CN201801588U - Graphite boat used in silicon chip production - Google Patents
Graphite boat used in silicon chip production Download PDFInfo
- Publication number
- CN201801588U CN201801588U CN201020504711XU CN201020504711U CN201801588U CN 201801588 U CN201801588 U CN 201801588U CN 201020504711X U CN201020504711X U CN 201020504711XU CN 201020504711 U CN201020504711 U CN 201020504711U CN 201801588 U CN201801588 U CN 201801588U
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- Prior art keywords
- graphite
- silicon chip
- pin
- boat
- wiring
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Abstract
A graphite boat used in silicon chip production comprises a plurality of first graphite plates and a plurality of second graphite plates that are arranged and combined in parallel at internals. First wiring projecting lugs are arranged at lower parts of two ends of each first graphite plate; the first wiring projecting lugs of the first graphite plate are connected through a plurality of first wiring blocks and first connecting bolts to form the wiring terminal of one polar of the graphite boat; second wiring projecting lugs are arranged at lower parts of the two ends of each second graphite plate; the second wiring projecting lugs of the second graphite plate ares connected through a plurality of second wiring blocks and second connecting bolts to form the wiring terminal of another polar of the graphite boat; corresponding positions of each first graphite plate and second graphite plate for placing a silicon chip is hollowed out and takes the shape of a silicon chip coating area; and the external diameter of a graphite pin is 0 to 0.003mm larger than the diameter of a through hole. After the graphite boat is mounted, the graphite boat plates and the pin are in close fit and can not loose. Since the thermal expansion coefficients are different, the pin is easy to enter into the through hole when the graphite boat plates are assembled in a heating manner, so that the breakage of the pin caused by rough extrusion can be avoided.
Description
Technical field
The utility model relates to the silicon chip production technical field, is meant the graphite boat that uses in a kind of silicon chip production especially.
Background technology
Close in semi-conductor (the being silicon chip) production process at sun power, usually adopt thin film deposition processes to carry out semi-conductive plated film, for example can adopt the depositing operation of PECVD (Plasma Enhanced Chemical VapourDeposition, plasma reinforced chemical vapour deposition) to carry out the vacuum plating of silicon nitride.Below sun power is closed production process of semiconductor and carries out brief introduction:
Close in the semiconductor production process at sun power, when carrying out plated film, uncoated silicon chip is inserted on the slide glass device of PECVD vacuum coating film equipment, the slide glass device is realized by graphite boat usually, is about to uncoated silicon chip and inserts graphite boat.Then graphite boat is placed in the PECVD vacuum coating film equipment cavity, adopts the pecvd process plated film that discharges.After plated film finishes, take out graphite boat, silicon chip is unloaded from graphite boat take off.
At present, every graphite flake forming graphite boat all is tabular, steady brace in order to restriction silicon chip position on the graphite flake generally mainly contains two kinds of fixed forms, a kind of is that steady brace adopts thread connecting mode to be fixed on the graphite flake, though this mode is simple, safeguard and change conveniently, requirement on machining accuracy is relatively low, but its shortcoming is arranged also: make this steady brace threaded hole place on the graphite flake when the assembling be easy to generate as the triable structure of graphite and break, and it is loosening easily in the process of using, thereby product is damaged easily, need running check.Another kind is the fixed form of present main flow---graphite pin and graphite flake wringing fit mode.The benefit of this mode is to use in the process highly stable, be not easy to become flexible, and need on graphite flake, not do screw hole, shortcoming is that working accuracy and matching requirements are very high, and current is that main mode by hard extruding removes to install the graphite pin when assembling, but when mounted because the triable structure of graphite itself, add that pin is very little and very thin, break when mounted easily, may need repeatedly to repeat the ability successful installation, bring very big trouble to assembling.
The utility model content
It is a kind of can avoid above-mentioned available technology adopting wringing fit mode fixedly the time that technical problem to be solved in the utility model is to provide, and pin is the new texture graphite boat of fracture easily.
For achieving the above object, the technical scheme that the utility model adopted is:
The graphite boat that uses during a kind of silicon chip is produced, combine alternately by some first graphite flakes are parallel with some second graphite flakes, bottom, the described first graphite flake two ends is provided with the first wiring lug, the first wiring lug of all first graphite flakes is connected to form the terminal stud of graphite boat one utmost point by some first tagblocks and first joint bolt, middle and upper part, the described second graphite flake two ends is provided with the second wiring lug, the second wiring lug of all second graphite flakes is connected to form the terminal stud of another utmost point of graphite boat by some second tagblocks and second joint bolt, and described each first graphite flake becomes silicon chip film-coated region shape with the corresponding position hollow out of placing silicon chip of second graphite flake.
Hollow out at first graphite flake and second graphite flake becomes the edge of silicon chip film-coated region shape to be provided with some through holes, be inserted with the graphite pin of restriction silicon chip position effect in the through hole on first graphite flake and second graphite flake, the external diameter of described graphite pin is than the big 0～0.003mm in the aperture of described through hole; The thermal expansivity of described graphite pin is 1.0 * 10
-6～3.0 * 10
-6Mm/ ℃, the thermal expansivity of first graphite flake and second graphite flake is 7.0 * 10
-6～8.2 * 10
-6Mm/ ℃.
During installation graphite boat sheet and graphite pin are heated simultaneously, because both thermal expansivity differences, graphite boat sheet through-hole aperture changes than the pin diameter variation greatly, makes pin be convenient to enter in the through hole.
The utlity model has following advantage: the through-hole aperture of graphite boat sheet is less than or equal to the external diameter of graphite pin, installs like this to closely cooperate between back graphite boat sheet and the pin and loosening; And because both thermal expansivity difference, adopt the mode of heating to assemble to be convenient to pin to enter in the through hole, avoided hard extruding to cause the phenomenon of pin fracture.
Description of drawings
Fig. 1 is the structural representation of the graphite boat of use during a kind of silicon chip of the utility model is produced.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the left view of Fig. 1.
Fig. 4 is the enlarged diagram of graphite boat one end of use during a kind of silicon chip of the utility model is produced.
Fig. 5 is the enlarged diagram of the graphite boat the other end of use during a kind of silicon chip of the utility model is produced.
Embodiment
For technique means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete accompanying drawing, further set forth the utility model.
Extremely shown in Figure 5 as Fig. 1, the graphite boat that a kind of silicon chip of the present utility model uses in producing, combine alternately by 7 first graphite flakes 100 and 6 second graphite flakes 200 are parallel, bottom, first graphite flake, 100 two ends is provided with wiring lug 110, and the wiring lug 110 of all first graphite flakes 100 is connected to form the terminal stud 310 of graphite boat one utmost point by 6 tagblocks 120 and joint bolt 130.Middle and upper part, second graphite flake, 200 two ends is provided with wiring lug 210, the wiring lug 210 of all second graphite flakes 200 is connected to form the terminal stud 320 of another utmost point of graphite boat by 5 tagblocks 220 and joint bolt 230, and each first graphite flake 100 becomes silicon chip film-coated region shape 400 with second graphite flake, 200 corresponding position hollow outs of placing silicon chips.
Hollow out at first graphite flake 100 and second graphite flake 200 becomes the edge of silicon chip film-coated region shape 400 to be provided with some through holes 500, be inserted with the graphite pin 510 of restriction silicon chip position effect in the through hole 500 on first graphite flake 100 and second graphite flake 200, the external diameter of graphite pin 510 is than the big 0～0.003mm in the aperture of through hole 500.
The thermal expansivity of graphite pin 510 is 1.0 * 10
-6～3.0 * 10
-6Mm/ ℃, the thermal expansivity of first graphite flake 100 and second graphite flake 200 is 7.0 * 10
-6～8.2 * 10
-6Mm/ ℃.
During installation, adopt following assembling mode:
(1) first graphite flake 100, second graphite flake 200 and graphite pin 510 were toasted 3～5 hours down at 600 ℃;
(2) under 600 ℃, graphite pin 510 is fit in the through hole 500 of first graphite flake 100, second graphite flake 200;
(3) will assemble first graphite flake 100 of graphite pin 510, the graphite boat of second graphite flake 200 is cooled to normal temperature, is assembled into graphite boat.
Adopt the graphite boat of said structure and mounting means, because its first graphite flake 100, second graphite flake 200 is different with the thermal expansivity of graphite pin 510,600 ℃ of bakings of 3-5 hour of process down, first graphite flake 100, through hole 500 apertures of second graphite flake 200 can enlarge about 0.005mm, and the diameter of graphite pin 510 enlarges about 0.002mm at most, because during normal temperature the diameter of graphite pin 510 than the big 0～0.003mm in the aperture of through hole 500 about, so the diameter of graphite pin 510 can be less than or equal to the aperture of through hole 500 under this temperature, and because graphite itself has self-lubricating property, so be easy to graphite pin 510 is installed first graphite flake 100, in the through hole 500 of second graphite flake 200, and can not cause the fracture of graphite pin 510.And when first graphite flake 100 that assembles graphite pin 510, when second graphite flake 200 is cooled to normal temperature, because through hole 500 apertures of first graphite flake 100, second graphite flake 200 are less than or equal to the diameter of graphite pin 510, first graphite flake 100, second graphite flake 200 can be realized closely cooperating automatically with graphite pin 510.
More than show and described ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that describes in the foregoing description and the specification sheets just illustrates principle of the present utility model; the utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (2)
1. the graphite boat of use during a silicon chip is produced, combine alternately by some first graphite flakes are parallel with some second graphite flakes, bottom, the described first graphite flake two ends is provided with the first wiring lug, the first wiring lug of all first graphite flakes is connected to form the terminal stud of graphite boat one utmost point by some first tagblocks and first joint bolt, middle and upper part, the described second graphite flake two ends is provided with the second wiring lug, the second wiring lug of all second graphite flakes is connected to form the terminal stud of another utmost point of graphite boat by some second tagblocks and second joint bolt, and described each first graphite flake becomes silicon chip film-coated region shape with the corresponding position hollow out of placing silicon chip of second graphite flake.
2. the graphite boat of use during a kind of silicon chip is as claimed in claim produced, it is characterized in that, hollow out at first graphite flake and second graphite flake becomes the edge of silicon chip film-coated region shape to be provided with some through holes, be inserted with the graphite pin of restriction silicon chip position effect in the through hole on first graphite flake and second graphite flake, the external diameter of described graphite pin is than the big 0～0.003mm in the aperture of described through hole; The thermal expansivity of described graphite pin is 1.0 * 10
-6～3.0 * 10
-6Mm/ ℃, the thermal expansivity of first graphite flake and second graphite flake is 7.0 * 10
-6～8.2 * 10
-6Mm/ ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020504711XU CN201801588U (en) | 2010-08-24 | 2010-08-24 | Graphite boat used in silicon chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020504711XU CN201801588U (en) | 2010-08-24 | 2010-08-24 | Graphite boat used in silicon chip production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201801588U true CN201801588U (en) | 2011-04-20 |
Family
ID=43871103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020504711XU Expired - Lifetime CN201801588U (en) | 2010-08-24 | 2010-08-24 | Graphite boat used in silicon chip production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201801588U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534564A (en) * | 2012-02-24 | 2012-07-04 | 湖南红太阳光电科技有限公司 | Graphite boat with electrode holes formed on double sides for PECVD (Plasma Enhanced Chemical Vapor Deposition) |
| CN102610701A (en) * | 2012-04-06 | 2012-07-25 | 无锡绿波新能源设备有限公司 | Graphite boat being convenient to dismantle and assemble |
| CN110629189A (en) * | 2018-06-25 | 2019-12-31 | 广州墨羲科技有限公司 | Substrate material carrier for capacitive coupling PECVD device |
| CN111188030A (en) * | 2020-03-12 | 2020-05-22 | 上海弘枫实业有限公司 | Double-spliced multi-frame graphite boat |
-
2010
- 2010-08-24 CN CN201020504711XU patent/CN201801588U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534564A (en) * | 2012-02-24 | 2012-07-04 | 湖南红太阳光电科技有限公司 | Graphite boat with electrode holes formed on double sides for PECVD (Plasma Enhanced Chemical Vapor Deposition) |
| CN102610701A (en) * | 2012-04-06 | 2012-07-25 | 无锡绿波新能源设备有限公司 | Graphite boat being convenient to dismantle and assemble |
| CN102610701B (en) * | 2012-04-06 | 2014-02-05 | 无锡绿波新能源设备有限公司 | Graphite boat being convenient to dismantle and assemble |
| CN110629189A (en) * | 2018-06-25 | 2019-12-31 | 广州墨羲科技有限公司 | Substrate material carrier for capacitive coupling PECVD device |
| CN111188030A (en) * | 2020-03-12 | 2020-05-22 | 上海弘枫实业有限公司 | Double-spliced multi-frame graphite boat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai Hongfeng Industry Co., Ltd. Assignor: Zhang Mengtong Contract record no.: 2012310000184 Denomination of utility model: Graphite boat used in silicon chip production Granted publication date: 20110420 License type: Exclusive License Record date: 20120924 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HONGFENG INDUSTRY CO., LTD. Free format text: FORMER OWNER: ZHANG MENGTONG Effective date: 20140718 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140718 Address after: 201716 Shanghai city Qingpu District Liantang Industrial Park chapter Liantang road 588 Lane No. 86 Patentee after: Shanghai Hongfeng Industry Co., Ltd. Address before: 201716 Shanghai city Qingpu District Liantang Industrial Park chapter Liantang road 588 Lane No. 86 Patentee before: Zhang Mengtong |
|
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Shanghai Hongfeng Industry Co., Ltd. Assignor: Zhang Mengtong Contract record no.: 2012310000184 Date of cancellation: 20140620 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110420 |
|
| CX01 | Expiry of patent term |