CN201804904U - High-light and high-efficiency LED - Google Patents
High-light and high-efficiency LED Download PDFInfo
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- CN201804904U CN201804904U CN2010201309344U CN201020130934U CN201804904U CN 201804904 U CN201804904 U CN 201804904U CN 2010201309344 U CN2010201309344 U CN 2010201309344U CN 201020130934 U CN201020130934 U CN 201020130934U CN 201804904 U CN201804904 U CN 201804904U
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Abstract
The utility model discloses a high-light and high-efficiency LED, which comprises an encapsulated base, wherein an accommodation space is arranged on the encapsulated base; an electrode pin, an LED and an encapsulated rubber material are accommodated in the accommodation space; and the wall of the accommodation space is coated with a metallic film, so that metal texture is generated on the surface of the accommodation space to form a reflective film layer. The reflective film layer arranged in the structure is cooperated with the light energy of the LED, so as to increase the light guide effect.
Description
Technical field
The utility model relates to a kind of LED structure that promotes lumination of light emitting diode efficient.
Background technology
Led module uses now in a large number on the electronic correlation product, continuous lifting along with range of application expansion and illuminator, the requirement of high powerization is risen rapidly since nineteen ninety, especially to beginning in 2000, the appearance of white light high-capacity LED, industry is for there being better radiating effect, many employing potteries are the pedestal raw material, because of pottery has higher heat-sinking capability and higher heat-resisting, air-tightness, therefore, ceramic substrate is present high-capacity LED one of pedestal 10 materials of normal use, and shown in first figure, and aluminium oxide also is one of employed material of industry.
Yet industry be for can reach radiating effect, only examines its radiating effect of rate from pedestal, and ignores its luminous efficiency problem of performance fully not as yet, and reality has to be strengthened.
Summary of the invention
The purpose of design of the utility model is for improving the luminous efficiency of light-emitting diode.
For achieving the above object, this practical technical scheme is: a kind of high smooth efficient LED, include an encapsulation base, be provided with accommodation space in encapsulation base, described holding space for holding has electrode pin, light-emitting diode and packaging adhesive material, it is characterized in that: on the wall of accommodation space, be coated with metallic film, make the accommodation space surface produce metal-like, be formed with reflexed light film.The set reflexed light film of this structure increases its light guide effect to cooperate the luminous energy of light-emitting diode.
As improvement, described reflexed light film is discontinuous steaming or the non-conductive surfacing of NCVM is handled the rete of shaping.This reflexed light film utilizes discontinuous the steaming or non-conductive surfacing processing (Nonconductive vacuum metalization, abbreviation NCVM), NCVM adopts to plate out films such as metal and insulating compound, utilize each mutually discontinuous characteristic, obtain FINAL APPEARANCE metal-like is arranged, NCVM processing procedure system hangs the product of electroplating in vacuum chamber, takes out vacuum, and material that then will evaporation is heated evaporation attached on the plastic products.By this, can make the accommodation space wall produce a reflexed light film.And the NCVM thickness of coating is thin, only is 0.05um-0.1um, and is few to the plastic material dependence, meets the requirement of environmental protection processing procedure.
Description of drawings
Fig. 1 is traditional package structure for LED figure;
Fig. 2 is a structure chart of the present utility model.
Embodiment
Primary clustering symbol description in the accompanying drawing:
10 ... encapsulation base 11 ... put and hold space 12 ... reflexed light film
21 ... electrode pin 22 ... metal routing 23 ... packaging adhesive material
30 ... light-emitting diode
Below in conjunction with the drawings and specific embodiments the utility model is further elaborated.
The high light efficient LED of the utility model, embodiment as shown in Figure 2 includes an encapsulation base 10 substantially, is provided with accommodation space 11 in encapsulation base 10, and can ccontaining electrode pin 21, light-emitting diode 30 and packaging adhesive material 23.
On the minute surface of accommodation space 11, be coated with metallic film, make the material surface produce metal-like, be formed with reflexed light film 12 as lampshade, this reflexed light film 12 is to utilize discontinuous the steaming or non-conductive surfacing processing (Non conductive vacuummetalization, abbreviation NCVM), NCVM adopts to plate out films such as metal and insulating compound, utilize each mutually discontinuous characteristic, obtain FINAL APPEARANCE metal-like is arranged, NCVM processing procedure system hangs the product of electroplating in vacuum chamber, take out vacuum, material that then will evaporation is heated evaporation attached on the plastic products.By this, can make accommodation space 11 walls produce a reflexed light film 12.And the NCVM thickness of coating is thin, only is 0.05um-0.1um, and is few to the plastic material dependence, meets the requirement of environmental protection processing procedure.
The high light efficient LED of the utility model utilizes the non-conductive plating of vacuum, forms reflective tunic, makes the lampshade effect that increases the light source refraction, simple in structure, tool increases the feature of luminous efficiency again, the true economical and practical value of tool, the whence propose in accordance with the law utility application it.
Claims (2)
1. one kind high smooth efficient LED, include an encapsulation base, be provided with accommodation space in encapsulation base, described accommodation space is provided with electrode pin, light-emitting diode and packaging adhesive material, it is characterized in that: on the wall of accommodation space, be coated with metallic film, be formed with reflexed light film.
2. high light efficient LED according to claim 1 is characterized in that: described reflexed light film is discontinuous steaming or the non-conductive surfacing of NCVM is handled the rete of shaping.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201309344U CN201804904U (en) | 2010-03-15 | 2010-03-15 | High-light and high-efficiency LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201309344U CN201804904U (en) | 2010-03-15 | 2010-03-15 | High-light and high-efficiency LED |
Publications (1)
Publication Number | Publication Date |
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CN201804904U true CN201804904U (en) | 2011-04-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010201309344U Expired - Fee Related CN201804904U (en) | 2010-03-15 | 2010-03-15 | High-light and high-efficiency LED |
Country Status (1)
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CN (1) | CN201804904U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103943747A (en) * | 2012-02-27 | 2014-07-23 | 义乌市运拓光电科技有限公司 | High-power LED lamp adopting ceramic for heat dissipation |
-
2010
- 2010-03-15 CN CN2010201309344U patent/CN201804904U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103943747A (en) * | 2012-02-27 | 2014-07-23 | 义乌市运拓光电科技有限公司 | High-power LED lamp adopting ceramic for heat dissipation |
CN103943747B (en) * | 2012-02-27 | 2015-12-30 | 义乌市运拓光电科技有限公司 | A kind of high power LED lamp using ceramic heat-dissipating |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 Termination date: 20130315 |