CN102110769A - Piezoelectric transformer and packaging structure thereof - Google Patents
Piezoelectric transformer and packaging structure thereof Download PDFInfo
- Publication number
- CN102110769A CN102110769A CN2009102435613A CN200910243561A CN102110769A CN 102110769 A CN102110769 A CN 102110769A CN 2009102435613 A CN2009102435613 A CN 2009102435613A CN 200910243561 A CN200910243561 A CN 200910243561A CN 102110769 A CN102110769 A CN 102110769A
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- piezoelectric transformer
- transformer
- encapsulating structure
- circuit board
- perforate
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Abstract
The present invention discloses a piezoelectric transformer packaging structure, the packaging structure comprises: a piezoelectric transformer; a hole arranged on the center of the piezoelectric transformer; a lateral electrode arranged on a hole wall of the hole; an external circuit board; and a fixed connector which fixes the piezoelectric transformer and the external circuit board by traversing the hole. In addition, the piezoelectric transformer is also provided in the present invention, the piezoelectric transformer comprises: the hole arranged on the center of the piezoelectric transformer; and the lateral electrode arranged on hole wall of the hole. By adopting the piezoelectric transformer and the packaging structure thereof in the present invention, the problem of failure in welding the lateral electrode of the transformer having an original structure is solved, simultaneously temperature rise of the transformer is effectively reduced, under the same work temperature rise, output power of the transformer is raised; and the technical solution also simplifies the packaging structure of the transformer, and decreases area occupied by the transformer on the circuit board.
Description
Technical field
The present invention relates to a kind of piezoelectric transformer, relate in particular to a kind of piezoelectric transformer and encapsulating structure thereof.
Background technology
Piezoelectric ceramic transformer is the electronic components of high power of emerging appearance, and it has low EMI, good EMC characteristic, high efficiency, power density height, characteristics such as compact.The present piezoelectric transformer product that occurs is mainly based on the booster type piezoelectric transformer (being mainly used in the backlight electric power of LCD) of small-power (less than 10W) and the power voltage-dropping type piezoelectric transformer (being mainly used in various power supplys) of (less than 50W) slightly greatly.For inventing related method for packing is at the voltage-dropping type piezoelectric ceramic transformer.
Present high-power piezoelectric transformer is mainly based on (profile) vibration mode radially, and patent ZL200820109614.3 and ZL 200820109616.2 have announced the piezoelectric transformer structure of a kind of radially (profile) vibration and the method that is electrically connected of piezoelectric transformer and external circuit.Basically all relate to radially (profile) vibration piezoelectric transformer at present, all are by the electrode of burning infiltration in the piezoelectric transformer side, connect lateral electrode and outside solder joint by lead.Find by the use checking that is in a large number, for this type of piezoelectric transformer, it lost efficacy and mainly occurred in the lateral electrode of piezoelectric transformer, the lateral electrode of main form of invalidation and welding lead disconnect, trace it to its cause, for the piezoelectric transformer of radially (profile) vibration, outermost profile, the displacement of its vibration and speed are all maximum, and there is the phenomenon of local overheating in the lateral electrode solder joint during work.Find through the research test, radially the displacement and the vibration velocity of circumference (profile) central area of (profile) vibration piezoelectric transformer are all less, but distribute from the temperature field on piezoelectric transformer plane, the temperature of central area is higher, if can improve the heat-sinking capability of central area, thereby improve the heat-sinking capability of entire device, certainly will will reduce the working temperature of entire device, thereby improve the control ability of piezoelectric transformer power.
Summary of the invention
In order to solve in the prior art radially (profile) vibration piezoelectric transformer, lateral electrode and the problem that is connected the Problem of Failure that lead disconnects, the invention provides a kind of piezoelectric transformer and encapsulating structure thereof, guarantee piezoelectric transformer, improve the heat-sinking capability of transformer, thereby improve the control ability of integral device power output.
For achieving the above object, the invention provides a kind of piezoelectric transformer, comprising:
The center of described piezoelectric transformer offers perforate;
Lateral electrode places on the hole wall of described perforate.
The size in the aperture of described perforate is no more than half of described piezoelectric transformer diameter.
The invention provides a kind of piezoelectric transformer encapsulating structure, comprising:
Piezoelectric transformer;
The center of described piezoelectric transformer offers perforate;
Lateral electrode places on the hole wall of described perforate;
The external circuit board;
Fixed connection apparatus, described fixed connection apparatus pass described perforate described piezoelectric transformer and described the external circuit board are fixed.
Described fixed connection apparatus is a hollow.
The wall of described fixed connection apparatus is provided with aperture.
Described piezoelectric transformer encapsulating structure also comprises the connection lead, described connection lead pass hollow described fixed connection apparatus and on described aperture be connected with described lateral electrode, and be connected with the solder joint of described the external circuit board.
Described fixed connection apparatus is metal bolts and nut, and described metal bolts is described hollow, and the wall of the metal bolts of described hollow is provided with aperture.
Described piezoelectric transformer encapsulating structure also comprises the insulating cement bed course, is provided with respectively between described metal bolts and the described piezoelectric transformer, and between described nut and the described external circuit.
Be provided with the insulating cement bed course between described piezoelectric transformer and the external circuit board.
The size in the aperture of described perforate is no more than half of described piezoelectric transformer diameter.
Therefore, adopt the problem that the invention solves original structure transformer lateral electrode weld failure, effectively reduced the temperature rise of transformer simultaneously, under identical work temperature rise, improved the power output of transformer; Above technical scheme has also been simplified the encapsulating structure of transformer, has reduced the area occupied of transformer on circuit board.
Description of drawings
Fig. 1 is the schematic cutaway view of surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer of the present invention.
Fig. 2 is the schematic front view of surface-mount type encapsulating structure of voltage-dropping type piezoelectric ceramic transformer of the present invention.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Piezoelectric transformer provided by the invention with and encapsulating structure, solved the problem of original structure transformer lateral electrode weld failure, effectively reduced the temperature rise of transformer simultaneously, under identical work temperature rise, improved the power output of transformer; Also simplify the encapsulating structure of transformer, reduced the area occupied of transformer on circuit board.
Be illustrated in figure 1 as the piezoelectric transformer schematic diagram after a kind of piezoelectric transformer encapsulating structure of the present invention encapsulates, Fig. 2 is the cutaway view of a kind of piezoelectric transformer encapsulating structure of the present invention, as shown in the figure, the encapsulating structure of this piezoelectric transformer is to carry out at piezoelectric transformer with holes 1, and the center of this piezoelectric transformer 1 offers perforate 100; Lateral electrode 102 (not shown)s place on the hole wall of described perforate 100; The external circuit board 2; Fixed connection apparatus 3, described fixed connection apparatus 3 pass described perforate 100 described piezoelectric transformer 1 and described the external circuit board 2 are fixed.Center drilling can increase area of dissipation, and fixedly the metal nuts of usefulness can be used for heat conduction simultaneously, thereby improves the heat-sinking capability of transformer.
As shown in Figure 2, described fixed connection apparatus 3 is a hollow, forms cavity 30 on fixed connection apparatus.The wall of described fixed connection apparatus is provided with aperture 300.As being example among the figure, fixed connection apparatus 3 is metal bolts 31 and nut 32, and described metal bolts is described hollow, and the wall of the inner chamber of the metal bolts of described hollow is provided with aperture.Except adopting screw bolt and nut, can also adopt double-screw bolt, these modes of screw, double-screw bolt and screw are hollow, form inner chamber, the chamber wall forms aperture, equally also can play with the same effect of screw bolt and nut.
Continuation is referring to shown in Figure 2, this encapsulating structure also comprises connection lead 4, described connection lead 4 pass hollow described fixed connection apparatus inner chamber 30 and on the hole wall of described aperture 300 and piezoelectric transformer on lateral electrode 102 be connected, and be connected with the solder joint of the external circuit board 2.
For the insulation effect that plays, between described metal bolts 31 and the described piezoelectric transformer 2, and between described nut 32 and described the external circuit board 2 insulating cement bed course 5 is set respectively.
Also can be provided with insulating cement bed course 5 between described piezoelectric transformer 1 and the external circuit board 2.
The size in the aperture of described perforate is no more than half of described piezoelectric transformer diameter.The present invention has adopted a kind of center piezoelectric transformer with holes; Use metal bolts that piezoelectric transformer is fixed on the circuit external plate; By being positioned at the lateral electrode of perforate, use lead to realize being electrically connected of piezoelectric transformer and external circuit.
By the invention solves the problem of original structure transformer lateral electrode weld failure, effectively reduced the temperature rise of transformer simultaneously, under identical work temperature rise, improved the power output of transformer; Also simplify the encapsulating structure of transformer, reduced the area occupied of transformer on circuit board.
It should be noted last that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (10)
1. piezoelectric transformer is characterized in that comprising:
The center of described piezoelectric transformer offers perforate;
Lateral electrode places on the hole wall of described perforate.
2. piezoelectric transformer according to claim 1, the size that it is characterized in that the aperture of described perforate is no more than half of described piezoelectric transformer diameter.
3. piezoelectric transformer encapsulating structure is characterized in that comprising:
Piezoelectric transformer;
The center of described piezoelectric transformer offers perforate;
Lateral electrode places on the hole wall of described perforate;
The external circuit board;
Fixed connection apparatus, described fixed connection apparatus pass described perforate described piezoelectric transformer and described the external circuit board are fixed.
4. piezoelectric transformer encapsulating structure according to claim 3 is characterized in that described fixed connection apparatus is a hollow.
5. piezoelectric transformer encapsulating structure according to claim 4 is characterized in that the wall of described fixed connection apparatus is provided with aperture.
6. piezoelectric transformer encapsulating structure according to claim 5, it is characterized in that also comprising the connection lead, described connection lead pass hollow described fixed connection apparatus and on described aperture be connected with described lateral electrode, and be connected with the solder joint of described the external circuit board.
7. piezoelectric transformer encapsulating structure according to claim 6 is characterized in that described fixed connection apparatus is metal bolts and nut, and described metal bolts is the formation inner chamber of described hollow, and the chamber wall of described inner chamber is provided with aperture.
8. piezoelectric transformer encapsulating structure according to claim 7 is characterized in that also comprising the insulating cement bed course, is provided with respectively between described metal bolts and the described piezoelectric transformer, and between described nut and the described external circuit.
9. piezoelectric transformer encapsulating structure according to claim 8 is characterized in that, is provided with the insulating cement bed course between described piezoelectric transformer and the external circuit board.
10. according to the arbitrary described piezoelectric transformer encapsulating structure of claim 1-9, the size that it is characterized in that the aperture of described perforate is no more than half of described piezoelectric transformer diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102435613A CN102110769A (en) | 2009-12-25 | 2009-12-25 | Piezoelectric transformer and packaging structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102435613A CN102110769A (en) | 2009-12-25 | 2009-12-25 | Piezoelectric transformer and packaging structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102110769A true CN102110769A (en) | 2011-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102435613A Pending CN102110769A (en) | 2009-12-25 | 2009-12-25 | Piezoelectric transformer and packaging structure thereof |
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| CN (1) | CN102110769A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256984A (en) * | 2018-11-20 | 2019-01-22 | 武汉理工大学 | Boosting and decompression can free switching integrated multi-functional pressure piezoelectric transformer and buck method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11354855A (en) * | 1998-06-08 | 1999-12-24 | Tokin Corp | Laminated piezoelectric transformer |
| JP2000294847A (en) * | 1999-04-02 | 2000-10-20 | Matsushita Electric Ind Co Ltd | Piezoelectric transformer |
| CN201655857U (en) * | 2009-12-25 | 2010-11-24 | 中国电子为华实业发展有限公司 | Piezoelectric transformer and packaging structure thereof |
-
2009
- 2009-12-25 CN CN2009102435613A patent/CN102110769A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11354855A (en) * | 1998-06-08 | 1999-12-24 | Tokin Corp | Laminated piezoelectric transformer |
| JP2000294847A (en) * | 1999-04-02 | 2000-10-20 | Matsushita Electric Ind Co Ltd | Piezoelectric transformer |
| CN201655857U (en) * | 2009-12-25 | 2010-11-24 | 中国电子为华实业发展有限公司 | Piezoelectric transformer and packaging structure thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256984A (en) * | 2018-11-20 | 2019-01-22 | 武汉理工大学 | Boosting and decompression can free switching integrated multi-functional pressure piezoelectric transformer and buck method |
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Application publication date: 20110629 |