.The intelligent paster 230 of intelligent paster installing card 200 and the intelligent paster 130 of the installation method of SIM card similar in appearance to intelligent paster installing card 10 and the installation method of SIM card, hold this and repeat no more.
Fig. 4 A illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.Intelligent paster installing card 300 comprises support plate 310, first bonding coat 120, intelligent paster 130, second bonding coat 140 and gum 150.Intelligent paster 130 is bonding on support plate 310 through the first bonding coat 120.Support plate 310 comprises recess 310r and has relative first surface 310s1 and second surface 310s2.
In the present embodiment, recess 310r is a groove, and intelligent paster 130 can be positioned at groove.Recess 310r comprises the first sub-groove 310r1 and the second sub-groove 310r2.First sub-groove 310r1 extends from first surface 310s1 toward the direction of second surface 310s2 and does not run through support plate 310.The direction that second sub-groove 310r2 extends toward second surface 310s2 from the groove bottom 310s3 of the first sub-groove 310r1 extends and does not run through support plate 310 equally.The specification of the intelligent paster 130 of the present embodiment meets the size of the first sub-groove 310r1 haply, and intelligent paster 130 can be made to be positioned at the first sub-groove 310r1.In another embodiment, the specification of intelligent paster 130 can meet the size of the second sub-groove 310r2, and intelligent paster 13 can be made to be positioned at the first sub-groove 310r1 or the second sub-groove 310r2.In addition, machining mode can be adopted to form recess 310r, machining mode is such as milling.
Fig. 4 B illustrates the side view of the support plate of Fig. 4 A.As seen from the figure, the size of the first sub-groove 310r1 is different from the second sub-groove 310r2.In the present embodiment, the size of the first sub-groove 310r1 can meet Normal specification, and the size of the second sub-groove 310r2 can meet Micro or Nano specification, the SIM card meeting Normal, Micro or Nano specification is made to can pass through the first sub-groove 310r1 or the second sub-groove 310r2 is installed on intelligent paster 130.In another embodiment, the size of the first sub-groove 310r1 can meet Micro specification, and the size of the second sub-groove 310r2 can meet or Nano specification, the SIM card meeting Micro or Nano specification is made to can pass through the first sub-groove 310r1 or the second sub-groove 310r2 is installed on intelligent paster 130.
Please refer to Fig. 5 A to Fig. 5 E, it illustrates the installation process figure of the intelligent paster 130 of the intelligent paster installing card 300 of SIM card 10 and Fig. 4 A.
As shown in Figure 5A, by tearing the mode of the first bonding coat 120, be separated a part 121 and the support plate 310 of the first bonding coat 120, to expose recess 310r.After recess 310r exposes, follow-up SIM card 10 (Fig. 5 C) can be located in the recess 310r that exposes.After tearing the first bonding coat 120, another part 122 of first bonding coat 120 still maintains and is bonding on the first surface 310s1 of support plate 310, make intelligent paster 130 constant haply with the relative position relation of recess 310r by this, so can promote intelligent paster 130 and SIM card 10 contraposition accuracy in subsequent step (Fig. 5 D).
As shown in Figure 5 B, gum 150 and the second bonding coat 140 is separated, to expose the second bond area 140s2 of the second bonding coat 140.
As shown in Figure 5 C, SIM card 10 is set in recess 110r.The specification of SIM card 10 is greater than or equals the specification of intelligent paster 130 haply.The intelligent paster 130 of the present embodiment and the specification of SIM card 10 all illustrate to meet Normal specification.In another embodiment, the specification of intelligent paster 130 meets can Micro specification, and under this design, the specification of SIM card 10 meets can Normal or Micro specification.In another embodiment, the specification of intelligent paster 130 meets can Nano specification, and under this design, the specification of SIM card 10 meets can Normal, Micro or Nano specification.In addition, SIM card 10 comprises multiple electrical contact 11, and it is towards the electrical contact 131 of intelligent paster 130, makes electrical contact 11 can be in electrical contact with the electrical contact 131 of intelligent paster 130.
As shown in Figure 5 D, by a part 121 for the first bonding coat 120 is binded on the first surface 310s1 of return load plate 310, drive the electrical contact 11 of the electrical contact 131 of intelligent paster 130 SIM card 10 in electrical contact, and SIM card 10 is bonding on the second bond area 140s2 of the second bonding coat 140.After installation, intelligent paster 130 becomes intelligent SIM card 10 ' with SIM card 10.
As shown in fig. 5e, separated intelligent type paster 130, support plate 310 and the first bonding coat 120, to take out intelligent SIM card 10 '.The intelligent SIM card 10 ' of Fig. 5 E can be installed on mobile phone by user, makes mobile phone have mobile payment and functionality mobile communication simultaneously.
Fig. 6 A illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention, and Fig. 6 B illustrates the side view of the support plate of Fig. 6 A.Intelligent paster installing card 400 comprises support plate 410, first bonding coat 120, intelligent paster 130, second bonding coat 140 and gum 150.In the present embodiment, support plate 410 has recess 410r and relative first surface 410s1 and second surface 410s2.Recess 410r is a groove, and it comprises the first sub-groove 310r1, the second sub-groove 310r2 and the 3rd sub-groove 410r1.First sub-groove 310r1 extends from first surface 410s1 toward the direction of second surface 410s2 and does not run through support plate 410.The direction that second sub-groove 310r2 extends toward second surface 410s2 from the groove bottom 310s3 of the first sub-groove 310r1 extends and does not run through support plate 410.The direction that 3rd sub-groove 410r1 extends toward second surface 410s2 from the groove bottom 310s4 of the second sub-groove 310r2 extends and does not run through support plate 410 equally.In the present embodiment, the size of the first sub-groove 310r1 can meet Normal specification, and the size of the second sub-groove 310r2 can meet Micro specification, and the size conforms of the 3rd sub-groove 410r1 can Nano specification.
The specification of the intelligent paster 130 of the present embodiment can meet Normal, Micro or Nano specification.In the intelligent paster 130 of intelligent paster installing card 400 and the installation process of SIM card, when the specification of intelligent paster 130 meets Normal specification, then the specification of SIM card 10 (not being illustrated in Fig. 6 A) can meet Normal specification, under this design, SIM card 10 can be located in the first sub-groove 310r1 in installing.Or when the specification of intelligent paster 130 meets Micro specification, then the specification of SIM card 10 can meet Normal or Micro specification; Under this design, SIM card 10 can be located in the first sub-groove 310r1 (Normal specification) or the second sub-groove 310r2 (Micro specification) in installing.Or when the specification of intelligent paster 130 meets Nano specification, the specification of SIM card 10 (not being illustrated in Fig. 6 A) can meet Normal, Micro or Nano specification; Under this design, SIM card 10 can be located in the first sub-groove 310r1 (Normal specification), the second sub-groove 310r2 (Micro specification) or the 3rd sub-groove 410r1 (Nano specification) in installing.
Fig. 7 illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.Intelligent paster installing card 500 comprises support plate 510, first bonding coat 120, intelligent paster 130, second bonding coat 140 (not illustrating) and gum 150 (not illustrating).Support plate 510 comprises recess 510r and relative first surface 510s1 and second surface 510s2.In the present embodiment, recess 510r is single groove, that is, the whole groove bottom 510s3 of recess 510r be coplanar and not the section of tool difference structure.Recess 510r extends from first surface 510s1 toward the direction of second surface 510s2, and does not run through support plate 510.In the present embodiment, because recess 510 is single grooves, the specification of intelligent paster 130, recess 510r and the SIM card of installing all can meet same specification (Normal, Micro or Nano specification), use the contraposition accuracy promoting intelligent paster 130 and SIM card.
Fig. 8 A illustrates the cut-open view of the intelligent paster installing card according to another embodiment of the present invention.Intelligent paster installing card 600 comprises support plate 310, first bonding coat 520, intelligent paster 230, second bonding coat 140 (not illustrating) and gum 150 (not illustrating).In another embodiment, support plate 310 also can change and replaces with support plate 110 or 210.
Fig. 8 B illustrates the side view of first bonding coat of Fig. 8 A.First bonding coat 520 has the first contraposition region 5212, contraposition region 5211, second and the 3rd contraposition region 5213, and wherein the size in the first contraposition region 5212, contraposition region 5211, second and the 3rd contraposition region 5213 is different.Such as, the size conforms Normal specification in the first contraposition region 5211, the size conforms Micro specification in the second contraposition region 5212, and the size conforms Nano specification in the 3rd contraposition region 5213.In the present embodiment, the first contraposition region 5212, contraposition region 5211, second and the 3rd contraposition region 5213 are such as dotted line frames, so also can be solid box.Because the first bonding coat 520 is transparent adhesive layer, therefore the first contraposition region 5212, contraposition region 5211, second and the 3rd contraposition region 5213 all can be watched from two faces of the first bonding coat 520.In another embodiment, the first bonding coat 520 can omit one or both in the first contraposition region 5212, contraposition region 5211, second and the 3rd contraposition region 5213.
In the present embodiment, the specification of intelligent paster 230 meets the size in the 3rd contraposition region 5213.In another embodiment, the specification of intelligent paster 230 can meet the size in the first contraposition region 5211 or the size in the second contraposition region 5212.When the specification of intelligent paster 230 meets the size in the first contraposition region 5211, intelligent paster 230 can be installed on the SIM card meeting Normal specification; When the specification of intelligent paster 230 meets the size in the second contraposition region 5212, intelligent paster 230 can be installed on the SIM card meeting Normal or Micro specification; When the specification of intelligent paster 230 meets the size in the 3rd contraposition region 5213, intelligent paster 230 can be installed on the SIM card meeting Normal, Micro or Nano specification.
Please refer to Fig. 9 A to Fig. 9 D, it illustrates the installation process figure of the intelligent paster 230 of the intelligent paster installing card 600 of SIM card 10 and Fig. 8 A.
As shown in Figure 9 A, the first bonding coat 520 and support plate 310 is separated completely.
As shown in Figure 9 B, gum 150 and the second bonding coat 140 is separated, to expose the second bond area 140s2 of the second bonding coat 140.
As shown in Figure 9 C, aim at the first contraposition region 5211, SIM card 10 is installed on intelligent paster 230.The specification of the intelligent paster 230 of the present embodiment meets Nano specification, and the specification of SIM card 10 can meet Normal, Micro or Nano specification, and the SIM card 10 of the present embodiment illustrates for Normal specification.In another embodiment, the specification of intelligent paster 230 can meet Micro specification, and because intelligent paster 230 can be installed on on its adjoining dimensions or larger SIM card, therefore the specification of SIM card 10 can meet Normal or Micro specification.Or the specification of intelligent paster 230 and SIM card 10 all can meet Normal specification.
As shown in fig. 9d, after installation, SIM card 10 is bonding on intelligent paster 230 through the second bonding coat 140, makes SIM card 10 and intelligent paster 230 become intelligent SIM card 10 '.The intelligent SIM card 10 ' of Fig. 9 D can be installed on mobile phone by user, makes mobile phone have mobile payment and functionality mobile communication simultaneously.
In sum, although the present invention with preferred embodiment disclose as above, so itself and be not used to limit the present invention.Persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is when being as the criterion of defining depending on the right of enclosing.
Claims (19)
1. an intelligent paster installing card, comprising:
One support plate, has a recess;
One first bonding coat, is bonding on this support plate;
One intelligent paster, is bonding on this first bonding coat, and the position of this intelligent paster is to should recess; And
One second bonding coat, is bonding on this intelligent paster.
2. intelligent paster installing card according to claim 1, wherein this second bonding coat is a double faced adhesive tape, and one first bond area of this double faced adhesive tape is bonding on this intelligent paster, and this intelligent paste card more comprises:
One gum, is bonding on one second bond area of this second bonding coat.
3. intelligent paster installing card according to claim 1, wherein this intelligent paster comprises multiple electrical contact, and this second bonding coat has a hollow-out parts, and these electrical contacts of this intelligent paster expose from this hollow-out parts of this second bonding coat.
4. intelligent paster installing card according to claim 1, wherein the specification of this intelligent paster is less than or equal to the size of this recess.
5. intelligent paster installing card according to claim 1, wherein this recess is a perforation, and this intelligent paster installing card more comprises:
One cladding plate, is sticked in this recess.
6. intelligent paster installing card according to claim 5, wherein this recess is a taper hole, and this cladding plate is a conical plate.
7. intelligent paster installing card according to claim 6, wherein this support plate has a relative first surface and a second surface, this first bonding coat is bonding on this first surface, one sidewall of this recess inside contracts from this first surface toward the direction of this second surface, and this cladding plate has the prism that is matched with this sidewall of this recess.
8. intelligent paster installing card according to claim 1, wherein this recess is a groove, and this intelligent paster is positioned at this groove.
9. intelligent paster installing card according to claim 8, wherein this support plate has a first surface, this first bonding coat is bonding on this first surface, this groove comprises one first sub-groove and one second sub-groove, this first sub-groove extends from this first surface, this second sub-groove extends from the groove bottom of this first sub-groove, and the specification of this intelligent paster meets the size of this first sub-groove or the size of this second sub-groove.
10. intelligent paster installing card according to claim 9, wherein this groove more comprises one the 3rd sub-groove, the groove bottom of this second sub-groove of the 3rd sub-groove extends, and the specification of this intelligent paster meets the size of this first sub-groove, the size of this second sub-groove or the size of the 3rd sub-groove.
11. intelligent paster installing cards according to claim 1, wherein the first bonding coat has one first contraposition region and one second contraposition region, the size in this first contraposition region and this second contraposition region is different, and the specification of this intelligent paster meets the size in this first contraposition region or the size in this second contraposition region.
12. intelligent paster installing cards according to claim 11, wherein the first bonding coat has more one the 3rd contraposition region, the size in this first contraposition region, this second contraposition region and the 3rd contraposition region is different, and the specification of this intelligent paster meets the size in this first contraposition region, the size in this second contraposition region or the size in the 3rd contraposition region.
The installation method of 13. 1 kinds of intelligent pasters, comprising:
One intelligent paster installing card as claimed in claim 1 is provided;
Bind a user discrimination module (Subscriber Identity Module, SIM) card and this intelligent paster; And
Be separated this first bonding coat and this intelligent paster.
14. installation methods according to claim 13, wherein this second bonding coat is a double faced adhesive tape, one first bond area of this double faced adhesive tape is bonding on this intelligent paster, and this intelligent paste card more comprises a gum, and this gum is bonding on one second bond area of this second bonding coat; This installation method more comprises:
Be separated this gum and this second bonding coat, to expose this second bond area;
In the step of binding this SIM card and this intelligent paster, this SIM card is bonding on this second bond area of this second bonding coat.
15. installation methods according to claim 13, wherein this intelligent paster comprises multiple electrical contact, and this second bonding coat has a hollow-out parts, and these electrical contacts expose from this hollow-out parts of this second bonding coat; This SIM card comprises multiple electrical contact; In the step of binding this SIM card and this intelligent paster, these electrical contacts that these electrical contacts this intelligent paster in electrical contact of this SIM card exposes from this hollow-out parts.
16. installation methods according to claim 13, wherein the specification of this intelligent paster is less than or equal to the size of this recess.
17. installation methods according to claim 13, wherein this recess is a perforation, and this intelligent paster installing card more comprises a cladding plate, and this cladding plate is sticked in this recess; Comprise in the step of binding this SIM card and this intelligent paster:
Be separated this cladding plate and this support plate, this intelligent paster is exposed from this recess; And
This SIM card is set in this recess, uses this SIM card to be bonding on being exposed to this intelligent paster.
18. installation methods according to claim 13, wherein this recess is a groove, and this intelligent paster is positioned at this groove; Comprise in the step of binding this SIM card and this intelligent paster:
Be separated a part and this support plate of this first bonding coat, to expose this recess;
This SIM card is set in this recess exposed; And
This part sticking back this first bonding coat, on this support plate, is used and is bonding in this SIM card by this intelligent paster.
19. installation methods according to claim 13, wherein the first bonding coat has one first contraposition region and one second contraposition region, the size in this first contraposition region and this second contraposition region is different, and the specification of this intelligent paster meets size or this second contraposition size in this first contraposition region;
Comprise in the step of binding this SIM card and this intelligent paster:
Be separated this first bonding coat and this support plate completely; And
Aim at the mode in this first contraposition region or this second contraposition region with this SIM card, bind this SIM card in this intelligent paster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410014098.6A CN104778492B (en) | 2014-01-13 | 2014-01-13 | Intelligent paster installation card and apply its installation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410014098.6A CN104778492B (en) | 2014-01-13 | 2014-01-13 | Intelligent paster installation card and apply its installation method |
Publications (2)
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| CN104778492B (en) | 2018-03-23 |
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