CN101789359B - Low-oxygen control system - Google Patents
Low-oxygen control system Download PDFInfo
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- CN101789359B CN101789359B CN2009102607677A CN200910260767A CN101789359B CN 101789359 B CN101789359 B CN 101789359B CN 2009102607677 A CN2009102607677 A CN 2009102607677A CN 200910260767 A CN200910260767 A CN 200910260767A CN 101789359 B CN101789359 B CN 101789359B
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Abstract
The invention relates to the field of semiconductor production devices and discloses a low-oxygen control system comprising a nitrogen gas conveying device, a circulating fan and a treatment chamber which are connected in sequence, wherein the outside of the treatment chamber is also connected with a circulating pipe and an oxygen analyzer; the other inlet of the oxygen analyzer is connected with the nitrogen gas conveying device; and the circulating fan is also provided with an air ventilating valve. The low-oxygen control system can control the oxygen concentration of a relative space (microenvironment), thereby effectively controlling the natural oxygen condition of a chip.
Description
Technical field
The invention belongs to the semiconductor production field, be specifically related to the low-oxygen control system in a kind of wafer oxidation technology.
Background technology
In semiconductor production, often need through heat treatment step.After heat treatment, the nearly superficial layer of wafer forms a locality protection layer that does not have defective, and in the semiconductor fabrication process, the heat treated target of wafer is by thickness requirement growth zero defect, uniform film.So-called film is a kind of thin solid matter of on substrate, growing, and this tunic can be conductor, megohmite insulant or semi-conducting material.Film can be silicon dioxide (SiO
2), silicon nitride (Si
3N
4) polysilicon and metal etc.
SiO
2It is intrinsic (pure) vitreum with 1732 ℃ of melting temperatures.The SiO of heat growth
2Can tightly stick on the silicon substrate, and have good dielectric property.Silicon face always covers one deck SiO
2, this is because wafer as long as in air, expose, will form the natural oxide film of several atomic layers above that at once.Even be exposed to for a long time under 25 ℃ the room temperature, it is right that the thickness of this layer oxide-film also can only reach 40 Izods.This oxide is uneven, in semiconductor technology, often is considered to kind of a pollutant.The influence of natural oxidizing layer has brought challenge for the thin-film technique technology, and for the very thin technology of film thickness, the variation that the crystal column surface oxygen molecule brings to film thickness will obviously influence the performance of microtransistor.
Therefore, all need in the space that can control oxygen concentration, get sheet before the heat treatment of wafer and after the heat treatment, pass the sheet operation.
Summary of the invention
The objective of the invention is to overcome defective of the prior art, design a kind of low-oxygen control system, control the oxygen concentration in the space (being microenvironment), thus the autoxidation situation of effective control wafer.
For realizing above-mentioned purpose; Technical scheme of the present invention provides a kind of low-oxygen control system; Comprise the nitrogen gas conveying device, circulating fan and the treatment chamber that connect successively, wherein, said treatment chamber outside also is connected with circulation line and oxygen analyser; Another arrival end of said oxygen analyser is connected with nitrogen gas conveying device, and the ventilation valve also is installed on the said circulating fan.
Wherein, be connected with gas exhaust piping on the said treatment chamber, on the said gas exhaust piping vent valve be installed, include control valve on the said nitrogen gas conveying device.
Wherein, also comprise control system, an end of said control system is connected with oxygen analyser, and the other end is connected with control valve on the said nitrogen gas conveying device, and said vent valve is connected with control system.
Wherein, the control valve on the said nitrogen gas conveying device is the bi-bit bi-pass reversal valve of two parallel connections.
Wherein, the rear portion of one of bi-bit bi-pass reversal valve of said two parallel connections also is connected with flowmeter.
Wherein, said chamber also is connected with pressure-detecting device, and said pressure-detecting device is connected with control system.
Wherein, filter and heat exchanger are installed also in the said treatment chamber, also are connected with two position two-way valve between the pipeline of said control valve and circulating fan.
Wherein, also comprise the vertical oxidation device, the top of said treatment chamber is connected with the fire door of vertical oxidation.
The method of controlling operation thereof of low-oxygen control system may further comprise the steps:
(1) the bi-bit bi-pass reversal valve of two parallel connections and vent valve and the oxygen analyser on the gas exhaust piping on ON cycle blower fan, the nitrogen gas conveying device replenish nitrogen and the gas of discharging in the treatment chamber simultaneously;
When (2) oxygen concentration in the said treatment chamber was lower than 50ppm, system closed a bi-bit bi-pass reversal valve automatically, kept the bi-bit bi-pass reversal valve that links to each other with flowmeter and opened;
When (3) oxygen concentration in the said treatment chamber was lower than 30ppm, control system was closed vent valve automatically, and control system control is 100-500L/min through the nitrogen flow of flowmeter;
When (4) pressure in the said treatment chamber was higher than 5000mTorr, system opened two position two-way valve automatically.
Wherein, in the said step (2), when oxygen concentration was lower than 30ppm, system closed a bi-bit bi-pass reversal valve automatically, kept the bi-bit bi-pass reversal valve that links to each other with flowmeter and opened; When oxygen concentration was lower than 10ppm in said (3), control system was closed vent valve automatically, and control system control is 100-200L/min through the nitrogen flow of flowmeter.
Advantage of the present invention and beneficial effect are: the oxidation program after sheet, film releasing program and the heat treatment of getting before the heat treatment of wafer is placed in the microenvironment that can control oxygen concentration carries out, thereby effectively reduce the oxidation of wafer.
Description of drawings
Fig. 1 is the systematic schematic diagram of low-oxygen control system of the present invention.
Among the figure:
1, bi-bit bi-pass reversal valve; 2, flowmeter; 3, control system; 4, oxygen analyser; 5, pressure detecting meter; 6, circulating fan; 7, filter; 8, treatment chamber; 9, heat exchanger; 10, switch valve; 11, pressure regulating valve; 12, Pressure gauge; 13, triple valve; 14, vent valve; 15: operated pneumatic valve; 16: two position two-way valve.
Embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention further describes.Following examples only are used for technical scheme of the present invention more clearly is described, and can not limit protection scope of the present invention with this.
Microenvironment is meant, in the equipment before the wafer heat treatment and after the heat treatment, and the environment that is exposed, promptly wafer is got the environment of sheet, oxidation among the present invention in treatment chamber.Preferably, the heat treatment of wafer is in vertical heat processing apparatus, to carry out.Hypoxemia among the present invention refers to that promptly oxygen concentration is lower than 10ppm.
Shown in accompanying drawing 1; Low-oxygen control system according to the scheme of inventing practical implementation; Comprise the nitrogen gas conveying device, circulating fan 6 and the treatment chamber 8 that connect successively, treatment chamber 8 is the containers that volume is very big, and treatment chamber 8 outsides also are connected with circulation line; Opening is arranged at its top, and its opening is connected with the fire door of vertical heat processing apparatus.
The position that treatment chamber 8 is connected with circulating fan 6 is equipped with filter 7, and treatment chamber 8 outsides also are connected with circulation line, and filter 7 is used to filter the gas that has been transported in the treatment chamber 8.With filter 7 relative ends heat exchanger 9 is installed, heat exchanger 9 is used for the exchange heat in the treatment chamber 8.Also be connected with gas exhaust piping on the treatment chamber 8, be connected with vent valve 14 on the gas exhaust piping, gas unnecessary in the treatment chamber 8 is discharged through the vent valve pipeline.Nitrogen gas conveying device is mainly pipeline and carries, and pipeline and nitrogen gas generation device (for example purity nitrogen jar, connections such as nitrogen production factory building) are connected with switch valve 10, pressure regulating valve 11 (being preferably the pressure regulating valve of 100psi) in turn so that supplying nitrogen on the pipeline.
Also be connected with pressure-detecting device on the treatment chamber 8, for example the pressure detecting meter 5, and pressure detecting meter 5 is used to detect the pressure in the treatment chamber 8, and the force value that pressure detecting meter 5 records flows to control system 3.Control system 3 is connected with an electromagnetically operated valve group, and through the bi-bit bi-pass reversal valve 1 of electromagnetically operated valve group control parallel connection and the switching of two position two-way valve 16, flowmeter 2 is controlled its flow through control system 3.The pipeline rear end that the bi-bit bi-pass reversal valve 1 of two parallel connections is formed connects circulating fan 6, and the gas circulation that circulating fan 6 is used to quicken in the treatment chamber 8 flows and mixing.Because the nitrogen gas concn in the treatment chamber 8 is very high; For the ease of Equipment Inspection; Top at circulating fan 6 also is equipped with the ventilation valve, for example: and operated pneumatic valve 15, when opening operated pneumatic valve 15; Can replenish air fast and get into treatment chamber 8, get into treatment chamber 8 and carry out Equipment Inspection thereby be convenient to personnel.
For preventing apparatus overload, between the pipeline of bi-bit bi-pass reversal valve 1 and circulating fan 6, also be connected with two position two-way valve 16.
Before equipment operation, gas is the ultra-clean chamber air in the treatment chamber 8.At first open switch valve 10, pressure regulating valve 11, bi-bit bi-pass reversal valve 1 on the nitrogen transfer pipeline, open the vent valve 14 on the treatment chamber 8 simultaneously, pressure detecting meter 5 through automatic control system 3; And circulating fan 6; Fill nitrogen fast, air in the treatment chamber 8 is discharged, the gas of treatment chamber 8 is under the effect of circulating fan 6; Circulate, mix.When oxygen content reaches certain set point in the treatment chamber 8, for example, be lower than 50ppm; When particularly being lower than 30ppm; Control system 3 is closed one of them bi-bit bi-pass reversal valve 1 through the control electromagnetically operated valve, keeps the bi-bit bi-pass reversal valve 1 that is connected with flowmeter 2; Under flowmeter 2 guides, fill nitrogen.Under the effect of circulating fan 6, the gas in the process chamber 8 constantly circulates, and is accompanied by flowing of nitrogen; The gas that constantly drives in the process chamber 8 gets into oxygen analyser 4, thereby in oxygen analyser 4, constantly compares with the standard content value of setting, thereby analyzes the ratio of standard content and sample gas; And then constantly detect the oxygen concentration of microenvironment; When oxygen concentration is lower than a setting threshold, for example be lower than 30ppm, be preferably 10ppm; When the best was 5ppm, system closed vent valve 14 automatically.Oxygen concentration in the microenvironment can be kept watch on, detected to oxygen analyser 4 constantly, thereby accurately control replenishes nitrogen, keeps the environment oxygen concentration.When oxygen concentration was lower than 30ppm, control system was closed vent valve 14 automatically, and control system control is 100-500L/min through the nitrogen flow of flowmeter 2, preferably reached 100-200L/min through flowmeter 2 control nitrogen flows.When pressure was higher than 5000mTorr, system opened two position two-way valve 16 automatically, plays overload protective function; The pressure that promptly detects in the process chamber 8 when pressure detecting meter 5 is excessive; Be air inlet when excessive, control system is directly discharged unnecessary air inlet from valve 16 automatically, thereby plays overload protective function.
During this equipment operation, the sample gas in the treatment chamber 8 constantly circulates; Be accompanied by flowing of nitrogen; The gas that constantly drives in the process chamber 8 gets into oxygen analyser 4, thereby in oxygen analyser 4, constantly compares with the standard content value of setting, thereby analyzes the ratio of standard content and sample gas; And then constantly detect the oxygen concentration of microenvironment; When oxygen concentration is lower than certain set point (like 30ppm), control system 3 is accurately controlled the nitrogen flow in the air inlet pipeline through flowmeter 2, thereby guarantees the oxygen concentration in the process chamber 8.
When the Equipment Inspection maintenance, in the time of need opening treatment chamber 8 hatch doors, open the operated pneumatic valve 15 of vent valve 14 and circulating fan 6 upwinds; Replenish air fast; Discharge the nitrogen in the treatment chamber 8, through oxygen analyser 4 to oxygen concentration reach when supplying degree that the staff breathes for example 18%; Can open hatch door, entering personnel maintenance.
The advantage of present embodiment is, the oxygen content in the checkout equipment microenvironment effectively, thus effectively reduce the oxidation of wafer, further guaranteed the oxidation technology of wafer.Keep malleation in the treatment chamber, the gas that can effectively prevent each seals at of chamber with pollute impurity etc. and get into chamber, guaranteed cleanliness factor.Oxygen is analyzed closed-loop system can effectively detect, monitor O in the chamber
2Concentration had both guaranteed technological requirement, personal safety when having guaranteed maintenance again.Working pressure detects closed-loop system, can detect, supervise the force value of detection chambers effectively.When microenvironment air pressure was higher than the requirement higher limit, control system 3 can make two position two-way valve 16 open automatically, guaranteed the stable of pressure.Circulating fan can guarantee its uniformity so that the gas in the microenvironment fully mixes.The operated pneumatic valve 15 of upwind is the replenish air valve, when system needs repairing in the microenvironment, utilizes the high pumping rate of blower fan upwind, makes air get into fast, has saved the maintenance stand-by period.Adopt the main and side road air feed, main road replenishes nitrogen fast, bypass fine setting control, thereby the process conditions of better meeting.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (8)
1. low-oxygen control system; Comprise the nitrogen gas conveying device, circulating fan and the treatment chamber that connect successively; It is characterized in that; Said treatment chamber outside also is connected with circulation line and oxygen analyser, and an arrival end of said oxygen analyser is connected with nitrogen gas conveying device, and the ventilation valve also is installed on the said circulating fan;
Be connected with gas exhaust piping on the said treatment chamber, on the said gas exhaust piping vent valve be installed, include control valve on the said nitrogen gas conveying device;
Said low-oxygen control system also comprises control system, and an end of said control system is connected with oxygen analyser, and the other end is connected with control valve on the said nitrogen gas conveying device, and said vent valve is connected with control system.
2. low-oxygen control system as claimed in claim 1 is characterized in that, the control valve on the said nitrogen gas conveying device is the bi-bit bi-pass reversal valve of two parallel connections.
3. low-oxygen control system as claimed in claim 2 is characterized in that, the rear portion of one of bi-bit bi-pass reversal valve of said two parallel connections also is connected with flowmeter.
4. low-oxygen control system as claimed in claim 3 is characterized in that said chamber also is connected with pressure-detecting device, and said pressure-detecting device is connected with control system.
5. low-oxygen control system as claimed in claim 4 is characterized in that, filter and heat exchanger also are installed in the said treatment chamber, also is connected with two position two-way valve between the pipeline of said control valve and circulating fan.
6. like each described low-oxygen control system among the claim 1-5, it is characterized in that also comprise the vertical oxidation device, the top of said treatment chamber is connected with the fire door of vertical oxidation.
7. a method of controlling operation thereof that is used for the low-oxygen control system of claim 5 is characterized in that, may further comprise the steps:
(1) the bi-bit bi-pass reversal valve of two parallel connections and vent valve and the oxygen analyser on the gas exhaust piping on ON cycle blower fan, the nitrogen gas conveying device replenish nitrogen and the gas of discharging in the treatment chamber simultaneously;
When (2) oxygen concentration in the said treatment chamber was lower than first threshold, control system was closed a bi-bit bi-pass reversal valve automatically, kept the bi-bit bi-pass reversal valve that links to each other with flowmeter and opened;
When (3) oxygen concentration in the said treatment chamber was lower than second threshold value, control system was closed vent valve automatically, and control system control is 100-500L/min through the nitrogen flow of flowmeter;
When (4) pressure in the said treatment chamber was higher than set point, system opened two position two-way valve automatically.
8. the method for controlling operation thereof of low-oxygen control system as claimed in claim 7 is characterized in that, the first threshold of said oxygen concentration is 30ppm, and second threshold value of said oxygen concentration is 10ppm, and the set point of said pressure is 5000mTorr.
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| CN2009102607677A CN101789359B (en) | 2009-12-31 | 2009-12-31 | Low-oxygen control system |
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Families Citing this family (9)
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|---|---|---|---|---|
| CN102261829A (en) * | 2011-04-30 | 2011-11-30 | 王幸正 | Oxygen control system for pole plate dryer |
| CN102881615B (en) * | 2011-07-14 | 2015-05-27 | 北京七星华创电子股份有限公司 | Heat treating equipment and method for semiconductor chip |
| CN103760929B (en) * | 2013-12-31 | 2017-08-22 | 北京七星华创电子股份有限公司 | A kind of silicon chip bearing area Control for Oxygen Content method of semiconductor equipment |
| CN104131351B (en) * | 2014-07-29 | 2017-12-15 | 北京大学东莞光电研究院 | A kind of industrialized unit and method for preparing nitride single crystal material |
| CN106449487B (en) * | 2016-10-28 | 2019-07-09 | 北京北方华创微电子装备有限公司 | A kind of control oxygen control pressure system of the processing chamber housing of semiconductor equipment |
| CN107871678A (en) * | 2017-11-13 | 2018-04-03 | 上海华力微电子有限公司 | A kind of vacuum monitoring method of vacuum monitoring system and polycrystalline silicon furnace tube board |
| CN108588667B (en) * | 2017-12-27 | 2020-10-02 | 深圳市华星光电技术有限公司 | Air charging device and air charging method for vacuum atmosphere conversion cavity and vacuum sputtering equipment |
| CN110797278B (en) * | 2018-08-01 | 2022-05-27 | 北京北方华创微电子装备有限公司 | Microenvironment pressure control system, semiconductor processing equipment and microenvironment pressure control method |
| CN116705657A (en) * | 2023-06-09 | 2023-09-05 | 上海稷以科技有限公司 | Oxygen concentration control system and control method |
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Address after: 100015 Jiuxianqiao Chaoyang District, East Beijing Road, building M2, floor 1, No. 2 Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
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Effective date of registration: 20180330 Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 Jiuxianqiao Chaoyang District, East Beijing Road, building M2, floor 1, No. 2 Patentee before: North China Science and technology group Limited by Share Ltd. |