CN202817021U - LED luminescent unit - Google Patents
LED luminescent unit Download PDFInfo
- Publication number
- CN202817021U CN202817021U CN 201220383799 CN201220383799U CN202817021U CN 202817021 U CN202817021 U CN 202817021U CN 201220383799 CN201220383799 CN 201220383799 CN 201220383799 U CN201220383799 U CN 201220383799U CN 202817021 U CN202817021 U CN 202817021U
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- Prior art keywords
- enclosure wall
- wall
- substrate
- chip
- adhesive layer
- Prior art date
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Abstract
The embodiment of the utility model discloses a LED luminescent unit, which comprises a substrate, a chip disposed on the surface of the substrate, a first wall which surrounds the periphery of the chip, a second wall which surrounds the periphery of the first wall, a fluorescent adhesive layer formed over the chip in the space surrounded by the first wall and a transparent adhesive layer formed over the fluorescent adhesive layer in the space surrounded by the second wall. Thus, only by forming the first wall and the second wall on the substrate, forming the fluorescent adhesive layer within the first wall and forming the transparent adhesive layer within the second wall, the LED fluorescent unit can be manufactured without the need of slotting the substrate. Therefore, complexity of the technology is reduced, and production efficiency is raised, cost is decreased. In addition, as the chip is positioned on the surface of the substrate, luminous efficiency of the product is high.
Description
Technical field
The utility model relates to the light-emitting diode field, relates in particular to a kind of LED luminescence unit.
Background technology
As a kind of novel light-emitting components and parts, it can be applicable to the fields such as illumination, demonstration to light-emitting diode (Light Emitting Diode, LED).Existing LED luminescence unit is made complicated, need to be prior to slotting on the aluminium base, and printed wire also is fixed in chip in the groove, makes circuit and chip conducting, at last by the flat glass technique of point, finishes the procedure for producing of LED luminescence unit.Because the substrate grooving processes is complicated, causes production efficiency lower, cost is higher, and because chip is positioned at groove, the product light extraction efficiency is low.
The utility model content
The utility model embodiment technical problem to be solved is, a kind of LED luminescence unit is provided, to improve light efficiency and to save cost.
In order to solve the problems of the technologies described above, the utility model embodiment has proposed a kind of LED luminescence unit, comprise substrate, be arranged at described substrate one lip-deep chip, be surrounded on described chip periphery the first enclosure wall, be surrounded on described the first enclosure wall periphery the second enclosure wall, surround the fluorescent adhesive layer that is formed in the space above the described chip at described the first enclosure wall, and surround the substratum transparent that is formed in the space above the described fluorescent adhesive layer at described the second enclosure wall.
Further, described the first enclosure wall and the second enclosure wall are by a glue mode moulding.
Further, described the first enclosure wall and the second enclosure wall are by the Shooting Technique moulding.
Further, described substrate is aluminium base or ceramic substrate.
The beneficial effect of the utility model embodiment is:
By having proposed a kind of LED luminescence unit, comprise substrate, be arranged at described substrate one lip-deep chip, be surrounded on the first enclosure wall of described chip periphery, be surrounded on the second enclosure wall of described the first enclosure wall periphery, surround the fluorescent adhesive layer that is formed in the space above the described chip at described the first enclosure wall, and surround the substratum transparent that is formed in the space above the described fluorescent adhesive layer at described the second enclosure wall, like this, only need to form the first enclosure wall and the second enclosure wall at substrate, and in the first enclosure wall, form fluorescent adhesive layer, in the second enclosure wall, form substratum transparent, need not slot to substrate, namely can be made into the LED luminescence unit, thereby reduced process complexity, improved production efficiency, reduced cost, and because chip is positioned at substrate surface, the product light extraction efficiency is high.
Description of drawings
Fig. 1 is the vertical view of the LED luminescence unit of the utility model embodiment.
Fig. 2 is the cutaway view of the LED luminescence unit of the utility model embodiment.
Embodiment
Need to prove that in the situation of not conflicting, embodiment and the feature among the embodiment among the application can mutually combine, and below in conjunction with the drawings and specific embodiments the utility model are described in further detail.
Such as Fig. 1 ~ shown in Figure 2, the utility model embodiment has proposed a kind of LED luminescence unit, it mainly comprises substrate 1, be arranged at substrate 1 one lip-deep chips 2, be surrounded on chip 2 peripheries the first enclosure wall 3, be surrounded on the first enclosure wall 3 peripheries the second enclosure wall 4, surround the fluorescent adhesive layer 5 that is formed in the space above the chip 2 at the first enclosure wall 3, and surround the substratum transparent 6 that is formed in the space above the fluorescent adhesive layer 5 at the second enclosure wall 4.
The first enclosure wall 3 and the second enclosure wall 4 can by a glue mode moulding, also can pass through the Shooting Technique moulding.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that does not break away from principle of the present utility model and spirit and can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is limited by claims and equivalency range thereof.
Claims (4)
1. LED luminescence unit, it is characterized in that, comprise substrate, be arranged at described substrate one lip-deep chip, be surrounded on described chip periphery the first enclosure wall, be surrounded on described the first enclosure wall periphery the second enclosure wall, surround the fluorescent adhesive layer that is formed in the space above the described chip at described the first enclosure wall, and surround the substratum transparent that is formed in the space above the described fluorescent adhesive layer at described the second enclosure wall.
2. LED luminescence unit as claimed in claim 1 is characterized in that, described the first enclosure wall and the second enclosure wall are by a glue mode moulding.
3. LED luminescence unit as claimed in claim 1 is characterized in that, described the first enclosure wall and the second enclosure wall are by the Shooting Technique moulding.
4. such as each described LED luminescence unit in the claims 1 to 3, it is characterized in that described substrate is aluminium base or ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220383799 CN202817021U (en) | 2012-08-03 | 2012-08-03 | LED luminescent unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220383799 CN202817021U (en) | 2012-08-03 | 2012-08-03 | LED luminescent unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202817021U true CN202817021U (en) | 2013-03-20 |
Family
ID=47875849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220383799 Expired - Fee Related CN202817021U (en) | 2012-08-03 | 2012-08-03 | LED luminescent unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202817021U (en) |
-
2012
- 2012-08-03 CN CN 201220383799 patent/CN202817021U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20200803 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |