TWI473022B - Integrated circuit film for smart card - Google Patents

Description

Integrated circuit patch for attaching to a smart card

The present invention relates to an integrated circuit patch attached to a smart card.

In the prior art, the functions or communication services (such as mobile banking services) that can be used by mobile phones usually depend on whether the SIM/USIM card can be supported. The "Double General Integrated Circuit Card System for Portable Devices", which is proposed by the Taiwan Patent Application No. 94106675, and the "Double Integrated Circuit Card System" proposed in Taiwan Patent Application No. 94217529, U.S. Patent Application Publication No. US2007 The "Multiple Interface Card in A Mobile Phone" proposed by the "Functional Module Improvement Structure for Expanded and Enhanced SIM Card", which is proposed by the Japanese Patent Application Publication No. US2009/0061933, proposes some methods to break through the traditional SIM/USIM card. The restrictions imposed.

In addition, the SIM/USIM card film used in mobile phones is also available on the market. For example, refer to the Weitong Card launched by Taiwan's Weibo Telecom (http://www.vibo.com.tw/CWS/ Consumer_05_08_08,,,,.html). The Qualcomm card and the patch are basically a film-type patch. Users can attach the patch to the traditional SIM card and put it into the mobile phone at the same time. The original SIM can be used via the mobile phone STK option function. The card does not provide a feature or application.

However, most of the above technologies are limited in the configuration of the mobile phone, or require additional processing of the original SIM card (such as burrowing or cutting cards), and even require specialized technicians to complete the operation, which is inconvenient to use, and the above processing The behavior in some countries even requires the consent of the telecommunications company that issued the SIM card.

One of the features of the integrated circuit chip in the embodiment of the present invention is that the integrated circuit chip omits the conventional packaging step, and in particular, does not need to cover the package molding material. The integrated circuit chip is directly bonded to the flexible circuit board, so the thickness can be reduced, and when combined with the smart card, there is no need to additionally process the smart card (such as burrowing or cutting cards), and the general smart card can still be read. Card device or slot for access.

According to an embodiment of the invention, an integrated circuit patch for attaching to a smart card includes a flexible circuit board, a first set of electrical contact pads, a second set of electrical contact pads, and an integrated circuit chip. The flexible circuit board has opposite first and second faces; the first set of electrical contact pads are disposed on the first surface and are used for electrically connecting the smart card; and the second set of electrical contact pads are disposed on the second side The integrated circuit chip is disposed on the flexible circuit board and electrically connected with a lead of the flexible circuit board, wherein the sum of the thickness of the flexible circuit board and the integrated circuit chip does not exceed 0.5 Mm. In addition, in another embodiment of the present invention, the mobile communication device has a SIM/USIM card and an integrated circuit patch as described above, wherein the integrated circuit patch is attached to the SIM/USIM card.

These features and advantages of the present invention will become more apparent from the description of the appended claims appended claims.

1 is a front and back view of an integrated circuit patch 100 in accordance with an embodiment of the present invention. The integrated circuit chip 100 includes a flexible circuit board 102, a first set of electrical contact pads C1, a second set of electrical contact pads C2, and an integrated circuit wafer 104. The flexible printed circuit board 102 has a first surface S1 and a second surface S2 opposite to each other; the first set of electrical contact pads C1 is disposed on the first surface S1 and is used for electrically connecting the smart card 200 (display) FIG. 3); a second set of electrical contact pads C2 are disposed on the second surface S2; the integrated circuit wafer 104 is disposed on the flexible circuit board 102 and is coupled to the lead 103 of the flexible circuit board 102 ( Bonding) to form an electrical connection.

Figure 2 further shows a front and back view of the flexible circuit board 102. As can be seen from FIG. 2, the first group of electrical contact pads C1 disposed on the first surface S1, the second group of electrical contact pads C2 disposed on the second surface S2, and the integrated circuit wafer 104 are formed by a flexible circuit board. The circuit on 102 is electrically connected. The circuitry of the flexible circuit board 102 can be formed as a printed circuit or by chemical deposition.

In FIG. 1 and FIG. 2, the first group of electrical contact pads C1 of the first surface S1 has a bump structure (see also FIG. 4), and the second group of electrical contact pads C2 of the second surface S2 has pits. The structure is located at a corresponding position on the flexible circuit board 102. However, in other embodiments not shown, as long as the electrical contact pad C1 can make electrical contact with the smart card to be attached, the electrical contact pad C2 can be connected to the general smart card access device (not shown). For electrical contact, the electrical contact pad C1 and the second set of electrical contact pads C2 may be located at different positions or have different shape structures, and the invention is not intended to be limited.

Preferably, as shown in FIG. 1 and FIG. 2, the positional structure of the first set of electrical contact pads C1 conforms to ISO7816-2, thereby electrically connecting the smart card under the ISO7816 specification, and the second set of electrical contact pads C2. The location structure is also in accordance with ISO7816-2, thereby electrically connecting the smart card access device under the ISO7816 specification (such as a SIM/USIM card slot or a smart card reader in a mobile phone).

As shown in FIG. 3 and FIG. 4, the integrated circuit wafer 104 is preferably disposed on the first surface S1, that is, facing the smart card 200. The first side S1 is provided with a double-sided tape, such as a 3M film VHB tape F-9460PC, for attaching to the surface of the smart card 200. When the integrated circuit patch 100 is attached to the smart card 200, the integrated circuit chip 104 is entirely outside the surface of the smart card 200. Thus, the integrated circuit wafer 104 is not covered by the package mold, but can be protected by both the smart card 200 and the flexible circuit board 102. However, the integrated circuit wafer 104 may be disposed on the second surface S2, and the present invention is not intended to be limited.

The integrated circuit wafer 104 is directly bonded to the leads 103 of the flexible circuit board 102 by an anisotropic conductive paste (ACF), or the integrated circuit wafer 104 is bonded to the pins 103 of the flexible circuit board 102 by gold wire bonding (GGI). Engage. In this embodiment, the integrated circuit wafer 104 does not cover the encapsulation molding (for example, epoxy resin); in contrast, the integrated circuit wafer 104 may be coated with only one layer of UV adhesive to enhance the fixing effect. The thickness of the integrated circuit wafer 104 can be greatly reduced, and when attached to the smart card 200, the step of burrowing or cutting the card on the smart card 200 is not required.

As shown in FIG. 4, the thickness d2 of the flexible circuit board 102 and the integrated circuit wafer 104 is not more than 0.5 mm, preferably not more than 0.4 mm; and the thickness d1 of the flexible circuit board 102 itself is not more than 0.2 mm, and preferably about 0.15. Mm. In general, the thickness of the smart card 200 is about 0.75-0.8 mm.

5 shows a mobile communication device 300 in accordance with an embodiment of the present invention. The mobile communication device 300 has a SIM/USIM card slot 302, a battery cover 304, and a SIM/USIM card 200 as shown in FIGS. 3 and 4 and attached thereto. The integrated circuit patch 100 on the upper side. The SIM/USIM card 200 and the integrated circuit chip 100 attached thereto can be placed in the slot 302 and accessed by the slot 302. At this time, the integrated circuit can be used via the STK option function in the mobile communication device 300. Additional features or communication services provided by SMD 100. For the functions or communication services provided by the integrated circuit patch 100, reference may be made to the descriptions of the prior art documents, and no further details are provided herein.

In addition, the smart card in this manual contains the integrated circuit card in accordance with ISO7816, which is not limited to the SIM/USIM card used in mobile phones. For the smart card application example, please refer to http:/ /www.smartcardalliance.org, and the invention is not intended to be limiting.

The present invention may be embodied in other specific forms without departing from the spirit and scope of the invention. The aspects of the specific embodiments are to be considered as illustrative and not restrictive. Accordingly, the scope of the invention is indicated by the appended claims rather All changes that fall within the meaning and scope of the patent application are deemed to fall within the scope of the patent application.

100. . . Integrated circuit patch

102. . . Flexible circuit board

103. . . Pin

104. . . Integrated circuit chip

200. . . Smart card

300. . . Mobile communication device

302. . . SIM/USIM card slot

304. . . battery cover

C1, C2. . . Electrical contact pad

S1, S2. . . Soft circuit board

D1. . . Flexible board thickness

D2. . . The sum of the thickness of the flexible circuit board and the integrated circuit chip

In order to immediately understand the advantages of the present invention, the present invention briefly described above will be described in detail with reference to the specific embodiments illustrated in the accompanying drawings. The invention is described with additional clarity and detail with reference to the accompanying drawings in which: FIG.

1 is a schematic view of an integrated circuit patch according to an embodiment of the present invention;

2 is a schematic diagram of a flexible circuit board in accordance with an embodiment of the present invention;

3 is a schematic diagram of an integrated circuit patch and a smart card according to an embodiment of the invention;

4 is a side view of an integrated circuit patch and a smart card according to an embodiment of the present invention;

FIG. 5 is a mobile communication device in accordance with an embodiment of the present invention.

100. . . Integrated circuit patch

102. . . Flexible circuit board

103. . . Pin

104. . . Integrated circuit chip

200. . . Smart card (SIM/USIM card)

C1, C2. . . Electrical contact pad

S1, S2. . . Soft circuit board

Claims (10)

An integrated circuit patch for attaching to a smart card, the integrated circuit patch comprising: a flexible circuit board having a first side and a second side; a first set of electrical contacts a pad disposed on the first surface and electrically connected to the smart card; a second set of electrical contact pads disposed on the second surface; and an integrated circuit chip disposed on the flexible circuit board And electrically engaging with the first set of electrical contact pads and the second set of electrical contact pads; and the sum of the thickness of the flexible circuit board and the integrated circuit chip does not exceed 0.5mm. The integrated circuit chip of claim 1, wherein the integrated circuit chip is disposed on the first side. The integrated circuit patch of claim 1, wherein the second set of electrical contact pads is arranged in accordance with ISO7816-2. The integrated circuit chip of claim 1, wherein the integrated circuit chip is bonded to a pin of the flexible circuit board by an anisotropic conductive paste (ACF). The integrated circuit chip of claim 1, wherein the integrated circuit chip is bonded to a pin of the flexible circuit board by a gold wire bonding (GGI) technique. The integrated circuit chip of claim 1, wherein the integrated circuit chip is not covered by a package mold. The integrated circuit chip of claim 1, wherein the thickness of the flexible circuit board does not exceed 0.2 mm. The integrated circuit chip of claim 1, wherein the sum of the thickness of the flexible circuit board and the integrated circuit chip does not exceed 0.4 mm. A mobile communication device having a SIM/USIM card and an integrated circuit patch as claimed in any one of claims 1 to 8, which is attached to the SIM/USIM card. The mobile communication device of claim 9, wherein the integrated circuit chip is entirely outside the surface of the smart card.