CN201858874U - Lifting Mechanism of Wafer Moving Bracket - Google Patents
Lifting Mechanism of Wafer Moving Bracket Download PDFInfo
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- CN201858874U CN201858874U CN2010205814893U CN201020581489U CN201858874U CN 201858874 U CN201858874 U CN 201858874U CN 2010205814893 U CN2010205814893 U CN 2010205814893U CN 201020581489 U CN201020581489 U CN 201020581489U CN 201858874 U CN201858874 U CN 201858874U
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- 230000007246 mechanism Effects 0.000 title claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 16
- 239000010703 silicon Substances 0.000 claims abstract description 16
- 230000003028 elevating effect Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 abstract description 30
- 238000010438 heat treatment Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
一种无网带高效烧结炉中的硅片移动托架的升降机构,包括水平推杆、摆杆、转轴、偏心轮、滚轮、轴承座、耳座、活动台和固定底板,转轴通过轴承座安装在固定底板上,偏心轮固定安装在转轴上,摆杆的上端固定安装在转轴上,转轴可转动地安装在固定底板上,摆杆的下端与水平推杆铰接,滚轮可转动地安装活动板的下端面上,滚轮通过耳座固定在活动板上,滚轮与偏心轮相接触。当水平推杆左右平移时,摆杆带动转轴左右摆转,由于偏心轮固定安装在转轴上,偏心轮也会之摆转,从而带动活动板往复升降运动,满足了移动托架相对于固定托架的升降动作要求。
A lifting mechanism for a moving bracket of a silicon wafer in a high-efficiency sintering furnace without a mesh belt, including a horizontal push rod, a swing rod, a rotating shaft, an eccentric wheel, a roller, a bearing seat, an ear seat, a movable table and a fixed bottom plate, and the rotating shaft passes through the bearing seat Installed on the fixed base plate, the eccentric wheel is fixedly installed on the rotating shaft, the upper end of the swing rod is fixedly mounted on the rotating shaft, the rotating shaft is rotatably installed on the fixed base plate, the lower end of the swing rod is hinged with the horizontal push rod, and the roller is rotatably installed On the lower end face of the plate, the roller is fixed on the movable plate through the lug seat, and the roller is in contact with the eccentric wheel. When the horizontal push rod moves left and right, the swing rod drives the rotating shaft to swing left and right. Since the eccentric wheel is fixedly installed on the rotating shaft, the eccentric wheel will also swing accordingly, thereby driving the movable plate to reciprocate and lift, satisfying the need for the movable bracket to move up and down relative to the fixed bracket. Rack lifting action requirements.
Description
技术领域:Technical field:
本实用新型涉及一种硅电池片烧结炉,尤其涉及硅电池片烧结炉中硅片输送装置。The utility model relates to a silicon cell sintering furnace, in particular to a silicon chip conveying device in the silicon cell sintering furnace.
背景技术:Background technique:
在太阳电池片生产工艺中,烧结是使晶体硅基片真正具有光电转换功能的至关重要的一步。因此,烧结设备的性能好坏直接影响着电池片的质量。In the production process of solar cells, sintering is a crucial step to make the crystalline silicon substrate truly have the function of photoelectric conversion. Therefore, the performance of the sintering equipment directly affects the quality of the cell.
目前,国内外的太阳能电池生产制造厂家主要使用欧美企业所生产的烧结炉,这类烧结炉结构都是网带式隧道烧结炉,在烧结炉的纵向上依次设有预热排胶区、升温区、烧结区和降温区,在不同区域布置不同密度的加热灯管,以此来控制各区域的温度,印刷电极的硅片通过网带传输,依次经过烧结炉的不同炉温区,完成预热排胶、升温、烧结和降温的电极烧结过程,虽然这种网带式隧道烧结技术比较成熟,但整个烧结炉的纵向占地面积大,需要设计很长的炉体才能保证硅片在隧道传输过程中的预热排胶、升温、烧结、降温过程,由于高温烧结区的工艺温度需要在850-950℃之间,因此需要设计2-3米的隧道长度才能达到如此高的温度,这使得网带式烧结炉的体积庞大。若缩小则无法满足烧结工艺要求。另外,耐高温网带在运转的过程中,需要绕炉体内外循环运转,网带部分伴随硅片接受升温和降温的过程,因此,在运转过程中,网带会从炉内携带出大量的热量,而这部分热量将全部作为损耗,不仅造成了大量能量的浪费,而且也升高了工作环境温度,为此,申请人研制了一种无网带高效烧结炉,它能很好地克服现有技术的不足,设备占地面积小,热效率高,耗电量少,节能效果显著。At present, solar cell manufacturers at home and abroad mainly use sintering furnaces produced by European and American companies. The structure of this type of sintering furnace is a mesh-belt tunnel sintering furnace. area, sintering area and cooling area, arrange heating lamps with different densities in different areas to control the temperature of each area, and the silicon wafers with printed electrodes are transported through the mesh belt, and pass through different furnace temperature areas of the sintering furnace in turn to complete the pre-heating process. The electrode sintering process of thermal debinding, heating up, sintering and cooling down, although this kind of mesh belt tunnel sintering technology is relatively mature, but the longitudinal footprint of the entire sintering furnace is large, and it is necessary to design a very long furnace body to ensure that the silicon wafers are kept in the tunnel. In the process of preheating, debinding, heating, sintering, and cooling during the transmission process, since the process temperature in the high-temperature sintering zone needs to be between 850-950°C, it is necessary to design a tunnel length of 2-3 meters to reach such a high temperature. Make the mesh belt type sintering furnace bulky. If it shrinks, it cannot meet the sintering process requirements. In addition, the high temperature resistant mesh belt needs to circulate around the inside and outside of the furnace during operation, and the mesh belt part is accompanied by the heating and cooling process of the silicon wafer. Therefore, during the operation, the mesh belt will carry a large amount of heat from the furnace. heat, and this part of heat will all be used as loss, which not only causes a lot of energy waste, but also increases the temperature of the working environment. Therefore, the applicant has developed a high-efficiency sintering furnace without mesh belt, which can well overcome the The disadvantages of the prior art are that the equipment occupies a small area, has high thermal efficiency, less power consumption, and remarkable energy-saving effect.
所述无网带高效烧结炉,包括进料台1、隧道式烧结箱2、出料台3、硅片输送装置4和炉体架5,如图1所示,沿隧道式烧结箱2的纵向依次设有预热排胶区21、升温区22、烧结区23和降温区24四个区域,在预热排胶区21、升温区22、烧结区23和降温区24之间均设有隔热板25和气流隔断门8,在预热排胶区21、升温区22和烧结区23内设有加热灯管26,如图2所示;硅片输送装置4设置在进料台1和出料台3之间,它包括固定托架41和移动托架42,固定托架41的两端分别固定在进料台1和出料台3中的固定架12和32上,移动托架42的两端分别固定在进料台1和出料台3中的滑动板17、37上,固定托架41位于两相邻移动托架42之间;进料台1和出料台3的结构相同,都包括固定底板11、31,固定架12、32,导向杆13、33,导向套14、34,活动板15、35,滑轨16、36和滑动板17、37,活动板15、35与固定底板11、31之间通过导向杆13、33与导向套14、34的套装配合结构相连接,滑轨16、36固定在活动板15、35上,滑动板17、37套装在滑轨16、36上,在固定底板11、31和活动板15、35之间设有往复升降机构,固定底板11、31安装在炉体架5上,在固定底板11、31与滑动板17、37之间设有往复平移机构7,如图3、图4、图5所示,往复升降机构带动活动板15、35相对于固定底板11、31周期性地完成上升和下降动作,往复平移机构7带动滑动板17、37相对于活动板15、35周期性地完成前移和后移动作,如图3所示。由此可知,往复升降机构和往复平移机构7是无网带高效烧结炉中的核心驱动机构。The high-efficiency sintering furnace without mesh belt comprises a feed table 1, a tunnel
实用新型内容:Utility model content:
本实用新型的目的是为无网带高效烧结炉提供一种硅片移动托架的升降机构。The purpose of the utility model is to provide a lifting mechanism for a silicon chip moving bracket for a high-efficiency sintering furnace without a mesh belt.
本实用新型所采用的技术方案是:The technical scheme adopted in the utility model is:
所述硅片移动托架的升降机构,包括水平推杆、摆杆、转轴、轴承座、偏心轮、滚轮、耳座、活动板和固定底板,转轴通过轴承座安装在固定底板上,偏心轮固定安装在转轴上,摆杆的上端固定安装在转轴上,转轴可转动地安装在固定底板上,摆杆的下端与水平推杆铰接,滚轮通过耳座固定在活动板的下端面上,滚轮与偏心轮相接触。The lifting mechanism of the silicon wafer mobile bracket includes a horizontal push rod, a swing rod, a rotating shaft, a bearing seat, an eccentric wheel, a roller, an ear seat, a movable plate and a fixed base plate, the rotating shaft is installed on the fixed base plate through the bearing seat, and the eccentric wheel Fixedly installed on the rotating shaft, the upper end of the swing rod is fixed on the rotating shaft, the rotating shaft is rotatably installed on the fixed base plate, the lower end of the swing rod is hinged with the horizontal push rod, the roller is fixed on the lower end surface of the movable plate through the ear seat, and the roller contact with the eccentric.
由于滚轮通过耳座固定在活动板上,转轴通过轴承座安装在固定底板上,偏心轮固定安装在转轴上,摆杆的上端固定安装在转轴上,转轴可转动地安装在固定底板上,摆杆的下端与水平推杆铰接,偏心轮与滚轮相接触,当水平推杆左右平移时,摆杆带动转轴在一定夹角范围内正反转动,由于偏心轮固定安装在转轴上,偏心轮也随之转动,从而带动活动板下降或上升,满足移动托架相对于固定托架的升降动作要求;它与平移机构协同作用,使移动托架不断将放置在固定托架上的硅片逐步向前搬运。Because the roller is fixed on the movable plate through the ear seat, the rotating shaft is installed on the fixed base plate through the bearing seat, the eccentric wheel is fixedly installed on the rotating shaft, the upper end of the swing rod is fixedly installed on the rotating shaft, and the rotating shaft is rotatably installed on the fixed base plate. The lower end of the rod is hinged with the horizontal push rod, and the eccentric wheel is in contact with the roller. When the horizontal push rod translates left and right, the swing rod drives the rotating shaft to rotate positively and negatively within a certain angle range. Since the eccentric wheel is fixedly installed on the rotating shaft, the eccentric wheel also It rotates accordingly, thereby driving the movable plate to descend or rise to meet the lifting action requirements of the mobile bracket relative to the fixed bracket; it cooperates with the translation mechanism to make the mobile bracket continuously move the silicon wafers placed on the fixed bracket to the front handling.
附图说明:Description of drawings:
图1为无网带烧结炉的整体结构示意图;Fig. 1 is the overall structure schematic diagram of no mesh belt sintering furnace;
图2为图1中隧道式烧结箱的结构示意图;Fig. 2 is the structural representation of the tunnel type sintering box in Fig. 1;
图3为硅片输送装置的结构示意图;Fig. 3 is the structural schematic diagram of silicon chip conveying device;
图4、图5为硅片输送装置中固定托架和移动托架的分布示意图;Fig. 4 and Fig. 5 are schematic diagrams of the distribution of fixed brackets and movable brackets in the silicon wafer conveying device;
图5为图4中C-C剖视图;Fig. 5 is C-C sectional view among Fig. 4;
图中:1为进料台;2为隧道式烧结箱;3为出料台;4为硅片输送装置;5为炉体架;7为往复平移机构;8为气流隔断门;11、31为固定底板;12、32为固定架;13、33为导向杆;14、34为导向套;15、35为活动板;16、36为滑轨;17、37为滑动板;21为预热排胶区;22为升温区;23为烧结区;24为降温区;25为隔热板;26为加热灯管;41为固定托架;42为移动托架;61为水平推杆;62为摆杆;63为转轴;64为轴承座;65为偏心轮;66为滚轮;67为耳座。In the figure: 1 is the feeding platform; 2 is the tunnel-type sintering box; 3 is the discharging platform; 4 is the silicon wafer conveying device; 5 is the furnace frame; 7 is the reciprocating translation mechanism; 8 is the air flow partition door; 12 and 32 are fixed frames; 13 and 33 are guide rods; 14 and 34 are guide sleeves; 15 and 35 are movable plates; 16 and 36 are slide rails; 17 and 37 are sliding plates; 21 is preheating Glue removal area; 22 is the heating area; 23 is the sintering area; 24 is the cooling area; 25 is the heat insulation board; 26 is the heating lamp; 41 is the fixed bracket; 63 is a rotating shaft; 64 is a bearing seat; 65 is an eccentric wheel; 66 is a roller; 67 is an ear seat.
具体实施方式:Detailed ways:
所述硅片移动托架的升降机构,如图3所示,它包括水平推杆61、摆杆62、转轴63、轴承座64、偏心轮65、滚轮66、耳座67、活动板15、35和固定底板11、31,转轴63通过轴承座64安装在固定底板11、31上,偏心轮65固定安装在转轴63上,摆杆62的上端固定安装在转轴63上,转轴63可转动地安装在固定底板11、31上,摆杆62的下端与水平推杆61铰接,滚轮66通过耳座67固定在活动板15、35的下端面上,滚轮66与偏心轮65相接触。The lifting mechanism of the moving bracket for silicon wafers, as shown in Figure 3, includes a
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205814893U CN201858874U (en) | 2010-10-29 | 2010-10-29 | Lifting Mechanism of Wafer Moving Bracket |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010205814893U CN201858874U (en) | 2010-10-29 | 2010-10-29 | Lifting Mechanism of Wafer Moving Bracket |
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| CN201858874U true CN201858874U (en) | 2011-06-08 |
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| CN2010205814893U Expired - Fee Related CN201858874U (en) | 2010-10-29 | 2010-10-29 | Lifting Mechanism of Wafer Moving Bracket |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102052829A (en) * | 2010-10-29 | 2011-05-11 | 常州亿晶光电科技有限公司 | Lifting mechanism for silicon chip movable bracket |
| CN108007209A (en) * | 2017-11-28 | 2018-05-08 | 乐山新天源太阳能科技有限公司 | Feeding device for silicon wafer sintering stove |
-
2010
- 2010-10-29 CN CN2010205814893U patent/CN201858874U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102052829A (en) * | 2010-10-29 | 2011-05-11 | 常州亿晶光电科技有限公司 | Lifting mechanism for silicon chip movable bracket |
| CN108007209A (en) * | 2017-11-28 | 2018-05-08 | 乐山新天源太阳能科技有限公司 | Feeding device for silicon wafer sintering stove |
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