CN201673168U - Low stress micro-silicon resonance accelerometer - Google Patents

Low stress micro-silicon resonance accelerometer Download PDF

Info

Publication number
CN201673168U
CN201673168U CN201020208085XU CN201020208085U CN201673168U CN 201673168 U CN201673168 U CN 201673168U CN 201020208085X U CN201020208085X U CN 201020208085XU CN 201020208085 U CN201020208085 U CN 201020208085U CN 201673168 U CN201673168 U CN 201673168U
Authority
CN
China
Prior art keywords
resonator
stress
accelerometer
lever
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201020208085XU
Other languages
Chinese (zh)
Inventor
裘安萍
施芹
苏岩
朱欣华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing University of Science and Technology
Original Assignee
Nanjing University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing University of Science and Technology filed Critical Nanjing University of Science and Technology
Priority to CN201020208085XU priority Critical patent/CN201673168U/en
Application granted granted Critical
Publication of CN201673168U publication Critical patent/CN201673168U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Micromachines (AREA)

Abstract

The utility model discloses a low stress micro-silicon resonance accelerometer. A structure of the accelerometer is made on two layers of monocrystalline silicon. An accelerometer mechanical structure is made on the upper layer of monocrystalline silicon wafer. Metals are deposited on the upper surface of the mechanical structure to serve as a signal input/output line. The lower layer of monocrystalline silicon is a substrate of the accelerometer. The accelerometer mechanical structure consists of a mass block, an upper resonator, a lower resonator, two upper primary lever magnifying mechanisms, two lower primary lever magnifying mechanisms, a middle stress release frame, an upper stress release frame and a lower stress release frame. The upper resonator and the lower resonator are symmetrical and adjacent up and down and are positioned in the middle of the mass block. The lower end of the upper resonator and the upper end of the lower resonator are connected with a middle fixed base by the middle stress release frame. The utility model greatly reduces machining residual stress and thermal stress generated by temperature variation of the working environment and improves stability of resonance frequency of the resonators. The magnification factor of the lever magnifying mechanisms is close to an ideal value.

Description

Low-stress silicon micro resonance type accelerometer
Technical field
The utility model belongs to the micro-inertia sensor technology among the microelectromechanical systems MEMS, particularly a kind of low-stress silicon micro resonance type accelerometer.
Background technology
MEMS (micro electro mechanical system) (Micro-electro-mechanical Systems, be called for short MEMS) is the frontier nature high-tech sector of the development in recent years multidisciplinary intersection of getting up.MEMS utilizes the silicon micro-machining technology that grows up from semiconductor technology, it mainly is material with silicon, on silicon chip, produce size in micron dimension, the movable three-dimensional structure of suspension, realize information perception and control to external world, and can be integrated with signal Processing and control circuit, constitute a multi-functional microsystem.MEMS (micro electro mechanical system) has that volume is little, cost is low, reliability is high, be easy to characteristics such as batch process, can be widely used in all many-sides such as Aero-Space, military affairs, communication, biomedicine, is considered to one of emerging technology geared to the 21st century even dominant technology.
Silicon micro accerometer is the typical MEMS inertial sensor, and its research starts from early 1970s, various ways such as existing condenser type, piezoelectric type, pressure resistance type, thermal convection, tunnel current formula and resonant mode.The unique features of silicon micro-resonance type accelerometer is that its output signal is a frequency signal, its accurate digital quantity output can be directly used in complicated digital circuit, has very high antijamming capability and stability, and removed the inconvenience of other type accelerometer aspect the signal transmission from, directly link to each other with digital processing unit.
At present, silicon micro-resonance type accelerometer generally is made up of resonance beam and responsive mass, and acceleration is converted to inertial force through responsive mass, and inertial force acts on the axial of resonance beam, the frequency of resonance beam is changed, extrapolate by measuring acceleration by the test resonance frequency.
2006, the Fan Shang of the BJ University of Aeronautics ﹠ Astronautics spring etc. in the past resonance type accelerometer propose a kind of new resonance type accelerometer (Fan Shangchun, benevolence outstanding person. a kind of resonance type micromechanical accelerometer, BJ University of Aeronautics ﹠ Astronautics, CN1844931A).This structure is made up of mass, brace summer, tuning fork and mechanics amplification system, and tuning fork is positioned at the centre of mass, and adjacent up and down symmetric arrangement, overcome the inhomogeneous and environment temperature of material to the device influence the big and not high shortcoming of mass utilization factor.But the mass of this structure supports by being positioned at its two middle brace summers, and then the stability of accelerometer and impact resistance are relatively poor.In addition, the support beam structure form of this structure is a semi-girder, and its ability that discharges unrelieved stress is relatively poor.
2008, the Qiu An of Institutes Of Technology Of Nanjing duckweed etc. discloses a kind of silicon micro-resonance type accelerometer (Qiu Anping, Shi Qin, Su Yan. silicon micro-resonance type accelerometer, Institutes Of Technology Of Nanjing, application number: 2008100255749), this structure is by silicon and glass is two-layer constitutes, physical construction is produced on the monocrystalline silicon piece, and glass is as substrate.Physical construction is made up of mass, resonator and lever enlarger etc., resonator is positioned in the middle of the mass, adjacent symmetric is arranged, mass supports by being positioned at its folded beam of four jiaos, this structure has overcome preferably that material is inhomogeneous, temperature is to the big shortcoming of device influence, has improved stability of structure and impact resistance.The two-layer material of this structure is respectively silicon and glass, both thermal expansivity do not wait, the resonance beam of this structure, lever directly link to each other with fixed pedestal simultaneously, thereby the thermal stress that forming residual stress and operating ambient temperature variation produce greatly, and the frequency stability of resonance type accelerometer is poor.The resonator of this structure has adopted the pectination broach, and the edge effect of pectination broach has reduced the linearity of resonator vibrates, thereby has reduced frequency stability.In addition, the folded beam of the support mass of this structure is three folding beams, has increased the intersecting axle sensitivity of structure.
Summary of the invention
The purpose of this utility model is to provide the silicon micro-resonance type accelerometer of a kind of low stress, high frequency stability, low intersecting axle sensitivity, strong shock resistance.
The technical solution that realizes the utility model purpose is: a kind of low-stress silicon micro resonance type accelerometer, arrangements of accelerometers is produced on the two-layer monocrystalline silicon, on the monocrystalline silicon piece of upper strata, make accelerometer physical construction, at the upper surface depositing metal of physical construction as the signal input/output line, lower floor's monocrystalline silicon is the substrate of accelerometer, accelerometer physical construction is by mass, last resonator, following resonator, two upper end one-level lever enlargers, two lower end one-level lever enlargers, intermediate stress discharges framework, upper end stress relief framework and lower end stress relief frame are formed, last resonator and following resonator be the adjacent centre that is positioned at mass of symmetry up and down, and the upper end of the lower end of last resonator and following resonator discharges framework by intermediate stress and links to each other with the center fixed pedestal; The upper end of last resonator is connected with the output terminal of two upper end one-level regulations and parameters enlargers respectively, upper end one-level regulations and parameters enlarger support end with link to each other with last fixed pedestal by upper end stress relief framework, the lower end of following resonator is connected with the output terminal of two lower end one-level regulations and parameters enlargers respectively, lower end one-level regulations and parameters enlarger support end link to each other with following fixed pedestal by lower end stress relief framework; The input end of upper and lower side one-level regulations and parameters enlarger is connected with mass respectively; Mass links to each other with four fixed pedestals that are positioned at four jiaos of masses respectively by four U type beams, and all fixed pedestals are installed on the fixed pedestal bonding point of lower floor's monocrystalline silicon, makes the physical construction part on upper strata unsettled on the monocrystalline substrate part of lower floor.
The utility model compared with prior art, its remarkable advantage: the structural sheet and the substrate layer of (1) this accelerometer have all adopted monocrystalline silicon, resonator all passes through the stress relief framework with one-level lever enlarger and links to each other with fixed pedestal, and the resonance beam of resonator links to each other with the stress relief framework by contiguous block, these several modes have reduced forming residual stress greatly and operating ambient temperature changes the thermal stress that produces, improved the stability of resonator resonance frequency, and the enlargement factor of lever enlarger is near ideal value; (2) support end of one-level lever enlarger, input end and output terminal have all adopted thin beam structure, thereby the axial tension rigidity of support end and output terminal is very big and bending stiffness is very little, and the axial and lever shaft of the thin beam of support end has been realized the theoretical value of enlargement factor near traditional lever enlarger to vertical mutually; (3) version of the drive electrode of resonator and detecting electrode has all adopted plate electrode, has reduced the electric field edge effect greatly, has improved the linearity of resonance beam vibration, has improved frequency stability; (4) mass links to each other with its fixed pedestal of four jiaos by rotational symmetry U type beam, rotational symmetry U type beam can not only discharge unrelieved stress effectively, also reduced the intersecting axle sensitivity of accelerometer, the brace summer of mass is arranged in its four jiaos of impact resistances that improve arrangements of accelerometers.
Below in conjunction with accompanying drawing the utility model is described in further detail.
Description of drawings
Fig. 1 is the structural representation of low-stress silicon micro resonance type accelerometer of the present utility model.
Fig. 2 is the structural representation of the enlarger of one-level lever of the present utility model.
Fig. 3 is the structural representation of resonator of the present utility model.
Embodiment
In conjunction with Fig. 1, the utility model low-stress silicon micro resonance type accelerometer, arrangements of accelerometers is produced on the two-layer monocrystalline silicon, on the monocrystalline silicon piece of upper strata, make accelerometer physical construction, at the upper surface depositing metal of physical construction as the signal input/output line, lower floor's monocrystalline silicon is the substrate of accelerometer, accelerometer physical construction is by mass 1, last resonator 2a, following resonator 2b, two upper end one- level lever enlarger 3a, 3b, two lower end one- level lever enlarger 3c, 3d, intermediate stress discharges framework 5a, upper end stress relief framework 5b and lower end stress relief frame 5c form, and the structure of four one-level levers of upper and lower side enlarger is in full accord.Last resonator 2a and following resonator 2b be the adjacent centre that is positioned at mass of symmetry up and down, can reduce the asymmetric of the inhomogeneous and processing generation of material, thereby the structural parameters high conformity of resonator 2a, 2b is up and down realized the differential output of resonance frequency effectively.The upper end of the lower end of last resonator 2a and following resonator 2b discharges framework 5a by intermediate stress and links to each other with center fixed pedestal 4a, and the fixed pedestal 4a of middle stress relief framework 5a and centre is between last resonator 2a and following resonator 2b.Stress relief framework 5a can discharge forming residual stress, reduces operating ambient temperature simultaneously and changes the thermal stress that produces.The upper end of last resonator 2a is connected with output terminal 11a, the 11b of two upper end one-level regulations and parameters enlarger 3a, 3b respectively, support end 9a, the 9b of 3a, the 3b of upper end one-level regulations and parameters enlarger with link to each other with last fixed pedestal 4b by upper end stress relief framework 5b, the lower end of following resonator 2b is connected with output terminal 11c, the 11d of two lower end one-level regulations and parameters enlarger 3c, 3d respectively, and support end 9c, the 9d of 3c, the 3d of lower end one-level regulations and parameters enlarger links to each other with following fixed pedestal 4c by lower end stress relief framework 5c; Upper and lower side one-level regulations and parameters enlarger 3a, 3b, 3c, input end 10a, the 10b of 3d, 10c, 10d are connected with mass 1 respectively; Mass 1 links to each other with four fixed pedestal 7a, 7b, 7c, 7d that are positioned at 1 four jiaos of masses respectively by four U type beam 6a, 6b, 6c, 6d, all fixed pedestal 4a, 4b, 4c, 7a, 7b, 7c, 7d are installed on the fixed pedestal bonding point of lower floor's monocrystalline silicon, make the physical construction part on upper strata unsettled on the monocrystalline substrate part of lower floor.Wherein, four U type beam 6a, 6b, 6c, 6d and fixed pedestal 7a, 7b, 7c, 7d are positioned on four angles of mass 1, increased the stability of accelerometer, and improve its impact resistance, and axisymmetric U type beam 6a, 6b, 6c, 6d not only discharge unrelieved stress effectively, reduce intersecting axle sensitivity.Each four U type beam 6a, 6b, 6c, 6d are axially symmetric structures.
In conjunction with Fig. 2, the upper and lower side one-level lever enlarger 3a of the utility model low-stress silicon micro resonance type accelerometer, 3b, 3c, 3d is by lever 8a, 8b, 8c, 8d, support end 9a, 9b, 9c, 9d input end 10a, 10b, 10c, 10d and output terminal 11a, 11b, 11c, 11d forms, support end 9a, 9b, 9c, 9d and input end 10a, 10b, 10c, 10d is positioned at lever 8a, 8b, 8c, the upper end of 8d, and output terminal 11a, 11b, 11c, 11d is positioned at lever 8a, 8b, 8c, the lower end of 8d, support end 9a, 9b, 9c, 9d, input end 10a, 10b, 10c, 10d and output terminal 11a, 11b, 11c, 11d has adopted thin beam structure, and support end 9a, 9b, 9c, axial and the lever 8a of 9d, 8b, 8c, 8d's is axially vertical mutually.For little lever, when the axial tension rigidity of support end and output terminal big more, and the bending stiffness of fulcrum beam and output terminal more hour, the enlargement factor of lever just can be near ideal value, therefore support end 9a, output terminal 11a and input end 10a all adopt thin beam structure, when being 40 μ m as the lever width, thin beam width is 6 μ m * 80 μ m.The support end of lever enlarger has also reduced the influence of stress to the lever enlargement factor greatly when being thin beam.The thin beam 9a's of support end is axially axially mutual vertical with lever 8a, and this also makes the enlargement factor of lever near ideal value.
In conjunction with Fig. 3, each resonator 2a of the utility model low-stress silicon micro resonance type accelerometer, 2b is by two resonance beam 12a, 12b, two float electrode 13a, 13b, two fixed drive electrode 14a, 14b, four fixed test electrode 15a, 15b, 15c, 15d and two contiguous blocks 16,17 form, two resonance beam 12a, 12b is arranged side by side and the contiguous block 16 by its two ends, 17 groups together, contiguous block 16 link to each other with corresponding one-level lever enlarger (as above resonator 2a contiguous block 16 and upper end one- level lever enlarger 3a, 3b connects, and another contiguous block 16 discharges framework 5a with intermediate stress and is connected; The contiguous block of last resonator 2b is connected with lower end one- level lever enlarger 3c, 3d, another contiguous block discharges framework 5a with intermediate stress and is connected), another contiguous block 17 discharges framework 5a by intermediate stress and links to each other with center fixed pedestal 4a, and this another contiguous block 17 and middle stress relief framework 5a can reduce the influence of unrelieved stress to resonance beam 12a, 12b greatly.The outside of two resonance beam 12a, 12b respectively connects float electrode 13a, a 13b, the outside of two float electrode 13a, 13b respectively is provided with fixed drive electrode 14a, a 14b, form and drive electric capacity, four fixed test electrode 15a, 15b, 15c, 15d are separately positioned between float electrode 13a, 13b and resonance beam 12a, the 12b, and float electrode 13a, 13b and fixed test electrode 15a, 15b, 15c, 15d form detection electric capacity.Resonator has adopted bilateral driving, on left fixed drive electrode 14a, apply the alternating voltage of band direct current biasing, on right fixed drive electrode 14b, apply the anti-phase alternating voltage of band direct current biasing, thereby the operation mode of having guaranteed resonance beam 12a, 12b is a vibrate in opposite phase mode.Float electrode 13a, the 13b, fixed drive electrode 14a, 14b and fixed test electrode 15a, 15b, 15c, the 15d that go up resonator 2a, 2b down are plate electrode.
Low-stress silicon micro resonance type accelerometer of the present utility model is used to measure the input acceleration of y direction, when the acceleration a along the y direction imports, on mass, produce inertial force F=-ma, this inertial force acts on respectively on four one-level lever enlargers, under the effect that lever amplifies, the acting force that acts on every resonance beam of resonator is
F B = - Ama 4
In the formula, A is the enlargement factor of one-level lever enlarger.Wherein going up the power that resonator is subjected to is pressure, and resonance frequency reduces, and the power that is subjected to of resonator is pulling force down, and resonance frequency increases, and the difference on the frequency of two resonators is
Δf=2f 0κAma
In the formula, κ is the constant with the resonant beam structure parameter correlation.As seen, the difference on the frequency of resonator is directly proportional with input acceleration up and down, by detecting the difference on the frequency of resonator up and down, then measures input acceleration.

Claims (5)

1. low-stress silicon micro resonance type accelerometer, it is characterized in that: arrangements of accelerometers is produced on the two-layer monocrystalline silicon, on the monocrystalline silicon piece of upper strata, make accelerometer physical construction, at the upper surface depositing metal of physical construction as the signal input/output line, lower floor's monocrystalline silicon is the substrate of accelerometer, accelerometer physical construction is by mass [1], last resonator [2a], following resonator [2b], two upper end one-level lever enlarger [3a, 3b], two lower end one-level lever enlarger [3c, 3d], intermediate stress discharges framework [5a], upper end stress relief framework [5b] and lower end stress relief frame [5c] are formed, the symmetrical up and down adjacent centre that is positioned at mass of last resonator [2a] and following resonator [2b], the upper end of the lower end of last resonator [2a] and following resonator [2b] discharge framework [5a] by intermediate stress and link to each other with center fixed pedestal [4a]; The upper end of last resonator [2a] is connected with the output terminal [11a, 11b] of two upper end one-level regulations and parameters enlargers [3a, 3b] respectively, the support end [9a, 9b] of [3a, the 3b] of upper end one-level regulations and parameters enlarger with link to each other with last fixed pedestal [4b] by upper end stress relief framework [5b], the lower end of following resonator [2b] is connected with the output terminal [11c, 11d] of two lower end one-level regulations and parameters enlargers [3c, 3d] respectively, and the support end [9c, 9d] of [3c, the 3d] of lower end one-level regulations and parameters enlarger links to each other with following fixed pedestal [4c] by lower end stress relief framework [5c]; The input end [10a, 10b, 10c, 10d] of upper and lower side one-level regulations and parameters enlarger [3a, 3b, 3c, 3d] is connected with mass [1] respectively; Mass [1] links to each other with four fixed pedestals [7a, 7b, 7c, 7d] that are positioned at [1] four jiao of mass respectively by four U type beams [6a, 6b, 6c, 6d], all fixed pedestals [4a, 4b, 4c, 7a, 7b, 7c, 7d] are installed on the fixed pedestal bonding point of lower floor's monocrystalline silicon, make the physical construction part on upper strata unsettled on the monocrystalline substrate part of lower floor.
2. low-stress silicon micro resonance type accelerometer according to claim 1, it is characterized in that: upper and lower side one-level lever enlarger [3a, 3b, 3c, 3d] by lever [8a, 8b, 8c, 8d], support end [9a, 9b, 9c, 9d] input end [10a, 10b, 10c, 10d] and output terminal [11a, 11b, 11c, 11d] form, support end [9a, 9b, 9c, 9d] and input end [10a, 10b, 10c, 10d] be positioned at lever [8a, 8b, 8c, 8d] the upper end, and output terminal [11a, 11b, 11c, 11d] be positioned at lever [8a, 8b, 8c, 8d] the lower end, support end [9a, 9b, 9c, 9d], input end [10a, 10b, 10c, 10d] and output terminal [11a, 11b, 11c, 11d] all adopted thin beam structure, and support end [9a, 9b, 9c, 9d] axially and lever [8a, 8b, 8c, 8d] axially mutually vertical.
3. low-stress silicon micro resonance type accelerometer according to claim 1 is characterized in that: each four U type beam [6a, 6b, 6c, 6d] is an axially symmetric structure.
4. low-stress silicon micro resonance type accelerometer according to claim 1, it is characterized in that: each resonator [2a, 2b] by two resonance beam [12a, 12b], two float electrode [13a, 13b], two fixed drive electrode [14a, 14b], four fixed test electrode [15a, 15b, 15c, 15d] and two contiguous blocks [16,17] form, two resonance beam [12a, 12b] be arranged side by side and the contiguous block [16 by its two ends, 17] group together, a contiguous block [16] is continuous with corresponding one-level lever enlarger, another contiguous block [17] discharges framework [5a] by intermediate stress and links to each other with center fixed pedestal [4a], two resonance beam [12a, 12b] the outside respectively connect a float electrode [13a, 13b], two float electrode [13a, 13b] the outside a fixed drive electrode [14a respectively is set, 14b], form and drive electric capacity, four fixed test electrode [15a, 15b, 15c, 15d] be separately positioned on float electrode [13a, 13b] and resonance beam [12a, 12b] between, float electrode [13a, 13b] and fixed test electrode [15a, 15b, 15c, 15d] form and detect electric capacity.
5. low-stress silicon micro resonance type accelerometer according to claim 4 is characterized in that: float electrode [13a, 13b], fixed drive electrode [14a, 14b] and the fixed test electrode of going up down resonator [2a, 2b]] 15a, 15b, 15c, 15d] be plate electrode.
CN201020208085XU 2010-05-28 2010-05-28 Low stress micro-silicon resonance accelerometer Expired - Fee Related CN201673168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020208085XU CN201673168U (en) 2010-05-28 2010-05-28 Low stress micro-silicon resonance accelerometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020208085XU CN201673168U (en) 2010-05-28 2010-05-28 Low stress micro-silicon resonance accelerometer

Publications (1)

Publication Number Publication Date
CN201673168U true CN201673168U (en) 2010-12-15

Family

ID=43330580

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020208085XU Expired - Fee Related CN201673168U (en) 2010-05-28 2010-05-28 Low stress micro-silicon resonance accelerometer

Country Status (1)

Country Link
CN (1) CN201673168U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101858927A (en) * 2010-05-28 2010-10-13 南京理工大学 Low-stress silicon micro resonance type accelerometer
CN102243251A (en) * 2011-04-25 2011-11-16 东南大学 Micromechanical silicon resonant accelerometer with different resonant frequencies
CN105242069A (en) * 2015-10-14 2016-01-13 华东光电集成器件研究所 Overload-resistant capacitive triaxial MEMS accelerometer
CN112881753A (en) * 2021-01-14 2021-06-01 南京理工大学 Damping-adjustable silicon tuning fork resonant accelerometer structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101858927A (en) * 2010-05-28 2010-10-13 南京理工大学 Low-stress silicon micro resonance type accelerometer
CN101858927B (en) * 2010-05-28 2012-05-09 南京理工大学 Low-stress silicon micro resonance type accelerometer
CN102243251A (en) * 2011-04-25 2011-11-16 东南大学 Micromechanical silicon resonant accelerometer with different resonant frequencies
CN105242069A (en) * 2015-10-14 2016-01-13 华东光电集成器件研究所 Overload-resistant capacitive triaxial MEMS accelerometer
CN112881753A (en) * 2021-01-14 2021-06-01 南京理工大学 Damping-adjustable silicon tuning fork resonant accelerometer structure
CN112881753B (en) * 2021-01-14 2023-02-24 南京理工大学 Damping-adjustable silicon tuning fork resonant accelerometer structure

Similar Documents

Publication Publication Date Title
CN101858927B (en) Low-stress silicon micro resonance type accelerometer
CN101266259B (en) Silicon micro-resonance type accelerometer
CN102109534B (en) Two-axis resonant silicon micro-accelerometer
CN101963624B (en) Silicon micro-resonant accelerometer
Wang et al. A MEMS piezoelectric in-plane resonant accelerometer based on aluminum nitride with two-stage microleverage mechanism
CN102590555B (en) Resonance dynamic balance capacitance-type triaxial acceleration transducer and manufacture method
CN101303365B (en) Resonance type micro accelerometer
CN102495236A (en) High-sensitivity dual-axis silicon-micro resonance accelerometer
CN102608356B (en) A kind of double-shaft micromechanical resonant accelerometer structure and production method
JPH09196682A (en) Angular velocity sensor and acceleration sensor
ITTO20130237A1 (en) HIGH SENSITIVITY MICROELECTROMECHANICAL DETECTION OF Z AXIS, IN PARTICULAR FOR A MEMS ACCELEROMETER
CN101368826A (en) Vibration isolation frame work decoupled silicon micro-gyroscope and preparation thereof
CN104374953A (en) Split type differential silicon micro resonant accelerometer
CN103439529B (en) Based on the silicon vibrating beam accelerometer of the integrated high precision measuring temperature structure of chip
CN201673168U (en) Low stress micro-silicon resonance accelerometer
Liu et al. A high-performance multi-beam microaccelerometer for vibration monitoring in intelligent manufacturing equipment
CN102243251A (en) Micromechanical silicon resonant accelerometer with different resonant frequencies
CN201796049U (en) Silicon micro resonant accelerometer
CN100498343C (en) Electric tuning resonance differential frequency accelerator
Kuo et al. Monolithic multi-sensor design with resonator-based MEMS structures
CN102175890B (en) Sandwich type translational closed-loop silicon-micro-accelerometer
CN201984082U (en) Biaxial resonant silicon micro- accelerometer
Li et al. A micro-machined differential resonance accelerometer based on silicon on quartz method
CN113945732A (en) Graphene double-shaft differential resonant accelerometer
CN111812355B (en) Low stress sensitivity silicon micro resonant accelerometer structure

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101215

Termination date: 20130528