CN201655856U - Surface-mounted packaging structure of step-down piezoelectric ceramic transformer - Google Patents
Surface-mounted packaging structure of step-down piezoelectric ceramic transformer Download PDFInfo
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- CN201655856U CN201655856U CN2009202783443U CN200920278344U CN201655856U CN 201655856 U CN201655856 U CN 201655856U CN 2009202783443 U CN2009202783443 U CN 2009202783443U CN 200920278344 U CN200920278344 U CN 200920278344U CN 201655856 U CN201655856 U CN 201655856U
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- piezoelectric ceramic
- voltage
- ceramic transformer
- transformer
- encapsulating structure
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Abstract
The utility model discloses a surface-mounted packaging structure of a step-down piezoelectric ceramic transformer, comprising a step-down piezoelectric ceramic transformer, an external circuit board and an insulating mat, wherein the step-down piezoelectric ceramic transformer is welded on the welding spot of the external circuit board, and the transformer is connected with the external circuit board by the insulating mat. Accordingly, the surface-mounted packaging structure of the step-down piezoelectric ceramic transformer can prevent the possible swinging of the transformer in the using process. Meanwhile, the surface-mounted connection of the transformer is realized, and the device density of the external circuit board is increased.
Description
Technical field
The utility model relates to a kind of packaging technology of Basic fundamentals of power electronics components and parts, relates in particular to a kind of surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer.
Background technology
Piezoelectric ceramic transformer is the electronic components of high power of emerging appearance, and it has low EMI, good EMC characteristic, high efficiency, power density height, characteristics such as compact.The present piezoelectric transformer product that occurs is mainly based on the booster type piezoelectric transformer (being mainly used in the backlight electric power of LCD) of small-power (less than 10W) and the power voltage-dropping type piezoelectric transformer (being mainly used in various power supplys) of (less than 50W) slightly greatly.
Piezoelectric ceramic transformer is to transmit energy (be different from the traditional electrical magnetic transformer and transmit energy by electromagnetic conversion) by ultrasonic vibration, so device can not hinder its vibration when work, otherwise will reduce its operating efficiency greatly.Owing to be power device, its heat radiation also is crucial problem simultaneously.
Utility model ZL200820109615.8 and ZL200820109618.1 have announced the packaged type and the shell of existing two kinds of voltage-dropping type piezoelectric transformers.A kind of wire-lead type piezoelectric transformer shell that ZL200820109615.8 announces; the method at first is welded to piezoelectric transformer on the pcb board; by lead-in wire piezoelectric transformer is fixed on the pcb board; it is not interrupted that the metal shell of piezoelectric transformer plays the vibration of protection piezoelectric transformer when work; and the heat-sinking capability that increases piezoelectric transformer, packaged piezoelectric transformer is connected with external circuit by lead-in wire.Because packaged piezoelectric transformer is not fixed on the circuit external plate, just simply connect by lead-in wire, make that the transformer after encapsulating rocks easily in the process of using, influence reliability.
And the pin-insertion type piezoelectric transformer method for packing that patent ZL200820109618.1 announces, owing to adopt the contact pin form to be connected, not as the Surface Mount type of attachment can improve the integration density of components and parts on the circuit board and the Surface Mount welding procedure that realizes high-efficient automatic with the external circuit board.
The utility model content
Rock easily in order to solve in the prior art, influence the low problem of reliability and integration density, the utility model provides a kind of surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer, guarantee under the vibration and the prerequisite of good heat-sinking capability of piezoelectric transformer when work the mode of piezoelectric transformer by welding to be fixed on the external circuit board.
For achieving the above object, the utility model provides a kind of surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer, comprising:
The voltage-dropping type piezoelectric ceramic transformer;
The external circuit board, described voltage-dropping type piezoelectric ceramic transformer is welded on the solder joint of described the external circuit board;
Insulation cushion, described transformer connects by this insulation cushion and described the external circuit board.
Described solder joint is 4.
The side electrode of described voltage-dropping type piezoelectric ceramic transformer by wire bonds on the solder joint of described the external circuit board.
Described lead is the aviation lead.
The length of described lead is not more than the diameter of described piezoelectric transformer.
Described insulation cushion is specially the insulation rubber cushion.
The surface-mount type encapsulating structure of described voltage-dropping type piezoelectric ceramic transformer also comprises shell, the ccontaining described piezoelectric transformer of described shell, and described shell is bonding or be connected on described the external circuit board.
Described shell is a metal shell.
Has insulation cushion between described voltage-dropping type piezoelectric ceramic transformer and the metal shell.
Therefore, adopt the surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer, what transformer may occur in the process that can prevent to use rocks; Realize the Surface Mount connection of transformer simultaneously, improve the device density of the external circuit board.
Description of drawings
Fig. 1 is the schematic cutaway view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer.
Fig. 2 is the schematic front view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer.
Fig. 3 is the schematic vertical view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer.
Fig. 4 analyses and observe for the schematic vertical view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Be illustrated in figure 1 as the schematic cutaway view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer; Fig. 2 is the schematic front view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer; Fig. 3 is the schematic vertical view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer; Fig. 4 analyses and observe for the schematic vertical view of surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer.
Shown in Fig. 1-4, the surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer comprises: voltage-dropping type piezoelectric ceramic transformer 1; The external circuit board 2, described voltage-dropping type piezoelectric ceramic transformer 1 are welded on the solder joint 100 of described the external circuit board 2; Insulation cushion 3, described piezoelectric ceramic transformer 1 connects with described the external circuit board 2 by this insulation cushion 3.As shown in Figure 3 and Figure 4, cooperate the size of piezoelectric ceramic transformer 1 to reserve four solder joints on the circuit external plate 2, be that the position of these four solder joints 100 and the size of piezoelectric ceramic transformer 1 are complementary, wherein four solder joints are respectively two input points and two output points, and four side electrodes 6 (only showing 1 among the figure) with piezoelectric ceramic transformer are welded on four solder joints by connecting lead 4 then.
The lead of welding usefulness uses the aviation lead that certain toughness is arranged usually, and the length of welding lead generally is not more than the diameter of piezoelectric ceramic transformer.The size of the position of four solder joints and described voltage-dropping type piezoelectric ceramic transformer is complementary, and can utilize the position of the described prior art of background technology to arrange, and does not repeat them here.
As shown in Figure 1, this encapsulating structure also comprises shell 5, these shell 5 ccontaining piezoelectric ceramic transformer 1 and solder joints 100, and this shell 5 is bonding or be connected on described the external circuit board 2.For example, use for example metal shell of shell 5, piezoelectric ceramic transformer and 4 solder joints after the welding are enclosed on the circuit board, metal shell can be bonding or be connected on the external circuit board, and other fixed forms are perhaps arranged.
Furthermore, has the insulation cushion rubber cushion that for example insulate between piezoelectric ceramic transformer and the metal shell, to increase the dielectric strength of transformer and metal shell.
Therefore, adopt the surface-mount type encapsulating structure of the utility model voltage-dropping type piezoelectric ceramic transformer, what transformer may occur in the process that can prevent to use rocks; Realize the Surface Mount connection of transformer simultaneously, improve the device density of the external circuit board.
It should be noted last that, above embodiment is only unrestricted in order to the explanation the technical solution of the utility model, although the utility model is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement the technical solution of the utility model, and not break away from the spirit and scope of technical solutions of the utility model.
Claims (10)
1. the surface-mount type encapsulating structure of a voltage-dropping type piezoelectric ceramic transformer is characterized in that comprising:
The voltage-dropping type piezoelectric ceramic transformer;
The external circuit board, described voltage-dropping type piezoelectric ceramic transformer is welded on the solder joint of described the external circuit board;
Insulation cushion, described transformer connects by this insulation cushion and described the external circuit board.
2. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 1 is characterized in that: described solder joint is 4.
3. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 1 is characterized in that: the side electrode of described voltage-dropping type piezoelectric ceramic transformer by wire bonds on the solder joint of described the external circuit board.
4. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 3 is characterized in that: described lead is the aviation lead.
5. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 3 is characterized in that: the length of described lead is not more than the diameter of described piezoelectric transformer.
6. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 1 is characterized in that described insulation cushion is specially the insulation rubber cushion.
7. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 1 is characterized in that also comprising shell, ccontaining described piezoelectric transformer of described shell and solder joint, and described shell is bonding or be connected on described the external circuit board.
8. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 7 is characterized in that described shell is a metal shell.
9. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 8 is characterized in that having insulation cushion between described transformer and the metal shell.
10. the surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer according to claim 2 is characterized in that the position of described solder joint and the size of described voltage-dropping type piezoelectric ceramic transformer are complementary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202783443U CN201655856U (en) | 2009-12-28 | 2009-12-28 | Surface-mounted packaging structure of step-down piezoelectric ceramic transformer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202783443U CN201655856U (en) | 2009-12-28 | 2009-12-28 | Surface-mounted packaging structure of step-down piezoelectric ceramic transformer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201655856U true CN201655856U (en) | 2010-11-24 |
Family
ID=43121099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202783443U Expired - Fee Related CN201655856U (en) | 2009-12-28 | 2009-12-28 | Surface-mounted packaging structure of step-down piezoelectric ceramic transformer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201655856U (en) |
-
2009
- 2009-12-28 CN CN2009202783443U patent/CN201655856U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20131228 |