CN201805621U

CN201805621U - PCB (Printed circuit board) structure

Info

Publication number: CN201805621U
Application number: CN2010201690590U
Authority: CN
Inventors: 刘金峰; 丁大舟; 王南生
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2010-04-19
Filing date: 2010-04-19
Publication date: 2011-04-20
Anticipated expiration: 2020-04-19

Abstract

The utility model is suitable for the field of circuit board processing and manufacturing, and provides a PCB (Printed circuit board) structure, which comprises a PCB substrate; a step hole is formed in the PCB substrate, and comprises a counter bore part and a through hole part; and at least one fabrication hole is formed in the lower end surface of the counter bore part. As the fabrication hole formed in the step hole of the PCB substrate, the contact surface between the PCB substrate and soldering tin can be increased, moisture and organic matters on the soldering tin can be volatilized easily, bad phenomena such as layering and bubbling of a copper sheet or board explosion and the like can be avoided, and the welding reliability and the using reliability of the PCB are improved.

Description

A kind of pcb board structure

Technical field

The utility model belongs to circuit board processing and manufacturing field, relates in particular to a kind of pcb board structure.

Background technology

At present, as depicted in figs. 1 and 2, on PCB substrate 900, step groove or stepped hole 910 are set in the position of need welding, stepped hole 910 of the prior art or step groove are unthreaded hole, the hole face is smooth, cause large tracts of land sealing copper sheet on step groove or the stepped hole, under the high temperature in drying-plate or when welding under the environment, copper sheet can produce bad phenomenon such as layering bubble or plate bursting, and moisture in the scolding tin and organic substance are not volatile, step groove or stepped hole 910 internal stresss are concentrated, and have had a strong impact on pcb board soldering reliability and dependability.

The utility model content

The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, and a kind of pcb board structure is provided, and it can avoid copper sheet to produce bad phenomenon such as layering bubble or plate bursting, has improved pcb board soldering reliability and dependability.

The utility model is achieved in that a kind of pcb board structure, comprises the PCB substrate, offers stepped hole on the described PCB substrate, and described stepped hole comprises counter sink portion and through-hole section, and described countersunk head subordinate end face offers at least one fabrication hole.

Particularly, described fabrication hole is provided with several and is that symmetry axis evenly is provided with the central axis of described counter sink portion.

Preferably, described fabrication hole is a blind hole.

Additionally, described fabrication hole is a perforation.

A kind of pcb board structure that the utility model provides, it offers fabrication hole by the stepped hole place at the PCB substrate, can increase the contact area of PCB substrate and scolding tin, make the moisture content and the organic substance of scolding tin be easy to volatilization, can avoid copper sheet to produce bad phenomenon such as layering bubble or plate bursting, improve pcb board soldering reliability and dependability.

Description of drawings

Fig. 1 is the pcb board structure that prior art provides;

Fig. 2 is the generalized section of Fig. 1;

Fig. 3 is the schematic perspective view of a kind of pcb board structure of providing of the utility model embodiment;

Fig. 4 is the generalized section of the fabrication hole of a kind of pcb board structure of providing of the utility model embodiment when being blind hole;

Fig. 5 is the generalized section of the fabrication hole of a kind of pcb board structure of providing of the utility model embodiment when being through hole;

Fig. 6 is another schematic perspective view of a kind of pcb board structure of providing of the utility model embodiment;

Fig. 7 is the generalized section of the fabrication hole among Fig. 6 when being blind hole;

Fig. 8 is the generalized section of the fabrication hole among Fig. 6 when being through hole.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.

As Fig. 3～shown in Figure 5, a kind of pcb board structure that the utility model embodiment provides, comprise PCB substrate 100, offer stepped hole 110 on the described PCB substrate 100, described stepped hole 110 comprises counter sink portion 111 and through-hole section 112, described countersunk head subordinate end face offers at least one fabrication hole 120, by fabrication hole 120 is set, when welding, more scolding tin is filled in the stepped hole 110 on the PCB substrate 100 and in the fabrication hole 120, and owing to set up fabrication hole 120, surface area on the PCB substrate 100 increases, help improving the heat dispersion of PCB substrate 100 when high-temperature soldering, moisture and organic substance are volatile simultaneously, it is inner stressed to reduce stepped hole 110, prevent that copper sheet from producing the layering bubble, avoided PCB substrate 100 to produce stress and bad phenomenon such as concentrated, thereby avoided PCB substrate 100 to produce defectives such as layering or plate bursting, can hold scolding tin in the fabrication hole 120, compare with PCB substrate 100 of the prior art, PCB substrate 100 structures provided by the utility model can ccontaining more scolding tin, and the area that scolding tin contacts with PCB substrate 100 increases, scolding tin is difficult for coming off from PCB substrate 100, has improved the reliability that product uses.Additionally, on the step groove on the PCB substrate 100 or at the need weld, offer fabrication hole 120, can avoid PCB substrate 100 to produce defectives such as layerings or plate bursting (with reference to figure 6～shown in Figure 8).In the practical application, can take following technological process: lamination, bore target, mill the limit, groove milling, boring, graphic plating, brill fabrication hole 120, alkali etching, outer inspection, by behind graphic plating, processing fabrication hole 120, can improve reliability of products.

Particularly, as Fig. 3～shown in Figure 5, described fabrication hole 120 is provided with several and is that symmetry axis evenly is provided with the central axis of described counter sink portion 111, by a plurality of fabrication holes 120 are set, moisture and organic substance that PCB substrate 100 is produced when welding can in time volatilize, and prevent that PCB substrate 100 from producing defectives such as layering or plate bursting.

Preferably, described fabrication hole 120 is blind hole (as Fig. 4 and shown in Figure 7), is convenient to the processing of product.

Additionally, described fabrication hole 120 is perforation (with reference to figure 5 and shown in Figure 8), and scolding tin can flow to the back side of PCB substrate 100, makes scolding tin be difficult for coming off from PCB substrate 100, has improved the reliability that product uses.

Preferably, described fabrication hole 120 forms by laser processing, and it has, and process velocity is fast, advantage of high precision.

Additionally, described fabrication hole 120 forms by machining, need not to drop into laser process equipment, just utilize conventional machining apparatus such as drilling machine, milling machine can process fabrication hole 120, has advantages such as equipment less investment, processing cost be lower.

The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims

1. a pcb board structure comprises the PCB substrate, offers stepped hole on the described PCB substrate, and described stepped hole comprises counter sink portion and through-hole section, it is characterized in that: described countersunk head subordinate end face offers at least one fabrication hole.

2. a kind of pcb board structure as claimed in claim 1 is characterized in that: described fabrication hole is provided with several and is that symmetry axis evenly is provided with the central axis of described counter sink portion.

3. a kind of pcb board structure as claimed in claim 1 or 2 is characterized in that: described fabrication hole is a blind hole.

4. a kind of pcb board structure as claimed in claim 1 or 2 is characterized in that: described fabrication hole is a perforation.