CN201708190U - LED lead frame and LED lamp comprising LED lead frame - Google Patents
LED lead frame and LED lamp comprising LED lead frame Download PDFInfo
- Publication number
- CN201708190U CN201708190U CN201020235012XU CN201020235012U CN201708190U CN 201708190 U CN201708190 U CN 201708190U CN 201020235012X U CN201020235012X U CN 201020235012XU CN 201020235012 U CN201020235012 U CN 201020235012U CN 201708190 U CN201708190 U CN 201708190U
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- CN
- China
- Prior art keywords
- lead frame
- led
- light
- reflector
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model applies to the LED packaging field, and provides a LED lead frame and a LED lamp comprising the LED lead frame. The LED lead frame comprises a lead frame metal electrode, a light emitting diode and a protective diode used for the static protection upon the light emitting diode, wherein the light-emitting diode and the protective diode are electrically connected with the lead frame metal electrode via a bonding wire, the LED lead frame also comprises at least two reflective cups, the light-emitting diode and the protective diode are located in different cups. The lead frame is advantaged by eliminating absorption of light by protective diode, improving light intensity of LED product and eliminating phenomenon of asymmetrical spatial distribution of product light intensity.
Description
Technical field
The utility model belongs to the LED encapsulation field, relates in particular to a kind of LED lead frame and comprises the LED lamp of this lead frame.
Background technology
LED is the photoelectric device that semi-conducting material is made, it is with remarkable advantages such as efficient, energy-saving and environmental protection, long-life, easy cares, become one of technical field of tool development prospect in recent years, become the significant leap again after incandescent lamp, fluorescent lamp on the human illumination history, will breed and expedite the emergence of new light source revolution.Because LED is an electrostatic sensitivity device; when it is applied in the high-end field; the diode (being designated hereinafter simply as the protection diode) that needs to add Zener diode or play pressure stabilization function is done electrostatic protection (as Fig. 2) to light-emitting diode, can promote the antistatic property of integral product like this.In traditional LED lead frame; light-emitting diode 1 is arranged on (as Fig. 1) in the same reflector with protection diode 2; can influence the optical characteristics of LED like this; comprise the reduction of the product light intensity that causes because of the light absorption of protection diode, and the asymmetric phenomenon of spatial distribution that the product light intensity occurs.
The utility model content
The purpose of the utility model embodiment is to provide a kind of LED lead frame, and it is low to be intended to solve the LED product light intensity that is caused by the protection diode in the existing LED lead frame, and the asymmetric problem of the spatial distribution of light intensity.
The utility model embodiment realizes like this; a kind of LED lead frame; comprise lead frame metal electrode, light-emitting diode; and the protection diode that is used for described light-emitting diode is done electrostatic protection; described light-emitting diode and protection diode are electrically connected with described lead frame metal electrode by bonding line; described LED lead frame also comprises at least two reflectors, and described light-emitting diode is arranged in different reflectors with the protection diode.
According to optimal technical scheme of the present utility model:
Described reflector comprises first reflector and second reflector; Described first reflector and second reflector all are positioned at the front of described lead frame metal electrode.
Described reflector comprises first reflector and second reflector; Described first reflector and second reflector lay respectively at the front and back of described lead frame metal electrode; Described light-emitting diode is positioned at described first reflector, and described protection diode is positioned at described second reflector.
Another purpose of the utility model embodiment is to provide a kind of LED lamp, and described LED lamp comprises above-mentioned LED lead frame.
The utility model embodiment will protect diode and light-emitting diode to be separately positioned in the different reflectors; avoided because the product light intensity that the absorption of the light that protection diode pair light-emitting diode sends causes reduces, and the asymmetric phenomenon of light intensity spatial distribution.This lead frame can make the light intensity of product promote 5～10%.
Description of drawings
Fig. 1 is the vertical view of existing LED lead frame;
Fig. 2 is a connection diagram of protecting diode and light-emitting diode in the existing LED lead frame;
Fig. 3 is the vertical view of the LED lead frame that provides of the utility model first embodiment;
Fig. 4 is the vertical view of the LED lead frame that provides of the utility model first embodiment;
Fig. 5 is the profile of the LED lead frame that provides of the utility model second embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model embodiment will protect diode and light-emitting diode to be separately positioned in the different reflectors, avoid the absorption of protection diode pair light, and then increase the light intensity of product, and avoid the asymmetric phenomenon of light intensity spatial distribution.
The utility model embodiment provides a kind of LED lead frame; comprise lead frame metal electrode, light-emitting diode; and the protection diode that is used for light-emitting diode is done electrostatic protection; light-emitting diode and protection diode are electrically connected with the lead frame metal electrode by bonding line; the LED lead frame also comprises at least two reflectors, and light-emitting diode is arranged in different reflectors with the protection diode.
The utility model embodiment also provides a kind of LED lamp, and this LED lamp comprises above-mentioned LED lead frame.
The utility model embodiment will protect diode and light-emitting diode to be separately positioned in the different reflectors; avoided the absorption of protection diode pair light that light-emitting diode sends; improve the light intensity of LED product, and eliminated the asymmetric phenomenon of product light intensity spatial distribution.
Below in conjunction with specific embodiment specific implementation of the present utility model is described in detail:
Embodiment one:
Fig. 3 and Fig. 4 show the vertical view of the LED lead frame that the utility model first embodiment provides, and for convenience of explanation, only show the part relevant with the utility model embodiment.
In this LED lead frame, lead frame metal electrode 5 and lead frame and plastic 9 have constituted led support.Light-emitting diode 1 is fixed on the lead frame metal electrode 5, realizes being electrically connected with lead frame metal electrode 5 by first bonding line 3.The light that light-emitting diode 1 sends excites the light-emitting phosphor in the packaging plastic 8 after 6 reflections of first reflector.Protection diode 2 is arranged in second reflector 7, realizes being electrically connected with lead frame metal electrode 5 by second bonding line 4, is used for light-emitting diode 1 is done electrostatic protection.Because two electrodes of light-emitting diode 1 can be adjusted with the polarity of protection diode 2, therefore in use, protection diode 2 can be fixed on the same utmost point or different poles of lead frame metal electrode 5 with light-emitting diode 1.
The making of this lead frame can adopt existing lead frame to make flow process; comprise the punching press of metal tablet, plating, injection mo(u)lding, cut-out bent angle; difference is in the time of insert-molded leadframe frame plastic cement (injection mo(u)lding); form two or more reflectors by Mould design, be used for protection diode and light-emitting diode placed apart.
This lead frame use and the use of existing lead frame similar; through operations such as pre-treatment, solid crystalline substance, bonding wire, encapsulating, testing, sorting, packings; difference is that solid crystalline substance, bonding wire, these three operations of encapsulating are done twice; i.e. fixing light-emitting diode 1 in first reflector 6; fixing protection diode 2 in second reflector 7; carry out bonding wire and encapsulating more respectively, carry out subsequent operation then.
Light-emitting diode 1 and protection diode 2 are arranged in two reflectors that are separated from each other, can avoid protecting diode 2 to absorb the light that light-emitting diode 1 sends, avoid the reduction of product light intensity, and the asymmetric phenomenon of light intensity spatial distribution.
Embodiment two:
Fig. 5 shows the profile of a kind of LED lead frame that the utility model second embodiment provides, and for convenience of explanation, the part relevant with the utility model embodiment only is shown.
Described with above-mentioned embodiment one, the utility model embodiment is arranged on light-emitting diode 1 in two different reflectors with protection diode 2 equally.But; when first reflector 6 and second reflector 7 all are positioned at lead frame metal electrode 5 positive; second reflector 7 can occupy a part of area of the positive light-emitting area of LED product; light-emitting area is reduced; therefore; in the utility model embodiment; first reflector 6 and second reflector 7 are separately positioned on the front and back of lead frame metal electrode; light-emitting diode 1 places in first reflector 6; protection diode 2 places in second reflector 7; so still, can solve the product light intensity that is caused by protection diode 2 reduces; and the asymmetric problem of light distribution, and can avoid because the phenomenon that the design of second reflector 7 reduces the product light-emitting area.
The making of this lead frame can adopt existing lead frame to make flow process, comprise the punching press of metal tablet, plating, injection mo(u)lding, cut-out bent angle, difference is in the time of insert-molded leadframe frame plastic cement, form two or more reflectors by Mould design, and the design attitude and the size of reflector are adjusted.
This lead frame use and the use of existing lead frame similar; through operations such as pre-treatment, solid crystalline substance, bonding wire, encapsulating, testing, sorting, packings; difference is that solid crystalline substance, bonding wire, these three operations of encapsulating are done twice; i.e. fixing light-emitting diode 1 in first reflector 6 on these lead frame metal electrode 5 tops; fixing protection diode 2 in second reflector 7 of these lead frame metal electrode 5 bottoms; carry out bonding wire and encapsulating more respectively, carry out subsequent operation then.
The utility model embodiment will protect diode and light-emitting diode to be separately positioned in the different reflectors; avoided the absorption of the light that protection diode pair light-emitting diode sends; improve the light intensity of LED product, and eliminated the asymmetric phenomenon of product light intensity spatial distribution.Second reflector is arranged on the back side of lead frame metal electrode, can avoids because the phenomenon that the design of second reflector reduces the product light-emitting area.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (4)
1. LED lead frame; comprise lead frame metal electrode, light-emitting diode; and the protection diode that is used for described light-emitting diode is done electrostatic protection; described light-emitting diode and protection diode are electrically connected with described lead frame metal electrode by bonding line; it is characterized in that; described LED lead frame also comprises at least two reflectors, and described light-emitting diode is arranged in different reflectors with the protection diode.
2. LED lead frame as claimed in claim 1 is characterized in that, described reflector comprises first reflector and second reflector; Described first reflector and second reflector all are positioned at the front of described lead frame metal electrode.
3. LED lead frame as claimed in claim 1 is characterized in that, described reflector comprises first reflector and second reflector; Described first reflector and second reflector lay respectively at the front and back of described lead frame metal electrode; Described light-emitting diode is positioned at described first reflector, and described protection diode is positioned at described second reflector.
4. a LED lamp is characterized in that, described LED lamp comprises each described LED lead frame of claim 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020235012XU CN201708190U (en) | 2010-06-22 | 2010-06-22 | LED lead frame and LED lamp comprising LED lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020235012XU CN201708190U (en) | 2010-06-22 | 2010-06-22 | LED lead frame and LED lamp comprising LED lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201708190U true CN201708190U (en) | 2011-01-12 |
Family
ID=43445344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020235012XU Expired - Fee Related CN201708190U (en) | 2010-06-22 | 2010-06-22 | LED lead frame and LED lamp comprising LED lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201708190U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117354A (en) * | 2012-12-31 | 2013-05-22 | 安徽问天量子科技股份有限公司 | Light-emitting diode (LED) lamp bead with built-in protection chip |
-
2010
- 2010-06-22 CN CN201020235012XU patent/CN201708190U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117354A (en) * | 2012-12-31 | 2013-05-22 | 安徽问天量子科技股份有限公司 | Light-emitting diode (LED) lamp bead with built-in protection chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NINGBO RUIKANG PHOTOELECTRONICS CO., LTD. Free format text: FORMER OWNER: SHENZHEN REFOND OPTOELECTRONICS CO., LTD. Effective date: 20120121 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 315000 NINGBO, ZHEJIANG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120121 Address after: 315000 No. 669 Jin Yuan Road, Yinzhou District, Zhejiang, Ningbo (Yinzhou investment Pioneer Center) Patentee after: Ningbo Ruikang Photoelectric Co., Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20180622 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |