CN201623143U - Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss - Google Patents

Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss Download PDF

Info

Publication number
CN201623143U
CN201623143U CN 201020123504 CN201020123504U CN201623143U CN 201623143 U CN201623143 U CN 201623143U CN 201020123504 CN201020123504 CN 201020123504 CN 201020123504 U CN201020123504 U CN 201020123504U CN 201623143 U CN201623143 U CN 201623143U
Authority
CN
China
Prior art keywords
chip
radiating block
heat sink
radiator
packaging structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201020123504
Other languages
Chinese (zh)
Inventor
王新潮
梁志忠
高盼盼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN 201020123504 priority Critical patent/CN201623143U/en
Application granted granted Critical
Publication of CN201623143U publication Critical patent/CN201623143U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to a normal chip packaging structure with an exposed substrate and a heat sink which is provided with a locking hole and connected with an external radiator through a boss. The normal chip packaging structure comprises a chip (3), a metal substrate (1), meal inner pins (4), metal wires (5), a conductive or non-conductive heat-transfer adhesive material I (2) and a plastic package (8), wherein the metal substrate (1) is exposed from the plastic package (8), the heat sink (7) with the locking hole (7.1) is disposed above the chip (3), a conductive or non-conductive heat-transfer adhesive material II (6) is embedded between the heat sink (7) and the chip (3), the radiator (11) is disposed above the heat sink (7) and connected with the heat sink (7) through the boss (11.1) in an interconnected manner, and a conductive or non-conductive heat-transfer adhesive material III (13) is embedded between the heat sink (7) and the radiator (11). The packaging structure can provide powerful capacity of heat dissipation.

Description

The base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator
(1) technical field
The utility model relates to a kind of base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator.
The purpose of this utility model is achieved in that a kind of base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator, include chip, the Metal Substrate island of being carried of chip below, pin in the metal, chip is to the wire of the signal interconnection of the interior pin of metal, conduction between chip and the Metal Substrate island or nonconducting heat conduction bonding material I and plastic-sealed body, the base island exposed plastic packaging material of described metal, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, protrusion is provided with a projection in the middle of the described radiator lower surface, and radiator patches with the radiating block that has lock hole by this projection and is connected; And between this radiator and described radiating block and in described lock hole, be equipped with the conduction or nonconducting heat conduction bonding material III.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator schematic diagram.
Reference numeral among the figure:
Pin 4, wire 5, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lock hole 7.1, plastic-sealed body 8, radiator 11, projection 11.1, conduction or nonconducting heat conduction bonding material III13 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator schematic diagram.As seen from Figure 5, the utility model base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator, include chip 3, the Metal Substrate island 1 of being carried of chip below, pin 4 in the metal, chip is to the wire 5 of the signal interconnection of the interior pin of metal, conduction between chip and the Metal Substrate island or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, plastic packaging material 8 is exposed on described Metal Substrate island 1, it is characterized in that above described chip 3, being provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, protrusion is provided with a projection 11.1 in the middle of described radiator 11 lower surfaces, and radiator 11 patches with the radiating block 7 that has lock hole by this projection 11.1 and is connected; And be equipped with conduction or nonconducting heat conduction bonding material III13 between this radiator 11 and the described radiating block 7 and in described lock hole 7.1; So that the two interfixes or bonds with radiator 11 and radiating block 7.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.

Claims (3)

1. base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator, include chip (3), the Metal Substrate island (1) of being carried of chip below, pin (4) in the metal, chip is to the wire (5) of the signal interconnection of the interior pin of metal, conduction between chip and the Metal Substrate island or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), plastic packaging material (8) is exposed on described Metal Substrate island (1), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with radiator (11) in described radiating block (7) top, protrusion is provided with a projection (11.1) in the middle of described radiator (11) lower surface, and radiator (11) patches with the radiating block that has lock hole (7) by this projection (11.1) and is connected; And between this radiator (11) and described radiating block (7) and in described lock hole (7.1), be equipped with the conduction or nonconducting heat conduction bonding material III (13).
2. a kind of base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of base island exposed chip packaging structure with upright radiating block with locking hole, protrude pillar and external radiator according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium, pottery or alloy.
CN 201020123504 2010-01-29 2010-01-29 Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss Expired - Fee Related CN201623143U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020123504 CN201623143U (en) 2010-01-29 2010-01-29 Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020123504 CN201623143U (en) 2010-01-29 2010-01-29 Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss

Publications (1)

Publication Number Publication Date
CN201623143U true CN201623143U (en) 2010-11-03

Family

ID=43026600

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020123504 Expired - Fee Related CN201623143U (en) 2010-01-29 2010-01-29 Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss

Country Status (1)

Country Link
CN (1) CN201623143U (en)

Similar Documents

Publication Publication Date Title
CN201629316U (en) Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss
CN201623147U (en) Normal chip packaging structure with exposed substrate and heat sink having locking hole and external heat-dissipating cap connected with heat sink through boss
CN201623143U (en) Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss
CN201623084U (en) Normal chip packaging structure with exposed substrate and heat sink
CN201623134U (en) Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator via boss
CN201623127U (en) Normal chip packaging structure with exposed substrate and heat sink having locking hole and external heat-dissipating plate connected with heat sink through boss
CN201623129U (en) Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external radiator
CN201623115U (en) Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external heat-dissipating cap
CN201623087U (en) Normal chip packaging structure with exposed substrate and heat sink having locking hole
CN201629320U (en) Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap via boss
CN201623128U (en) Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator
CN201623049U (en) Normal chip packaging structure with exposed substrate and heat plug having locking hole and projecting surface
CN201623083U (en) Normal chip packaging structure with exposed substrate and rectangular heat sink having locking hole
CN201623145U (en) Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole and connected with external radiator
CN201623060U (en) Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface
CN201629310U (en) Normal chip packaging structure with exposed substrate and heat sink connected with external radiator
CN201623086U (en) Normal chip packaging structure with exposed substrate and inverted T-shaped heat sink having locking hole
CN201623057U (en) Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole
CN201629321U (en) Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap
CN201623121U (en) Normal chip packaging structure with embedded substrate and inverted-T-shaped heat sink having locking hole and connected with external radiator
CN201623125U (en) Normal chip packaging structure with embedded substrate and heat sink connected with external radiator
CN201629324U (en) Normal chip packaging structure with exposed substrate and inverted-T-shaped heat sink connected with external radiator
CN201623061U (en) Normal chip packaging structure with embedded substrate and heat sink having locking hole
CN201623059U (en) Normal chip packaging structure with embedded substrate and inverted T-shaped heat sink having locking hole
CN201629311U (en) Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and radiator with external boss

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101103

Termination date: 20140129