CN201732773U - Chip carrier - Google Patents
Chip carrier Download PDFInfo
- Publication number
- CN201732773U CN201732773U CN2010202637115U CN201020263711U CN201732773U CN 201732773 U CN201732773 U CN 201732773U CN 2010202637115 U CN2010202637115 U CN 2010202637115U CN 201020263711 U CN201020263711 U CN 201020263711U CN 201732773 U CN201732773 U CN 201732773U
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- Prior art keywords
- side wall
- leg
- longitudinal fluting
- wafer carrier
- sidewall
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- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a chip carrier which comprises a box body, wherein openings are formed on the top and bottom of the box body, the box body is provided with a first side wall and a second side wall opposite to each other, a first end wall and a second end wall are used for connecting the first side wall with the second side wall, a plurality of first vertical concave grooves and a plurality of second vertical concave grooves penetrate through the bottoms of the side walls to be arranged on the inner surfaces of the first side wall and the second side wall in constant spacing, the first vertical concave grooves correspond to the second vertical concave grooves in transverse direction; a first support leg and a second support leg are respectively connected with the lower ends of the first end wall and a second end wall and respectively positioned no the inner sides of the first side wall and the second side wall, and openings are respectively formed between the first support leg and the first side wall, and between the second support leg and the second side wall. The chip carrier can effectively solve the defect that the chip edge cannot be cleaned effectively during cleaning process.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly a kind of wafer carrier.
Background technology
New and renewable sources of energy is one of material technical field of tool in the 21 century development of world economy.Photovoltaic cell is a kind of important renewable energy, both can be used as separate energy source, also can realize generating electricity by way of merging two or more grid systems, and be zero disposal of pollutants.Silicon solar cell can only be used for the space at first owing to the cost reason, but along with technical development and technical maturity, uses also progressively expansion.In the face of the energy supply situation of today and serious environmental pollution day by day, silicon solar cell has obtained using widely especially.
The manufacturing process of silicon solar cell mainly comprises: monocrystalline or polycrystalline ingot → butt → polishing or acid corrosion → steps such as line section → cleaning.Wafer carrier in cleaning step (claiming to clean the gaily decorated basket again) is indispensable.As number of patent application is 200410101211.0, and the applying date is on December 17th, 2004, and name is called in the patent application of " silicon wafer carrier " and discloses a kind of silicon wafer carrier, as shown in Figure 1, is the schematic diagram of wafer carrier in the prior art.This square silicon wafer carrier 1 comprises: the sidewall 2 that open top 11 and bottom 12, two sides oppose mutually, H shape end wall 3 and another dull and stereotyped end wall 4 and leg 24 opposed with it.Sidewall 2 outer surfaces of this silicon wafer carrier 1 vertically arranged side by side have the pane 21 that liquid flows out when cleaning silicon chip that is used for of fixed width, the part that each pane 21 clips has formed the fixedly tooth bar 22 of silicon chip position in side wall inner surfaces.Each silicon chip enters into silicon wafer carrier 1 along tooth bar 22, is fixed by tooth bar 22 and 26 pairs of silicon chips of conical tooth of being positioned at leg 24 upsides simultaneously.Wherein, between leg 24 and sidewall 2 only at interval leave a plurality of gaps 25 to be used for the outflow of cleaning fluid.By its structure as can be known, be separated with plastic strip between between per two adjacent segments 25, one end of plastic strip is connecting leg 24, hence one can see that, and its other end must be connected with at tooth bar 22 downsides and the horizontal plastic strip between adjacent two tooth bars 22, that is tooth bar 22 bottoms are connected to each other by a horizontal plastic strip.
The shortcoming that prior art exists is, because the plastic strip between leg and sidewall and be formed at the marginal portion that the horizontal plastic strip of tooth bar 22 bottoms has stopped silicon chip, when cleaning, cause cleaning fluid to be hindered on the one hand at the mobile of these parts, on the other hand, when cleaning, silicon chip adopted ultrasonic wave in order to strengthen cleaning performance, described plastic strip has hindered the propagation of ultrasonic wave at these positions, and cleaning performance depends on flowing of hyperacoustic propagation and cleaning fluid to a great extent, thereby the existing carrier problem that exists silicon chip edge part to get effective washing, particularly for square silicon chip, it is more that the edge is blocked part, and this problem is more outstanding.
The utility model content
The purpose of this utility model is intended to solve at least above-mentioned technological deficiency, particularly improves the defective that the edge of wafer can't get effective washing.
For achieving the above object, the utility model proposes a kind of wafer carrier on the one hand, comprise: box-shaped body, the top and the bottom of described box-shaped body are formed with opening, and described box-shaped body has the first side wall and second sidewall that is oppositely arranged, first end wall and second end wall that connect described the first side wall and described second sidewall, in the face of described the first side wall and described second sidewall with constant spacing, the mode that runs through sidewall bottom is provided with a plurality of first longitudinal flutings and a plurality of second longitudinal fluting, and described a plurality of first longitudinal fluting and a plurality of second longitudinal fluting are laterally corresponding one by one; And first leg and second leg, described first leg and second leg are connected to the lower end of described first end wall and second end wall, and lay respectively at the inboard of the described the first side wall and second sidewall, between described first leg and described the first side wall and described second leg and described second sidewall, be formed with opening.
During use, wafer is inserted in the wafer carrier along first longitudinal fluting and second longitudinal fluting, depends on first longitudinal fluting and second longitudinal fluting to its crosswise fixed, does not promptly take place laterally to move.
According to wafer carrier of the present utility model, satisfy corrosion-resistant, use the indeformable while for a long time, because it is formed with opening between leg and sidewall bottom, and the groove of sidewall is the groove of bottom opening, when wafer cleans, help flowing and hyperacoustic transmission of cleaning fluid, therefore can improve cleaning performance significantly.
According to an embodiment of the present utility model, wherein, described first end wall is a H shape end wall, and described second end wall is dull and stereotyped end wall.
According to an embodiment of the present utility model, wherein, on the cell wall of at least one described first longitudinal fluting, be formed with at least one horizontal cut.
According to an embodiment of the present utility model, wherein, on the cell wall of at least one described second longitudinal fluting, be formed with at least one horizontal cut.
According to an embodiment of the present utility model, wherein, the horizontal cut on the cell wall of described first longitudinal fluting and/or second longitudinal fluting evenly distributes.
According to an embodiment of the present utility model, wherein, the horizontal cut on two adjacent cell walls of described first longitudinal fluting and/or second longitudinal fluting is interspersed.
According to an embodiment of the present utility model, wherein, be formed with the wafer introduction part in the upper end of the described the first side wall and/or second sidewall.
According to an embodiment of the present utility model, wherein, be formed with at least one crossbeam at the outer surface of the described the first side wall and/or second sidewall.
According to an embodiment of the present utility model, wherein, described horizontal cut runs through or partly disconnects the cell wall of described first groove and/or second groove fully.
According to an embodiment of the present utility model, wherein, on described first leg and second leg, be formed with two location notchs respectively accordingly.
According to an embodiment of the present utility model, wherein, on described first leg and second leg, on position, also be formed with the conical tooth that is used for fixing wafer corresponding to the cell wall of described first longitudinal fluting and second longitudinal fluting.
By wafer carrier of the present utility model, satisfy corrosion-resistant, use the indeformable while for a long time, because it is formed with opening between leg and sidewall bottom, and the groove of sidewall is the groove of bottom opening, help flowing and hyperacoustic transmission of cleaning fluid, therefore can improve cleaning performance significantly.
In addition, by the horizontal cut on the cell wall that is formed at first groove and/or second groove, more help flowing and hyperacoustic transmission of cleaning fluid, thereby can further improve cleaning performance.Simultaneously, owing to can save the raw-material consumption of wafer carrier, help reducing cost.
Aspect that the utility model is additional and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Description of drawings
Above-mentioned and/or additional aspect of the utility model and advantage are from obviously and easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, wherein:
Fig. 1 is the schematic diagram of the wafer carrier of prior art;
Fig. 2 is the stereogram of the wafer carrier of an embodiment of the present utility model;
Fig. 3 is the vertical view of the wafer carrier of an embodiment of the present utility model;
Fig. 4 is the cutaway view along the A-A direction of the wafer carrier of an embodiment of the present utility model;
Fig. 5 is the cutaway view along the A-A direction of the wafer carrier of another embodiment of the present utility model.
Embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, term " inboard ", " outside ", " vertically ", " laterally ", " on ", close the orientation of indications such as D score, " top ", " end " or position is based on orientation shown in the drawings or position relation, it only is the utility model rather than require the utility model therefore can not be interpreted as for convenience of description with specific orientation structure and operation to restriction of the present utility model.
In following, will be example with square silicon wafer (not shown), describe in detail according to wafer carrier of the present utility model, but need to prove, wafer carrier of the present utility model not only limits the use of in the square silicon wafer of carrying, and can be applied in any wafer that needs carrying, such as circular silicon wafer, square or circular glass sheet etc.Following thus only for exemplary purposes rather than in order to limit protection range of the present utility model.
Describe wafer carrier below with reference to accompanying drawings in detail according to embodiment of the present utility model.
Fig. 2 is the stereogram according to the wafer carrier 100 of an embodiment of the present utility model.Wafer carrier 100 comprises: casing 200, first leg 310 and second leg 320.Wherein, casing 200 has the first side wall 210 and second sidewall 220, first end wall 230 that is connected the first side wall 210 and second sidewall 220 and second end wall 240 that is oppositely arranged.In the face of the first side wall 210 and second sidewall 220, be provided with a plurality of first longitudinal flutings 250 and a plurality of second longitudinal fluting 260, and first longitudinal fluting 250 and second longitudinal fluting 260 are laterally corresponding one by one with constant spacing, the mode that runs through sidewall bottom.
During use, wafer is inserted in the wafer carrier along first longitudinal fluting 250 and second longitudinal fluting 260, depends on first longitudinal fluting and second longitudinal fluting to its crosswise fixed, does not promptly take place laterally to move.
According to an embodiment of the present utility model, the first side wall 210 of wafer carrier 100 and second sidewall, 220 outer surfaces also are formed with the crossbeam 270 of three levels, crossbeam 270 is on the one hand when playing reinforcement effect, also play the effect of fixing square silicon chip 400 (not shown)s simultaneously, to prevent that square silicon chip 400 is thrown out of in the spin-drying operation after cleaning.
According to an embodiment of the present utility model, wafer carrier 100 in the upper end of the first side wall 210 and second sidewall 220 outstanding laterally be formed with prominent along 280, with the convenient artificial or manipulator wafer carrier 100 of taking.And be formed with two alignment pins 291 respectively near first end wall 230 and second end wall, 240 places at the prominent upper surface of a side along 280, and be formed with two location holes 292 respectively at the prominent relative position place of opposite side along 280.This alignment pin 291 and location hole 292 are to be used for two wafer carriers 100 when relative exchange silicon chip or wafer carrier 100 being located by connecting during with other device exchange silicon chip.
According to an embodiment of the present utility model, on first leg 310, second leg 320, be formed with 2 location notchs 311, be used for wafer carrier 100 is positioned over and clean and location during the equipment of drying (not shown).
Fig. 3 is the vertical view of the wafer carrier 100 of an embodiment of the present utility model.As shown in Figure 3, first leg 310 and second leg 320 are connected to the lower end of first end wall 230 and second end wall 240, and lay respectively at the inboard of the first side wall 210 and second sidewall 220, be formed with opening between first leg 310 and the first side wall 210 and between second leg 320 and second sidewall 220, be beneficial to the outflow of cleaning fluid, help hyperacoustic transmission simultaneously, therefore can improve cleaning performance significantly.
Fig. 4 is the cutaway view along the A-A direction of the wafer carrier of an embodiment of the present utility model.As shown in Figure 4, be formed with a plurality of horizontal cuts 261 on the cell wall of first longitudinal fluting 250 and second longitudinal fluting 260.Among the figure, for the sake of clarity, described horizontal cut 261 partly disconnects the cell wall of first longitudinal fluting 250 and second longitudinal fluting 260.Described horizontal cut helps flowing of cleaning fluid, helps the transmission of ultrasonic wave at silicon chip edge simultaneously, therefore can significantly improve the cleaning performance of silicon chip edge.
Be illustrated in figure 5 as the cutaway view along the A-A direction of the wafer carrier of an alternative embodiment of the invention.As shown in Figure 5, respectively be formed with five crossbeams 270 at the first side wall 210 and second sidewall, 220 outsides in the present embodiment, satisfying under the situation about being connected of cell wall and whole box body 200, all (also can be wherein a part) horizontal cuts 261 also can run through the cell wall of first longitudinal fluting 250 and second longitudinal fluting 260 fully.Can improve the cleaning performance of silicon chip edge thus further.
According to an embodiment of the present utility model, in the inner distance top certain distance of the first side wall 210 and second sidewall 220, be formed with wafer introduction part 211 and 221 respectively, described wafer introduction part 211 and 221 is in fact respectively the head portion of the cell wall of first longitudinal fluting 250 and second longitudinal fluting 260, promptly the head portion at the cell wall of first longitudinal fluting 250 and second longitudinal fluting 260 does not form horizontal cut, but the state that is kept perfectly is with as the wafer introduction part.In view of the above, wafer can be inserted into wafer carrier 100 smoothly and be unlikely to take place problem such as dislocation.
Preferably, according to an embodiment of the present utility model, on first leg 310, second leg 320, on position, can also be formed with the conical tooth (not shown) that is used for fixing wafer corresponding to the cell wall of described first longitudinal fluting 250 and second longitudinal fluting 260.In view of the above, for the cleaning of imperfect wafer, the conical tooth of bottom can play fixation, makes wafer not take place laterally to move.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that under the situation that does not break away from principle of the present utility model and spirit and can carry out multiple variation, modification, replacement and modification that scope of the present utility model is by claims and be equal to and limit to these embodiment.
Claims (10)
1. a wafer carrier is characterized in that, comprising:
Box-shaped body, the top and the bottom of described box-shaped body are formed with opening, and described box-shaped body has the first side wall and second sidewall, first end wall that is connected described the first side wall and described second sidewall and second end wall that is oppositely arranged, in the face of described the first side wall and described second sidewall, be provided with a plurality of first longitudinal flutings and a plurality of second longitudinal fluting, and described a plurality of first longitudinal fluting and a plurality of second longitudinal fluting are laterally corresponding one by one with constant spacing, the mode that runs through sidewall bottom; And
First leg and second leg, described first leg and second leg are connected to the lower end of described first end wall and second end wall, and lay respectively at the inboard of the described the first side wall and second sidewall, between described first leg and described the first side wall and described second leg and described second sidewall, be formed with opening.
2. wafer carrier as claimed in claim 1 is characterized in that, wherein, described first end wall is a H shape end wall, and described second end wall is dull and stereotyped end wall.
3. wafer carrier as claimed in claim 1 is characterized in that, wherein, is formed with at least one horizontal cut at least one cell wall of described first longitudinal fluting and/or described second longitudinal fluting.
4. wafer carrier as claimed in claim 3 is characterized in that, the horizontal cut on the cell wall of described first longitudinal fluting and/or second longitudinal fluting evenly distributes.
5. wafer carrier as claimed in claim 3 is characterized in that, the horizontal cut on two adjacent slot walls of described first longitudinal fluting and/or second longitudinal fluting is interspersed.
6. wafer carrier as claimed in claim 3 is characterized in that, is formed with the wafer introduction part in the upper end of the described the first side wall and/or second sidewall.
7. wafer carrier as claimed in claim 1 is characterized in that, is formed with at least one crossbeam at the outer surface of the described the first side wall and/or second sidewall.
8. wafer carrier as claimed in claim 7 is characterized in that, described horizontal cut runs through or partly disconnect the cell wall of described first groove and/or second groove.
9. wafer carrier as claimed in claim 1 is characterized in that, is formed with two location notchs on described first leg and second leg respectively accordingly.
10. wafer carrier as claimed in claim 1 is characterized in that, wherein, on described first leg and second leg, also is formed with conical tooth on the position corresponding to the cell wall of described first longitudinal fluting and second longitudinal fluting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202637115U CN201732773U (en) | 2010-07-13 | 2010-07-13 | Chip carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202637115U CN201732773U (en) | 2010-07-13 | 2010-07-13 | Chip carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201732773U true CN201732773U (en) | 2011-02-02 |
Family
ID=43523928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202637115U Expired - Fee Related CN201732773U (en) | 2010-07-13 | 2010-07-13 | Chip carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201732773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021628A1 (en) * | 2022-07-26 | 2024-02-01 | 上海中欣晶圆半导体科技有限公司 | Method for alleviating cvd particle poorness and contamination |
-
2010
- 2010-07-13 CN CN2010202637115U patent/CN201732773U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021628A1 (en) * | 2022-07-26 | 2024-02-01 | 上海中欣晶圆半导体科技有限公司 | Method for alleviating cvd particle poorness and contamination |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110202 Termination date: 20150713 |
|
| EXPY | Termination of patent right or utility model |