CN201607540U - Package structure of center wavelength of stable curve array waveguide grating chip - Google Patents
Package structure of center wavelength of stable curve array waveguide grating chip Download PDFInfo
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- CN201607540U CN201607540U CN2010201281584U CN201020128158U CN201607540U CN 201607540 U CN201607540 U CN 201607540U CN 2010201281584 U CN2010201281584 U CN 2010201281584U CN 201020128158 U CN201020128158 U CN 201020128158U CN 201607540 U CN201607540 U CN 201607540U
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Abstract
The utility model discloses a package structure of the center wavelength of a stable curve array waveguide grating chip, comprising a curve AWG chip, a single-core fiber array and a multiple-core fiber array, wherein the curve AWG chip is fixed on a heating module; the single-core fiber array is in coupling alignment and connection with one end of the curve AWG chip; and the multiple-core fiber array is in coupling alignment and connection with the other end of the curve AWG chip. The other end of the multiple-core fiber array is connected with a ribbon fiber, and the lower surface of the side of the heating module positioned at the multiple-core fiber array is connected with the upper surface of one end of a quartz glass sheet. The upper surface of the other end of the quartz glass sheet is provided with a ribbon fiber cushion block which is positioned under the ribbon fiber. The heating module comprises a low thermal resistance substrate, a heater, a high thermal resistance substrate and a thermal resistor, wherein the low thermal resistance substrate, the heater and the high thermal resistance substrate are arranged from top to bottom in sequence and make a hot field uniform, and the thermal resistor is inlaid in the middle position of the middle part of the low thermal resistance substrate. The package structure has the advantages of simple structure, low cost and convenient use and increases the wavelength stability of devices.
Description
Technical field
The utility model relates to a kind of encapsulating structure of array waveguide grid chip.The encapsulating structure that particularly relates to a kind of curve of stability array waveguide grid chip centre wavelength.
Background technology
Array waveguide grating (AWG) device is a kind of optical device that is in great demand on the optical communication market, a kind of for dense wave division multipurpose/demodulation multiplexer.At present, each optical device producer is in order to reduce chip cost, with original chip external form by the square shaped form chip that changes into as shown in Figure 1.
Because chip material is a silicon based silicon dioxide, material itself is all very responsive to temperature, stress.
For the temperature sensitivity of chip, by heating module chip is added gentle temperature control usually, reduce the susceptibility of the external T-Ring of device border temperature.Heating module described here comprises well heater, is used for the thermistor or the RTD of Temperature Feedback, is used to improve the well heater thermal field and improves the heat sink of thermal conductivity.
Stress sensitivity for chip, since chip by original square become shaped form after, deformation very easily takes place in slight stressed back external form, thereby cause the variation of the centre wavelength of device, therefore, with respect to square AWG chip, solve chip because extraneous stress causes the deformation of chip to become most important, usually adopt two kinds of schemes to solve scheme one: as shown in Figure 2, entire chip closely to be amplexiformed on a smooth square stiffening plate.This scheme can be separated and decided the chip deformation that other external force beyond the square stiffening plate is brought, and as the thrust or the pulling force of ribbon fiber, but the variation that can not solve the chip optical index that stress that the bonding process produces causes requires very high to technique for sticking; Scheme two: as shown in Figure 3, the input and output of chip fluctuation two ends are bonded on the crossbeam, the chip that will glue crossbeam more closely is attached on the heating plate with heat-conducting silicone grease and silicon rubber.This scheme also can be separated and decided the chip deformation that square stiffening plate other external force is in addition brought, simultaneously since the most responsive Waveguide array of chip partly usefulness be that heat-conducting silicone grease and silicon rubber are bonding, therefore, the bonding stress that brings is less, to the also corresponding reduction of the requirement of technique for sticking.But this method complex process, cost also increases.
Summary of the invention
Technical problem to be solved in the utility model is, a kind of wavelength sensitivity that can overcome the curved array waveguide grating chip is provided, solve the variation of the optical index that chip and heating plate bonding force bring, improve the be coupled encapsulating structure of curve of stability array waveguide grid chip centre wavelength of long-time stability of end face of array waveguide grid chip and fiber array simultaneously.
The technical scheme that the utility model adopted is: a kind of encapsulating structure of curve of stability array waveguide grid chip centre wavelength, include the shaped form AWG chip that is fixed on the heating module, the single-core fiber array that is coupled and aligned and is connected with an end of shaped form AWG chip, hold the multi-core fiber array that is coupled and aligned and is connected in addition with one of shaped form AWG chip, the other end of described multi-core fiber array is connected with ribbon fiber, described heating module is positioned at the upper surface of lower surface connection quartz glass plate one end of that side of multi-core fiber array, the upper surface of the described quartz glass plate other end is provided with banded fine cushion block, and the fine cushion block of described band shape is positioned at the below of described ribbon fiber.
Described shaped form AWG chip is fixedlyed connected by heat-conducting silicone grease with heating module.
Described ribbon fiber is fixed on the upper surface of the fine cushion block of described band shape by silicon rubber.
Described heating module includes: what from top to bottom set gradually makes the uniform low thermal resistance substrate of thermal field, well heater and high thermal resistance cushion block, and is embedded in the thermistor in the centre position at low thermal resistance substrate middle part.
Spacing between fine cushion block of described band shape and the heating module is 15～30mm.
The fast thickness of the thickness of described quartz glass plate and high thermal resistance pad is consistent.
The fine cushion block of described band shape is a metal material, and surfacing.
The fine cushion block of described band shape is a glass material, and surfacing.
Also be provided with enclosure, the described heating module that is connected with shaped form AWG chip, quartz glass plate and banded fine cushion block, and the single-core fiber array that is coupled and aligned and is connected with an end of shaped form AWG chip, hold the multi-core fiber array that is coupled and aligned and is connected to be installed in the enclosure in addition with one of shaped form AWG chip, described ribbon fiber is exported from enclosure ribbon fiber output port.
The encapsulating structure of curve of stability array waveguide grid chip centre wavelength of the present utility model, simple in structure, with low cost, easy to use, can reduce in the encapsulation process, the stress of heating module and die bonding reduces the influence to the chip optical index; Can avoid the different chip deformation that brings of ribbon fiber and enclosure thermal expansivity, and the wave length shift in the high low temperature cyclic process, the wavelength stability of raising device; Because ribbon fiber is fixed on the suitable quartz glass plate of thermal expansivity,, improved the long-term reliability of device coupling end face so when extraneous variation of ambient temperature, the bonding plane of chip and fiber array end face is stressed less.
Description of drawings
Fig. 1 is a shaped form chip schematic appearance;
Fig. 2 is the square stiffening plate of employing at present commonly used chip external form figure after bonding;
Fig. 3 is employing crossbeam at present commonly used chip external form figure after bonding;
Fig. 4 is the novel device package schematic appearance of this use;
Fig. 5 is the vertical section structure synoptic diagram of Fig. 4.
Wherein:
1: shaped form AWG chip 2: ribbon fiber
3: ribbon fiber abutting edge 4: single-core fiber array
5: multi-core fiber array 6: heating module
6-1: well heater 6-2: thermistor
6-3: low thermal resistance substrate 6-4: high thermal resistance cushion block
7: enclosure 8: quartz glass plate
9: banded fine cushion block
Embodiment
Provide specific embodiment below in conjunction with accompanying drawing, how the encapsulating structure that further specifies curve of stability array waveguide grid chip centre wavelength of the present utility model is realized.
As Fig. 4, shown in Figure 5, the encapsulating structure of curve of stability array waveguide grid chip centre wavelength of the present utility model, include by heat-conducting silicone grease and be fixed on shaped form AWG chip 1 on the heating module 6, the single-core fiber array 4 that is coupled and aligned and is connected with an end of shaped form AWG chip 1, hold the multi-core fiber array 5 that is coupled and aligned and is connected in addition with one of shaped form AWG chip 1, the other end of described multi-core fiber array 5 is connected with ribbon fiber 2, described heating module 6 is positioned at the upper surface of lower surface connection quartz glass plate 8 one ends of multi-core fiber array 5 those sides, the upper surface of described quartz glass plate 8 other ends is provided with banded fine cushion block 9, and the spacing between fine cushion block 9 of described band shape and the heating module 6 is 15～30mm.The fine cushion block 9 of described band shape also is positioned at the below of described ribbon fiber 2, and described ribbon fiber 2 is fixed on the upper surface of the fine cushion block 9 of described band shape by silicon rubber.
The fine cushion block 9 of described band shape can adopt metal material, and surfacing.The fine cushion block 9 of described band shape can also adopt glass material, and surfacing.
Also be provided with enclosure 7, the described heating module 6 that is connected with shaped form AWG chip 1, quartz glass plate 8 and banded fine cushion block 9, and the single-core fiber array 4 that is coupled and aligned and is connected with an end of shaped form AWG chip 1, hold the multi-core fiber array 5 that is coupled and aligned and is connected to be installed in the enclosure 7 in addition with one of shaped form AWG chip 1, described ribbon fiber 2 is exported from enclosure ribbon fiber output port.
As shown in Figure 5, described heating module 6 includes: what from top to bottom set gradually makes the uniform low thermal resistance substrate of thermal field 6-3, well heater 6-1 and high thermal resistance cushion block 6-4, and is embedded in the thermistor 6-2 in the centre position at low thermal resistance substrate 6-3 middle part.The thickness of the thickness of described quartz glass plate 8 and the fast 6-4 of high thermal resistance pad is consistent.
Illustrate below in conjunction with Fig. 5 and the manufacturing process of the encapsulating structure of curve of stability array waveguide grid chip centre wavelength of the present utility model to include following steps:
1) end of quartz glass plate 8 is bonded in the lower surface of heating module 6, the other end of quartz glass plate 8 stretches out heating module 6.The consistency of thickness of the thickness of quartz glass plate 8 and the fast 6-4 of high thermal resistance pad.
2) quartz glass plate 8 stretch out heating module 6 parts directly over be bonded with a fine cushion block 9 of band shape apart from the position of heating module edge 15～30mm, the surface of the fine cushion block 9 of this band shape should be smooth, thereby make the smooth output of ribbon fiber.Banded fine cushion block 9 materials can be metal or glass material.Distance 15～30mm's is to make banded fine cushion block 9 positions be positioned at ribbon fiber 2 belows apart from purpose, but not fiber array 5 belows.
3) single-core fiber array 4 and multi-core fiber array 5 are coupled and aligned with shaped form AWG chip 1 two ends respectively after, bonding with the ultra-violet curing glue end face that will be coupled;
4) coat heat-conducting silicone grease uniformly in shaped form AWG chip 1 bottom, and this shaped form AWG chip 1 is fixed on the heating module 6, guarantee that simultaneously ribbon fiber 2 is directly over the fine cushion block 9 of band shape by anchor clamps;
5) in the chip neighboring area that shaped form AWG chip 1 contacts with heating module 6, remove and the end region that is coupled outside, all adopt silicon rubber bonding;
6) adopt silicon rubber to fix between ribbon fiber 2 and the banded fine cushion block 9.
7) heating module 6 with bonding AWG chip 1, quartz glass plate 8 and banded fine cushion block 9 is installed in the enclosure 7, and ribbon fiber is exported from enclosure ribbon fiber output port.
In said structure, the silicon rubber that described shaped form AWG chip 1 employing heat-conducting silicone grease and elasticity coefficient are big is bonding, and shaped form AWG chip can slightly move relative to the heating plate surface.Bonding stress is less, and is very little to the optical index influence of chip.
Shaped form AWG chip 1 in the said structure is consistent with described heating module 6 sizes.As shown in Figure 4, described heating module 6 is to be set gradually from top to bottom and constituted by low thermal resistance substrate 6-3, well heater 6-1, high thermal resistance cushion block 6-4, also is provided with thermistor 6-2 in the hollow position at described heat sink 6-3 middle part.Well heater 6-1 generates heat after energising, and shaped form AWG chip is heated to working temperature.Thermistor 6-2 is used for the actual temperature of feedback profile type AWG chip, by the peripheral temperature control circuit, and can be under fixing temperature with shaped form AWG chip operation.Low thermal resistance substrate 6-3 is used to improve the thermal field homogeneity of well heater itself, uses the lower material of thermal resistivity usually, as metal etc.High thermal resistance cushion block 6-4 is positioned at well heater below, thermal resistance height.According to thermal conduction principle, heat is towards the low direction transmission of thermal resistance, thus the power consumption requirement of reduction device.
In said structure, ribbon fiber is fixed on the very approaching quartz glass plate of thermal expansivity.The enclosure of AWG commonly used mainly contains two kinds at present, and a kind of is metal, and in the majority with aluminium alloy, the thermal expansivity of aluminium alloy is about 23ppm; Another kind of AWG enclosure commonly used is the plastic package box, and it is bigger that thermal expansivity differs, between 10～100ppm.And the material of optical fiber is a fused quartz, and the thermal expansivity of fused quartz is generally 0.5ppm.Common operating ambient temperature range at AWG is-15～65 degrees centigrade, because being primary Calculation, the displacement that environment temperature is brought to arrive the millimeter magnitude, the deformation meeting of chip is because chip form is different with bonding strength, the deformation that brings differs, as long as but have deformation will cause the variation of the centre wavelength of device.After adopting structure of the present utility model, the chip deformation that the external force that ribbon fiber brings causes is very little, can ignore the influence of centre wavelength, and the coupling end face of chip and fiber array is stressed very little simultaneously, can improve coupled end face length phase reliability.
The encapsulating structure ultimate principle of curve of stability array waveguide grid chip centre wavelength of the present utility model is:
1, the surface of contact of shaped form AWG chip 1 and heating module 6 uses heat-conducting silicone grease, because thermal grease conduction is a milk, shaped form AWG chip can be free to slide on heating module, can not produce stress basically.All adopt silicon rubber bonding around the shaped form AWG chip, because the silicon rubber softness, bonding stress is very little between shaped form AWG chip and the heating module.
2, because the starting material of optical fiber are quartz material, and thermal expansivity is very little, when extraneous variation of ambient temperature, enclosure can be to the external force effect of ribbon fiber generation because thermal expansivity is bigger.This external force passes on the bonding end face of coupling of fiber array and shaped form AWG chip by ribbon fiber, long-term reliability to end face has certain influence, and in addition, this external force also can pass on the shaped form AWG chip, make shaped form AWG chip produce deformation, cause the centre wavelength of device to change.And in this structure, ribbon fiber is fixed on the quartz glass plate 8 by the fine cushion block 9 of band shape, external force obtains in the ribbon fiber abutting edge discharging, simultaneously because the thermal expansivity of the thermal expansivity of optical fiber and quartz glass plate is suitable, therefore, the external force of 8 pairs of optical fiber of quartz glass plate is very little, and the deformation that chip produces is also very little, thus the long-term reliability of the high low temperature wavelength characteristic of the device that improves and coupling section.
Claims (9)
1. the encapsulating structure of a curve of stability array waveguide grid chip centre wavelength, include the shaped form AWG chip (1) that is fixed on the heating module (6), the single-core fiber array (4) that is coupled and aligned and is connected with an end of shaped form AWG chip (1), hold the multi-core fiber array (5) that is coupled and aligned and is connected in addition with one of shaped form AWG chip (1), the other end of described multi-core fiber array (5) is connected with ribbon fiber (2), it is characterized in that, described heating module (6) is positioned at the upper surface of lower surface connection quartz glass plate (8) one ends of that side of multi-core fiber array (5), the upper surface of described quartz glass plate (8) other end is provided with banded fine cushion block (9), and the fine cushion block of described band shape (9) is positioned at the below of described ribbon fiber (2).
2. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1 is characterized in that, described shaped form AWG chip (1) is fixedlyed connected by heat-conducting silicone grease with heating module (6).
3. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1 is characterized in that, described ribbon fiber (2) is fixed on the upper surface of the fine cushion block of described band shape (9) by silicon rubber.
4. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1, it is characterized in that, described heating module (6) includes: what from top to bottom set gradually makes the uniform low thermal resistance substrate of thermal field (6-3), well heater (6-1) and high thermal resistance cushion block (6-4), and is embedded in the thermistor (6-2) in the centre position at low thermal resistance substrate (6-3) middle part.
5. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1 is characterized in that, the spacing between fine cushion block of described band shape (9) and the heating module (6) is 15～30mm.
6. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 4 is characterized in that, the thickness of the thickness of described quartz glass plate (8) and high thermal resistance pad fast (6-4) is consistent.
7. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1 is characterized in that, the fine cushion block of described band shape (9) is a metal material, and surfacing.
8. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1 is characterized in that, the fine cushion block of described band shape (9) is a glass material, and surfacing.
9. the encapsulating structure of curve of stability array waveguide grid chip centre wavelength according to claim 1, it is characterized in that, also be provided with enclosure (7), the described shaped form AWG chip (1) that is connected with, the heating module (6) of quartz glass plate (8) and banded fine cushion block (9), and the single-core fiber array (4) that is coupled and aligned and is connected with an end of shaped form AWG chip (1), hold the multi-core fiber array (5) that is coupled and aligned and is connected to be installed in the enclosure (7) in addition with one of shaped form AWG chip (1), described ribbon fiber (2) is exported from enclosure ribbon fiber output port.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010201281584U CN201607540U (en) | 2010-03-11 | 2010-03-11 | Package structure of center wavelength of stable curve array waveguide grating chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010201281584U CN201607540U (en) | 2010-03-11 | 2010-03-11 | Package structure of center wavelength of stable curve array waveguide grating chip |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103558657A (en) * | 2013-11-15 | 2014-02-05 | 四川飞阳科技有限公司 | Array waveguide grating |
| CN103926663A (en) * | 2014-04-25 | 2014-07-16 | 武汉光迅科技股份有限公司 | Multi-wavelength light source and low-cost manufacturing method thereof |
| CN103955029A (en) * | 2014-05-09 | 2014-07-30 | 上海亨通宏普通信技术有限公司 | Curve-shaped arrayed waveguide grating (AWG) dense wavelength division multiplexing device with heat and manufacturing device, manufacturing method and testing method thereof |
-
2010
- 2010-03-11 CN CN2010201281584U patent/CN201607540U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103558657A (en) * | 2013-11-15 | 2014-02-05 | 四川飞阳科技有限公司 | Array waveguide grating |
| WO2015070692A1 (en) * | 2013-11-15 | 2015-05-21 | 四川飞阳科技有限公司 | Arrayed waveguide grating |
| CN103558657B (en) * | 2013-11-15 | 2016-06-22 | 四川飞阳科技有限公司 | array waveguide grating |
| CN103926663A (en) * | 2014-04-25 | 2014-07-16 | 武汉光迅科技股份有限公司 | Multi-wavelength light source and low-cost manufacturing method thereof |
| CN103955029A (en) * | 2014-05-09 | 2014-07-30 | 上海亨通宏普通信技术有限公司 | Curve-shaped arrayed waveguide grating (AWG) dense wavelength division multiplexing device with heat and manufacturing device, manufacturing method and testing method thereof |
| CN103955029B (en) * | 2014-05-09 | 2017-01-04 | 江苏亨通光网科技有限公司 | A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and producing device, manufacture method and method of testing |
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Granted publication date: 20101013 |
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