CN201749846U - Lead frame for welding diode grain - Google Patents
Lead frame for welding diode grain Download PDFInfo
- Publication number
- CN201749846U CN201749846U CN 201020198260 CN201020198260U CN201749846U CN 201749846 U CN201749846 U CN 201749846U CN 201020198260 CN201020198260 CN 201020198260 CN 201020198260 U CN201020198260 U CN 201020198260U CN 201749846 U CN201749846 U CN 201749846U
- Authority
- CN
- China
- Prior art keywords
- welding
- zone
- weld zone
- crystal grain
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
A lead frame for welding a diode grain comprises a flat bracket and a convex bracket. One end of the flat bracket is provided with a first welding zone connected with one end of the grain, and the other end is provided with a first pin zone. A bending zone is arranged between the first welding zone and the first pin zone. The bending zone leads the welding zone and the pin zone in the different planes. A convex point is arranged on the first welding zone and close to one side of the bending zone. One end of the convex bracket is provided with a second welding zone, and the other end is provided with a second pin zone. A bending zone is arranged between the second welding zone and the second pin zone. A welding convex point for welding with the other end of the grain is arranged on the second welding zone and close to one side of the bending zone. The lead frame and a welding boat form a closed loop which plays a role in stopping the grain so that the grain cannot deflect.
Description
Technical field
The utility model relates to a kind of lead frame, relates in particular to a kind of lead frame that is used for the diode crystal particle welding.
Background technology
The framework of existing lead frame structure is divided into flat support and protruding support (also calling support chip), is scolder and crystal grain between flat support and protruding support, sees welding finished product end view (seeing accompanying drawing one).
During assembly operation, at first flat support is put on the welding ship (also being fixed head or Soldering Boat), the Kong Weihui that weld on the ship this moment carries out three spacing (seeing accompanying drawing two) to flat support; On flat support, place scolder and crystal grain (also being Dice or chip) then; Above crystal grain, place protruding support at last.
The problem points of this moment is, because three spacing (seeing accompanying drawing three) only carried out to crystal grain in the position, hole on the welding ship, another direction (the breach direction of welding position, ship hole) needs to place flat support and can't carry out spacing design on the welding ship.Cause the crystal grain can be along there not being spacing direction to move, especially in carrying welding ship and welding process for very.Its consequence is the product grains deflection (also being Dice misalignment) after the welding, influences reliability of products.Such problem need be avoided taking place in manufacture process.
The problem that how to solve welding back crystal grain deflection is exactly the problem of the utility model research.
Summary of the invention
The utility model provides a kind of lead frame that is used for the diode crystal particle welding, and this lead frame becomes relative closed loop to play good position-limiting action to crystal grain with the welding ship shape, thereby guarantees that crystal grain can deflection.
For achieving the above object, the technical solution adopted in the utility model is: a kind of lead frame that is used for the diode crystal particle welding, comprise flat support and protruding support, described flat support one end is to be used for first weld zone that is connected with crystal grain one end, the flat support other end is the first pin district, between first weld zone and the first pin district is flex area, and this flex area makes the weld zone be positioned at different planes with the pin district, and a salient point is positioned on described first weld zone and close flex area one side; Described protruding support one end is second weld zone, and the protruding support other end is the second pin district, is flex area between second weld zone and the second pin district, and one is used for being positioned on described second weld zone and close flex area one side with the pedestal of crystal grain other end welding.
Because the technique scheme utilization, the utility model compared with prior art has following advantage:
The utility model is on the basis of supporting structure, on the flat support that does not have spacing direction (welding position, ship hole direction jaggy), make a salient point, three face portion of this salient point and welding position, ship hole form a relative closed loop, at this moment, the welding ship can to crystal grain carry out three spacing, salient point on the flat support can be spacing to crystal grain at four direction, this closed relatively loop can play good position-limiting action to crystal grain, guarantee that crystal grain can not gone in this closed loop outside, thereby guarantee that crystal grain can deflection, description of drawings
Accompanying drawing 1 is the welding finished product end view of existing structure;
Accompanying drawing 2 is the schematic diagram of flat support in welding position, ship hole of existing structure;
Accompanying drawing 3 is the spacing schematic diagram of the crystal grain of existing structure in welding position, ship hole;
Accompanying drawing 4 is the welding semi-finished product end view of new structure;
Accompanying drawing 5 is the schematic diagram of flat support in welding position, ship hole of new structure;
Accompanying drawing 6 is the spacing schematic diagram of the crystal grain of new structure in welding position, ship hole.
In the above accompanying drawing: 1, flat support; 2, protruding support; 3, first weld zone; 4, the first pin district; 5, flex area; 6, salient point; 7, second weld zone; 8, the second pin district; 9, pedestal; 10, welding ship.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment: a kind of lead frame that is used for the diode crystal particle welding,
Shown in accompanying drawing 1-6, comprise flat support 1 and protruding support 2, it is characterized in that: described flat support 1 one ends are to be used for first weld zone 3 that is connected with crystal grain one end, the flat support other end is the first pin district 4, between first weld zone 3 and the first pin district 4 is flex area 5, this flex area makes the weld zone be positioned at different planes with the pin district, and a salient point 6 is positioned on described first weld zone 3 and close flex area one side; Described protruding support 2 one ends are second weld zone 7, protruding support 2 other ends are the second pin district 8, between second weld zone 7 and the second pin district 8 is flex area, and one is used for being positioned on described second weld zone 7 and close flex area one side with the pedestal 9 of crystal grain other end welding.
Above-mentioned lead frame structure, on the flat support 1 that does not have spacing direction (welding position, ship 10 hole direction jaggy), make a salient point 6 (seeing accompanying drawing four), three face portion of this salient point 6 and welding position, ship 10 hole form a relative closed loop (seeing accompanying drawing five), at this moment, welding ship 10 can to crystal grain carry out three spacing, salient point on the flat support 1 can be spacing to crystal grain at four direction, this closed relatively loop can play good position-limiting action to crystal grain, guarantee that crystal grain can not gone in this closed loop outside, thereby guarantee that crystal grain can deflection, see accompanying drawing six.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (1)
1. one kind is used for the lead frame that diode crystal particle welds, comprise flat support (1) and protruding support (2), it is characterized in that: described flat support (1) one end is to be used for first weld zone (3) that is connected with crystal grain one end, the flat support other end is the first pin district (4), between first weld zone (3) and the first pin district (4) is flex area (5), and a salient point (6) is positioned at described first weld zone (3) and goes up also near flex area one side; Described protruding support (2) one ends are second weld zone (7), protruding support (2) other end is the second pin district (8), between second weld zone (7) and the second pin district (8) is flex area, and one is used for being positioned at described second weld zone (7) upward also near flex area one side with the pedestal (9) of crystal grain other end welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020198260 CN201749846U (en) | 2010-05-21 | 2010-05-21 | Lead frame for welding diode grain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020198260 CN201749846U (en) | 2010-05-21 | 2010-05-21 | Lead frame for welding diode grain |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201749846U true CN201749846U (en) | 2011-02-16 |
Family
ID=43584519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020198260 Expired - Fee Related CN201749846U (en) | 2010-05-21 | 2010-05-21 | Lead frame for welding diode grain |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201749846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539324A (en) * | 2012-01-19 | 2012-07-04 | 苏州固锝电子股份有限公司 | Detection device used for testing welding pulling force of patch type diode |
-
2010
- 2010-05-21 CN CN 201020198260 patent/CN201749846U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539324A (en) * | 2012-01-19 | 2012-07-04 | 苏州固锝电子股份有限公司 | Detection device used for testing welding pulling force of patch type diode |
| CN102539324B (en) * | 2012-01-19 | 2013-10-16 | 苏州固锝电子股份有限公司 | Detection device used for testing welding pulling force of patch type diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110216 Termination date: 20180521 |