CN201725786U - Panel reverse ceramic outer casing - Google Patents
Panel reverse ceramic outer casing Download PDFInfo
- Publication number
- CN201725786U CN201725786U CN 201020240162 CN201020240162U CN201725786U CN 201725786 U CN201725786 U CN 201725786U CN 201020240162 CN201020240162 CN 201020240162 CN 201020240162 U CN201020240162 U CN 201020240162U CN 201725786 U CN201725786 U CN 201725786U
- Authority
- CN
- China
- Prior art keywords
- cathode
- flange
- ring
- anode
- sealing ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 229910052573 porcelain Inorganic materials 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 6
- 210000003205 muscle Anatomy 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Thyristors (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020240162 CN201725786U (en) | 2010-06-24 | 2010-06-24 | Panel reverse ceramic outer casing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020240162 CN201725786U (en) | 2010-06-24 | 2010-06-24 | Panel reverse ceramic outer casing |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201725786U true CN201725786U (en) | 2011-01-26 |
Family
ID=43494135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201020240162 Expired - Lifetime CN201725786U (en) | 2010-06-24 | 2010-06-24 | Panel reverse ceramic outer casing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201725786U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102768997A (en) * | 2012-07-28 | 2012-11-07 | 江阴市赛英电子有限公司 | High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing |
CN105448847A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with external electrodes |
CN105448849A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with replaceable internal electrodes |
CN107768314A (en) * | 2017-10-21 | 2018-03-06 | 江阴市赛英电子股份有限公司 | A kind of flat board elastic compression joint encapsulation IGBT ceramic cartridges and preparation method |
CN110026640A (en) * | 2019-05-15 | 2019-07-19 | 江阴市赛英电子股份有限公司 | A kind of thin electrode ceramic soldering shell with the silver-colored structure of resistance |
-
2010
- 2010-06-24 CN CN 201020240162 patent/CN201725786U/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102768997A (en) * | 2012-07-28 | 2012-11-07 | 江阴市赛英电子有限公司 | High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing |
CN105448847A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with external electrodes |
CN105448849A (en) * | 2015-12-05 | 2016-03-30 | 江阴市赛英电子有限公司 | Ceramic package housing with replaceable internal electrodes |
CN107768314A (en) * | 2017-10-21 | 2018-03-06 | 江阴市赛英电子股份有限公司 | A kind of flat board elastic compression joint encapsulation IGBT ceramic cartridges and preparation method |
CN107768314B (en) * | 2017-10-21 | 2023-08-22 | 江阴市赛英电子股份有限公司 | Ceramic tube shell for flat elastic crimping packaging IGBT and preparation method |
CN110026640A (en) * | 2019-05-15 | 2019-07-19 | 江阴市赛英电子股份有限公司 | A kind of thin electrode ceramic soldering shell with the silver-colored structure of resistance |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee after: JIANGYIN SAIYING ELECTRON CO., LTD. Address before: 214432 No. 6, Jing Jing Village, Chengjiang industry concentrated area, Jiangsu, Jiangyin Patentee before: Jiangyin Saiying Electron Co., Ltd. Address after: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee after: JIANGYIN SAIYING ELECTRON CO., LTD. Address before: 214432 No. 6, Jing Jing Village, Chengjiang industry concentrated area, Jiangsu, Jiangyin Patentee before: Jiangyin Saiying Electron Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110126 |