CN201392549Y - SIM card - Google Patents
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- Publication number
- CN201392549Y CN201392549Y CN200820303871U CN200820303871U CN201392549Y CN 201392549 Y CN201392549 Y CN 201392549Y CN 200820303871 U CN200820303871 U CN 200820303871U CN 200820303871 U CN200820303871 U CN 200820303871U CN 201392549 Y CN201392549 Y CN 201392549Y
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- CN
- China
- Prior art keywords
- sim card
- circuit board
- module
- opening
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to an SIM card, in particular to an SIM card used for conveniently inserting a plurality of IC modules. The SIM card comprises at least one IC module, a standard interface adapting to a card holder of the mobile communication terminal SIM card, a circuit board and also a card base, the IC module is connected with and fixedly arranged on the upper surface of the circuit board, the standard interface is fixedly connected with the lower surface of the circuit board, the IC module and the standard interface are electrically connected with each other through a circuit in the circuit board, the card base is provided with an opening which adapts to the IC module, and the IC module is tightly embedded in the opening of the card base. Because the circuit board and the card base are separated from each other, the utility model effectively enlarges the circuit area in the SIM card, thereby facilitating the insertion of more IC modules and other devices and components, and realizing the multiple expansion functions of the SIM card. In addition, the utility model has the advantages of simple processing technology and low manufacturing cost.
Description
Technical field
The utility model relates to a kind of SIM card, particularly a kind of convenient SIM card that embeds a plurality of IC modules.
Background technology
The SIM card (SubscriberIdentity Model) that mobile communication technology is used is widely used as the customer identification device of mobile communication terminal.Along with scientific technological advance, in order to make SIM card except that having basic SIM card function, also have other to be close to the function of life more, producer increases various smart circuit modules by the whole bag of tricks and develops the new application SIM card in the SIM card body of common mobile communication terminal, radio-frequency SIM card is exactly one of them.Chinese patent: 200710124354.7 disclose correlation technique.
The device increase that new application SIM card with expanded function is used owing to function increases causes existing SIM production technology can't satisfy this new application SIM card.At first existing SIM card technology can only encapsulate at single IC, and the SIM card of new application generally all needs to encapsulate the device more than two or two, especially with the SIM card of radio circuit, also needs to encapsulate devices such as a lot of resistance capacitances.Next is that the SIM card module area is too little, and the area that can place circuit and device is littler, can't place the circuit with expanded function.So must enlarge the placement area of circuit and device.
Based on above background, the utility model for solve this new application SIM card increase multiple device need and existing production technology in the too little defective of contradiction between the IC encapsulation and existing SIM card module area a kind of SIM card of package assembly type has been proposed, solved the problems referred to above effectively.
The utility model content
Technical problem to be solved in the utility model has provided a kind of SIM card, enlarges the module area of SIM card effectively, and has solved the encapsulation of IC in the existing production technology and SIM card and increase the contradiction between the needs of a plurality of devices, a plurality of IC modules of convenient embedding.
The technical scheme that the utility model solves the problems of the technologies described above is as follows: a kind of SIM card, comprise at least one IC module and with the adaptive standard interface of mobile communication terminal SIM card seat, also comprise a circuit board, described IC module is arranged on the upper surface of this circuit board, described standard interface is arranged on the lower surface of described circuit board, realizes being electrically connected by the circuit connecting wire in the circuit board between described IC module and the described standard interface; Described SIM card also comprises a card base, and the card base is provided with opening, and described IC module closely is embedded in the opening on the described card base.
The beneficial effects of the utility model are: described circuit board can effectively enlarge the circuit area in the SIM card, the size of circuit board can reach the size of SIM card, can place more circuit, conveniently place more IC module, realize the multiple expanded function of SIM card in SIM card; In addition, the SIM card in the utility model adopts circuit board, blocks basic double-layer structure, and processing technology is simple, and is cheap for manufacturing cost, adopts the production technology of existing SIM card to realize.
On the basis of technique scheme, the utility model can also be done following improvement.
Further, described circuit board is two-layer, be equipped with circuit connecting wire in every layer circuit board, circuit connecting wire in described IC module and the last layer circuit board is electrically connected, circuit connecting wire in described standard interface and the lower circuit plate is electrically connected, and is electrically connected by circuit connecting wire between the described levels circuit board.
The beneficial effect that adopts above-mentioned further scheme is that circuit board adopts double-layer structure, by increasing the thickness of circuit board, can insert more IC module and other devices in circuit board.
Further, the opening on the described card base is hole or groove or the non-enclosed opening that is located at card primary surface one side.
The beneficial effect that adopts above-mentioned further scheme is the IC module closely can be embedded in the described opening, and the thickness of the thickness of Ruo Kaji and IC module is suitable, and then this opening is the hole; The thickness of Ruo Kaji is greater than the thickness of IC module, and then this opening is a groove; If this opening is non-enclosed opening, then can easily the IC module closely be inserted in this opening.
Further, basic size of described card and shape are consistent with standard S IM card.
The beneficial effect that adopts above-mentioned further scheme be convenient with this SIM card use with mobile communication terminal in as mobile phone etc.
Further, the material of described circuit board is flexible PCB or hard PCB.
Further, described IC module is made up of a slice IC device at least.
Further, described IC module is fixed on the circuit board by the mode of paster welding or directly encapsulation.
The beneficial effect that adopts above-mentioned further scheme is that the IC module fixedly secures on circuit board difficult drop-off.
Further, the shape of the shape of described perforate and described IC module is suitable.
Further, the corner shape of described perforate is fan-shaped circular or square or rhombus.
Further, the material of described card base is the environment-friendly materials with elasticity, toughness.
Adopting the beneficial effect of such scheme is that described circuit board can conveniently connect more IC module and other devices, has effectively enlarged the circuit area in the SIM card; SIM card in the utility model adopts circuit board, the basic structure of card, and the IC module on the circuit board closely is embedded in the opening of card base, makes circuit board closely be connected with the card base, and processing technology is simple, can realize with existing SIM card production technology; And the tight reliable in quality of the IC module that embeds also can be simultaneously embeds the IC device of multiple other packing forms in the card base of described SIM card.
Description of drawings
Fig. 1 is the downward projection synoptic diagram of the utility model main circuit board;
Fig. 2 is the side projection synoptic diagram of the utility model main circuit board;
Fig. 3 is the structural representation of the utility model SIM card base;
Fig. 4 is the utility model SIM card structural representation;
Embodiment
Be described below in conjunction with the principle and the feature of accompanying drawing to utility model, institute gives an actual example and only is used to explain the utility model, is not to be used to limit scope of the present utility model.
A kind of SIM card is made up of circuit board, card base, is fixedly connected with at least one IC module on the circuit board, and the card base is provided with and the suitable opening of IC module, realizes circuit board and basic being connected of card by the IC module being embedded into opening; And on circuit board, also be connected with and the suitable standard interface of mobile communication terminal SIM card deck, thereby form whole SIM card.
The downward projection synoptic diagram of circuit board as shown in Figure 1, 2 and side projection synoptic diagram, circuit board 100 materials are flexible or rigid PCB, and its thickness is less than 0.2mm, and in establish circuit connecting wire.IC module 101 is connected with this circuit board, describedly is connected the lower surface of this circuit board with the suitable standard interface of the SIM card deck of mobile communication terminal, realizes being electrically connected by the circuit connecting wire in the circuit board between this IC module and the described standard interface.Afterwards, the IC module sticker is welded on the circuit board upper surface to be about to be welded on the circuit board upper surface after the IC module package, or directly plastic packaging is about to encapsulate after each device is bundled in the circuit board upper surface at the circuit board upper surface, thereby make more firm being fixed on the circuit board of IC module.In addition, the shape of this IC module can be designed to difformity according to actual conditions, is shaped as right angle, circular arc, oblique angle etc. as tetragonal body, hexahedron or its corner angle, is made up of by encapsulation a slice IC device at least.Except that said structure, described circuit board also can be two-layer, be equipped with circuit connecting wire in every layer circuit board, circuit connecting wire in described IC module and the last layer circuit board is electrically connected, circuit connecting wire in described standard interface and the lower circuit plate is electrically connected, and is electrically connected by circuit connecting wire between the described levels circuit board.
Fig. 3 is a SIM card base synoptic diagram, this blocks basic 200 materials is the environment-friendly materials with elasticity, toughness, as PVC, the profile of this card base is scarce one jiao the rectangle identical with the standard SIM card, and size is identical with the SIM card of standard, the card base is provided with opening 201, the shape of this opening 201 and described IC module are suitable, in addition, and according to the difformity in IC module bight, the corner shape of this opening can be designed to fan-shaped, circular, square, rhombus, with the convenient tight embedding that realizes the IC module.The thickness of the thickness of Ruo Kaji and described IC module is suitable, and then this opening can be designed to the hole; The thickness of Ruo Kaji is greater than the thickness of described IC module, and then this opening can be designed to groove; If the IC module closely need be inserted in this opening, then this opening can be designed to non-enclosed opening.
Figure 4 shows that the structural representation of SIM card, the IC module 101 that is fixed on circuit board 100 upper surfaces closely is embedded in the opening 201 of card base, circuit board 100 promptly fixedly secures on card base 200, form a complete SIM card, during use, this SIM card is inserted in the sim card slot of portable terminal such as mobile phone, interface in the sim card slot of the standard interface on the circuit board 100 and mobile communication terminal such as mobile phone is contacted, can in mobile communication terminal, realize the function of all IC modules in this SIM card.In addition, fixedly connected a plurality of corresponding IC modules in circuit board according to actual needs also, to realize required multiple expanded function, for example, can realize functions such as mobile phone wallet, Mobile banking by increasing corresponding IC module and being fixed on the circuit board.
The above only is preferred embodiment of the present utility model, and is in order to restriction the utility model, not all within spirit of the present utility model and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.
Claims (9)
1. SIM card, comprise at least one IC module and with the adaptive standard interface of mobile communication terminal SIM card deck, it is characterized in that, also comprise a circuit board, described IC module is arranged on the upper surface of this circuit board, described standard interface is arranged on the lower surface of described circuit board, realizes being electrically connected by the circuit connecting wire in the circuit board between described IC module and the described standard interface; Described SIM card also comprises a card base, and the card base is provided with opening, and described IC module closely is embedded in the opening on the described card base.
2. SIM card according to claim 1, it is characterized in that, described circuit board is two-layer, be equipped with circuit connecting wire in every layer circuit board, circuit connecting wire in described IC module and the last layer circuit board is electrically connected, circuit connecting wire in described standard interface and the lower circuit plate is electrically connected, and is electrically connected by circuit connecting wire between the described levels circuit board.
3. SIM card according to claim 1 is characterized in that, the opening on the described card base is hole or groove or the non-enclosed opening that is located at card primary surface one side.
4. SIM card according to claim 1 is characterized in that, basic size of described card and shape are consistent with the standard SIM card.
5. SIM card according to claim 1 is characterized in that, the material of described circuit board is flexible PCB or hard PCB.
6. SIM card according to claim 1 is characterized in that, described IC module is made up of a slice IC device at least.
7. SIM card according to claim 1 is characterized in that, described IC module is fixed on the circuit board by the mode of paster welding or directly encapsulation.
8. SIM card according to claim 1 is characterized in that, the shape of the shape of described opening and described IC module is suitable.
9. SIM card according to claim 1 is characterized in that, the corner shape of described opening is fan-shaped circular or square or rhombus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200820303871U CN201392549Y (en) | 2008-12-30 | 2008-12-30 | SIM card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200820303871U CN201392549Y (en) | 2008-12-30 | 2008-12-30 | SIM card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201392549Y true CN201392549Y (en) | 2010-01-27 |
Family
ID=41599370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200820303871U Expired - Lifetime CN201392549Y (en) | 2008-12-30 | 2008-12-30 | SIM card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201392549Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012075876A1 (en) * | 2010-12-06 | 2012-06-14 | 国民技术股份有限公司 | Communication system and communication method |
| CN102567751A (en) * | 2010-12-31 | 2012-07-11 | 国民技术股份有限公司 | Short-distance radio frequency communication system and method |
| WO2012145867A1 (en) * | 2011-04-29 | 2012-11-01 | Zhao Zheng | Novel integrated circuit card |
| CN104778492A (en) * | 2014-01-13 | 2015-07-15 | 全宏科技股份有限公司 | Intelligent patch-mounted card and mounting method using same |
-
2008
- 2008-12-30 CN CN200820303871U patent/CN201392549Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012075876A1 (en) * | 2010-12-06 | 2012-06-14 | 国民技术股份有限公司 | Communication system and communication method |
| CN102567751A (en) * | 2010-12-31 | 2012-07-11 | 国民技术股份有限公司 | Short-distance radio frequency communication system and method |
| WO2012145867A1 (en) * | 2011-04-29 | 2012-11-01 | Zhao Zheng | Novel integrated circuit card |
| CN104778492A (en) * | 2014-01-13 | 2015-07-15 | 全宏科技股份有限公司 | Intelligent patch-mounted card and mounting method using same |
| CN104778492B (en) * | 2014-01-13 | 2018-03-23 | 全宏科技股份有限公司 | Intelligent paster installation card and apply its installation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100127 |