CN105448849A - Ceramic package housing with replaceable internal electrodes - Google Patents
Ceramic package housing with replaceable internal electrodes Download PDFInfo
- Publication number
- CN105448849A CN105448849A CN201510879344.9A CN201510879344A CN105448849A CN 105448849 A CN105448849 A CN 105448849A CN 201510879344 A CN201510879344 A CN 201510879344A CN 105448849 A CN105448849 A CN 105448849A
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- CN
- China
- Prior art keywords
- anode
- electrode
- built
- ceramic
- negative electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
Abstract
The invention relates to a ceramic housing with replaceable internal electrodes. The ceramic package housing comprises a ceramic base and an upper cover, which can be closed together, wherein the ceramic base comprises an anode flange, a ceramic ring, an anode sealing cup, a gate lead tube and an internal anode electrode; the anode flange is concentrically welded on the upper end surface of the ceramic ring; the anode sealing cup is concentrically welded on the lower end surface of the ceramic ring; the anode flange, the ceramic ring and the anode sealing cup are superimposed from top to bottom and are concentrically welded; the gate lead tube is connected to the housing wall of the ceramic ring in a penetrating manner; the internal anode electrode is arranged in the anode sealing cup; the upper cover comprises a cathode sealing cup and an internal cathode electrode; and the internal cathode electrode is arranged in the cathode sealing cup. The ceramic housing with the replaceable internal electrodes can meet customized requirements of customers and can also achieve large-scale production of the ceramic housing.
Description
Technical field
The present invention relates to electric and electronic technical field, particularly one replaceable built-in electrode ceramic packaging shell.
Background technology
Conventional electric power electronic device mainly refers to thyristor, in many key areas, still there is irreplaceable effect, but in recent years along with the development of the novel power transistors such as IGBT, MOSFET, the market space of middle low power thyristor is progressively compressed, competition is tending towards fierce, and Cost Problems starts to show especially.
On the other hand, device integrated, lightness, the miniaturized a kind of trend having become device technology iteration,
Therefore aluminium electrode replaces copper electrode has become the important channel that industry seeks to fall this, but the fusing point of aluminium is very low, brazing temperature and device operating temperature gap less than normal, reliability is under suspicion.
From standardization of products angle; because factor impacts such as application scenarios is different, application extensive, design concept differences; cause existing power electronic device specification numerous; even if same specification, overall dimension is identical, but due to the small variations of electrode size; often a kind of specification has just derived a hundreds of kind; therefore ceramic package is all that customized type is produced, and production cost is very high, cannot accomplish scale production.
Summary of the invention
Technical problem to be solved by this invention provides a kind of replaceable built-in electrode ceramic packaging shell for above-mentioned prior art; a soldering difficult problem for aluminium electrode can be avoided; reduce costs and significantly alleviator weight revolutionaryly; realize product diversification by the same ceramic package of different electrode configurations simultaneously; both met the requirement of customization formula, the large-scale production of ceramic package can have been realized again.
The present invention's adopted technical scheme that solves the problem is: a kind of replaceable built-in electrode ceramic package, include the ceramic base and upper cover that can mutually cover together, described ceramic base includes anode flange, porcelain ring, anode seal bowl, gate lead pipe and built-in anode electrode; Described anode flange is welded in the upper surface of porcelain ring with one heart, described anode seal bowl is welded in the lower surface of porcelain ring with one heart, described anode flange, porcelain ring and anode seal bowl be superimposed concentric welding from top to bottom, described gate lead pipe is connected on the shell wall of porcelain ring, and described built-in anode electrode is placed in anode seal bowl;
Described upper cover includes negative electrode obturating cup and built-in cathode electrode, and described built-in cathode electrode is placed in negative electrode obturating cup.
Preferably, be respectively arranged with at the center of described anode seal bowl and built-in anode electrode the anode reference column and anode location hole that mutually agree with.
Preferably, be respectively arranged with at the center of described negative electrode obturating cup and built-in cathode electrode the negative electrode reference column and negative electrode location hole that mutually agree with.
Compared with prior art, the invention has the advantages that:
1, compared with existing welded type electrode, electrode can customize according to customer demand, and its housing parts can carry out standardized production.
2, electrode is without the need to welding, and can not affect the original machining accuracy of electrode because of high temperature brazing, built-in electrode is by crimping with the gross area of obturating cup is seamless, and reliability is higher.
3, electrode is without the need to welding, avoids a soldering difficult problem for aluminium electrode, provides reliable technological approaches, can replace copper electrode, thus reduce costs revolutionaryly and significantly alleviate device weight in major applications scene for aluminium electrode replaces copper electrode.
Accompanying drawing explanation
Fig. 1 is the structural representation in the embodiment of the present invention.
Wherein:
Ceramic base 1, upper cover 2, anode flange 1.1, porcelain ring 1.2, anode seal bowl 1.3, gate lead pipe 1.4, built-in anode electrode 1.5, anode reference column 1.3.1, anode location hole 1.5.1, negative electrode obturating cup 2.1, built-in cathode electrode 2.2, negative electrode reference column 2.1.1, negative electrode location hole 2.2.1.
Embodiment
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
As shown in Figure 1, the replaceable built-in electrode ceramic package of one in the present embodiment, include the ceramic base 1 and upper cover 2 that can mutually cover together, described ceramic base 1 includes anode flange 1.1, porcelain ring 1.2, anode seal bowl 1.3, gate lead pipe 1.4 and built-in anode electrode 1.5, described anode flange 1.1 is welded in the upper surface of porcelain ring 1.2 with one heart, described anode seal bowl 1.3 is welded in the lower surface of porcelain ring 1.3 with one heart, described anode flange 1.1, porcelain ring 1.2 and anode seal bowl 1.3 be superimposed concentric welding from top to bottom, the center of described anode seal bowl 1.3 is provided with anode reference column 1.3.1, anode location hole 1.5.1 is offered at the center of described built-in anode electrode 1.5, built-in anode electrode 1.5 is placed on anode seal bowl 1.3, and the anode location hole 1.5.1 on built-in anode electrode 1.5 agrees with the anode reference column 1.3.1 phase on anode seal bowl 1.3.Described gate lead pipe 1.4 is connected on the shell wall of porcelain ring 1.2;
Described upper cover 2 includes negative electrode obturating cup 2.1 and built-in cathode electrode 2.2, the center of described negative electrode obturating cup 2.1 is provided with negative electrode reference column 2.1.1, negative electrode location hole 2.2.1 is offered at the center of described built-in cathode electrode 2.2, described built-in cathode electrode 2.2 is placed in negative electrode obturating cup 2.1, and negative electrode location hole 2.2.1 agrees with the negative electrode reference column 2.1.1 phase on negative electrode obturating cup 2.1.
In addition to the implementation, the present invention also includes other execution modes, the technical scheme that all employing equivalents or equivalent substitute mode are formed, within the protection range that all should fall into the claims in the present invention.
Claims (3)
1. a replaceable built-in electrode ceramic package, include the ceramic base (1) and upper cover (2) that can mutually cover together, it is characterized in that: described ceramic base (1) includes anode flange (1.1), porcelain ring (1.2), anode seal bowl (1.3), gate lead pipe (1.4) and built-in anode electrode (1.5); Described anode flange (1.1) is welded in the upper surface of porcelain ring (1.2) with one heart, described anode seal bowl (1.3) is welded in the lower surface of porcelain ring (1.3) with one heart, the superimposed concentric welding from top to bottom of described anode flange (1.1), porcelain ring (1.2) and anode seal bowl (1.3), described gate lead pipe (1.4) is connected on the shell wall of porcelain ring (1.2), and described built-in anode electrode (1.5) is placed in anode seal bowl (1.3);
Described upper cover (2) includes negative electrode obturating cup (2.1) and built-in cathode electrode (2.2), and described built-in cathode electrode (2.2) is placed in negative electrode obturating cup (2.1).
2. the replaceable built-in electrode ceramic package of one according to claim 1, is characterized in that: be respectively arranged with at the center of described anode seal bowl (1.3) and built-in anode electrode (1.5) the anode reference column (1.3.1) and anode location hole (1.5.1) that mutually agree with.
3. the replaceable built-in electrode ceramic package of one according to claim 1 and 2, is characterized in that: be respectively arranged with at the center of described negative electrode obturating cup (2.1) and built-in cathode electrode (2.2) the negative electrode reference column (2.1.1) and negative electrode location hole (2.2.1) that mutually agree with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510879344.9A CN105448849A (en) | 2015-12-05 | 2015-12-05 | Ceramic package housing with replaceable internal electrodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510879344.9A CN105448849A (en) | 2015-12-05 | 2015-12-05 | Ceramic package housing with replaceable internal electrodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105448849A true CN105448849A (en) | 2016-03-30 |
Family
ID=55558886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510879344.9A Pending CN105448849A (en) | 2015-12-05 | 2015-12-05 | Ceramic package housing with replaceable internal electrodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105448849A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783749A (en) * | 2016-12-15 | 2017-05-31 | 江阴市赛英电子股份有限公司 | A kind of super large-scale ceramic package structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340916A (en) * | 1997-06-05 | 1998-12-22 | Toshiba Corp | Press-contact type semiconductor device |
| CN201725786U (en) * | 2010-06-24 | 2011-01-26 | 江阴市赛英电子有限公司 | Panel reverse ceramic outer casing |
| US20150102481A1 (en) * | 2013-10-15 | 2015-04-16 | Ixys Corporation | Sintered backside shim in a press pack cassette |
| CN205303441U (en) * | 2015-12-05 | 2016-06-08 | 江阴市赛英电子股份有限公司 | Can replace built -in electrode ceramic encapsulation shell |
-
2015
- 2015-12-05 CN CN201510879344.9A patent/CN105448849A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10340916A (en) * | 1997-06-05 | 1998-12-22 | Toshiba Corp | Press-contact type semiconductor device |
| CN201725786U (en) * | 2010-06-24 | 2011-01-26 | 江阴市赛英电子有限公司 | Panel reverse ceramic outer casing |
| US20150102481A1 (en) * | 2013-10-15 | 2015-04-16 | Ixys Corporation | Sintered backside shim in a press pack cassette |
| CN205303441U (en) * | 2015-12-05 | 2016-06-08 | 江阴市赛英电子股份有限公司 | Can replace built -in electrode ceramic encapsulation shell |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783749A (en) * | 2016-12-15 | 2017-05-31 | 江阴市赛英电子股份有限公司 | A kind of super large-scale ceramic package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: South Gate Street: 214405 Jiangyin Road, Jiangsu city of Wuxi Province, No. 60 Applicant after: JIANGYIN SAIYING ELECTRON CO., LTD. Address before: South Gate Street: 214405 Jiangyin Road, Jiangsu city of Wuxi Province, No. 60 Applicant before: Jiangyin Saiying Electron Co., Ltd. |
|
| COR | Change of bibliographic data | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160330 |