CN201623010U - Low-oxygen control system - Google Patents
Low-oxygen control system Download PDFInfo
- Publication number
- CN201623010U CN201623010U CN2009202918188U CN200920291818U CN201623010U CN 201623010 U CN201623010 U CN 201623010U CN 2009202918188 U CN2009202918188 U CN 2009202918188U CN 200920291818 U CN200920291818 U CN 200920291818U CN 201623010 U CN201623010 U CN 201623010U
- Authority
- CN
- China
- Prior art keywords
- control system
- oxygen
- valve
- low
- treatment chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Abstract
The utility model relates to the field of semiconductor production equipment and discloses a low-oxygen control system comprising a nitrogen transportation device, a circulating fan and a treatment chamber which are connected in sequence, wherein the treatment chamber is also externally connected with a circulating pipeline and an oxygen analyzer; the other inlet end of the oxygen analyzer is connected with the nitrogen transportation device; and the circulating fan is provided with an air change valve. The low-oxygen control system can control the oxygen concentration in a relative space (namely, microenvironment), thus effectively controlling the autoxidation condition of a wafer.
Description
Technical field
The utility model belongs to the semiconductor production field, is specifically related to the low-oxygen control system in a kind of wafer oxidation technology.
Background technology
In semiconductor production, often need through heat treatment step.After heat treatment, the nearly superficial layer of wafer forms a locality protection layer that does not have defective, and in the semiconductor fabrication process, the heat treated target of wafer is by thickness requirement growth zero defect, uniform film.So-called film is a kind of thin solid matter of growing on substrate, and this tunic can be conductor, megohmite insulant or semi-conducting material.Film can be silicon dioxide (SiO
2), silicon nitride (Si
3N
4) polysilicon and metal etc.
SiO
2It is intrinsic (pure) vitreum with 1732 ℃ of melting temperatures.The SiO of heat growth
2Can tightly stick on the silicon substrate, and have good dielectric property.Silicon face always covers one deck SiO
2, this is because wafer as long as expose, will form the natural oxide film of several atomic layers thereon at once in air.Even be exposed to for a long time under 25 ℃ the room temperature, the thickness of this layer oxide-film also can only reach the 40 Izod right sides.This oxide is uneven, often is considered to kind of a pollutant in semiconductor technology.The influence of natural oxidizing layer has brought challenge for the thin-film technique technology, and for the very thin technology of film thickness, the variation that the crystal column surface oxygen molecule brings to film thickness will obviously influence the performance of microtransistor.
Therefore, all need in the space that can control oxygen concentration, get sheet before the heat treatment of wafer and after the heat treatment, pass the sheet operation.
The utility model content
The purpose of this utility model is to overcome defective of the prior art, designs a kind of low-oxygen control system, controls the oxygen concentration in the space (being microenvironment), thus the autoxidation situation of effective control wafer.
For achieving the above object, the technical solution of the utility model provides a kind of low-oxygen control system, comprise the nitrogen gas conveying device, circulating fan and the treatment chamber that connect successively, wherein, described treatment chamber outside also is connected with circulation line and oxygen analyser, one arrival end of described oxygen analyser is connected with nitrogen gas conveying device, and the ventilation valve also is installed on the described circulating fan.
Wherein, be connected with gas exhaust piping on the described treatment chamber, include control valve on the described nitrogen gas conveying device.
Wherein, on the described gas exhaust piping vent valve is installed.
Wherein, also comprise control system, an end of described control system is connected with oxygen analyser, and the other end is connected with control valve on the described nitrogen gas conveying device, and described vent valve is connected with control system.
Wherein, the control valve on the described nitrogen gas conveying device is the bi-bit bi-pass reversal valve of two parallel connections.
Wherein, the rear portion of one of bi-bit bi-pass reversal valve of described two parallel connections also is connected with flowmeter.
Wherein, described chamber also is connected with pressure-detecting device, and described pressure-detecting device is connected with control system.
Wherein, filter and heat exchanger are installed also in the described treatment chamber, also are connected with two position two-way valve between the pipeline of described control valve and circulating fan.
Wherein, also comprise the vertical oxidation device, the top of described treatment chamber is connected with the fire door of vertical oxidation.
Advantage of the present utility model and beneficial effect are: the oxidation program after sheet, film releasing program and the heat treatment of getting before the heat treatment of wafer is placed in the microenvironment that can control oxygen concentration carries out, thereby effectively reduce the oxidation of wafer.
Description of drawings
Fig. 1 is the systematic schematic diagram of the utility model low-oxygen control system.
Among the figure:
1, bi-bit bi-pass reversal valve; 2, flowmeter; 3, control system; 4, oxygen analyser; 5, pressure detecting meter; 6, circulating fan; 7, filter; 8, treatment chamber; 9, heat exchanger; 10, switch valve; 11, pressure regulating valve; 12, Pressure gauge; 13, triple valve; 14, vent valve; 15: operated pneumatic valve; 16: two position two-way valve.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only are used for the technical solution of the utility model more clearly is described, and can not limit protection range of the present utility model with this.
Microenvironment is meant, in the equipment before the wafer heat treatment and after the heat treatment, and the environment that is exposed, promptly wafer is got the environment of sheet, oxidation in the utility model in treatment chamber.Preferably, the heat treatment of wafer is to carry out in vertical heat processing apparatus.Hypoxemia in the utility model refers to that promptly oxygen concentration is lower than 10ppm.
As shown in Figure 1, low-oxygen control system according to the concrete scheme of implementing of utility model, comprise the nitrogen gas conveying device, circulating fan 6 and the treatment chamber 8 that connect successively, treatment chamber 8 is the containers that volume is very big, treatment chamber 8 outsides also are connected with circulation line, opening is arranged at its top, and its opening is connected with the fire door of vertical heat processing apparatus.
The position that treatment chamber 8 is connected with circulating fan 6 is equipped with filter 7, and treatment chamber 8 outsides also are connected with circulation line, and filter 7 is used to filter the gas that has been transported in the treatment chamber 8.An end relative with filter 7 is equipped with heat exchanger 9, and heat exchanger 9 is used for the exchange heat in the treatment chamber 8.Also be connected with gas exhaust piping on the treatment chamber 8, be connected with vent valve 14 on the gas exhaust piping, gas unnecessary in the treatment chamber 8 is discharged by the vent valve pipeline.Nitrogen gas conveying device is mainly pipeline and carries, pipeline and nitrogen gas generation device (purity nitrogen jar for example, connections such as nitrogen production factory building), be connected with switch valve 10, pressure regulating valve 11 (being preferably the pressure regulating valve of 100psi), Pressure gauge 12 and triple valve 13 on the pipeline in turn, so that supplying nitrogen.
Switch valve 10 and pressure regulating valve 11 are used for switch, flow and the pressure of the nitrogen conveying of control piper.The rear portion of triple valve 13 connects two branch lines, pipeline that branch line is made up of the bi-bit bi-pass reversal valve 1 of two parallel connections wherein, and the rear portion of one of them bi-bit bi-pass reversal valve 1 also is connected with flowmeter 2.Be connected with oxygen analyser 4 on another branch line, in process chamber 8,, carry gas in oxygen analyser 4 along with flowing of nitrogen, make oxygen analyser 4 can collect the purity nitrogen in the nitrogen transfer pipeline, thereby the correction data of purity nitrogen and oxygen can be provided.One end of oxygen analyser 4 is connected with treatment chamber 8, gas collecting in the treatment chamber 8 is to oxygen analyser 4, analyze contrast with the purity nitrogen of collecting in the oxygen analyser 4, this correction data flows to control system 3, and oxygen analyser 4 is used to detect oxygen concentration or the content in the treatment chamber 8.Gas is by analysis discharged from the gas exhaust piping of oxygen analyser 4.
Also be connected with pressure-detecting device on the treatment chamber 8, for example the pressure detecting meter 5, and pressure detecting meter 5 is used to detect the pressure in the treatment chamber 8, and the force value that pressure detecting meter 5 records flows to control system 3.Control system 3 is connected with an electromagnetically operated valve group, and by the bi-bit bi-pass reversal valve 1 of electromagnetically operated valve group control parallel connection and the switching of two position two-way valve 16, flowmeter 2 is controlled its flow by control system 3.The pipeline rear end that the bi-bit bi-pass reversal valve 1 of two parallel connections is formed connects circulating fan 6, and the gas circulation that circulating fan 6 is used to quicken in the treatment chamber 8 flows and mixing.Because the nitrogen gas concn in the treatment chamber 8 is very high, for the ease of Equipment Inspection, top at circulating fan 6 also is equipped with the ventilation valve, for example: operated pneumatic valve 15, when opening operated pneumatic valve 15, can replenish air fast and enter treatment chamber 8, enter treatment chamber 8 and carry out Equipment Inspection thereby be convenient to personnel.
For preventing apparatus overload, between the pipeline of bi-bit bi-pass reversal valve 1 and circulating fan 6, also be connected with two position two-way valve 16.
Before equipment operation, gas is the ultra-clean chamber air in the treatment chamber 8.At first open switch valve 10, pressure regulating valve 11, bi-bit bi-pass reversal valve 1 on the nitrogen transfer pipeline by automatic control system 3, open the vent valve 14 on the treatment chamber 8 simultaneously, pressure detecting meter 5, and circulating fan 6, fill nitrogen fast, air in the treatment chamber 8 is discharged, the gas of treatment chamber 8 is under the effect of circulating fan 6, circulate, mix.When oxygen content reaches certain set point in the treatment chamber 8, for example, be lower than 50ppm, when particularly being lower than 30ppm, control system 3 is closed one of them bi-bit bi-pass reversal valve 1 by the control electromagnetically operated valve, keeps the bi-bit bi-pass reversal valve 1 that is connected with flowmeter 2, under flowmeter 2 guides, fill nitrogen.Under the effect of circulating fan 6, gas in the process chamber 8 constantly circulates, be accompanied by flowing of nitrogen, constantly the gas that drives in the process chamber 8 enters oxygen analyser 4, thereby in oxygen analyser 4, constantly compare with the standard content value of setting, thereby analyze the ratio of standard content and sample gas, and then constantly detect the oxygen concentration of microenvironment, when oxygen concentration is lower than a setting threshold, for example be lower than 30ppm, be preferably 10ppm, when the best was 5ppm, system closed vent valve 14 automatically.Oxygen analyser 4 can monitor, detect oxygen concentration in the microenvironment constantly, thereby accurately control replenishes nitrogen, keeps the environment oxygen concentration.When oxygen concentration was lower than 30ppm, control system was closed vent valve 14 automatically, and control system control is 100-500L/min by the nitrogen flow of flowmeter 2, preferably reached 100-200L/min by flowmeter 2 control nitrogen flows.When pressure was higher than 5000mTorr, system opened two position two-way valve 16 automatically, plays overload protective function; promptly the pressure that detects in the process chamber 8 when pressure detecting meter 5 is excessive; be air inlet when excessive, control system is directly discharged unnecessary air inlet from valve 16 automatically, thereby plays overload protective function.
During this equipment operation, sample gas in the treatment chamber 8, constantly circulate, be accompanied by flowing of nitrogen, constantly the gas that drives in the process chamber 8 enters oxygen analyser 4, thereby in oxygen analyser 4, constantly compare with the standard content value of setting, thereby analyze the ratio of standard content and sample gas, and then constantly detect the oxygen concentration of microenvironment, when oxygen concentration is lower than certain set point (as 30ppm), control system 3 is accurately controlled nitrogen flow in the air inlet pipeline by flowmeter 2, thereby guarantees the oxygen concentration in the process chamber 8.
When the Equipment Inspection maintenance, in the time of need opening treatment chamber 8 hatch doors, open the operated pneumatic valve 15 of vent valve 14 and circulating fan 6 upwinds, replenish air fast, discharge the nitrogen in the treatment chamber 8, through oxygen analyser 4 to oxygen concentration when reaching the degree of breathing for the staff, for example 18%, can open hatch door, enter personnel's maintenance.
The advantage of present embodiment is, the oxygen content in the checkout equipment microenvironment effectively, thus effectively reduce the oxidation of wafer, further guaranteed the oxidation technology of wafer.Keep malleation in the treatment chamber, can effectively prevent from the gas of each sealing place of chamber and pollute impurity etc. to enter chamber, guaranteed cleanliness factor.Oxygen is analyzed closed-loop system can effectively detect, monitor O in the chamber
2Concentration had both guaranteed technological requirement, personal safety when having guaranteed maintenance again.Working pressure detects closed-loop system, can detect, supervise the force value of detection chambers effectively.When microenvironment air pressure was higher than the requirement higher limit, control system 3 can make two position two-way valve 16 open automatically, guaranteed the stable of pressure.Circulating fan can guarantee its uniformity so that the gas in the microenvironment fully mixes.The operated pneumatic valve 15 of upwind is the replenish air valve, when system needs repairing in the microenvironment, utilizes the high pumping rate of blower fan upwind, makes air enter fast, has saved the maintenance stand-by period.Adopt the main and side road air feed, main road replenishes nitrogen fast, bypass fine setting control, thereby the process conditions of better meeting.
The above only is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (9)
1. low-oxygen control system, comprise the nitrogen gas conveying device, circulating fan and the treatment chamber that connect successively, it is characterized in that, described treatment chamber outside also is connected with circulation line and oxygen analyser, one arrival end of described oxygen analyser is connected with nitrogen gas conveying device, and the ventilation valve also is installed on the described circulating fan.
2. low-oxygen control system as claimed in claim 1 is characterized in that, is connected with gas exhaust piping on the described treatment chamber, includes control valve on the described nitrogen gas conveying device.
3. low-oxygen control system as claimed in claim 2 is characterized in that, on the described gas exhaust piping vent valve is installed.
4. low-oxygen control system as claimed in claim 3 is characterized in that, also comprises control system, and an end of described control system is connected with oxygen analyser, and the other end is connected with control valve on the described nitrogen gas conveying device, and described vent valve is connected with control system.
5. low-oxygen control system as claimed in claim 4 is characterized in that, the control valve on the described nitrogen gas conveying device is the bi-bit bi-pass reversal valve of two parallel connections.
6. low-oxygen control system as claimed in claim 5 is characterized in that, the rear portion of one of bi-bit bi-pass reversal valve of described two parallel connections also is connected with flowmeter.
7. low-oxygen control system as claimed in claim 6 is characterized in that described chamber also is connected with pressure-detecting device, and described pressure-detecting device is connected with control system.
8. low-oxygen control system as claimed in claim 7 is characterized in that, filter and heat exchanger also are installed in the described treatment chamber, also is connected with two position two-way valve between the pipeline of described control valve and circulating fan.
9. as each described low-oxygen control system among the claim 1-8, it is characterized in that also comprise the vertical oxidation device, the top of described treatment chamber is connected with the fire door of vertical oxidation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202918188U CN201623010U (en) | 2009-12-31 | 2009-12-31 | Low-oxygen control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202918188U CN201623010U (en) | 2009-12-31 | 2009-12-31 | Low-oxygen control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623010U true CN201623010U (en) | 2010-11-03 |
Family
ID=43026466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202918188U Expired - Lifetime CN201623010U (en) | 2009-12-31 | 2009-12-31 | Low-oxygen control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623010U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789359B (en) * | 2009-12-31 | 2012-03-07 | 北京七星华创电子股份有限公司 | Low-oxygen control system |
| CN115948243A (en) * | 2022-09-30 | 2023-04-11 | 河北医科大学第二医院 | Special low oxygen workstation of high connotation |
-
2009
- 2009-12-31 CN CN2009202918188U patent/CN201623010U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789359B (en) * | 2009-12-31 | 2012-03-07 | 北京七星华创电子股份有限公司 | Low-oxygen control system |
| CN115948243A (en) * | 2022-09-30 | 2023-04-11 | 河北医科大学第二医院 | Special low oxygen workstation of high connotation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101789359B (en) | Low-oxygen control system | |
| US9099505B2 (en) | Thermal processing apparatus and cooling method | |
| CN100470434C (en) | Device and method for controlling atmosphere content and pressure balance in negative pressure container | |
| WO2022041544A1 (en) | Closed-type proton-exchange membrane fuel cell system housing ventilation and drainage apparatus | |
| KR950007481B1 (en) | Vacuum processing equipment | |
| CN201623010U (en) | Low-oxygen control system | |
| CN102881615B (en) | Heat treating equipment and method for semiconductor chip | |
| JP2002257474A (en) | High efficiency cooling type heat treatment apparatus | |
| KR20210105817A (en) | Inspection apparatus | |
| CN109487025B (en) | Furnace top nitrogen system | |
| CN209368309U (en) | A kind of furnace roof nitrogen system | |
| WO2023025001A1 (en) | Gas supply system of fuel cell, and gas supply method | |
| CN115790148A (en) | Automatic exhaust method and automatic exhaust equipment for lithium iron phosphate roller kiln | |
| CN212925088U (en) | Nitrogen annealing furnace | |
| CN213984508U (en) | Atmosphere sintering furnace structure | |
| CN103727778B (en) | Vertical oxidizing furnace process door cooling method and device used in wet oxidation process | |
| KR200264825Y1 (en) | Exhaust system of a rapid thermal processing chamber | |
| CN113426240B (en) | Electric heating type semiconductor waste gas treatment equipment and cooling method thereof | |
| JP2022143759A (en) | Substrate processing device and manufacturing method of semiconductor device | |
| CN211739607U (en) | Cooling device of thermogravimetric analyzer | |
| CN219037554U (en) | Stable control system for top temperature of gas-based shaft furnace | |
| CN105300746A (en) | Nuclear power plant reactor containment air sampling device and method | |
| CN219243354U (en) | Float glass manufacturing device and slag box waste gas emission adjusting device | |
| CN205367725U (en) | Purification heating device of system of oxygenerator group | |
| CN201081534Y (en) | Oxidation oven capable of preventing halt due to insufficient air drafting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20101103 Effective date of abandoning: 20091231 |