CN201608176U - Surface adhesive type light-emitting diode thread stand structure - Google Patents
Surface adhesive type light-emitting diode thread stand structure Download PDFInfo
- Publication number
- CN201608176U CN201608176U CN 201020112523 CN201020112523U CN201608176U CN 201608176 U CN201608176 U CN 201608176U CN 201020112523 CN201020112523 CN 201020112523 CN 201020112523 U CN201020112523 U CN 201020112523U CN 201608176 U CN201608176 U CN 201608176U
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- CN
- China
- Prior art keywords
- bearing portion
- emitting diode
- chip bearing
- crystal chip
- metallic support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The utility model provides a surface adhesive type light-emitting diode thread stand structure consisting of a thick and thin copper metal bracket and a bowl-shaped base, wherein the bowl-shaped base is coated and injected on the thick and thin copper metal bracket by injection molding, and a depressed bowl-shaped space thereof is at least divided into a first holding space for arranging an LED crystal plate, at least one second holding space positioned at the side of the first holding space and used for arranging a static-removing crystal plate, and at least one convex rib for dividing the first holding space and the second holding space; and the convex rib is used for dividing the first holding space and the second holding space, thus being capable of solving the problem that the a light-emitting diode reduces the brightness due to the arrangement of the static-removing crystal plate. In addition, the bowl-shaped base exposes the thick and thin copper metal bracket so as to form a radiating end and a welding end, thus achieving the purposes of radiating and promoting the production efficiency.
Description
Technical field
The utility model relates to a kind of surface adhesion type light-emitting diode wire frame structure, refers to especially with the surface adhesion type light-emitting diode wire frame structure of thickness copper metallic support structure as the basis.
Background technology
As shown in Figure 1, existing light emitting diode construction is made of wafer 3, some leads 4 and the packaging body 5 that a metallic support 1, one bowl-shape pedestal 2, is set up on the metallic support.Aforementioned metal support 1 comprises crystal chip bearing portion 6, a plurality of rows that is positioned at central authorities and lists in the conducting terminal 7 of crystal chip bearing portion 6 both sides, is separated with certain bit space 8 mutually between the conducting terminal 7 of crystal chip bearing portion 6 and both sides.
Aforementioned bowl-shape pedestal 2 ejection formations are on metallic support 1, to insert in the space 8, location, and the part is attached on crystal chip bearing portion 6, the conducting terminal 7, and forms a bowl-shape accommodation space (being called the coil holder moulding on the processing procedure) in the end face of crystal chip bearing portion 6 and conducting terminal 7; Wafer 3 is erected in the crystal chip bearing portion 6 and (is called solid crystalline substance on the processing procedure), and each lead 4 is connected in 7 (are called on the processing procedure and are called routing on the processing procedure) between wafer 3 and conducting terminal; Packaging body 5 is filled in the bowl-shape pedestal 2 and with wafer 3 and lead 4 encapsulation fixing (being called encapsulation on the processing procedure).
Through after the above-mentioned fabrication stage, again the light-emitting diode semi-finished product are cut off separation (being called cut-out on the processing procedure) on metal metal plate sheet, after the bending operation is bent to form welding ends downwards with conducting terminal 7, promptly finish each independent LED.But said structure uses when high brightness LED, because of packaging body 5 is an epoxy resin, and bowl-shape pedestal 2 is coated on the bottom surface of metallic support 1, so thermal conductivity is relatively poor, so that light-emitting diode is difficult for heat radiation under long-term the use, causes light-emitting diode overheated and reduce useful life easily.
Therefore, as shown in Figure 2, for strengthening radiating effect, second kind of existing mode stamps out recessed crystal chip bearing portion 6 in metallic support 1, via steps such as coil holder moulding, solid crystalline substance, routing, encapsulation, cut-outs, finish the light-emitting diode semi-finished product, after the bending operation is bent into conducting terminal 7 stepped downwards, make its crystal chip bearing portion 6 and the bottom surface of conducting terminal 7 be positioned at same datum level, make light-emitting diode steadily be set up on the circuit board, and by crystal chip bearing portion bottom surface heat loss through conduction, and then the useful life of increase light-emitting diode.
But in above-mentioned processing procedure, the bottom surface of crystal chip bearing portion and conducting terminal is if produce excessive drop when bending, set up the irregular problem except causing, also can influence the lighting angle after setting up, therefore bend the manufacturing process that operation must adopt higher accuracy, the bottom surface of conducting terminal is aligned on the datum level of expection, and the bending nargin that must keep conducting terminal before the bending, influence accuracy to prevent metallic elastic stress from causing bending back deflection, not only reduce the yield that produces of light-emitting diode, and the volume of light-emitting diode also because of must bending afterwards, conducting terminal can't be reduction again.
In view of this, this creator constructs as the basis with a kind of metallic support of uniqueness, makes light-emitting diode have the function of quick heat radiating, and does not need conducting terminal is bent, make light-emitting diode easier, effectively reduce industry cost and manufacturing process towards the slimming development.
But this creator finds in design process, the static that produces during start between light-emitting diode and the circuit causes the damage of wafer easily, especially the light-emitting diode consume to more accurate, that volume is little is bigger, therefore, the light-emitting diode of thin typeization another need to overcome be the problem of generation of static electricity.
For solving the influence of static to light-emitting diode, the existing practice is that LED wafer and a kind of elimination electrostatic wafer together are encapsulated in crystal chip bearing portion, to prevent the damage of static to light-emitting diode, to but this kind eliminate electrostatic wafer and mostly be appearance of black and have the effect that absorbs 5%～10% illumination brightness, make the overall brightness of light-emitting diode descend, so, can make the surface adhesion type light-emitting diode wire frame structure more perfect if can solve the problem that antistatic wafer absorbs lighting effect.
Summary of the invention
Main purpose of the present utility model is that metallic support with a kind of uniqueness as the basis, makes light-emitting diode have the function of quick heat radiating, and solves because of the problem that electrostatic wafer reduces brightness of eliminating is installed.
For reaching above-mentioned purpose, the utility model surface adhesion type light-emitting diode wire frame structure is by a thickness copper metallic support, and a bowl-shape pedestal forms, wherein:
Described bowl-shape base top surface central authorities have the bowl shaped space of a depression, and penetrate on thickness copper metallic support with the ejection formation bag; Described bowl-shape pedestal is divided into first accommodation space of a capable for LED wafer setting, at least one first accommodation space side that is positioned at least for second accommodation space and at least one fin that separates first, second accommodation space of eliminating the electrostatic wafer setting in the bowl shaped space of depression; Aforementioned fin separates first accommodation space and second accommodation space, avoids the brightness of LED wafer to be eliminated electrostatic wafer and absorbs, and reaches the effect of static eliminating function again.
During enforcement, described thickness copper metallic support further comprises the junction that a crystal chip bearing portion, plurality of rows list in crystal chip bearing portion both sides, be separated with the space, location between the junction of crystal chip bearing portion and both sides mutually, aforementioned bowl-shape pedestal bag is penetrated in thickness copper metallic support, be filled in the space, location, and make the end face of crystal chip bearing portion and junction and bottom surface exposed, its exposed end face can be implanted the LED wafer and eliminate electrostatic wafer for the follow-up solid brilliant stage; Exposed bottom surface can provide light-emitting diode to finish product when follow-up use, is directly welded on the circuit board, and as the heat radiation purposes.
In said structure, crystal chip bearing portion end face is corresponding with first accommodation space of bowl-shape pedestal, implants for the LED wafer; The junction end face is corresponding with second accommodation space, implants for eliminating electrostatic wafer; Be separated with aforementioned fin mutually between crystal chip bearing portion end face and the junction end face, described fin can be avoided the brightness of LED wafer to be eliminated electrostatic wafer absorbing, make light-emitting diode keep original brightness.
Moreover, the forming process of described thickness copper metallic support is one to have the metal metal plate sheet of thickness, the bottom surface of its metal metal plate sheet has a plurality of chases that are arranged in parallel and upwards cave in, the thickness copper metallic support that makes metal metal plate sheet form having a plurality of proper alignment with punching press or cut mode again allows each thickness copper metallic support have aforesaid crystal chip bearing portion, junction and space, location.
The crystal chip bearing portion of aforementioned thickness copper metallic support is positioned at identical last datum level, bottom surface with the end face of junction and is positioned at identical following datum level, and the chase of space, location between crystal chip bearing portion and the junction and aforementioned metal metal plate sheet is corresponding and present the fovea superior aspect, penetrates fixing in order to bowl-shape pedestal bag.
Aforementioned bowl-shape pedestal bag is penetrated on thickness copper metallic support, make the exposed bottom surface of crystal chip bearing portion and junction form radiating end and welding ends, provide light-emitting diode to finish product when follow-up use, directly the welding ends with junction is welded on the circuit board, do not need junction is bent again, and the exposed radiating end in crystal chip bearing portion bottom surface can be directly as the heat radiation purposes, to prolong the useful life of light-emitting diode.And because of the bottom surface of crystal chip bearing portion and junction remains on identical following datum level, help producing the light-emitting diode that thickness is thinner, accuracy is higher, can effectively reduce the industry cost and promote product quality.
In addition, for increasing the chance of the utility model use on different product, its thickness copper metallic support also can further be provided with a recessed crystal chip bearing portion, better the concentrating of light source that allows LED wafer; Or make crystal chip bearing portion be positioned at a wherein side of thickness copper metallic support; Perhaps make crystal chip bearing portion for following spill and be positioned at the wherein side of thickness copper metallic support; Above-mentioned various embodiment makes the utility model can be applied to increase usability of the present utility model on the light-emitting diode of different size..
Compared to prior art, the utility model is provided with fin in bowl-shape pedestal, the lighting effect of LED wafer in the active set, solve the problem of eliminating electrostatic wafer absorbing light degree of illuminating, and directly dispel the heat in the bottom surface of crystal chip bearing portion, exempt the bending operation, effectively reduce the industry cost, promote and produce efficient.
Description of drawings
Fig. 1 is existing light-emitting diode structure schematic diagram ();
Fig. 2 is existing light-emitting diode structure schematic diagram (two);
Fig. 3 is the stereoscopic figure of the utility model first embodiment;
Fig. 4 is that the LED wafer of the utility model first embodiment is provided with position view with the elimination electrostatic wafer;
Fig. 5 is the side sectional view of the utility model first embodiment;
Fig. 6 is the metal metal plate sheet cross-sectional schematic of the utility model first embodiment;
Fig. 7 is the stereoscopic figure of the utility model second embodiment;
Fig. 8 is the stereoscopic figure of the utility model the 3rd embodiment;
Fig. 9 is the stereoscopic figure of the utility model the 4th embodiment.
Description of reference numerals: 100-metal metal plate sheet; The 101-chase; 10-thickness copper metallic support; 11-crystal chip bearing portion; The 111-radiating end; The 12-junction; The 121-welding ends; 13-locatees the space; The bowl-shape pedestal of 20-; 21-first accommodation space; 22-second accommodation space; The 23-fin; The 30-LED wafer; 40-eliminates electrostatic wafer.
Embodiment
As shown in Figure 3 and Figure 4, the stereoscopic figure of the utility model first embodiment and LED wafer are provided with position view with the elimination electrostatic wafer, disclose the utility model surface adhesion type light-emitting diode wire frame structure among the figure by a thickness copper metallic support 10, and one bowl-shape pedestal 20 form, wherein:
Described bowl-shape pedestal 20 end face central authorities have the bowl shaped space of a depression, and penetrate on thickness copper metallic support 10 with the ejection formation bag; Described bowl-shape pedestal is divided into first accommodation space 21, at least one second accommodation space 22 and at least one fin 23 that separates first, second accommodation space 21,22 that is positioned at first accommodation space, 21 sides for 40 settings of elimination electrostatic wafer that a capable for LED wafer 30 is provided with at least in the bowl shaped space of depression; Aforementioned fin 23 separates first accommodation space 21 and second accommodation space 22, avoids 30 brightness of LED wafer to be eliminated electrostatic wafer 40 and absorbs, and reaches the effect of static eliminating function again.
During enforcement, described thickness copper metallic support 10 further comprises the junction 12 that a crystal chip bearing portion 11, plurality of rows list in crystal chip bearing portion 11 both sides, be separated with space 13, location between the junction 12 of crystal chip bearing portion 11 and both sides mutually, aforementioned bowl-shape pedestal 20 bags are penetrated in thickness copper metallic support 10, be filled in the space 13, location, and make crystal chip bearing portion 11 exposed with the end face and the bottom surface of junction 12, its exposed end face can be implanted the LED wafer and eliminate electrostatic wafer for the follow-up solid brilliant stage; Exposed bottom surface can provide light-emitting diode to finish product when follow-up use, is directly welded on the circuit board, and as the heat radiation purposes.
See also Fig. 4 and shown in Figure 5, in said structure, crystal chip bearing portion 11 end faces are corresponding with first accommodation space 21 of bowl-shape pedestal 20, implant for LED wafer 30; Junction 12 end faces are corresponding with second accommodation space 22, implant for eliminating electrostatic wafer 40; Be separated with aforementioned fin 23 mutually between crystal chip bearing portion 11 end faces and junction 12 end faces, described fin 23 can be avoided 30 brightness of LED wafer to be eliminated electrostatic wafer 40 absorbing, make light-emitting diode keep original brightness.
See also shown in Figure 6, the forming process of described thickness copper metallic support 10 is one to have the metal metal plate sheet 100 of thickness, the bottom surface of its metal metal plate sheet 100 has a plurality of chases 101 that are arranged in parallel and upwards cave in, make metal metal plate sheet 100 form thickness copper metallic support 10 with punching press or cut mode again, allow each thickness copper metallic support 10 have aforesaid crystal chip bearing portion 11, junction 12 and space 13, location with a plurality of proper alignment.
The crystal chip bearing portion 11 of aforementioned thickness copper metallic support 10 is positioned at identical last datum level, bottom surface with the end face of junction 12 and is positioned at identical following datum level, and the chase 101 of the space, location 13 between crystal chip bearing portion 11 and the junction 12 and aforementioned metal metal plate sheet 100 is corresponding and present the fovea superior aspect, penetrates fixing in order to bowl-shape pedestal 20 bags.
Aforementioned bowl-shape pedestal 20 bags are penetrated on thickness copper metallic support 10, make crystal chip bearing portion 11 and the bottom surface that junction 12 exposes form radiating end 111 and welding ends 121, provide light-emitting diode to finish product when follow-up use, directly the welding ends 121 with junction 12 is welded on the circuit board, do not need junction 12 is bent again, and the exposed radiating end 111 in crystal chip bearing portion 11 bottom surfaces can be directly as the heat radiation purposes, to prolong the useful life of light-emitting diode, and because of the bottom surface of crystal chip bearing portion 11 and junction 12 remains on identical following datum level, it is thinner to help producing thickness, the light-emitting diode that accuracy is higher, can effectively reduce the industry cost, also promote product quality simultaneously.
See also Fig. 7 to Fig. 9, second, third and the 4th embodiment of the present utility model, as shown in Figure 7, its thickness copper metallic support 10 further is provided with a recessed crystal chip bearing portion 11, better the concentrating of light source that allows LED wafer; Or as shown in Figure 8, crystal chip bearing portion 11 is positioned at a wherein side of thickness copper metallic support 10; Or as shown in Figure 9, crystal chip bearing portion 11 is a following spill and a wherein side that is positioned at thickness copper metallic support 10; Above-mentioned various embodiment can be applied on the light-emitting diode of different size the utility model, increases the chance of the utility model use at different product.
But, with implementation and graphic shown in, be to illustrate preferred embodiment person of the present utility model, be not to limit to the utility model with this.Be with, approximate with structure of the present utility model, device, feature etc. such as or identical mutually person all should belong to of the present utility model founding within purpose and the claim.
Claims (5)
1. surface adhesion type light-emitting diode wire frame structure, by a thickness copper metallic support, and a bowl-shape pedestal forms, and it is characterized in that:
Described bowl-shape base top surface central authorities have the bowl shaped space of a depression, and penetrate on thickness copper metallic support with the ejection formation bag; Described bowl-shape pedestal is divided into first accommodation space that the LED wafer is set at least in the bowl shaped space of depression, at least one first accommodation space side that is positioned at is provided with second accommodation space of eliminating electrostatic wafer, and at least one fin that separates described first accommodation space and described second accommodation space;
Described thickness copper metallic support comprises crystal chip bearing portion and a plurality of described crystal chip bearing portion both sides that are arranged in that an end face is exposed in first accommodation space and is exposed to junction in described second accommodation space, be separated with the space, location mutually between the junction of described crystal chip bearing portion and both sides, the exposed bottom surface of described crystal chip bearing portion is a radiating end, and the bottom surface that described junction is exposed is a welding ends.
2. surface adhesion type light-emitting diode wire frame structure according to claim 1, it is characterized in that, the crystal chip bearing portion of described thickness copper metallic support is positioned at identical last datum level with the end face of described junction, and the crystal chip bearing portion of described thickness copper metallic support is positioned at identical following datum level with the bottom surface of described junction.
3. surface adhesion type light-emitting diode wire frame structure according to claim 2 is characterized in that, described thickness copper metallic support further comprises the crystal chip bearing portion of spill.
4. surface adhesion type light-emitting diode wire frame structure according to claim 2 is characterized in that, described crystal chip bearing portion is positioned at a wherein side of described thickness copper metallic support.
5. according to claim 2 a described surface adhesion type light-emitting diode wire frame structure, it is characterized in that crystal chip bearing portion is a following spill and a wherein side that is positioned at described thickness copper metallic support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020112523 CN201608176U (en) | 2010-02-05 | 2010-02-05 | Surface adhesive type light-emitting diode thread stand structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020112523 CN201608176U (en) | 2010-02-05 | 2010-02-05 | Surface adhesive type light-emitting diode thread stand structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201608176U true CN201608176U (en) | 2010-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020112523 Expired - Fee Related CN201608176U (en) | 2010-02-05 | 2010-02-05 | Surface adhesive type light-emitting diode thread stand structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN201608176U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108413264A (en) * | 2018-04-20 | 2018-08-17 | 江苏鸿利国泽光电科技有限公司 | A kind of high light-emitting rate ultraviolet LED lighting device |
-
2010
- 2010-02-05 CN CN 201020112523 patent/CN201608176U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108413264A (en) * | 2018-04-20 | 2018-08-17 | 江苏鸿利国泽光电科技有限公司 | A kind of high light-emitting rate ultraviolet LED lighting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101013 Termination date: 20150205 |
|
| EXPY | Termination of patent right or utility model |