CN204118068U - A kind of LED - Google Patents

Abstract

The utility model discloses an LED light-emitting device, which comprises a first transparent substrate and a second transparent substrate oppositely arranged, more than one LED chip is installed between the first transparent substrate and the second transparent substrate, and the more than one LED chip The electrodes of the chip are electrically connected with the conductive circuit. Further, a sealing material is also distributed between the first transparent substrate and the second transparent substrate to form a sealed clamping space between the first transparent substrate and the second transparent substrate, and the LED chip is arranged on in the clamping space. The utility model can effectively simplify the LED manufacturing process, improve the light output efficiency, and can also protect the LED chip; wherein, when the LED chip electrode and the conductive circuit are electrically connected, the alignment can be realized through a self-alignment structure such as an optical mark, which avoids The metal wire process of the front-mounted chip and the soldering (chip) process of the flip-chip further simplify the process and reduce the manufacturing cost.

Description

A kind of LED light emitting device

technical field

The utility model relates to a semiconductor light emitting device, in particular to an LED light emitting device. the

Background technique

The first LED product was born in the United States in the 1960s. Its appearance has brought a lot of brilliance to people's lives. Due to the advantages of LEDs such as long life, low power consumption, and environmental protection, related technologies have developed very rapidly. . It has become a "ubiquitous" optoelectronic device and light source that is closely related to our lives, such as the backlight of mobile phones, traffic lights, large-screen full-color display screens and lights for landscape lighting, etc. the

At present, high-voltage LED technology belongs to the category of emerging technologies, and its technology has the following problems: 

The light output efficiency of LED chips needs to be improved. Theoretically, the luminous efficiency of using blue LEDs to excite yellow phosphors to synthesize white light is as high as 300 lumens per watt, but the current actual efficiency is less than half of the theoretical value, about one-third of the theoretical value. One of the important reasons is that a part of the light emitted from the active region cannot escape from the inside of the LED chip. The absorption and blocking of light by the chip material itself and the substrate cause a great loss of LED light efficiency.

In addition, the existing metal wire bonding process for front-mounted chips and the soldering (chip bonding) process for flip-chips are complicated in process and high in manufacturing cost. the

Contents of the invention

The purpose of the utility model is to provide an LED light-emitting device and a manufacturing method thereof, so as to overcome the deficiencies in the prior art. the

In order to achieve the above object, the utility model provides the following technical solutions:

An LED light-emitting device, including a first transparent substrate and a second transparent substrate oppositely arranged, and more than one LED chip is installed between the first transparent substrate and the second transparent substrate, and the electrodes of the more than one LED chip and the conductive circuit electrical connection.

Further, a sealing material is also distributed between the first transparent substrate and the second transparent substrate for forming a sealed clamping space between the first transparent substrate and the second transparent substrate, and the LED chip is arranged on the in the clamping space. the

Further, a transparent thermal conductive glue is also filled between the first transparent substrate and the second transparent substrate. the

Preferably, the conductive circuit is disposed on any one of the first transparent substrate and the second transparent substrate, and the LED chip is fixedly connected to one of the first transparent substrate and the second transparent substrate. on the other. the

Further, a plurality of LED chips are distributed between the first transparent substrate and the second transparent substrate, and the plurality of LED chips are connected in series and/or in parallel through the conductive circuit. the

Preferably, a first self-alignment portion and a second self-alignment portion are respectively provided on the first transparent substrate and the second transparent substrate, and the first self-alignment portion and the second self-alignment portion cooperate to form self-aligned structure. the

Preferably, the surface of the first transparent substrate and/or the second transparent substrate is provided with optical microstructures or lenses for improving light extraction efficiency. the

Further, the lens is spherical or hemispherical. the

Further, the material of the first transparent substrate or the second transparent substrate can be selected from glass, sapphire, silicon carbide or organic transparent body, but not limited thereto. the

Further, the conductive circuit is selected from metal or transparent conductive circuit, wherein the material of the transparent conductive circuit may include indium tin oxide, zinc oxide, carbon nanotube or graphene, but not limited thereto. the

A method for manufacturing an LED light emitting device, comprising:

disposing LED chips on the surface of the first transparent substrate;

setting a conductive circuit on the surface of the second transparent substrate;

arranging the first transparent substrate and the second transparent substrate oppositely, and making the electrodes of the LED chip electrically contact with the conductive circuit;

And, applying encapsulation material between the first transparent substrate and the second transparent substrate, so that the first transparent substrate and the second transparent substrate are fixedly connected, and the LED chips are all sealed on the first transparent substrate. In the clamping space between the substrate and the second transparent substrate.

Further, a plurality of LED chips are connected to the first transparent substrate, and a first self-alignment part and a second self-alignment part are respectively provided on the first transparent substrate and the second transparent substrate,

Moreover, when the first transparent substrate and the second transparent substrate are arranged oppositely, and the first self-alignment part and the second self-alignment part cooperate to form a self-alignment structure, the electrodes of each LED chip are aligned with the The corresponding points on the conductive circuit are in electrical contact.

Further, the self-alignment structure may adopt an optical, electrical or mechanical self-alignment structure. the

For example, specific optical marks can be respectively provided on the first transparent substrate and the second transparent substrate, and a self-alignment structure can be formed by aligning the corresponding optical marks on the first transparent substrate and the second transparent substrate. the

Alternatively, specific mechanical structures, such as bumps and grooves that cooperate with each other, can also be provided on the first transparent substrate and the second transparent substrate, and a self-aligning structure is formed by joining the bumps and grooves. the

The encapsulation material may include materials such as organic silica gel, transparent thermal conductive adhesive, and the like. the

Compared with the prior art, the utility model has the advantages of:

(1), the utility model sandwiches the LED chip between two transparent substrates, which simplifies the LED manufacturing process, improves the light extraction efficiency, and can also protect the LED chip;

(2) The surrounding area between the two transparent substrates is sealed by encapsulation material, which can prevent the encapsulation material from being bonded and covered by dust;

(3) When the LED chip electrodes and the conductive circuit are electrically connected, the alignment is achieved through a self-alignment structure such as an optical mark, which avoids the metal wire process of the front-mounted chip and the soldering (chip) process of the flip-chip , which further simplifies the process and reduces the manufacturing cost;

(4) Microstructures such as pyramids, or transparent media such as lenses are also provided on the surface of the transparent substrate to further improve the light extraction efficiency of the device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments recorded in the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative work. the

Fig. 1 shows the structural representation of the LED light-emitting device in the specific embodiment of the utility model;

Figure 2a is a schematic diagram of a first transparent substrate provided with LED chips in a specific embodiment of the present invention;

Figure 2b is a schematic diagram of a second transparent substrate provided with a conductive circuit in a specific embodiment of the present invention;

Fig. 3 is a schematic structural diagram of an LED light-emitting device in a specific embodiment of the present invention (the surface is provided with a microstructure);

Fig. 4 is a schematic structural diagram of an LED light-emitting device in a specific embodiment of the present invention (the surface is provided with a spherical crown or a hemispherical transparent medium).

Detailed ways

The technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the drawings in the embodiments of the present invention. Apparently, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model. the

1 and 2, the LED light-emitting device includes a first transparent substrate 1 and a second transparent substrate 2, the first transparent substrate 1 and the second transparent substrate 2 are oppositely arranged, the first transparent substrate 1 and the second transparent substrate 2 A plurality of LED chips 3 are provided therebetween, and the plurality of LED chips 3 are connected in series through a conductive circuit 4 . the

The materials of the first transparent substrate 1 and the second transparent substrate 2 are preferably selected from glass, sapphire, silicon carbide or organic transparent bodies. the

The conductive circuit 4 is a metal circuit or a transparent conductive circuit, and the material of the transparent conductive circuit is preferably indium tin oxide, zinc oxide, carbon nanotube or graphene. the

Furthermore, transparent heat-conducting glue is filled between the first transparent substrate 1 and the second transparent substrate 2, and LED chips are wrapped with it, and phosphor powder can also be doped or wrapped in these transparent heat-conducting glues. the

Further, the periphery of the clamping space between the first transparent substrate and the second transparent substrate is sealed by an encapsulation material, which is composed of organic silica gel or epoxy resin, etc., which can be uniformly doped, coated with phosphor, etc. , to realize the wavelength conversion of the light emitted by the LED chip, and through this packaging form, the light emitted by the device can also have better uniformity. The type of the phosphor can be selected according to the requirements of practical applications, and there are also various ways to obtain it, for example, it can be obtained from commercially available ways. the

As shown in FIG. 3 , microstructures 5 can also be provided on the surface of the LED light emitting device, and the light extraction efficiency can be further improved through the function of the microstructures 5 . The microstructure 5 can be in the shape of a pyramid or a corrugation arranged in an array. The microstructures can be arranged only on the first transparent substrate, or only on the surface of the second transparent substrate, or both on the surfaces of the first transparent substrate and the second transparent substrate. the

Referring to FIG. 4 , in other embodiments, a lens 6 may also be provided on the surface of the LED light emitting device, and the lens 6 is preferably a spherical or hemispherical transparent medium. The lens 6 is preferably arranged correspondingly above and below each LED chip. It is conceivable that the lens 6 may also be disposed only on the first transparent substrate or the second transparent substrate, and each lens corresponds to an LED chip. the

As shown in Figure 2a and Figure 2b, the embodiment of the present invention also provides a method for making self-alignment of LED light-emitting devices, including:

s1, disposing LED chips 3 and optical marks 7 on the first transparent substrate 1;

s2. The conductive circuit 4 and the optical mark 8 are arranged on the second transparent substrate 2, and the positions of the optical mark 7 and the optical mark 8 are designed to satisfy: when the two are aligned up and down, the electrodes of the conductive circuit 4 and the LED chip realize self-alignment allow;

s3, arranging the first transparent substrate 1 and the second transparent substrate 2 opposite each other, and aligning the optical mark 7 and the optical mark 8, and then bonding the first transparent substrate 1 and the second transparent substrate 2 with a transparent heat-conducting adhesive, Finally, it is encapsulated by organic silica gel or the like.

In the above manufacturing method, the self-alignment of the first transparent substrate 1 and the second transparent substrate 2 can also be realized through a physical structure, for example, through holes are correspondingly provided on the first transparent substrate 1 and the second transparent substrate 2, or the first Protruding points are arranged on the transparent substrate 1 , and grooves are correspondingly arranged on the second transparent substrate 2 . the

In summary, the utility model has the advantages of:

1), the utility model simplifies the manufacturing process of the LED light source by using two transparent substrates;

2) Two transparent substrates sandwich the LED chips, and the edges are sealed with organic silica gel, etc. This method can improve heat dissipation performance, improve light output efficiency, and protect the LED chips;

3) Manufacture a metal or transparent conductive circuit on one of the transparent substrates, and connect the LED chip electrodes and the circuit through a self-aligned structure and process, avoiding the metal wire process of the front-mounted chip, or the welding crystal of the flip-chip ( patch) process, which simplifies the process and reduces the manufacturing cost;

4) It achieves several goals of simultaneously improving light extraction efficiency and heat dissipation, improving reliability, preventing the surface of silicone from being easily bonded and covered by dust, simplifying the manufacturing process, and reducing costs. the

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element. the

The above description is only a specific embodiment of the utility model, and it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made. Retouching should also be regarded as the scope of protection of the present utility model. the

Claims (7)

1. An LED light-emitting device, characterized in that it includes a first transparent substrate and a second transparent substrate oppositely arranged, and more than one LED chip is installed between the first transparent substrate and the second transparent substrate, and the more than one LED chip The electrodes are electrically connected to the conductive circuit. 2. The LED light-emitting device according to claim 1, characterized in that a sealing material is distributed between the first transparent substrate and the second transparent substrate for sealing between the first transparent substrate and the second transparent substrate. A sealed clamping space is formed between them, and the LED chip is arranged in the clamping space. 3. The LED lighting device according to claim 1 or 2, characterized in that a transparent heat-conducting glue is also filled between the first transparent substrate and the second transparent substrate. 4. The LED light-emitting device according to claim 1 or 2, wherein the conductive circuit is arranged on any one of the first transparent substrate and the second transparent substrate, and the LED chip is fixedly connected to on the other of the first transparent substrate and the second transparent substrate. 5. The LED lighting device according to claim 3, characterized in that a plurality of LED chips are distributed between the first transparent substrate and the second transparent substrate, and the plurality of LED chips are connected in series through the conductive circuit and/or in parallel. 6. The LED light-emitting device according to claim 3, wherein a first self-alignment portion and a second self-alignment portion are respectively provided on the first transparent substrate and the second transparent substrate, and the first self-alignment portion The self-alignment part cooperates with the second self-alignment part to form a self-alignment structure. 7. The LED light-emitting device according to any one of claims 1, 2, 5, 6, characterized in that the surface of the first transparent substrate and/or the second transparent substrate is provided with an optical device for improving light extraction efficiency. microstructures or lenses.