CN201803157U - High-power LED fixture radiating with heat pipe - Google Patents
High-power LED fixture radiating with heat pipe Download PDFInfo
- Publication number
- CN201803157U CN201803157U CN2010202961513U CN201020296151U CN201803157U CN 201803157 U CN201803157 U CN 201803157U CN 2010202961513 U CN2010202961513 U CN 2010202961513U CN 201020296151 U CN201020296151 U CN 201020296151U CN 201803157 U CN201803157 U CN 201803157U
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- Prior art keywords
- heat pipe
- heat
- pipe
- chip
- radiator
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Abstract
The utility model discloses a high-power LED fixture radiating with a heat pipe. The high-power LED fixture comprises an LED chip, a circuit board and a heat pipe radiator; the LED chip is directly encapsulated on the surface of an evaporation end of the heat pipe of the heat pipe radiator. In the utility model, the chip is directly fixed and encapsulated on the surface of the heat pipe; the temperature of a PN junction of the chip is directly transferred to the heat pipe from an epitaxial layer, and the middle heat transfer path is reduced, thereby greatly improving the heat transfer efficiency, making full use of the radiating efficiency of the heat pipe radiator, and the entire system can obtain heat balance relatively quickly. The utility model has the advantages of effectively reducing the LED junction temperature, improving the luminous efficiency of the LED chip, prolonging the service life and increasing the power range of the high-power LED fixture to more than hundreds or thousands of watt.
Description
Technical field
The utility model relates to a kind of high-power LED lamp that adopts heat pipe heat radiation.
Background technology
The LED semiconductor light sources is compared with conventional light source, has significant advantages such as energy-saving and environmental protection, long service life and operating cost is low, but because quantity of heat production is big and can't in time shed, has seriously restricted its development speed.How in time, the huge heat that led light source produces that sheds quickly and efficiently is technical barrier and the huge challenge that present numerous insiders face.Conventional high-power LED light source is led chip to be encapsulated on copper base or the ceramic substrate form light source module, light source module is fitted on the various radiators then, carry out heat exchange with air, what radiating efficiency was best at present is the heat-pipe radiator that utilizes the circle heat pipe to make, the capillary porosity duct that has metal sintering to form in the tube wall of this round heat pipe, heated liquid vaporization in the evaporation ends inside pipe wall pore, the heat band is liquefied to condensation end again, and be back to evaporation ends through capillary porosity duct, circulation so repeatedly, constantly with the heat band to the low end of temperature.The radiating efficiency of this heat pipe after the low temperature end is provided with radiating fin is very high, and it is little with circle heat pipe surface contact area that shortcoming is a heater element, several heat pipes need be fixed on one usually and have on mounting platform heat sink, and its capacity of heat transmission is restricted.In order to overcome this shortcoming, flat hot pipe is made after this round heat pipe is flattened by the producer that has, and forms flat surface, to increase generating surface, improves heat transfer efficiency.The problem of this heat transport schemes maximum is that the heat of chip mainly is to reach on the radiator by substrate, because the substrate thermal resistance is excessive, the radiating efficiency of radiator is not in full use, so that the heat that chip P N interface produces can't in time conduct to the heat radiation terminal efficiently, particularly adopt the high-power LED chip of power, make that junction temperature is too high, cause the LED luminous efficiency to descend in the above integrated optical source of 1W, wearing out of speed-up chip makes its scope of application and service life be restricted.
Summary of the invention
The purpose of this utility model is at the deficiencies in the prior art part, a kind of high-power LED lamp that adopts heat pipe heat radiation is provided, can improves chip, thereby effectively reduce the LED junction temperature to the heat transfer efficiency between the radiator, improve the luminous efficiency of led chip, prolong its service life.
For achieving the above object, the utility model has adopted following technical scheme: it comprises led chip, circuit board and heat-pipe radiator, and described led chip directly is encapsulated in the heat pipe evaporation ends surface of heat-pipe radiator.
Above-mentioned heat pipe can adopt flat hot pipe or circle heat pipe.When adopting the circle heat pipe, the circle heat pipe has the platform that is pressed into the plane at evaporation ends, and described led chip is encapsulated on this platform.
As shown from the above technical solution, the scheme that the utility model solves is not conceived to improve the radiating efficiency of radiator, but start with from improving chip to the heat transfer efficiency between the radiator, with heat pipe alternative package substrate, chip is directly fixed and is encapsulated on the heat pipe surface, chip P N junction temperature directly is passed on the heat pipe from epitaxial loayer, reduced middle heat transfer path, not only rate of heat transfer is greatly improved, and can give full play to the heat transfer efficiency of heat-pipe radiator, whole system can comparatively fast reach thermal balance, the LED junction temperature can be reduced to below 125 ℃, improve the luminous efficiency of led chip, prolong its service life, make the lamp power of utilizing high power LED integrated optical source manufacturing can be promoted to more than 100 watts.
Description of drawings
Fig. 1 adopts the structural representation of flat heat pipe radiator for the utility model;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 adopts another example structure schematic diagram of flat heat pipe radiator for the utility model;
Fig. 4 is the vertical view of Fig. 3;
Fig. 5 adopts the structural representation of circle heat-pipe radiator for the utility model;
Fig. 6 be Fig. 5 along A-A line cutaway view.
The specific embodiment
As shown in Figure 1 and Figure 2, radiator adopts flat hot pipe radiator, form by flat hot pipe 3 and radiating fin 2, flat hot pipe 3 two ends bendings also are connected with radiating fin, mid portion is an evaporation ends, thereby form the radiator of two heat pipe structures, led chip 1 directly is encapsulated in heat pipe 3 evaporation ends surfaces by latticed form, is electrically connected with circuit board 4 again.The shell of light fixture and driving electrical appliance part thereof do not draw in the drawings.
Also can adopt single flat hot pipe radiator, its structure as shown in Figure 3 and Figure 4, led chip 1 directly is encapsulated in flat hot pipe 3 one ends.
As Fig. 5, shown in Figure 6, radiator adopts the circle heat-pipe radiator, form by circle heat pipe 3, radiating fin 2 and aluminium base heat sink 6, circle heat pipe 3 has three, every round heat pipe 3 two ends bending also are connected with radiating fin 2, heat pipe 3 mid portions are evaporation ends, thereby form the radiator of six roots of sensation heat pipe structure, the evaporation ends partial fixings are in aluminium base heat sink 6 arc-shaped slot and be pressed into the platform 5 on plane in the middle of the heat pipe 3, led chip 1 directly is encapsulated in heat pipe 3 evaporation ends platforms 5 surfaces by latticed form, is electrically connected with circuit board 4 again.The shell of light fixture and driving electrical appliance part thereof do not draw in the drawings.
Claims (3)
1. adopt the high-power LED lamp of heat pipe heat radiation, comprise led chip, circuit board and heat-pipe radiator, it is characterized in that: described led chip directly is encapsulated in the heat pipe evaporation ends surface of heat-pipe radiator.
2. the high-power LED lamp of employing heat pipe heat radiation according to claim 1 is characterized in that: described heat pipe is a flat hot pipe.
3. the high-power LED lamp of employing heat pipe heat radiation according to claim 1 is characterized in that: described heat pipe has the platform that is pressed into the plane for circle heat pipe, circle heat pipe at evaporation ends, and described led chip is encapsulated on this platform.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202961513U CN201803157U (en) | 2010-08-17 | 2010-08-17 | High-power LED fixture radiating with heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202961513U CN201803157U (en) | 2010-08-17 | 2010-08-17 | High-power LED fixture radiating with heat pipe |
Publications (1)
Publication Number | Publication Date |
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CN201803157U true CN201803157U (en) | 2011-04-20 |
Family
ID=43872655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010202961513U Expired - Fee Related CN201803157U (en) | 2010-08-17 | 2010-08-17 | High-power LED fixture radiating with heat pipe |
Country Status (1)
Country | Link |
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CN (1) | CN201803157U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10168041B2 (en) | 2014-03-14 | 2019-01-01 | Dyson Technology Limited | Light fixture |
-
2010
- 2010-08-17 CN CN2010202961513U patent/CN201803157U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10168041B2 (en) | 2014-03-14 | 2019-01-01 | Dyson Technology Limited | Light fixture |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 Termination date: 20130817 |