CN201732754U - Patch-type filamentous fuse - Google Patents

Patch-type filamentous fuse Download PDF

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Publication number
CN201732754U
CN201732754U CN2010201352151U CN201020135215U CN201732754U CN 201732754 U CN201732754 U CN 201732754U CN 2010201352151 U CN2010201352151 U CN 2010201352151U CN 201020135215 U CN201020135215 U CN 201020135215U CN 201732754 U CN201732754 U CN 201732754U
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CN
China
Prior art keywords
fuse
substrate
base plate
patch
encapsulated layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010201352151U
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Chinese (zh)
Inventor
王劲
陆秀荣
杨漫雪
南式荣
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Nanjing Sart Science and Technology Development Co Ltd
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Nanjing Sart Science and Technology Development Co Ltd
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Priority to CN2010201352151U priority Critical patent/CN201732754U/en
Application granted granted Critical
Publication of CN201732754U publication Critical patent/CN201732754U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a patch-type filamentous fuse which comprises a base plate, fuse and an encapsulating layer, wherein the base plate is made of insulating material, at least one surface of the base plate has plane structure; the two ends of the plane are laid with surface electrodes, and a certain distance exists between the two surface electrodes; the two ends of the fuse are respectively stuck or welded on the surface electrodes arranged at the two ends of the base plate; the fuse is stuck or welded on the surface electrodes of the base plate; the fuse, bonding points or welding points and part of the surface electrodes are packed in the encapsulating layer; the encapsulating layer, and the fuse are distributed at one side of the base plate; and the two ends of the base plate are arranged outside the encapsulating layer. The patch-type filamentous fuse has the advantages of consistent performance, low cost and high reliability.

Description

A kind of patch-type filamentous fuse
Technical field
The invention belongs to Electronic Protection class components and parts field, be specifically related to a kind of patch-type filamentous fuse.
Background technology
SMD fuse is used widely in printed circuit board (PCB), and along with the microminaturization of electronic device, its size is also more and more littler.It is a kind of being installed in the circuit, guarantees the electric elements of circuit safety operation.When circuit breaks down or is unusual, be accompanied by electric current and constantly raise, and the electric current that raises might damage some important devices or valuable device in the circuit, also might burn circuit even cause fire.Fuse protection electronic equipment is not subjected to the injury of overcurrent, can avoid electronic equipment because of the caused grievous injury of internal fault yet.
Being widely used in the method for making fuse at present has two kinds, and a kind of is the printing electroplating technology, and another kind is to wear silk in cavity.But the printing electroplating technology provides a kind of method of mass production fuse, by the design to conducting layer figure, can produce the fuse of different electric currents, its structure such as Fig. 1, and the two ends of substrate 3 are provided with face electrode 1, and melt 2 is printed between the face electrode 1.But there is fatal defective in this technology, and promptly Yin Shua circuit is after the sintering drying, and its compactness is difficult to assurance, thereby causes the performance discreteness of product very big, electroplates the environmental issue of being brought in addition and also receives publicity day by day.The fuse device performance of wearing the silk manufacturing in cavity is more stable, but its production efficiency is low, causes product cost always than higher, and is difficult to produce small-sized or subminiature fuse.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of features simple structure is provided, is easy to process, the SMD fuse of long service life, function admirable.
Purpose of the present invention is achieved through the following technical solutions.
A kind of patch-type filamentous fuse comprises substrate, fuse, encapsulated layer; It is characterized in that, described substrate is an insulating material, it has a surface at least is planar structure, these two ends, plane are provided with the face electrode, between the face electrode certain spacing is arranged, the two ends of described fuse are bonding respectively or be welded on the face electrode at substrate two ends, and fuse is wrapped in the encapsulated layer together with bonding point or pad and part face electrode, encapsulated layer and fuse are distributed in a side of substrate, and the substrate two ends are in the encapsulated layer outside.
Said enclosure layer is a kind of foamable polymer in the above-mentioned fuse, and has less conductive coefficient, for example the Foamex of conductive coefficient about 0.03w/m.k.Adopt the main cause of the little material of conductive coefficient to be: fuse is to belong to a kind of electronic device that heat is worked that relies on, when the electric current that passes through fuse in the circuit raises, its inner fuse has so just avoided equipment that big fault takes place because of the heating turn-off current.The little effect that just can play heat build-up of encapsulated layer conductive coefficient, if the encapsulated layer conductive coefficient is too big, because fuse is very little, its thermal capacity is also smaller, the heat of fuse can be transmitted to encapsulated layer very soon, the heat that fuse does not reach fusing just can not move, and finally can cause equipment that bigger fault takes place.Adopt the main cause of expanded material to be fragment and energy when the hole of expanded material can provide certain space to be carried on fuse failure.
The present invention also provides the preparation method of above-mentioned patch-type filamentous fuse: at regular intervals electrode of tool is set at the two ends of insulated substrate, the two ends of fuse are bondd respectively or be welded on the face electrode at substrate two ends, and then integral body seals, and fuse and its fixing point are encapsulated in the encapsulated layer.
Arrange with array way as junior unit on the above-mentioned said substrate,, the face electrode that is same as other junior units is arranged all on each junior unit as forming a plurality of substrate junior units on the printed circuit board (PCB).Fuse couples together two ends by the method for bonding or welding with the corresponding surface electrode, realize being electrically connected of fuse two ends, can be bonding between two corresponding electrodes or weld one or more fuse, fuse realize and substrate between junior unit after being electrically connected of circuit, on substrate, form the array integral body of a fuse, then this substrate is put into mould, injecting frothing material from the injection hole of mould, take out finished product behind the heat-insulation pressure keeping, cut off again, just formed single fuse.
Patch-type filamentous fuse provided by the invention is a kind of fuse based on printed circuit board (PCB), and compares with the fuse of conventional method manufacturing at present, and its outstanding substantive distinguishing features and obvious improvement is mainly reflected in the following aspects:
1: simple in structure, easily manufactured.This fuse parts are few, integrated degree height, and product is small-sized, and production cost is low, and process equipment is simple, and is easy to operate, no any chemicals in the course of processing, compliance with environmental protection requirements.
2: compare with present fuse, the fuse function admirable of fuse-wires structure, the structure of fuse is dense, has guaranteed consistency of product and reliability, thereby has improved the yield of product, because the lifting of yield, cost also has certain reduction.
3: this processes process stabilizing is reliable, produces rapidly, owing to adopt the substrate of array, can save the time of a large amount of more conversion materials in the production, and its production efficiency gets a promotion.
4: flexible configuration, because fuse is bonding or is welded on the substrate, can on substrate, bond or weld the fuse of one or more same size or different size according to actual conditions, so just reduced raw-material kind, not only be beneficial to material procurement, can also under identical size, derive many moneys product.
5: product structure provided by the invention is firm, and the product reliability height because fuse is to be wrapped in the resin, thereby has been avoided the exhausting problem of fuse when sealing of hollow-core construction, and is more favourable for producing.
Description of drawings
Fig. 1 is the fuse schematic diagram of typography in the prior art.Wherein 1 is electrode, 2 melt parts for printing, and 3 is substrate.
Fig. 2 is the monolith substrate structural representation.
Fig. 3 is the agent structure schematic diagram of embodiments of the invention one.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the agent structure schematic diagram of embodiments of the invention two.
Fig. 6 is the vertical view of Fig. 5.
In Fig. 2-Fig. 6,4 is substrate, and 5 is electrode, and 6 is fuse, and 7 is encapsulated layer.
Embodiment:
The preparation of the utility model fuse: on an insulating rectangular plate, form a plurality of little cell array substrates (as Fig. 2), the independently wiring board that is same as other unit is all arranged on each base board unit, after this wiring board adopts evaporation, plating or etching method to form, again with fuse bonding or be welded on the face electrode of wiring board, encapsulating material wraps fuse and solder joint or bonding point and part face electrode, and with substrate between driving fit be connected, and then the full wafer substrate is cut, form this product.
Above-mentioned fuse according to different products, can be one or more of.The fuse diameter does not wait from 15 microns to 500 microns.
During production, at first substrate 4 is done cleaning, can be in supersonic wave cleaning machine remove the dust of substrate surface is dirty, this substrate is placed in the special fixture, use the method for ultrasonic wire bonding or solder attach then, fuse 6 is fixed on the electrode 5 of substrate.Owing to adopt machine to advance silk, chopping automatically, the length basically identical of filament, thus guaranteed the performance of product itself.The method of fuse materials can be pressure welding or pompon weldering in bonding on the substrate or welding, but also can be not limited to these two kinds of methods as herein described.The full wafer substrate that fixes fuse carries out surperficial injection moulding again, and Foamex or other high molecular polymers 7 are covered on the substrate, carries out heat-insulation pressure keeping then and makes it sclerosis.Cutting again is divided into single fuse device with the substrate of integral body after the sclerosis.
In order to satisfy different specification needs, in the time of on the electrode that fuse is fixed on substrate, can according to circumstances select one or more of silk materials, seal according to the method described above then, cut and obtain single fuse device.
Embodiment one
As shown in Figure 3, Figure 4, single fuse 6 is soldered or be bonded in the electrode zone 5 of substrate, and encapsulated layer 7 is fuse 6 parcels, and closely pastes mutually with substrate 4, has guaranteed the seal of sealing.
Embodiment two
As Fig. 5, shown in Figure 6, two fuses 6 are soldered or be bonded in the electrode zone 5 of substrate, and encapsulated layer 7 is fuse 6 parcels, and closely paste mutually with substrate 4, guaranteed the seal of sealing.
To carry out the performance comparison test with the product of this explained hereafter and the product of traditional approach, the product of this explained hereafter, its resistance is more stable, same batch product resistance maximin is in 5 milliohms, voltage drop can be controlled at 5%, its operating chacteristics is also very consistent, and this feasibility that has proved absolutely this technology is with advanced.

Claims (1)

1. a patch-type filamentous fuse comprises substrate, fuse, encapsulated layer; It is characterized in that described substrate is an insulating material, it has a surface at least is planar structure, and this two ends, plane paved surface electrode has certain spacing between the face electrode, and the two ends of fuse are bonding respectively or be welded on the face electrode at substrate two ends; Described fuse bonding or be welded on the face electrode of substrate, fuse is wrapped in the encapsulated layer together with bonding point or pad and part face electrode, and encapsulated layer and fuse are distributed in a side of substrate, and the substrate two ends are in the encapsulated layer outside.
CN2010201352151U 2010-03-18 2010-03-18 Patch-type filamentous fuse Expired - Lifetime CN201732754U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010201352151U CN201732754U (en) 2010-03-18 2010-03-18 Patch-type filamentous fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010201352151U CN201732754U (en) 2010-03-18 2010-03-18 Patch-type filamentous fuse

Publications (1)

Publication Number Publication Date
CN201732754U true CN201732754U (en) 2011-02-02

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Application Number Title Priority Date Filing Date
CN2010201352151U Expired - Lifetime CN201732754U (en) 2010-03-18 2010-03-18 Patch-type filamentous fuse

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101794690A (en) * 2010-03-18 2010-08-04 南京萨特科技发展有限公司 Patch-type filamentous fuse and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101794690A (en) * 2010-03-18 2010-08-04 南京萨特科技发展有限公司 Patch-type filamentous fuse and manufacturing method thereof

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CX01 Expiry of patent term

Granted publication date: 20110202

CX01 Expiry of patent term