CN201608204U - LED chip packaging structure - Google Patents
LED chip packaging structure Download PDFInfo
- Publication number
- CN201608204U CN201608204U CN2010291800526U CN201029180052U CN201608204U CN 201608204 U CN201608204 U CN 201608204U CN 2010291800526 U CN2010291800526 U CN 2010291800526U CN 201029180052 U CN201029180052 U CN 201029180052U CN 201608204 U CN201608204 U CN 201608204U
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- CN
- China
- Prior art keywords
- led chip
- glass cover
- transparent glass
- high transparent
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an LED chip packaging structure, which belongs to the technical field of semiconductor illuminating equipment and comprises a substrate. An LED chip is welded on the substrate, and the substrate is connected with positive and negative electrode pins of the LED chip; a reflective ring is arranged outside the LED chip; a high transparent glass cover is sleeved outside the reflective ring; the high transparent glass cover and the substrate are sealed; and fluorescent powder is uniformly coated on the inner wall of the high transparent glass cover. The utility model has the advantages of simple structure and reasonable design, the LED chip is directly welded on the heat radiating substrate, the distance between the LED chip and the glass cover is large, the heat radiating area is increased, the heat radiating efficiency is improved, the whole illuminating efficiency is improved, the packaging sealing is carried out in the inert gas environment, the gas not oxidized is filled in the glass cover, the fluorescent powder can not be oxidized under the protection of the inert gas, the attenuation of the fluorescent powder is decreased, and the service life of the LED is prolonged.
Description
Technical field
The utility model belongs to the semiconductor lighting apparatus technology, is specifically related to a kind of led chip encapsulating structure.
Background technology
The LED lamp is paid close attention to by deeply in the whole world as environmental protection in this century, the most energy-conservation third generation light fixture, along with the improvement of LED technology and the reduction of cost, in foreseeable future, led light source certainly will replace the light emitting source of lighting apparatus such as present bulb or fluorescent lamp or other display unit, and becomes most important luminescence component.Led light source constantly increases it owing to have characteristics such as volume is little, power consumption is low, long service life on the popularity of purposes.At present, luminous efficiency, the reduction light decay of various countries research institution for improving the LED light fixture studied at the various production links of LED light fixture manufacturing.
The utility model content
At problems of the prior art, the purpose of this utility model is to provide a kind of technical scheme of led chip encapsulating structure, improves the luminous efficiency of LED, reduces the generation of light decay, prolongs the useful life of LED.
Described a kind of led chip encapsulating structure, it is characterized in that comprising base material, welding is provided with led chip and connects the both positive and negative polarity pin on the base material, led chip is provided with taperedchromeplatedbezel outward, the outer socket of taperedchromeplatedbezel is provided with high transparent glass cover, sealing is provided with between high transparent glass cover and the base material, and high transparent glass cover inwall evenly applies fluorescent material.
Described a kind of led chip encapsulating structure, the material that it is characterized in that described taperedchromeplatedbezel is plastics, glass, pottery, and reflecting surface is through mirror process, and taperedchromeplatedbezel cooperates with the base material bonding.
Described a kind of led chip encapsulating structure is characterized in that described high transparent glass cover is dome-type, U type, camber.
Described a kind of led chip encapsulating structure is characterized in that after high transparent glass cover and the taperedchromeplatedbezel socket that bonding cooperates again.
Described a kind of led chip encapsulating structure is characterized in that being provided with between high transparent glass cover and the base material epoxy sealing and reinforces.
The utility model is simple in structure, reasonable in design; led chip directly is welded on the heat radiating material; and the spacing between led chip and the cloche is bigger, has increased area of dissipation, has improved radiating efficiency; improved whole luminous efficiency; encapsulation is to seal under the environment of inert gas, does not have the gas of oxidation in cloche, and fluorescent material can be not oxidized under the protection of inert gas; reduce the generation of fluorescent material light decay, prolonged the useful life of LED.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2-Fig. 4 is the different shape of high transparent glass cover.
Among the figure: 1-base material, 2-taperedchromeplatedbezel, 3-LED chip, the high transparent glass cover of 4-, 5-fluorescent material.
Embodiment
Below in conjunction with accompanying drawing the utility model is further described.
A kind of led chip encapsulating structure as shown in the figure comprises base material 1, and welding is provided with led chip 3 and connects the both positive and negative polarity pin on the base material 1, and led chip 3 directly welding is arranged on the heat radiating material, has improved radiating efficiency.Led chip 3 is outer to be provided with taperedchromeplatedbezel 2, and the material of taperedchromeplatedbezel 2 is plastics, glass, pottery etc., and reflecting surface is through mirror process, bright and clean on the reflecting surface, inviolateness.Taperedchromeplatedbezel 2 cooperates with base material 1 bonding, high transparent glass cover 4 is set in taperedchromeplatedbezel 2 outer sockets and then bonding cooperates, sealing is provided with between high transparent glass cover 4 and the base material 1, reinforce by epoxy sealing then, high transparent glass cover 4 inwalls evenly apply fluorescent material 5, and fluorescent material 5 will apply evenly, thickness is consistent.
Taperedchromeplatedbezel 2 requires to change the angle of inclination according to the light of different lamps, and high transparent glass cover 4 cooperates taperedchromeplatedbezel 2 can be designed to different shape, as dome-type, U type, camber etc.Taperedchromeplatedbezel 2 can reflex to the photon that led chip 3 is sent on the fluorescent material 5 of high transparent glass cover 4 inwalls to greatest extent, gets the light rate thereby improve, and high transparent glass cover 4 can all emit the light that fluorescent material sent, and has improved luminous efficiency.Be positioned over during encapsulation in the environment of inert gas and carry out sealed package, under the protection of inert gas, fluorescent material can be not oxidized, thereby the light decay that has reduced fluorescent material takes place.Spacing between led chip and the high transparent glass cover 4 is bigger, has increased area of dissipation, improves radiating efficiency, has prolonged the useful life of LED.
Above-described only is preferred implementation of the present utility model.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model principle, can also make some modification and improvement, these also should be considered as belonging to protection range of the present utility model.
Claims (5)
1. led chip encapsulating structure, it is characterized in that comprising base material (1), base material (1) is gone up welding and led chip (3) is set and connects the both positive and negative polarity pin, the outer taperedchromeplatedbezel (2) that is provided with of led chip (3), the outer socket of taperedchromeplatedbezel (2) is provided with high transparent glass cover (4), sealing is provided with between high transparent glass cover (4) and the base material (1), and high transparent glass cover (4) inwall evenly applies fluorescent material (5).
2. a kind of led chip encapsulating structure as claimed in claim 1, the material that it is characterized in that described taperedchromeplatedbezel (2) is plastics, glass, pottery, and reflecting surface is through mirror process, and taperedchromeplatedbezel (2) cooperates with base material (1) bonding.
3. a kind of led chip encapsulating structure as claimed in claim 1 is characterized in that described high transparent glass cover (4) is dome-type, U type, camber.
4. a kind of led chip encapsulating structure as claimed in claim 1 is characterized in that after high transparent glass cover (4) and taperedchromeplatedbezel (2) socket that bonding cooperates again.
5. a kind of led chip encapsulating structure as claimed in claim 1 is characterized in that being provided with between high transparent glass cover (4) and the base material (1) epoxy sealing and reinforces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010291800526U CN201608204U (en) | 2010-02-04 | 2010-02-04 | LED chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010291800526U CN201608204U (en) | 2010-02-04 | 2010-02-04 | LED chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201608204U true CN201608204U (en) | 2010-10-13 |
Family
ID=42952907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010291800526U Expired - Fee Related CN201608204U (en) | 2010-02-04 | 2010-02-04 | LED chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201608204U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106224919A (en) * | 2016-08-18 | 2016-12-14 | 东莞市闻誉实业有限公司 | Led lamp |
| WO2019047007A1 (en) * | 2017-09-05 | 2019-03-14 | 深圳前海小有技术有限公司 | Package structure of semiconductor element |
-
2010
- 2010-02-04 CN CN2010291800526U patent/CN201608204U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106224919A (en) * | 2016-08-18 | 2016-12-14 | 东莞市闻誉实业有限公司 | Led lamp |
| WO2019047007A1 (en) * | 2017-09-05 | 2019-03-14 | 深圳前海小有技术有限公司 | Package structure of semiconductor element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101013 Termination date: 20130204 |