CN201820257U - Smart card module based on copper wire bonding - Google Patents
Smart card module based on copper wire bonding Download PDFInfo
- Publication number
- CN201820257U CN201820257U CN2010205703405U CN201020570340U CN201820257U CN 201820257 U CN201820257 U CN 201820257U CN 2010205703405 U CN2010205703405 U CN 2010205703405U CN 201020570340 U CN201020570340 U CN 201020570340U CN 201820257 U CN201820257 U CN 201820257U
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- smart card
- wire bonding
- chip
- copper wire
- module
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Abstract
The utility model discloses a smart card module based on copper wire bonding. The module is formed by chipset molding packaging or UV (ultraviolet) packaging; and a chip in the module is mounted in a chip bearing area on a carrier tape through adhesive and is in wire bonding with a circuit on the carrier tape through a copper wire. The module utilizes the copper wire to replace a gold wire, achieves electrical connection through achieving wire bonding between the chip and the carrier tape, and reduces the packaging cost.
Description
Technical field
The utility model relates to the semiconductor microelectronics encapsulation technology, is specifically related to a kind of smart card module based on copper wire bonding.
Background technology
Along with the continuous progress of integrated circuit encapsulation technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.In field of intelligent cards because security and multi-functional requirement display gradually, require cost reduce or constant situation under increase reliability.
But the encapsulation of conventional intelligent object generally all is to use FR4 or the G10 substrate layer as carrier band, single face or two-sided deposited copper wire are set, then intelligent card chip paster, routing are connected, direct molding or UV encapsulate after waiting to finish, and realize the high reliability of smart card module.When carrying out the routing connection in the existing method for packing, all be to utilize gold thread to carry out routing to connect.Because the singularity of gold thread material itself, it costs an arm and a leg, and will make the expense height that intelligent object encapsulates like this, greatly reduces the market competitiveness of corresponding intelligent object.
Therefore, designing a kind of smart card module of low encapsulation overhead, is the problem that this area is needed solution badly.
Summary of the invention
The utility model utilizes the gold thread routing to connect problems such as existing expense height when encapsulating at existing smart card module, and provide a kind of novel smart card module, this module utilizes copper cash to replace gold thread to carry out the routing connection, will reduce the encapsulation overhead of smart card module greatly.
In order to achieve the above object, the utility model adopts following technical scheme:
Smart card module based on copper wire bonding, this module is formed by chipset molded packages or UV encapsulation, the carrier band that described chipset comprises chip, is used for carries chips and is electrically connected, described carrier band is provided with the chip bearing zone and the circuit of carries chips, described chip is installed to chip bearing zone on the described carrier band by cementing agent, and by the bonding that goes between of the circuit on copper cash and the described carrier band.
The utlity model has following advantage according to what technique scheme obtained:
(1) utilizes copper cash to replace gold thread, realize that the lead-in wire bonding between chip and the carrier band reaches electric connection, reduce packaging cost;
(2) whole module adopts molded packages or UV encapsulation, and technology maturation is convenient to practical application, and can guarantee the usability of module.
Description of drawings
Further specify the utility model below in conjunction with the drawings and specific embodiments.
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is a structural representation of the present utility model.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
Embodiment 1
Referring to Fig. 1, the smart card module based on copper wire bonding that provides in this enforcement mainly comprises chipset 100 and the packaging body 200 that forms the module profile.
In order to reach module package cheaply, this embodiment chips group 100 comprises chip 101, be used for carries chips and the go between copper cash 103 of bonding of the carrier band 102 that is electrically connected and being used to.
Wherein carrier band 102 is provided with the chip bearing zone and the circuit (not shown) of carries chips.
Chip 101 is installed to chip bearing zone on the carrier band 102 by cementing agent 104, and by copper cash 103 and circuit on the carrier band bonding that goes between.
Chip 101 goes between bondings with carrier band 102 after, carry out molded packages, form packaging body 200.
Such scheme replaces gold thread by copper cash, realizes the lead-in wire bonding between chip 101 and the carrier band 102.Under the situation that does not influence the smart card module usability, reduced the encapsulation overhead of module.
Embodiment 2
Referring to Fig. 2, the smart card module that this embodiment provides based on copper wire bonding, identical with the smart card module structure that provides among the embodiment 1, do not given unnecessary details herein.
The UV encapsulation forms packaging body 200 among this embodiment.
This scheme replaces gold thread by copper cash equally, realizes the lead-in wire bonding between chip and the carrier band.Under the situation that does not influence the smart card module usability, reduced the encapsulation overhead of module.
More than show and described ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that describes in the foregoing description and the instructions just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof
Claims (1)
1. based on the smart card module of copper wire bonding, this module is formed by chipset molded packages or UV encapsulation, the carrier band that described chipset comprises chip, is used for carries chips and is electrically connected, it is characterized in that, described carrier band is provided with the chip bearing zone and the circuit of carries chips, described chip is installed to chip bearing zone on the described carrier band by cementing agent, and by the bonding that goes between of the circuit on copper cash and the described carrier band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205703405U CN201820257U (en) | 2010-10-21 | 2010-10-21 | Smart card module based on copper wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205703405U CN201820257U (en) | 2010-10-21 | 2010-10-21 | Smart card module based on copper wire bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201820257U true CN201820257U (en) | 2011-05-04 |
Family
ID=43918205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205703405U Expired - Fee Related CN201820257U (en) | 2010-10-21 | 2010-10-21 | Smart card module based on copper wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201820257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446868A (en) * | 2011-12-28 | 2012-05-09 | 上海长丰智能卡有限公司 | Novel dual-interface smart card module and implementation method thereof |
-
2010
- 2010-10-21 CN CN2010205703405U patent/CN201820257U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446868A (en) * | 2011-12-28 | 2012-05-09 | 上海长丰智能卡有限公司 | Novel dual-interface smart card module and implementation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110504 Termination date: 20161021 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |