CN201623060U - Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface - Google Patents
Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface Download PDFInfo
- Publication number
- CN201623060U CN201623060U CN 201020118036 CN201020118036U CN201623060U CN 201623060 U CN201623060 U CN 201623060U CN 201020118036 CN201020118036 CN 201020118036 CN 201020118036 U CN201020118036 U CN 201020118036U CN 201623060 U CN201623060 U CN 201623060U
- Authority
- CN
- China
- Prior art keywords
- chip
- metal substrate
- radiating block
- packaging structure
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a normal chip packaging structure with an embedded substrate and a heat sink having a locking hole and a protruded surface, which comprises a chip (3), a metal substrate (1), inner metal pins (4), metal wires (5), a conductive or non-conductive heat-transfer adhesive material I (2) and a plastic package (8). The metal substrate (1) is arranged below the chip, signals of the chip and the inner metal pins are interconnected via the metal wires (5), the conductive or non-conductive heat-transfer adhesive material I (2) is arranged between the chip and the metal substrate, and the metal substrate (1) is embedded into the plastic package (8). The normal chip packaging structure is characterized in that a heat sink (7) is disposed above the chip (3) and provided with a locking hole (7.1), a conductive or non-conductive heat-transfer adhesive material II (6) is embedded between the heat sink (7) and the chip (3), and the surface of the heat sink (7) is protruded out of the plastic package (8). By means of adding the heat sink above the chip, the packaging structure has a high heat radiating function, is strong in radiating capacity, fast conducts heat of the chip to the outside of the packaging body, and then prevents the chip from aging fast and even being burnt or burnt out.
Description
(1) technical field
The utility model relates to a kind of base island embedded chip packaging structure of radiating block with locking hole and convex surface.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong base island embedded chip packaging structure of radiating block with locking hole and convex surface.
The purpose of this utility model is achieved in that a kind of base island embedded chip packaging structure of radiating block with locking hole and convex surface, include chip 3, the Metal Substrate island 1 of being carried of chip below, pin 4 in the metal, chip is to the wire 5 of the signal interconnection of the interior pin of metal, conduction between chip and the Metal Substrate island or nonconducting heat conduction bonding material I2 and plastic-sealed body 8, plastic packaging material 8 is imbedded on described Metal Substrate island 1, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II6 between this radiating block 7 and the described chip 3; Plastic-sealed body 8 outsides are protruded on the surface of described radiating block 7.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip,, serve as the function of the heat radiation of high heat, can provide heat dissipation capability strong, make the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model base island embedded chip packaging structure of radiating block with locking hole and convex surface schematic diagram.
Reference numeral among the figure:
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model base island embedded chip packaging structure of radiating block with locking hole and convex surface schematic diagram.As seen from Figure 5, the utility model base island embedded chip packaging structure of radiating block with locking hole and convex surface, include chip 3, the Metal Substrate island 1 of being carried of chip below, pin 4 in the metal, chip is to the wire 5 of the signal interconnection of the interior pin of metal, conduction between chip and the Metal Substrate island or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, plastic packaging material 8 is imbedded on described Metal Substrate island 1, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Plastic-sealed body 8 outsides are protruded on the surface of described radiating block 7.。
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
Claims (2)
1. base island embedded chip packaging structure of radiating block with locking hole and convex surface, include chip (3), the Metal Substrate island (1) of being carried of chip below, pin (4) in the metal, chip is to the wire (5) of the signal interconnection of the interior pin of metal, conduction between chip and the Metal Substrate island or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), plastic-sealed body (8) is imbedded on described Metal Substrate island (1), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Plastic-sealed body (8) outside is protruded on the surface of described radiating block (7).
2. a kind of base island embedded chip packaging structure of radiating block with locking hole and convex surface according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020118036 CN201623060U (en) | 2010-01-27 | 2010-01-27 | Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020118036 CN201623060U (en) | 2010-01-27 | 2010-01-27 | Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201623060U true CN201623060U (en) | 2010-11-03 |
Family
ID=43026517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201020118036 Expired - Fee Related CN201623060U (en) | 2010-01-27 | 2010-01-27 | Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201623060U (en) |
-
2010
- 2010-01-27 CN CN 201020118036 patent/CN201623060U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201623147U (en) | Normal chip packaging structure with exposed substrate and heat sink having locking hole and external heat-dissipating cap connected with heat sink through boss | |
CN201623084U (en) | Normal chip packaging structure with exposed substrate and heat sink | |
CN201623060U (en) | Normal chip packaging structure with embedded substrate, and heat sink having locking hole and protruded surface | |
CN201623045U (en) | Package structure for inverted T radiating block inversed on chip with embedded inner lead and provided with locking hole | |
CN201623048U (en) | Normal chip packaging structure with exposed substrate and inverted T-shaped heat sink | |
CN201623057U (en) | Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole | |
CN201623054U (en) | Normal chip packaging structure with embedded substrate and heat sink having protruded surface | |
CN201623061U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole | |
CN201623087U (en) | Normal chip packaging structure with exposed substrate and heat sink having locking hole | |
CN201623052U (en) | Normal chip packaging structure with embedded substrate and totally encapsulated heat sink | |
CN201629307U (en) | Normal chip packaging structure with embedded substrate and heat sink | |
CN201623083U (en) | Normal chip packaging structure with exposed substrate and rectangular heat sink having locking hole | |
CN201623128U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator | |
CN201623134U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator via boss | |
CN201623059U (en) | Normal chip packaging structure with embedded substrate and inverted T-shaped heat sink having locking hole | |
CN201623049U (en) | Normal chip packaging structure with exposed substrate and heat plug having locking hole and projecting surface | |
CN201623053U (en) | Normal chip packaging structure with embedded substrate and inverted-T-shaped totally-encapsulated heat sink | |
CN201623085U (en) | Normal chip packaging structure with exposed substrate and heat sink having projecting surface | |
CN201623145U (en) | Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole and connected with external radiator | |
CN201629321U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap | |
CN201623143U (en) | Normal chip packaging structure with exposed substrate and heat sink having locking hole and external radiator connected with heat sink through boss | |
CN201623086U (en) | Normal chip packaging structure with exposed substrate and inverted T-shaped heat sink having locking hole | |
CN201623141U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external heat-dissipating plate | |
CN201629310U (en) | Normal chip packaging structure with exposed substrate and heat sink connected with external radiator | |
CN201623131U (en) | Normal chip packaging structure with embedded substrate and heat sink connected with external radiating cap |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20140127 |