CN201608895U - Anti-interference capacitor type microphone - Google Patents
Anti-interference capacitor type microphone Download PDFInfo
- Publication number
- CN201608895U CN201608895U CN2009200301179U CN200920030117U CN201608895U CN 201608895 U CN201608895 U CN 201608895U CN 2009200301179 U CN2009200301179 U CN 2009200301179U CN 200920030117 U CN200920030117 U CN 200920030117U CN 201608895 U CN201608895 U CN 201608895U
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- China
- Prior art keywords
- signal amplifying
- wiring board
- amplifying apparatus
- amplifying device
- conducting resinl
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses an anti-interference capacitor type microcomputer, which comprises a circuit board and an outer casing. A protection structure of the microphone is formed by the circuit board and the outer casing. A sound hole is arranged on the protection structure; a parallel plate capacitor component and a signal amplifying device are installed inside the protection structure; two electrodes of the parallel plate capacitor component are respectively electrically connected with the signal amplifying device; insulation glue is wrapped outside the signal amplifying device; and conductive glue electrically connected to a grounding circuit on the circuit board is arranged outside the insulation glue. The grounding conductive glue can shield the signal amplifying device, and avoid influence of electromagnetic radiation generated by the signal amplifying device on an output electrode of the parallel plate capacitor component, thereby lowering sound signal quality, achieving high power supply rejection ratio performance and strong anti-interference performance, improving pushing-pulling force between the signal amplifying device and the circuit board, avoiding the problem of poor connection of circuits between the signal amplifying device and the circuit board when in welding and installing processes of the microphone.
Description
Technical field
The utility model relates to the anti-interference capacitor formula microphone that the transmission of a kind of good reliability, voice signal is clear, shield effectiveness is good.
Background technology
In recent years; a large amount of Electret Condencer Microphones is applied in the electronic products such as mobile phone, notebook; in order to receive the external sound signal and to convert the signal of telecommunication to; general Electret Condencer Microphone structure adopts an external conductive casing and a wiring board to form protection, shielding space; inside is equipped with a plane-parallel capacitor as sound-electrical switching device, and wiring board inside is equipped with signal amplifying apparatus such as FET, analogue amplifier or digital amplifier.Showed a kind of structural representation of Electret Condencer Microphone as Fig. 1; a wiring board 1 and a protection that has the external conductive casing 2 formation Electret Condencer Microphones in hole 21; shielding space; interior volume is equipped with a plane-parallel capacitor 3 as sound-electrical switching device; plane-parallel capacitor 3 comprises a fixing back pole plate 31; a shading ring 32 and a vibrating diaphragm assembly 33; interior volume also is equipped with a dead ring 4 and a conductive metal ring 5; dead ring 4 and conductive metal ring 5 are can be connected on the wiring board 1 by becket 5 and shell 2 conductions respectively for two electrode back pole plates 31 that guarantee plane-parallel capacitor 3 and vibrating diaphragm assembly 33, and respectively as the output electrode and the grounding electrode of Electret Condencer Microphone capacitance component.Signal amplifying apparatus 6 is installed on the wiring board 1, signal amplifying apparatus 6 is BGA encapsulation (Ball Grid ArrayPackage), utilize SMT (Surface Mounted Technology) technology welded and installed to wiring board 1 by a plurality of solder joints 61, and (technology that circuit is set on the wiring board is a known technology in the industry to the circuit on the connection line plate 1, circuit diagram is not shown), functions such as the signal amplification of realization Electret Condencer Microphone, conversion generally can be FET, analogue amplifier or digital amplifier etc.
Electret Condencer Microphone in this structure, signal amplifying apparatus itself can produce electromagnetic radiation at work, along with the size of Electret Condencer Microphone is more and more littler, distance between synchronous signal amplifying device outer surface and the Electret Condencer Microphone capacitance component output electrode is also more and more littler, the electromagnetic radiation of signal amplifying apparatus generation itself is increasing to the influence of Electret Condencer Microphone capacitance component output electrode like this, and Power Supply Rejection Ratio (PSR) performance is not high.Simultaneously, the technology of this signal amplifying apparatus of welded and installed in the circuit board also has other a lot of defectives, for example the anti-push-pull effort performance between wiring board and the signal amplifying apparatus is not enough, and general Electret Condencer Microphone also needs the process of a high-temperature soldering to electronic product, causes the scolding tin between wiring board and the signal amplifying apparatus to melt circuit bad connections such as rosin joint takes place once more in this process easily.
The utility model content
The utility model provides a kind of anti-interference capacitor formula microphone, technical problem to be solved is under the less situation of product size, thereby the electromagnetic radiation of avoiding signal amplifying apparatus itself to produce exerts an influence to Electret Condencer Microphone parallel plate capacitor assembly output electrode and reduces sound signal quality, Power Supply Rejection Ratio performance height, strong anti-interference performance; Simultaneously, improve the push-pull effort between signal amplifying apparatus and the wiring board, solve Electret Condencer Microphone causes producing between signal amplifying apparatus and the wiring board circuit bad connection in the welded and installed process problem.
For solving the problems of the technologies described above; the technical solution adopted in the utility model is: anti-interference capacitor formula microphone; comprise the wiring board that signal amplifying apparatus is installed; and the shell of an end opening; described wiring board and described shell form the protection structure of microphone; described protection structure is provided with the sound hole that is used to receive voice signal; described protection inside configuration is equipped with the parallel plate capacitor assembly; two electrodes of described parallel plate capacitor assembly are electrically connected the signal amplifying apparatus on the described wiring board respectively; and: described signal amplifying apparatus external packets is wrapped with insulating cement; described insulating cement outer setting has conducting resinl, and described conducting resinl is electrically connected to the earthed circuit on the described wiring board.Utilize this design, the conducting resinl of ground connection can the shielded signal amplifying device, the electromagnetic radiation of avoiding signal amplifying apparatus itself to produce exerts an influence to Electret Condencer Microphone parallel plate capacitor assembly output electrode, thereby reduces sound signal quality, Power Supply Rejection Ratio performance height, strong anti-interference performance; And can improve the push-pull effort between signal amplifying apparatus and the wiring board, avoid Electret Condencer Microphone in the welded and installed process, to cause producing between signal amplifying apparatus and the wiring board problem of circuit bad connection.
The improvement of the technical program is: described conducting resinl is arranged on described signal amplifying apparatus near on the surface of described parallel plate capacitor assembly one side.
The improvement of the technical program is: described conducting resinl is that the plane is provided with.
The improvement of the technical program is: described conducting resinl is silver slurry conducting resinl.
The improvement of the technical program is: the binding post of described signal amplifying apparatus is electrically connected described wiring board by metal wire.
The improvement of the technical program is: the binding post of described signal amplifying apparatus and described wiring board are welded to connect.
Owing to adopt technique scheme; anti-interference capacitor formula microphone; comprise the wiring board that signal amplifying apparatus is installed; and the shell of an end opening; described wiring board and described shell form the protection structure of microphone; described protection structure is provided with the sound hole that is used to receive voice signal; described protection inside configuration is equipped with the parallel plate capacitor assembly; two electrodes of described parallel plate capacitor assembly are electrically connected the signal amplifying apparatus on the described wiring board respectively; and: described signal amplifying apparatus external packets is wrapped with insulating cement; described insulating cement outer setting has conducting resinl, and described conducting resinl is electrically connected to the earthed circuit on the described wiring board.Utilize this design, the conducting resinl of ground connection can the shielded signal amplifying device, the electromagnetic radiation of avoiding signal amplifying apparatus itself to produce exerts an influence to Electret Condencer Microphone parallel plate capacitor assembly output electrode, thereby reduces sound signal quality, Power Supply Rejection Ratio performance height, strong anti-interference performance; Improve the push-pull effort between signal amplifying apparatus and the wiring board, and avoided Electret Condencer Microphone in the welded and installed process, to cause producing between signal amplifying apparatus and the wiring board problem of circuit bad connection.
Description of drawings
Fig. 1 is the structural representation of the utility model background technology;
Fig. 2 is the structural representation of the utility model case study on implementation one;
Fig. 3-Fig. 8 is the installation steps schematic diagram of the utility model case study on implementation one circuit board module;
Fig. 9 is the structural representation of the utility model case study on implementation two circuit board components.
Among the figure: 1. wiring board; 11. fixing colloid; 12. metal wire; 13. insulating cement; 14. conducting resinl; 15. wiring board earthed circuit; 2. metal shell; 21. sound hole; 3. parallel plate capacitor assembly; 31. pole plate; 32. shading ring; 33. vibrating diaphragm assembly; 4. dead ring; 5. conductive metal ring; 6. signal amplifying apparatus; 61. solder joint; 7. glue-pouring device.
Embodiment
Embodiment one:
Fig. 2 is the structural representation of the implementation case, and Fig. 3-Fig. 8 is the installation steps schematic diagram of the utility model case study on implementation circuit board module, and Fig. 8 detail display the structure of circuit board module among Fig. 2.Anti-interference capacitor formula microphone comprises the circuit board module that a circular wiring board 1 and signal amplifying apparatus 6 constitute; The circular groove shape metal shell 2 of one one end opening, the bottom of metal shell 2 are provided with the sound hole 21 that is used to receive voice signal; The openend of circuit board module and metal shell 2 is in conjunction with the protection structure that forms microphone, the protection inside configuration is equipped with a parallel plate capacitor assembly 3, parallel plate capacitor assembly 3 comprises a pole plate 31, (vibrating diaphragm assembly 33 generally comprises the fixedly becket of diaphragm edge of a diaphragm and for shading ring 32 and vibrating diaphragm assembly 33, be known technology in the industry), pole plate 31 and vibrating diaphragm assembly 33 form two electrodes of parallel plate capacitor assembly 3, and be electrically connected to wiring board 1 by conductive metal ring 5 and metal shell 2 respectively, wiring board 1 is provided with circuit and can be connected to signal amplifying apparatus 6 (design of circuit configuration on the wiring board belongs to known technology in the industry, do not represent among the figure), pass through plastic insulation ring 4 mutually insulateds between conductive metal ring 5 and the metal shell 2; Pole plate 31 is the output electrode of parallel plate capacitor assembly 3; Signal amplifying apparatus 6 is by the circuit on a plurality of metal wire 12 electrical interconnection plates 1, and signal amplifying apparatus 6 and metal wire 12 external packets are wrapped with insulating cement 13, and insulating cement 13 outer setting have the conducting resinl 14 that is electrically connected to earthed circuit 15 on the wiring board 1.
Utilize this design, the conducting resinl 14 of ground connection can shielded signal amplifying device 6, avoid signal amplifying apparatus 6 electromagnetic radiation that produce own that the output electrode 31 of Electret Condencer Microphone parallel plate capacitor assembly 3 is exerted an influence, thereby the reduction sound signal quality, Power Supply Rejection Ratio performance height, strong anti-interference performance; And can improve the push-pull effort between signal amplifying apparatus 6 and the wiring board 1, also avoid Electret Condencer Microphone in the welded and installed process, to cause producing between signal amplifying apparatus 6 and the wiring board 1 problem of circuit bad connection.
The circuit board module of this anti-interference capacitor formula microphone can be installed as Fig. 3-installation steps schematic diagram shown in Figure 8, and step is as follows:
A circular wiring board 1 is provided;
By fixing colloid 11 signal amplifying apparatus 6 is fixed on the wiring board 1;
By fixed (bonding) technology of nation with a plurality of electrodes of signal amplifying apparatus 6 by the circuit on a plurality of metal wire 12 electrical interconnection plates 1;
A both ends open, the predefined glue-pouring device 7 of shape are provided, be buckled in an openend of glue-pouring device 7 on the wiring board 1 and surround signal amplifying apparatus 6 and metal wire 12, pour into insulating cement 13 from another openend of glue-pouring device 7, make insulating cement 13 wrap up signal amplifying apparatus 6 and metal wires 12;
After solidifying, insulating cement 13 takes off glue-pouring device 7;
Coat conducting resinl 14 on the surface of insulating cement 13, and make conducting resinl 14 be electrically connected to earthed circuit 15 on the wiring board 1.
In the implementation case, signal amplifying apparatus 6 can be selected FET or analogue amplifier or digital amplifier.
In the implementation case, conducting resinl 14 is arranged on the relative zone of the output electrode-pole plate 31 of signal amplifying apparatus 6 and parallel-plate capacitance component 3, near parallel plate capacitor assembly 3.This is arranged on signal amplifying apparatus 6 and pole plate 31 relative zones with conducting resinl 14 and just can realizes effect, does not need large-area conducting resinl 14.
In the implementation case, the insulating cement 13 of the location that the output electrode-pole plate of signal amplifying apparatus 6 and parallel-plate capacitance component 3 31 is relative is the plane.This design can realize by the glue-pouring device 7 of setting solid shape, and the advantage of this design is, avoids insulating cement 13 to form too high height on signal amplifying apparatus 6 surfaces, thereby can improve the overall dimensions of product, and this is not hoped.
In the implementation case, the conducting resinl 14 preferred silver slurries that adopt, technology realizes comparatively simple and the better products effect is arranged.
Embodiment two:
Fig. 9 is the structural representation of the utility model case study on implementation two circuit board components.In the implementation case, signal amplifying apparatus 6 is for utilizing SMT technology welded and installed to wiring board 1 and be connected to circuit on the wiring board 1 by a plurality of solder joints 61, and utilize glue-pouring device 7 that the external packets of signal amplifying apparatus 6 is wrapped with insulating cement 13, coat conducting resinl 14 on the surface of insulating cement 13, and make conducting resinl 14 be electrically connected to earthed circuit 15 on the wiring board 1.Can realize the effect identical with case study on implementation one.
Claims (6)
1. anti-interference capacitor formula microphone; comprise the wiring board that signal amplifying apparatus is installed; and the shell of an end opening; described wiring board and described shell form the protection structure of microphone; described protection structure is provided with the sound hole that is used to receive voice signal; described protection inside configuration is equipped with the parallel plate capacitor assembly; two electrodes of described parallel plate capacitor assembly are electrically connected the signal amplifying apparatus on the described wiring board respectively; it is characterized in that: described signal amplifying apparatus external packets is wrapped with insulating cement; described insulating cement outer setting has conducting resinl, and described conducting resinl is electrically connected to the earthed circuit on the described wiring board.
2. anti-interference capacitor formula microphone according to claim 1 is characterized in that: described conducting resinl is arranged on described signal amplifying apparatus near on the surface of described parallel plate capacitor assembly one side.
3. anti-interference capacitor formula microphone according to claim 2 is characterized in that: described conducting resinl is that the plane is provided with.
4. anti-interference capacitor formula microphone according to claim 1 is characterized in that: described conducting resinl is silver slurry conducting resinl.
5. according to claim 1,2,3 or 4 described anti-interference capacitor formula microphones, it is characterized in that: the binding post of described signal amplifying apparatus is electrically connected described wiring board by metal wire.
6. according to claim 1,2,3 or 4 described anti-interference capacitor formula microphones, it is characterized in that: the binding post of described signal amplifying apparatus and described wiring board are welded to connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200301179U CN201608895U (en) | 2009-07-23 | 2009-07-23 | Anti-interference capacitor type microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200301179U CN201608895U (en) | 2009-07-23 | 2009-07-23 | Anti-interference capacitor type microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201608895U true CN201608895U (en) | 2010-10-13 |
Family
ID=42953595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200301179U Expired - Lifetime CN201608895U (en) | 2009-07-23 | 2009-07-23 | Anti-interference capacitor type microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201608895U (en) |
-
2009
- 2009-07-23 CN CN2009200301179U patent/CN201608895U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101013 |