CN201681883U - Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures - Google Patents
Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures Download PDFInfo
- Publication number
- CN201681883U CN201681883U CN2010201806084U CN201020180608U CN201681883U CN 201681883 U CN201681883 U CN 201681883U CN 2010201806084 U CN2010201806084 U CN 2010201806084U CN 201020180608 U CN201020180608 U CN 201020180608U CN 201681883 U CN201681883 U CN 201681883U
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- Prior art keywords
- pin
- dao
- island
- base
- lead
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to base-island exposing type and multi-protruding-point base-island exposing lead frame structures, which comprise base islands (1) and lead pins (2). Two sets of base islands (1) are provided; one set is a first base island (1.1), and the other set is a second base island (1.2); the central area of the second base island (1.2) sinks; a plurality of lead pins (2); the front surfaces of a first base island (1.1) and the lead pins (2) are provided with a first metal layer (4); the back surface of the first base island (1.1), the second base island (1.2) and the lead pins (2) is provided with a second metal layer (5). Packless plastic materials (3) are embedded in the area at the outer periphery of the lead pins (2), the area between the lead pins (2) and the first base island (1.1), the area between the second base island (1.2) and the lead pins (2) and the area between the lead pin (2) and the lead pin (2), and lead the backside size of the base island and the pins to be smaller than the frontside size of the base island and the pins to form the base island and the lead-pins structure with a larger upper part and a smaller lower part. The benefits are as follows: the binding capacity of the plastic body and the metal pins is large.
Description
(1) technical field
The utility model relates to a kind of base island exposed type and sinks base island exposed type multi-turn pin lead frame structure.Belong to the semiconductor packaging field.
(2) background technology
Traditional lead frame structure mainly contains two kinds:
First kind:
After chemical etching and surface electrical coating are carried out in the front of employing metal substrate, stick the resistant to elevated temperatures glued membrane of one deck at the back side of metal substrate and form the leadframe carrier (as shown in Figure 2) that to carry out encapsulation process.
Second kind:
After chemical etching and surface electrical coating are carried out in the front of employing metal substrate, promptly finish the making (as shown in Figure 3) of lead frame.Back etched is then carried out at the back side of lead frame again in encapsulation process.
And the not enough point of two kinds of above-mentioned lead frames below in encapsulation process, having existed:
First kind:
1) but the lead frame of this kind must stick the glued membrane of one deck costliness high temperature resistance because of the back side.So directly increased high cost.
2) but also because the glued membrane of one deck high temperature resistance must be sticked in the back side of the lead frame of this kind, so the load technology in encapsulation process can only be used conduction or nonconducting resin technology, and the technology that can not adopt eutectic technology and slicken solder is fully carried out load, so selectable product category just has bigger limitation.
3) but again because the glued membrane of one deck high temperature resistance must be sticked in the back side of the lead frame of this kind, and in the ball bonding bonding technology in encapsulation process, because but the glued membrane of this high temperature resistance is a soft materials, so caused the instability of ball bonding bonding parameter, seriously influenced the quality of ball bonding and the stability of production reliability.
4) but again because the glued membrane of one deck high temperature resistance must be sticked in the back side of the lead frame of this kind, and the plastic package process process in encapsulation process, because the high pressure of plastic packaging relation is easy to cause between lead frame and the glued membrane and infiltrates plastic packaging material, be that the kenel of conduction has become insulation pin (as shown in Figure 4) on the contrary because of having infiltrated plastic packaging material and will formerly should belong to metal leg.
Second kind:
The lead frame structure of this kind has carried out etching partially technology in the metal substrate front, though can solve the problem of first kind of lead frame, but because only carried out the work that etches partially in the metal substrate front, and plastic packaging material only envelopes the height of half pin in the plastic packaging process, so the constraint ability of plastic-sealed body and metal leg has just diminished, when if the plastic-sealed body paster is not fine to pcb board, does over again again and heavily paste, with regard to the problem (as shown in Figure 5) that is easy to generate pin.
Especially the kind of plastic packaging material is to adopt when filler is arranged, because material is at the environment and the follow-up surface-pasted stress changing relation of production process, can cause metal and plastic packaging material to produce the crack of vertical-type, its characteristic is the high more then hard more crisp more crack that is easy to generate more of proportion of filler.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of and reduces that packaging cost, selectable product category are wide, the big base island exposed type and the base island exposed type multi-turn pin lead frame structure of sinking of constraint ability of good stability, plastic-sealed body and the metal leg of the quality of ball bonding and production reliability.
(3) summary of the invention
The purpose of this utility model is achieved in that a kind of base island exposed type and sinks base island exposed type multi-turn pin lead frame structure, comprise Ji Dao and pin, described Ji Dao has two groups, one group is first Ji Dao, another group is second Ji Dao, the described second basic island middle section sinks, front at described first Ji Dao and pin is provided with the first metal layer, at described first Ji Dao, the back side of second Ji Dao and pin is provided with second metal level, described pin has multi-turn, zone in described pin periphery, zone between the pin and the first basic island, zone between first Ji Dao and the second basic island, zone between zone between second Ji Dao and the pin and pin and the pin is equipped with packless plastic packaging material, described packless plastic packaging material is with periphery, pin bottom, the pin and the first Ji Dao bottom, first Ji Dao and the second Ji Dao bottom, second Ji Dao and pin bottom and pin and pin bottom link into an integrated entity, and make described Ji Dao and pin back side size less than Ji Dao and the positive size of pin, form up big and down small Ji Dao and pin configuration.
The beneficial effects of the utility model are:
1) but the glued membrane of one deck costliness high temperature resistance need not sticked in the back side of the lead frame of this kind.So directly reduced high cost.
2) but because the glued membrane of one deck high temperature resistance need not sticked in the back side of the lead frame of this kind yet, so the load technology in encapsulation process is except using conduction or nonconducting resin technology, can also adopt the technology of eutectic technology and slicken solder to carry out load, so selectable product category is just wide.
3) but again because the glued membrane of one deck high temperature resistance need not sticked in the back side of the lead frame of this kind, guaranteed the stability of ball bonding bonding parameter, guaranteed the quality of ball bonding and the stability of production reliability.
4) but again because the lead frame of this kind need not stick the glued membrane of one deck high temperature resistance, and the plastic package process process in encapsulation process can not cause between lead frame and the glued membrane fully and infiltrate plastic packaging material.
5) because the zone between described metal leg (pin) and metal leg is equipped with packless soft gap filler, this packless soft gap filler has the filler plastic packaging material to envelope the height of whole metal leg with the routine in the plastic packaging process, so the constraint ability of plastic-sealed body and metal leg just becomes big, do not have the problem that produces pin again.
6) owing to adopted positive method of separating the etching operation with the back side, so in the etching operation, can form the slightly little and big slightly structure of positive basic island size of the size of back side Ji Dao, and slided by the tighter more difficult generation that packless plastic packaging material coated and falling pin with the size that varies in size up and down of a Ji Dao.
(4) description of drawings
Fig. 1 is the base island exposed type of the utility model and the base island exposed type multi-turn pin lead frame structure schematic diagram that sinks.
Fig. 2 was for sticked the resistant to elevated temperatures glued membrane figure of one deck operation in the past at the back side of metal substrate.
Fig. 3 was for to adopt the front of metal substrate to carry out chemical etching and surface electrical coating flow diagram in the past.
Fig. 4 was for formed insulation pin schematic diagram in the past.
Fig. 5 pin figure for what formed in the past.
Reference numeral among the figure:
1.1, the second basic island 1.2,1, the first basic island, base island, pin 2, packless plastic packaging material 3, the first metal layer 4, second metal level 5.
(5) embodiment
Referring to Fig. 1, Fig. 1 is the base island exposed type of the utility model and the base island exposed type multi-turn pin lead frame structure schematic diagram that sinks.As seen from Figure 1, the base island exposed type of the utility model and the base island exposed type multi-turn pin lead frame structure of sinking, comprise basic island 1 and pin 2, described basic island 1 has two groups, one group is the first basic island 1.1, another group is the second basic island 1.2, the described second basic island 1.2 middle sections sink, front at the described first basic island 1.1 and pin 2 is provided with the first metal layer 4, on the described first basic island 1.1, the back side of the second basic island 1.2 and pin 2 is provided with second metal level 5, described pin 2 has multi-turn, zone in described pin 2 peripheries, zone between the pin 2 and the first basic island 1.1, zone between the first basic island 1.1 and the second basic island 1.2, zone between the second basic island 1.2 and the pin 2 and the zone between pin 2 and the pin 2 are equipped with packless plastic packaging material 3, described packless plastic packaging material 3 is with periphery, pin bottom, pin 2 and 1.1 bottoms, the first basic island, the first basic island 1.1 and 1.2 bottoms, the second basic island, the second basic island 1.2 links into an integrated entity with pin 2 bottoms with pin 2 bottoms and pin 2, and make described Ji Dao back side size less than the positive size in basic island, form up big and down small basic island structure.
Claims (1)
1. a base island exposed type and the base island exposed type multi-turn pin lead frame structure of sinking, comprise Ji Dao (1) and pin (2), it is characterized in that: described Ji Dao (1) has two groups, one group is first Ji Dao (1.1), another group is second Ji Dao (1.2), described second Ji Dao (1.2) middle section sinks, described pin (2) has multi-turn, front at described first Ji Dao (1.1) and pin (2) is provided with the first metal layer (4), at described first Ji Dao (1.1), the back side of second Ji Dao (1.2) and pin (2) is provided with second metal level (5), in the peripheral zone of described pin (2), zone between pin (2) and first Ji Dao (1.1), zone between first Ji Dao (1.1) and second Ji Dao (1.2), zone between zone between second Ji Dao (1.2) and the pin (2) and pin (2) and the pin (2) is equipped with packless plastic packaging material (3), described packless plastic packaging material (3) is with periphery, pin bottom, pin (2) and first Ji Dao (1.1) bottom, first Ji Dao (1.1) and second Ji Dao (1.2) bottom, second Ji Dao (1.2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2), and make described Ji Dao (1) and pin (2) back side size less than Ji Dao (1) and the positive size of pin (2), form up big and down small Ji Dao and pin configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201806084U CN201681883U (en) | 2010-04-28 | 2010-04-28 | Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201806084U CN201681883U (en) | 2010-04-28 | 2010-04-28 | Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681883U true CN201681883U (en) | 2010-12-22 |
Family
ID=43346919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201806084U Expired - Lifetime CN201681883U (en) | 2010-04-28 | 2010-04-28 | Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681883U (en) |
-
2010
- 2010-04-28 CN CN2010201806084U patent/CN201681883U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170111 Address after: Tianjin free trade zone (Dongjiang Bonded Port) No. 6865 North Road, 1-1-1802-7 financial and trade center of Asia Patentee after: Xin Xin finance leasing (Tianjin) Co., Ltd. Address before: 214434 Binjiang Middle Road, Jiangyin Development Zone, Jiangsu, China, 275 Patentee before: Jiangsu Changdian Sci. & Tech. Co., Ltd. |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Changjiang Electronics Technology Co., Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320000152 Denomination of utility model: Base-island extruding and sinking base-island extruding multi-ring pins lead frame structures Granted publication date: 20101222 License type: Exclusive License Record date: 20170614 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320000152 Date of cancellation: 20200416 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101222 |