CN201860522U

CN201860522U - Case with Internally balanced heat transferring and dissipating structure

Info

Publication number: CN201860522U
Application number: CN2010205660838U
Authority: CN
Inventors: 曾纪光; 赵纯源; 邵益丰
Original assignee: JIEYUAN TECHNOLOGY (MALAYSIA) Co Ltd
Current assignee: JIEYUAN TECHNOLOGY (MALAYSIA) Co Ltd
Priority date: 2010-10-19
Filing date: 2010-10-19
Publication date: 2011-06-08
Anticipated expiration: 2020-10-19

Abstract

The utility model relates to a case with an internally balanced heat transferring and dissipating structure, which comprises a circuit board and heat dissipating fins inside. The heat dissipating fins are used for dissipating heat of electronic heating devices on the circuit board and are divided into a longitudinal group and a transverse group, the longitudinal heat dissipating fin group consists of a plurality of heat dissipating fins which are arrayed parallelly mutually, one end of each heat dissipating fin is connected to the side surface of the case while the other end of each heat dissipating fin is connected to a board surface of the transverse heat dissipating fin group, and the other side of the board surface of the transverse heat dissipating fin group is connected with the electronic heating devices on the circuit board. By the aid of the structure, the case with an internally balanced heat transferring and dissipating structure can lead heat of the electronic heating devices to be dissipated to an internal space and an external space of the case quickly and uniformly, and guarantees circuits and chips to be operated normally for a long time.

Description

A kind of interior balanced radiator structure casing that passes

Technical field

The utility model belongs to the heat radiation field of the electronic device that generates heat, and is specifically related to a kind of interior balanced radiator structure casing that passes.

Background technology

At present, mounting circuit boards is a kind of very conventional project organization in the casing, and does not also have at present unified design for the heat dissipating method of heater members in the casing cavity interior circuit board, and existing heat dissipating method mainly contains following several:

1. add a step in the casing inboard, the used for electronic device screw that will generate heat is fixed on the step;

2. directly lock a slice fin at heater members, fin is hung in casing;

3. directly on heater members, lock a slice fin, fin is locked at inwall of casing etc. by screw.

But, these structural designs are not all considered the thermal source on the fin are evenly distributed, the regional area of heat on casing that the heating electronic device sends concentrated, cause casing can't be fast the heat of inside to be dispersed into space outerpace, thereby make the heat on the heating electronic device in time not loose, the work and the life-span of influence heating electronic device, electronic circuit can not normally be moved.

Summary of the invention

For overcoming above-mentioned defective, hot concentration phenomenon at existing casing inside, the purpose of this utility model is to provide a kind of interior balanced radiator structure casing that passes, make the heat of heating electronic device can be dispersed into the inner space and the space outerpace of casing rapidly equably, guarantee the long-time operate as normal of circuit, chip.

In order to achieve the above object, the technical solution of the utility model is: a kind of interior balanced radiator structure casing that passes, its inside includes circuit board and is used for the fin of heating dissipation from electronic devices on the circuit board, described some fin are divided into two groups of vertical and horizontal, described vertical groups of fins is made up of the polylith fin that is arranged parallel to each other, and every fin one end junctor shell-side face, the other end connects the plate face of heatsink transverse sheet group; The opposite side of described heatsink transverse sheet group plate face is connected with the heating electronic device on the circuit board.

The efficient that shifts to casing in order to improve the fin heat, the utility model can extend to bottom of shell with a side of heatsink transverse sheet group and vertical groups of fins and be attached thereto.

Fin in the sheet of heatsink transverse described in the utility model group can also can be monolithic for stacked multi-sheet structure.It is monolithic in this preferred embodiment.When being superposeed by the multi-disc fin, for reducing thermal resistivity, can adopt methods such as being coated with thermal conductive silicon.

For heat is transmitted evenly, the fin interval of described vertical groups of fins equates.

As preferred embodiment, fin and casing are structure as a whole in described vertical groups of fins, i.e. modeling one-shot forming is convenient and reliable, and the heat transfer efficiency height.

For each position temperature equalization that makes casing rises, the heating electronic device on the described circuit board is uniformly distributed in the plate face of heatsink transverse sheet group in the average mode of area.

The utility model also can be processed louvre and come auxiliary heat dissipation on fin.

The utility model also can arrange the auxiliary heat dissipation sheet and improve radiating effect at the vacant position of casing inner wall.

Radiating principle of the present utility model is: behind heating electronics device heating, transfer heat to fast and uniformly on the heatsink transverse sheet group, the heatsink transverse sheet group of high temperature is transferred to vertical groups of fins with most heats, and fraction is delivered to casing and casing inner space; Vertically fin is delivered to the whole space of casing inside very soon with heat, thereby the whole bulk temperature of casing inside is promptly raise simultaneously reach fast the heat with inside be delivered to space outerpace, thereby realizes fast, the purpose of Homogeneouslly-radiating.

Description of drawings

Below in conjunction with accompanying drawing and enforcement the utility model is further specified.

Fig. 1 is the perspective view of the utility model casing.

Fig. 2 is casing radiating principle figure.

Among the figure: 1. vertical fin 2. heatsink transverse sheets 3. heating electronic devices 4. bolts 5. auxiliary heat dissipation sheets 6. casings.

Embodiment

As shown in Figure 1: be provided with the vertical and horizontal groups of fins in casing 6 inside, heatsink transverse sheet group is single chip architecture; Vertically groups of fins is two groups and symmetric design, and every group then is made up of nine vertical fin 1 that are arranged parallel to each other; Every vertical fin 1 then links to each other with casing 6 sides respectively, with the plate face of heatsink transverse sheet 2, the vertical connection of bottom surface of casing 6; One end of heatsink transverse sheet 2 links to each other with casing 6 bottoms, and its another lateral plates then links to each other with heating electronic device 3 on the circuit board.The vacant position of casing 6 inwalls then is provided with auxiliary heat dissipation sheet 5 and improves radiating effect.

During installation, circuit board is fixing by bolt 4, the electronic device 3 that will generate heat is close on the heatsink transverse sheet 2 and evenly and distributes, be impartial division of fin area related around each heating electronic device 3, and heating electronic device 3 can be fixed with screws or clamps between the two with fin, and thermal resistance is the smaller the better, can cooperate thermal conductive silicon to use.

As shown in Figure 2: after 3 heatings of heating electronic device, fast and uniformly with heat delivered on heatsink transverse sheet group, the heatsink transverse sheet group of high temperature arrives vertical groups of fins with most heat delivered, because the Position Design relation of heating electronic device 3, make heatsink transverse sheet 2 and the vertically almost rising simultaneously of temperature of fin 1, the uniform Design that adds upper casing 6 inner fins, make the fin can be, and each position temperature equalization of casing 6 inside is risen the whole space that is delivered to casing 6 internal cavities of heat balance; Owing to all be in the condition of high temperature in the casing 6, then each positions in the casing 6 all will be in state at a high speed with the heat transferred in the casing 6 to extraneous, thereby reach the purpose of quick heat radiating.

The shape of casing is not limit in the present embodiment, can be circular or square or other structures.

The material of fin can be selected and casing 6 same materials in the present embodiment, also can select other thermally conductive materials.

The balanced radiator structure that passes in the utility model adopts makes the heat of heating electronic device can be dispersed into the inner space and the space outerpace of casing quickly and evenly, has prolonged the useful life of chip, guarantees the long-time operate as normal of circuit, chip.

Claims

1. the balanced radiator structure casing that passes in a kind, its inside includes circuit board and is used for the fin of heating dissipation from electronic devices on the circuit board, it is characterized in that: described some fin are divided into two groups of vertical and horizontal, described vertical groups of fins is made up of the polylith fin that is arranged parallel to each other, and every fin one end junctor shell-side face, the other end connects the plate face of heatsink transverse sheet group; The opposite side of described heatsink transverse sheet group plate face is connected with the heating electronic device on the circuit board.

2. a kind of interior equilibrium according to claim 1 passes the radiator structure casing, and it is characterized in that: described heatsink transverse sheet group links to each other with bottom of shell.

3. a kind of interior equilibrium according to claim 1 passes the radiator structure casing, and it is characterized in that: described vertical groups of fins links to each other with bottom of shell.

4. according to claim 1 or 3 described a kind of interior balanced radiator structure casings that pass, it is characterized in that: the fin interval of described vertical groups of fins equates.

5. a kind of interior equilibrium according to claim 1 and 2 passes the radiator structure casing, and it is characterized in that: fin is monolithic in the described heatsink transverse sheet group.

6. a kind of interior balanced radiator structure casing that passes according to claim 1 is characterized in that: fin and casing is integrated or Split type structure in described vertical groups of fins.

7. a kind of interior balanced radiator structure casing that passes according to claim 1, it is characterized in that: the heating electronic device on the described circuit board is uniformly distributed in the plate face of heatsink transverse sheet group in the thermal balance mode.

8. a kind of interior balanced radiator structure casing that passes according to claim 1 is characterized in that: be processed with louvre on the fin.