CN201613681U - Copper and aluminum composite metal plate and strip - Google Patents
Copper and aluminum composite metal plate and strip Download PDFInfo
- Publication number
- CN201613681U CN201613681U CN2010203014639U CN201020301463U CN201613681U CN 201613681 U CN201613681 U CN 201613681U CN 2010203014639 U CN2010203014639 U CN 2010203014639U CN 201020301463 U CN201020301463 U CN 201020301463U CN 201613681 U CN201613681 U CN 201613681U
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- copper
- aluminum
- composite metal
- strip
- metal plate
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Abstract
The utility model discloses a copper and aluminum composite metal plate and strip, which comprises an aluminum basal body layer, wherein at least one of the upper surface and the lower surface of the aluminum basal body layer is uniformly composited with a copper covering layer, the thickness of the aluminum basal body layer ranges from 1 mm to 12 mm, and the thickness of the copper covering layer ranges from 0.1 mm to 2 mm. The copper and aluminum composite metal plate and strip provided by the utility model has good surface quality, strong bonding strength of the copper covering layer and the aluminum basal body layer, light weight, good electrical conductivity and thermal conductivity and strong corrosion resistance; the electric conductivity is between the electric conductivities of copper and aluminum, and the mechanical property is between the mechanical properties of copper and aluminum; and the original surface quality of a cooper plate and strip is remained, so that the copper and aluminum composite metal plate and strip can be further processed in a cold rolling manner, thereby achieving low cost and price. The copper and aluminum composite metal plate and strip provided by the utility model can be extensively applied to such high-tech fields as military industry, aerospace, electronic computers and electronic components, as well as electric power, high-low voltage electric equipment, automation and building industries.
Description
Technical field
The utility model belongs to the bimetal strip technical field, is specifically related to a kind of copper, aluminum composite metal strip.
Background technology
Copper and aluminium are important non-ferrous metals, are widely used in industry, military affairs, field such as civilian.Copper has favorable conductive, heat conduction, corrosion-resistant, bacteriostasis property, and aluminium has favorable conductive, heat conductivility.Copper and aluminium are compared, and bauxite resource is abundant, the copper shortage of resources, and aluminium to have proportion little, advantages such as low price.In application facet, there is the cost height in simple copper coin band, shortcomings such as Heavy Weight, and simple aluminium sheet band then exists perishable, and fungistatic effect is poor, and mechanical strength is low, problems such as poor toughness.
The utility model content
The purpose of this utility model provides a kind of conduction, heat conduction, and decay resistance, deep processing are functional, and surface quality is good, and is in light weight, and low copper, the aluminum composite metal strip of cost.
In order to realize above purpose, the technical scheme that the utility model adopted is: a kind of copper, aluminum composite metal strip, comprise the aluminum substrate layer, one side at least in the upper and lower faces of aluminum substrate layer evenly is compounded with copper capping layer, the thickness of aluminum substrate layer is 1～12mm, and the thickness of copper capping layer is 0.1～2mm.
Further, the upper and lower faces of described aluminum substrate layer all evenly is compounded with copper capping layer.
The copper that the utility model provides, aluminum composite metal strip have been concentrated the high chemical stability of the high conduction performance of aluminium, in light weight, low cost and copper, and lower advantages such as contact resistance are a kind of novel conductor material and ornament materials.The copper that the utility model provides, aluminum composite metal strip are utilized solid-liquid phase composite principle, make through anaerobic continuous casting and rolling technology, anaerobic continuous casting and rolling technology be meant liquid aluminium in the roll-type crystallizer behind the semi-solidification and solid-state copper strip through Rolling Production aluminium and copper composite metal band.
Copper of the present utility model, aluminum composite metal strip surface quality are good, in light weight, conduction, good heat conductivity, decay resistance is strong, the bond strength height of copper and aluminium, bond strength 〉=100MPa can carry out cold rolling deep processing, and electrical conductivity is between copper, aluminium, mechanical property is between copper, the aluminium mechanical property, and kept copper coin band original surface quality, cost is low, low price.The copper that the utility model provides, aluminum composite metal strip can be widely used in high-tech areas such as military project, Aero-Space, electronic computer, electronic devices and components and electric power, high and low voltage electrical equipment, automation, building trade.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation of the utility model embodiment 2.
The specific embodiment
Embodiment 1
As shown in Figure 1, the copper that the utility model provides, aluminum composite metal strip comprise aluminum substrate layer 1, and arbitrary in the upper and lower faces of aluminum substrate layer 1 evenly is compounded with copper capping layer 2, the thickness of aluminum substrate layer 1 is 1～12mm, and the thickness of copper capping layer 2 is 0.1～2mm.
As shown in Figure 2, the copper that the utility model provides, aluminum composite metal strip comprise aluminum substrate layer 1, and the upper and lower faces of aluminum substrate layer 1 all evenly is compounded with copper capping layer 2, and the thickness of aluminum substrate layer 1 is 1～12mm, and the thickness of copper capping layer 2 is 0.1～2mm.
Claims (2)
1. a copper, aluminum composite metal strip, it is characterized in that: comprise the aluminum substrate layer, the one side at least in the upper and lower faces of described aluminum substrate layer evenly is compounded with copper capping layer, and the thickness of described aluminum substrate layer is 1～12mm, and the thickness of copper capping layer is 0.1～2mm.
2. copper according to claim 1, aluminum composite metal strip is characterized in that: the upper and lower faces of described aluminum substrate layer evenly is compounded with copper capping layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203014639U CN201613681U (en) | 2010-01-25 | 2010-01-25 | Copper and aluminum composite metal plate and strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010203014639U CN201613681U (en) | 2010-01-25 | 2010-01-25 | Copper and aluminum composite metal plate and strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201613681U true CN201613681U (en) | 2010-10-27 |
Family
ID=43000053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010203014639U Expired - Lifetime CN201613681U (en) | 2010-01-25 | 2010-01-25 | Copper and aluminum composite metal plate and strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201613681U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102205346A (en) * | 2011-04-28 | 2011-10-05 | 上海交通大学 | Method for preparing copper-aluminum-copper compound board |
| CN109807571A (en) * | 2019-03-27 | 2019-05-28 | 江苏扬铜新材料有限公司 | A kind of complex copper band and preparation method thereof |
-
2010
- 2010-01-25 CN CN2010203014639U patent/CN201613681U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102205346A (en) * | 2011-04-28 | 2011-10-05 | 上海交通大学 | Method for preparing copper-aluminum-copper compound board |
| CN109807571A (en) * | 2019-03-27 | 2019-05-28 | 江苏扬铜新材料有限公司 | A kind of complex copper band and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101027 |
|
| CX01 | Expiry of patent term |