CN201273546Y - High-power LED lamp cooling device - Google Patents

High-power LED lamp cooling device Download PDF

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Publication number
CN201273546Y
CN201273546Y CNU2008200941147U CN200820094114U CN201273546Y CN 201273546 Y CN201273546 Y CN 201273546Y CN U2008200941147 U CNU2008200941147 U CN U2008200941147U CN 200820094114 U CN200820094114 U CN 200820094114U CN 201273546 Y CN201273546 Y CN 201273546Y
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China
Prior art keywords
heat
fin
heat radiation
wafer
power led
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Expired - Fee Related
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CNU2008200941147U
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Chinese (zh)
Inventor
凌广
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Individual
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Individual
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Priority to CNU2008200941147U priority Critical patent/CN201273546Y/en
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Publication of CN201273546Y publication Critical patent/CN201273546Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a heat abstractor of big power LED lamps, wherein the heat abstractor comprises a heat-storage module, a heat pipe and heat dissipating 'fins', wherein the heat pipe is fixedly arranged on the heat dissipating 'fins', the heat-storage module is fixedly arranged with the heat pipe. When in use, an LED wafer is arranged on the heat-storage module, which enables the big power (more than one watt) LED wafer to rapidly discharge heat generated by the wafer when carrying out the electric-to-optical transformation and simultaneously greatly reduce the area when finishing product devices, thereby realizing the aim of reducing the resource waste. Since the heat can be rapidly discharged, when the wafer in work, the efficiency is higher, the performance and the work effect are more stable, and the service life is longer, which greatly saves the use of resources.

Description

A kind of great power LED heat sink for lamp
Technical field
The utility model relates to the LED lighting field, is a kind of heat dissipation technology that is applied in high-power (more than 1 watt) LED houselights product.
Background technology
The LED wafer is photoelectric device, has only 15%~25% electric energy to convert luminous energy in its course of work at present, and remaining electric energy nearly all changes into heat energy, and the temperature of LED wafer is raise.In great power LED, heat radiation is a big problem especially.For example, 1 10 watts of white light LEDs wafer, if its electro-optical efficiency is 20%, 8 watts electric energy conversion thermal energy is then arranged, if do not add cooling measure, the temperature of great power LED wafer can rise rapidly, when its temperature rises above maximum allowable temperature (generally being 1500C), the great power LED wafer can damage because of overheated, and temperature and the life-span relation of being inversely proportional to, when temperature is 450C, its life-span is more than 100,000 hours; When temperature is 650C, its life-span is 54000 hours; When temperature is 800C, its life-span is 34000 hours; When temperature was 1000C, its life-span only was 19500 hours.
The temperature of LED wafer and the electro-optical efficiency of LED also are inversely proportional to, when the temperature of LED wafer reach junction temperature 95% the time, will damage the LED wafer, the electro-optical efficiency of LED wafer is reduced greatly.For example the LED lamp of a 10W is 20% as if its electro-optical efficiency, and then its power of 80% consumes with the form of heating, and when the temperature increase, its electro-optical efficiency will reduce.Experiment showed, one 10 watts LED wafer, when temperature reaches 95% of outlet temperature, its electro-optical efficiency just reduces to 8%.
So heat radiation is distinct issues in the LED application always.All on the market high-power LED radiators all exist heat radiation not enough at present, usually all be to strengthen area of dissipation with aluminium flake or copper sheet, perhaps just add a small fan, but this way can not satisfy the heat radiation requirement of great power LED wafer usually, also taken a large amount of spatial volumes, so the high-powered LED lamp application can not miniaturization.For example be applied on the headlight for vehicles or the like.
Summary of the invention
The purpose of this utility model provides under a kind of situation that can allow high-power (more than 1 watt) LED lamp can maintain efficient cryogenic all the time and works, and makes the LED wafer carry out electro-optical efficiency and is in optimum state, and advantage such as reach capacity service life.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of great power LED heat sink for lamp, this device comprises heat accumulation module, heat pipe and heat radiation " fin ", heat pipe is fixedly mounted in the heat radiation " fin ", and heat accumulation module and heat pipe are fixedly installed togather.
The technical scheme that its technical problem that solves the utility model adopts further comprises:
Described heat radiation " fin " is square.
Described heat radiation " fin " is rounded, and heat radiation " fin " is a hollow structure, and the heat accumulation module is installed in heat radiation " fin " end.
In the described heat radiation " fin " radiator fan is installed.
In the described heat radiation " fin " radiator fan is installed, radiator fan is installed in heat radiation " fin " other end.
The beneficial effects of the utility model are: the utility model technology can make high-power (more than 1 watt) LED wafer when carrying out the electric light conversion, the heat that can produce wafer is apace drained, simultaneously reduced volume widely when making the product device has reached the purpose that reduces the wasting of resources.Because heat extraction fast, institute so that wafer when work, efficient is higher, the performance and the effect of working are more stable, the life-span is longer, has saved the use of the energy significantly.
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Description of drawings
Fig. 1 is the utility model embodiment one decomposing state structural representation.
Fig. 2 is the utility model embodiment one perspective view.
Fig. 3 is the utility model embodiment two decomposing state structural representations.
Fig. 4 is the utility model embodiment two perspective view.
Fig. 5 is the utility model embodiment one band fan decomposing state structural representation.
Fig. 6 is the utility model embodiment one band fan perspective view.
Fig. 7 is the utility model embodiment two band fan decomposing state structural representations.
Fig. 8 is the utility model embodiment two band fan perspective view.
Among the figure, the 1-LED wafer, 2-heat accumulation module, the 3-heat pipe, 4-dispels the heat " fin ", the 5-radiator fan.
The specific embodiment
Present embodiment is the utility model preferred implementation, and other all its principles are identical with present embodiment or approximate with basic structure, all within the utility model protection domain.
Embodiment one: please referring to accompanying drawing 1 and accompanying drawing 2, in the present embodiment, the utility model mainly comprises heat accumulation module 2, heat pipe 3 and heat radiation " fin " 4, and heat radiation " fin " 4 is square, heat pipe 3 is fixedly mounted in the heat radiation " fin " 4, and heat accumulation module 2 is fixedly installed togather with heat pipe 3.Please, in the present embodiment, on heat radiation " fin " 4, radiator fan 5 is installed referring to accompanying drawing 5 and accompanying drawing 6.
Embodiment two: please referring to accompanying drawing 3 and accompanying drawing 4, in the present embodiment, the utility model mainly comprises heat accumulation module 2, heat pipe 3 and heat radiation " fin " 4, heat radiation " fin " 4 is rounded, heat radiation " fin " 4 inside are hollow structure, heat pipe 3 is fixedly mounted in the hollow cavity in the heat radiation " fin " 4, and heat accumulation module 2 is fixedly installed togather with heat pipe 3 one ends.Please referring to accompanying drawing 7 and accompanying drawing 8, in the present embodiment, on heat radiation " fin " 4 radiator fan 5 is installed, radiator fan 5 is installed in heat radiation " fin " 4 other ends.
Working method of the present utility model is the heat that great power LED wafer 1 is produced when carrying out the electric light conversion, be transmitted to heat accumulation module 2, pass to again to heat pipe 3, utilize the efficient heat transfer of heat pipe, rapidly heat is delivered to heat radiation " fin " 4, walk by the torrid zone on mobile " fin " 4 that will dispel the heat of air, reach the heat radiation purpose.In certain volume, fast inadequately if heat distributes, can add again on " fin " 4 in heat radiation radiator fan 5 is installed, utilize the heat that radiator fan 5 will dispel the heat in " fin " 4 to blow away.

Claims (5)

1, a kind of great power LED heat sink for lamp is characterized in that: described device comprises heat accumulation module, heat pipe and heat radiation " fin ", and heat pipe is fixedly mounted in the heat radiation " fin ", and heat accumulation module and heat pipe are fixedly installed togather.
2, great power LED heat sink for lamp according to claim 1 is characterized in that: described heat radiation " fin " is square.
3, great power LED heat sink for lamp according to claim 1 is characterized in that: described heat radiation " fin " is rounded, and heat radiation " fin " is a hollow structure, and the heat accumulation module is installed in heat radiation " fin " end.
4, great power LED heat sink for lamp according to claim 1 and 2 is characterized in that: in the described heat radiation " fin " radiator fan is installed.
5, great power LED heat sink for lamp according to claim 3 is characterized in that: in the described heat radiation " fin " radiator fan is installed, radiator fan is installed in heat radiation " fin " other end.
CNU2008200941147U 2008-05-21 2008-05-21 High-power LED lamp cooling device Expired - Fee Related CN201273546Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200941147U CN201273546Y (en) 2008-05-21 2008-05-21 High-power LED lamp cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200941147U CN201273546Y (en) 2008-05-21 2008-05-21 High-power LED lamp cooling device

Publications (1)

Publication Number Publication Date
CN201273546Y true CN201273546Y (en) 2009-07-15

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ID=40883893

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200941147U Expired - Fee Related CN201273546Y (en) 2008-05-21 2008-05-21 High-power LED lamp cooling device

Country Status (1)

Country Link
CN (1) CN201273546Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105090908A (en) * 2014-05-12 2015-11-25 浙江世明光学科技有限公司 Intelligent heat radiator
CN106402743A (en) * 2016-10-24 2017-02-15 东莞市闻誉实业有限公司 LED lighting device
CN109340612A (en) * 2018-09-04 2019-02-15 东莞市闻誉实业有限公司 Illuminator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105090908A (en) * 2014-05-12 2015-11-25 浙江世明光学科技有限公司 Intelligent heat radiator
CN106402743A (en) * 2016-10-24 2017-02-15 东莞市闻誉实业有限公司 LED lighting device
CN106402743B (en) * 2016-10-24 2019-04-02 东莞市闻誉实业有限公司 LED light device
CN109340612A (en) * 2018-09-04 2019-02-15 东莞市闻誉实业有限公司 Illuminator

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C14 Grant of patent or utility model
GR01 Patent grant
DD01 Delivery of document by public notice

Addressee: Ling Guang

Document name: Notification to Pay the Fees

DD01 Delivery of document by public notice

Addressee: Ling Guang

Document name: Notification of Termination of Patent Right

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090715

Termination date: 20120521