CN201725786U - Panel reverse ceramic outer casing - Google Patents
Panel reverse ceramic outer casing Download PDFInfo
- Publication number
- CN201725786U CN201725786U CN 201020240162 CN201020240162U CN201725786U CN 201725786 U CN201725786 U CN 201725786U CN 201020240162 CN201020240162 CN 201020240162 CN 201020240162 U CN201020240162 U CN 201020240162U CN 201725786 U CN201725786 U CN 201725786U
- Authority
- CN
- China
- Prior art keywords
- cathode
- flange
- ring
- anode
- sealing ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000919 ceramic Substances 0.000 title claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 229910052573 porcelain Inorganic materials 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 6
- 210000003205 muscle Anatomy 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Thyristors (AREA)
- Die Bonding (AREA)
Abstract
The utility model relates to a panel reverse ceramic outer casing, which comprises a ceramic base and an upper cover. The upper cover is arranged on the ceramic base in a covering manner, the ceramic base includes a cathode flange (1), a ceramic ring (2), a cathode sealing ring (3), a cathode (4), a gate lead pipe (5) and a cathode lead-out end (6), the inner edge of the cathode sealing ring (3) is concentrically welded in the middle of the outer edge of the cathode (4), the outer edge of the cathode sealing ring (3) is concentrically welded on the lower end surface of the ceramic ring (2), and the cathode flange (1) is concentrically welded on the upper end surface of the ceramic ring (2). The upper cover contains an anode (7) and an anode flange (8), and the anode flange (8) is concentrically welded at the outer edge of the anode (7). The panel reverse ceramic outer casing can meet the requirement of high-end equipment encapsulation.
Description
(1) technical field
The utility model relates to a kind of shell, especially relates to the dull and stereotyped inverted ceramic package of a kind of suitable GTO, the contour end-apparatus spare encapsulation of IGBT, IGCT usefulness, belongs to electric and electronic technical field.
(2) background technology
The basic characteristics of plate shaped ceramic package are that shell and radiator plane contact realize two-sided heat radiation, thereby are suitable for big electric current and especially big current device.Plate shaped ceramic package is generally by forming as the loam cake of cathode terminal and the ceramic base of anode tap.Cathode electrode and flange that loam cake is put tube core by pad are formed, and anode electrode, porcelain ring, anode seal ring, gate lead pipe and flange that ceramic base is put tube core by pad are formed.For three terminal device, have gate pole location hole and gate lead groove on the cathode electrode, the gate pole of fixation in loam cake cathode electrode gate pole location hole during assembling is connected with gate lead pipe on being connected to ceramic base porcelain ring by gate lead.
For triode thyristor and rectifying tube, the gate pole assembly is more single, and this structure can satisfy still that encapsulation requires.But in recent years, the high-end devices of full-control type such as GTO, IGBT, IGCT are rapidly developed, and the gate pole of these high-end devices triggers the structure more complicated.Adopt hard lead-in wire to connect to bear big electric current as GTO, IGBT adopts multicore sheet assembled package, multi-door pole tension to drive, and IGCT adopts integral gate triggering etc.Gate pole originally places the structure on the loam cake electrode to be difficult to guarantee the accuracy of assembling, needs the encapsulation requirement that a kind of new structure adapts to high-end device.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of dull and stereotyped inverted ceramic package that high-end device package requires that satisfies is provided.
The purpose of this utility model is achieved in that the inverted ceramic package of a kind of flat board, include ceramic base and loam cake, described loam cake lid places on the ceramic base, described ceramic base includes cathode flange, the porcelain ring, the negative electrode sealing ring, cathode electrode, gate lead pipe and cathode end, described negative electrode sealing ring inner edge is welded in the middle of the outer rim of cathode electrode with one heart, described negative electrode sealing ring outer rim is welded on the lower surface of porcelain ring with one heart, described cathode flange is welded on the upper surface of porcelain ring with one heart, cathode flange, the superimposed from top to bottom concentric welding of porcelain ring and negative electrode sealing ring, have gate pole location hole and lead-in wire groove on the described cathode electrode, described gate lead pipe is connected on the shell wall of porcelain ring, and align with the lead-in wire groove of cathode electrode, described cathode end horizontal welding is connected on the outer wall of negative electrode sealing ring, and is positioned at porcelain ring below;
Described loam cake includes anode electrode and anode flange, and anode flange is welded on the outer rim of anode electrode with one heart.
The dull and stereotyped inverted ceramic package of the utility model, described porcelain ring is provided with the skirt muscle.
The beneficial effects of the utility model are:
Loam cake is as anode tap, and ceramic base is as cathode terminal, and is opposite with common enclosure.Gate pole location hole and lead-in wire groove are arranged on the cathode electrode of ceramic base, and the lead-in wire groove aligns with gate lead pipe on the porcelain ring, all gate pole assemblies can be finished assembling on ceramic base like this, greatly reduce the complexity of assembling, improve the accuracy rate of assembling, therefore be particularly suitable for GTO, the IGBT of complex gate electrode structure, the encapsulation requirement of the contour end-apparatus spare of IGCT.
(4) description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model ceramic base structural representation.
Among the figure: cathode flange 1, porcelain ring 2, porcelain ring skirt muscle 2-1, negative electrode sealing ring 3, cathode electrode 4, gate pole location hole 4-1, lead-in wire groove 4-2, gate lead pipe 5, cathode end 6, anode electrode 7, anode flange 8.
(5) embodiment
Referring to Fig. 1, the utility model relates to the inverted ceramic package of a kind of flat board, includes ceramic base and loam cake, and described loam cake lid places on the ceramic base;
Ginseng Fig. 1 and Fig. 2, described ceramic base includes cathode flange 1, porcelain ring 2, negative electrode sealing ring 3, cathode electrode 4, gate lead pipe 5 and cathode end 6, negative electrode sealing ring 3 inner edges are welded in the middle of the outer rim of cathode electrode 4 with one heart, described negative electrode sealing ring 3 outer rims are welded on the lower surface of porcelain ring 2 with one heart, cathode flange 1 is welded on the upper surface of porcelain ring 2 with one heart, cathode flange 1, the superimposed from top to bottom concentric welding of porcelain ring 2 and negative electrode sealing ring 3, have gate pole location hole 4-1 and lead-in wire groove 4-2 on the described cathode electrode 4, described gate lead pipe 5 is connected on the shell wall of porcelain ring, and align with the lead-in wire groove 4-2 of cathode electrode 4, having on the described porcelain ring 2 increases the skirt of creepage distance muscle 2-1, described cathode end 6 horizontal weldings are connected on the outer wall of negative electrode sealing ring 3, and are positioned at porcelain ring 2 belows.
Described loam cake includes anode electrode 7 and anode flange 8, and anode flange 8 is welded on the outer rim of anode electrode 7 with one heart.
Claims (2)
1. inverted ceramic package of flat board, include ceramic base and loam cake, described loam cake lid places on the ceramic base, it is characterized in that: described ceramic base includes cathode flange (1), porcelain ring (2), negative electrode sealing ring (3), cathode electrode (4), gate lead pipe (5) and cathode end (6), described negative electrode sealing ring (3) inner edge is welded in the middle of the outer rim of cathode electrode (4) with one heart, described negative electrode sealing ring (3) outer rim is welded on the lower surface of porcelain ring (2) with one heart, described cathode flange (1) is welded on the upper surface of porcelain ring (2) with one heart, cathode flange (1), porcelain ring (2) and the superimposed from top to bottom concentric welding of negative electrode sealing ring (3), have gate pole location hole (4-1) and lead-in wire groove (4-2) on the described cathode electrode (4), described gate lead pipe (5) is connected on the shell wall of porcelain ring, and align with the lead-in wire groove (4-2) of cathode electrode (4), described cathode end (6) horizontal welding is connected on the outer wall of negative electrode sealing ring (3), and is positioned at porcelain ring (2) below;
Described loam cake includes anode electrode (7) and anode flange (8), and anode flange (8) is welded on the outer rim of anode electrode (7) with one heart.
2. the inverted ceramic package of a kind of according to claim 1 flat board is characterized in that: described porcelain ring (2) is provided with skirt muscle (2-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020240162 CN201725786U (en) | 2010-06-24 | 2010-06-24 | Panel reverse ceramic outer casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020240162 CN201725786U (en) | 2010-06-24 | 2010-06-24 | Panel reverse ceramic outer casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201725786U true CN201725786U (en) | 2011-01-26 |
Family
ID=43494135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020240162 Expired - Lifetime CN201725786U (en) | 2010-06-24 | 2010-06-24 | Panel reverse ceramic outer casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201725786U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768997A (en) * | 2012-07-28 | 2012-11-07 | 江阴市赛英电子有限公司 | High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing |
| CN105448847A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with external electrodes |
| CN105448849A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with replaceable internal electrodes |
| CN107768314A (en) * | 2017-10-21 | 2018-03-06 | 江阴市赛英电子股份有限公司 | A kind of flat board elastic compression joint encapsulation IGBT ceramic cartridges and preparation method |
| CN110026640A (en) * | 2019-05-15 | 2019-07-19 | 江阴市赛英电子股份有限公司 | A kind of thin electrode ceramic soldering shell with the silver-colored structure of resistance |
-
2010
- 2010-06-24 CN CN 201020240162 patent/CN201725786U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768997A (en) * | 2012-07-28 | 2012-11-07 | 江阴市赛英电子有限公司 | High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing |
| CN105448847A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with external electrodes |
| CN105448849A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with replaceable internal electrodes |
| CN107768314A (en) * | 2017-10-21 | 2018-03-06 | 江阴市赛英电子股份有限公司 | A kind of flat board elastic compression joint encapsulation IGBT ceramic cartridges and preparation method |
| CN107768314B (en) * | 2017-10-21 | 2023-08-22 | 江阴市赛英电子股份有限公司 | Ceramic tube shell for flat elastic crimping packaging IGBT and preparation method |
| CN110026640A (en) * | 2019-05-15 | 2019-07-19 | 江阴市赛英电子股份有限公司 | A kind of thin electrode ceramic soldering shell with the silver-colored structure of resistance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee after: JIANGYIN SAIYING ELECTRON CO., LTD. Address before: 214432 No. 6, Jing Jing Village, Chengjiang industry concentrated area, Jiangsu, Jiangyin Patentee before: Jiangyin Saiying Electron Co., Ltd. Address after: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee after: JIANGYIN SAIYING ELECTRON CO., LTD. Address before: 214432 No. 6, Jing Jing Village, Chengjiang industry concentrated area, Jiangsu, Jiangyin Patentee before: Jiangyin Saiying Electron Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110126 |