CN103955029B - A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and producing device, manufacture method and method of testing - Google Patents

A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and producing device, manufacture method and method of testing Download PDF

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Publication number
CN103955029B
CN103955029B CN201410196496.4A CN201410196496A CN103955029B CN 103955029 B CN103955029 B CN 103955029B CN 201410196496 A CN201410196496 A CN 201410196496A CN 103955029 B CN103955029 B CN 103955029B
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China
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awg chip
awg
chip
input
shaped
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CN201410196496.4A
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Chinese (zh)
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CN103955029A (en
Inventor
徐虎
赵关宝
陈立坚
施雪磊
张亚崇
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江苏亨通光网科技有限公司
江苏亨通光电股份有限公司
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Priority to CN201410196496.4A priority Critical patent/CN103955029B/en
Publication of CN103955029A publication Critical patent/CN103955029A/en
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Abstract

The invention discloses a kind of shaped form and have hot AWG array waveguide grating dense wave division multiplexer and producing device, manufacture method and method of testing;The present invention describes the structure of wavelength division multiplexer self product in detail, including: an enclosure, an AWG chip is placed in this enclosure, one single fiber coupled with the input of AWG chip, and the monocrystal silicon fiber array coupled with the outfan of AWG chip, one is respectively arranged at the glass cover-plate at AWG chip input and outfan coupling, this glass cover-plate adds coupling area, also include that a monitoring temperature assembly, described monitoring temperature assembly include that a temperature control equipment and is arranged at least two heater driver of single fiber side.Coordinating a whole set of technological process so that the wavelength division multiplexer bandwidth of operation wave-length coverage prepared is 1528nm 1565nm, the dependent loss such as wavelength-division is uniform, stable performance, polarization are low.

Description

A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and a producing device thereof, manufacture method and Method of testing
Technical field
The present invention relates to the manufacture field of optical device, particularly relating to a kind of shaped form has hot AWG Waveguide array light Grid dense wave division multiplexer and producing device thereof, manufacture method and method of testing.
Background technology
Due to large-scale FTTH network design, and China's Conventional wide band mainly uses with ADSL as representative Copper cash broadband technology, is difficult to meet the wideband requirements that user increases day by day.There is hot AWG array waveguide grating close Collection wavelength division multiplexer owing to its Channel depletion is uniform, size is little, be easily integrated, be easy to the advantages such as batch production, Simultaneously by the continuous upgrading of FTTH core technology PON, there is hot AWG array waveguide grating dense wavelength division multiple 1G, 2.5G can be easily provided even to count the bandwidth of 10G, Mei Geyong on the node of optical access network with device The access rate at family is also corresponding quickly to be improved, and is to be best suitable for for jumbo dense wave division multipurpose (DWDM) The Primary Component of system.
There is the hot AWG substantial amounts of demand of array waveguide grating dense wave division multiplexer big at present, but machining accuracy Serious contravention is there is, although through scientists groping for many years, but have hot AWG Waveguide array light with quantity Grid dense wave division multiplexer large-scale processing problem is always the bottle of dense wave division multipurpose (DWDM) system production capacity Neck.Based on this, we are by optical communications industry years of researches, in conjunction with optical information and Machining Technology, Invention works out this producing device and method.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of shaped form the hot intensive ripple of AWG array waveguide grating Division multiplexer and producing device thereof, manufacture method and method of testing;The present invention describes wavelength division multiplexer in detail The structure of self product, and and coordinate a whole set of technological process so that the wavelength division multiplexer work prepared Making bandwidth wave-length coverage is 1528nm-1565nm, and the test wave band of insertion loss covers this wavelength band Spectrum curve, described operating central wavelength is 1550nm, and wavelength-division is uniform, stable performance, and polarization etc. is correlated with It is lost low.
For reaching above-mentioned purpose, technical scheme is as follows:
A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer, including:
One enclosure, places an AWG chip in this enclosure,
One single fiber coupled with the input of AWG chip, and a list coupled with the outfan of AWG chip Crystal silicon fiber array,
One is respectively arranged at the glass cover-plate at AWG chip input and outfan coupling, and this glass cover-plate increases Add coupling area,
Also include that a monitoring temperature assembly, described monitoring temperature assembly include a temperature control equipment and a setting At least two heater driver in single fiber side.
A kind of shaped form has the producing device of hot AWG array waveguide grating dense wave division multiplexer, including:
One AWG chip manufacture device, solid including an AWG chip cover glass cover board arrangement and an AWG chip Change and lapping device;
Described AWG chip cover glass cover board arrangement is used for increasing coupling area;Described AWG chip solidification dress Putting and be both secured on interlayer substrate by multiple AWG chips, the AWG chip after solidification is entered by lapping device simultaneously Row grinds,
One coupling device, for coupling the input of single fiber with AWG chip and by monocrystal silicon fiber array Couple with the outfan of AWG chip,
And an encapsulating housing, the product after test passes is packaged.
In a preferred embodiment of the invention, also include the complete AWG chip of coupling is carried out optical fiber biography The test device of the test of transmission of data, described test device includes:
One specimen holder, for placing the AWG chip that coupling is complete,
One ASE wideband light source and a photoswitch being connected with ASE bandwidth light source, this photoswitch and single fiber one end It is connected,
And a spectrogrph, this spectrogrph is connected with one end of monocrystal silicon fiber array.
In a preferred embodiment of the invention, described AWG chip cover glass cover board arrangement includes:
One clamping platform, described clamping platform arranges the structural feature of a curvilinear shaped recesses, described shaped form The structural feature of groove matches with the input/output terminal of AWG chip,
One is positioned at the locating platform directly over structural feature, and this locating platform includes what vertical clamping platform was arranged Two-dimensional adjustment balance axle, for being accurately positioned the bondline thickness of glass cover-plate and AWG chip,
And the zigzag alignment platform being positioned at structural feature side, it is used for blocking AWG chip, improves AWG Chip loads stability.
In a preferred embodiment of the invention, described coupling device includes:
One shaped form has hot AWG chip loading platform, is used for placing and clamp AWG chip,
One input CCD image intensifer and outfan CCD image intensifer,
One display being connected with input CCD image intensifer and outfan CCD image intensifer, this display Alignment picture during vision-control,
One be arranged at AWG chip input side to optical assembly, described optical assembly is included a photoswitch, And the tunable laser source being connected with photoswitch,
And the light power meter being arranged at AWG chip output side, this light power meter is used for measuring regulation During light power meter reading.
In a preferred embodiment of the invention, described shaped form has hot AWG chip loading platform to include:
One base, described base includes upper strata positioning table and lower floor's positioning table;
Described upper strata positioning table includes the bottom tub of a placement AWG chip, one is positioned at the upper strata in the middle part of bottom tub Clamp system and one is positioned at two circular grooves of clamp system both sides, upper strata, described circular groove with described under Layer positioning table is fixing to be connected;Described lower floor positioning table is propped up with center by the stage body being connected mutually with described circular groove It is configured to,
One pressing plate covering base, described pressing plate includes upper strata plate body and lower floor's plate body equally;
Described upper strata plate body uses a monoblock hardness sheet material big, lightweight, and middle part arranges lower floor's clamping machine On structure, with base arrange upper strata clamp system with the use of;Described lower floor plate body uses soft, plasticity Big sheet material.
A kind of shaped form has the manufacture method of hot AWG array waveguide grating dense wave division multiplexer, including following Step:
One AWG chip coupling step, specific as follows:
Step one, the input adjustment of AWG chip;The three-dimensional that regulation is connected with input CCD image intensifer Adjusting bracket, makes can clearly show single fiber end face and AWG chip input end face on display,
Regulation input 6 DOF adjusting bracket so that it is parallel that single fiber end face reaches both sides with AWG chip input end face And the position that side is parallel;
Step 2, the outfan adjustment of AWG chip;The three-dimensional regulation being connected with outfan CCD image intensifer Frame, makes can clearly show monocrystal silicon fiber array end face and AWG chip output end face on display,
Regulation outfan 6 DOF adjusting bracket so that monocrystal silicon fiber array end face reaches with AWG chip output face Parallel to both sides and that side is parallel position;
Single fiber input waveguide is directed at one by one by above-mentioned steps one and step 2 with AWG chip input waveguide, Again AWG chip output waveguide is directed at one by one with the waveguide of monocrystal silicon fiber array;
Step 3, balance adjustment;Input CCD image intensifer moves to single fiber end face input with AWG chip End, and the reading combining light power meter is adjusted;
Outfan CCD image intensifer is moved at monocrystal silicon fiber array end face and AWG chip output face, Reading also in conjunction with light power meter is adjusted;
Until when shaped form has the optical fiber reading both less than regulation that the input of hot AWG chip is corresponding with outfan Standard value time, some UV glue solidify simultaneously;
One testing procedure, for the complete AWG chip of coupling being carried out the test of fiber-optic transfer data,
One encapsulation step, is packaged the product after test passes.
In a preferred embodiment of the invention, before AWG chip coupling step, an AWG core is also included Sheet procedure of processing;
Step one, uses AWG chip cover glass cover board arrangement that AWG chip two ends are carried out cover glass lid Plate;
Step 2, has the AWG chip of glass cover-plate utilize the solidification of AWG chip and grind by the connection in step one Mill apparatus carries out solidifying and grinding;
In cure stage, AWG chip is passed through binding agent thermosetting on interlayer substrate, it is ensured that interlayer substrate is total Flatness is 2-15um, and angularity is that the bonded adhesives between 20-50um, and AWG chip and described substrate is thick Degree is less than 1um;After solidification, carry out 8 degree of angles and grind.
In a preferred embodiment of the invention, the grinding in described step 2 is divided into rough grinding pass and polishing Process, described rough grinding pass uses powder granularity to be 10nm-2000nm, and split Mohs' hardness is 7-9, has The grounds travel of certain lattice form;Described polishing process uses powder granularity to be 5nm-200nm, split Mohs Hardness is the polishing powder of 5-9.
A kind of shaped form has the method for testing of hot AWG array waveguide grating dense wave division multiplexer, including following Step:
Step one, a wire jumper one end being connected into ASE wideband light source, one end is connected into spectrogrph OPTICAL INPUT end, carries out zero calibration;
Step 2, by step one wire jumper central point disconnect, use welding test method, shaped form There are hot AWG array waveguide grating dense wavelength division multiplexing device input and outfan tie jumper source ends and light respectively Spectrometer OPTICAL INPUT end;
Step 3, spectrogrph pattern is switched to write mode, be then scanned test;
Step 4, there is hot AWG array waveguide grating every optical fiber reading of dense wavelength division multiplexing device the least when shaped form When the standard value of regulation, product is certified products.
By technique scheme, the invention has the beneficial effects as follows:
Above-mentioned dense wave division multiplexer uses the working method of Dual Drive Hot Spare to carry out the temperature control of AWG chip System, it is possible to be greatly enhanced the reliability of temperature control circuit;And its bandwidth of operation wave-length coverage can reach 1528nm-1565nm, the test wave band of insertion loss covers the spectrum curve of this wavelength band, described The dependent loss such as operating central wavelength is 1550nm, and wavelength-division is uniform, stable performance, polarization are low;
This producing device and manufacture method, based on existing PLC light branch is to optical coupling board, add Shaped form has hot AWG chip loading platform, it is achieved that simple to operate, the coupling effect that degree of accuracy is high, the most greatly Production efficiency and the product that shaped form is had hot AWG array waveguide grating dense wavelength division multiplexing device is improved in degree Quality;
The test device carrying out this method of testing includes specimen holder, ASE bandwidth light source, spectrometer equipment, light Switch, the method using welding test, required test number of devices is few, not by surrounding, checkout area The restriction on ground, low cost, easily carry out, the method using this accelerated test, not only shorten the testing time (only needing 1/10th of the conventionally test time), improves testing efficiency, and can test whole ripple The incipient fault of section, has hot AWG array waveguide grating dense wavelength division multiplexing device quality and reliability to shaped form Improve, serve effect greatly, shorten the cycle of launch products.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Figure 1A is that the shaped form that the present invention makes has hot AWG array waveguide grating dense wavelength division multiplexing device overall diagram.
Figure 1B is the cut-away view of 1A.
Fig. 2 A is the structural representation of the AWG chip cover glass cover plate of the present invention.
Fig. 2 B is the overall diagram of the concrete operations of Fig. 2 A.
Fig. 3 is the AWG die bonding of the present invention and solidifies the structural representation of interlayer substrate.
Fig. 4 A is the overall structure schematic diagram that the shaped form of the present invention has hot AWG chip loading platform.
Fig. 4 B is the internal structure schematic diagram of Fig. 4 A.
Fig. 4 C is the overall diagram of the concrete operations of Fig. 4 A.
Fig. 4 D is Fig. 4 A, the explosive view of 4B, 4C.
Fig. 5 is the flow chart of the preparation method of the present invention.
Fig. 6 is the fundamental diagram of the AWG chip coupling step of the present invention.
Fig. 7 A is that the present invention is to one of optical coupling 6 DOF regulation systematic schematic diagram.
Fig. 7 B is the present invention two to optical coupling 6 DOF regulation systematic schematic diagram.
Fig. 8 is the fundamental diagram of method of testing of the present invention.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, Below in conjunction with being specifically illustrating, the present invention is expanded on further.
As shown in Figure 1A, 1B, the shaped form that the present invention prepares has hot AWG array waveguide grating condensation wave Division multiplexer, including a temperature control device of high reliable wavelength division array optical waveguide 1, two heater driver 4, The temperature control that two heater driver use the working method of Dual Drive Hot Spare to carry out AWG chip 2, this Invention can be greatly enhanced the reliability of temperature control circuit.
AWG chip 2 two ends are respectively adopted single fiber (pigtail) 5 and monocrystal silicon fiber array (monocrystalline silicon fiber array) 6 couples, at AWG chip 2 input Need to carry out sticking on glass cover-plate 3 with outfan, thus increase coupling area, simplify coupling difficulty.
Monocrystal silicon fiber array 6 is by the monocrystal silicon V on substrate or U-lag array, upper cover plate and multicore monofilm Optical fiber is formed by adhesive bonds, and single fiber, AWG chip and monocrystal silicon fiber array are respectively through UV, baking The processes such as roasting, TC aging, 8 degree of angle grindings, tests.
As shown in Fig. 2 A, 2B, described AWG chip input and outfan cover glass cover plate put with specifically The overall diagram of operation, is fabricated to the shaped form matched with AWG chip input/output terminal on clamping platform The structural feature of groove.
Manually regulation two-dimensional adjustment balance axle 7 can control the glue-line thickness between glass cover-plate and AWG chip Degree so that glue-line is uniformly distributed.The alignment thereof of glass cover-plate and AWG chip end face is by the zigzag of fixture Alignment platform 8 controls, and improves the stability that AWG chip loads, adds coupling area, simplify coupling Close difficulty, it is to avoid because the coupling of less area causes AWG chip to damage.
AWG die bonding is also solidified on sandwich like way (as shown in Figure 3), thus carries out 8 degree of angles and grind, its In 8 degree of angles are ground so that incident illumination device has optimal return loss and minimum dispersion.
With to optical coupling, can disposably increase shaped form has the grinding quantity of hot AWG chip (AWG chip) Avoid the damage of this AWG chip simultaneously, and overcome the deformation that this chip brings in Heatless AWG manufacturing process, Improve the stability of its spectrophotometric data, particularly centre wavelength, and without the temperature-compensating of external power supply The Heatless AWG preparation method of curved array waveguide grating.
The incidence end of described optical device is 8 degree of angles, and another corresponding angle of optical device coupled thereto is also 8 During degree angle, when laser transmits in described optical device, the optical fiber array that optical signal makes at g.652 single-mode fiber When biographies are defeated, return loss value can reach maximum, and total dispersion coefficient can reach smaller value.
By AWG chip by binding agent thermosetting on interlayer substrate, bonding agent include heat-curable glue, paraffin, Ultraviolet glue.Described fusing point is the cohesive material of 50~150 DEG C, at normal temperatures can be to AWG chip and interlayer substrate Solidify.The described total flatness of interlayer substrate is 2~15um, and angularity is 20~50um.Described AWG core Bonded adhesives thickness between sheet and described interlayer substrate is less than 1um.
Can carry out 8 degree of angles after described solidification to grind, can disposably increase shaped form has hot AWG chip simultaneously The grinding quantity of (AWG chip), and overcome the deformation that this chip brings in Heatless AWG manufacturing process. Described lapping mode can be accurately positioned 8 degree of angles, avoids the damage of this chip simultaneously.Described orientation range is 8°±0.3°。
Grinding steps is divided into rough grinding pass and stannum grind, and rough grinding pass grounds travel employing powder granularity is 10nm~2000nm, split Mohs' hardness is 7~9, and powder body crystal formation is lamellar, hexagonal cylinder, four directions, monocline, The materials such as the ferrum oxide of cube etc., green carborundum, chromium oxide.Described grits granule has certain lattice Form, forms sharp keen wedge angle time broken.Described polishing process grounds travel employing powder granularity is 5nm~200nm, split Mohs' hardness is 5~9, and powder body crystal formation is lamellar, hexagonal cylinder, four directions, monocline, The materials such as the aluminium oxide of cube etc., cerium oxide, zirconium oxide.Described polishing powder has suitable hardness and close Spend, and water has good wellability and suspension.
As shown in Fig. 4 A, Fig. 4 B, and combining Fig. 4 C, Fig. 4 D, wherein Fig. 4 C is the concrete behaviour of loading platform Making schematic diagram, Fig. 4 D is the explosive view of loading platform.
Optical coupling chip loading platform is made up of by above-mentioned AWG chip base 9 and pressing plate 10, and base sets Putting upper and lower two-layer positioning table plate body, upper strata positioning table is had the knot similar to AWG chip structure body by edge Structure cube composition (as shown in Figure 4 B), and containing upper strata clamp system 11.
One two circular grooves 12 being positioned at upper strata clamp system 11 both sides, described circular groove 12 is with described Lower floor positioning table uses screw to be engaged togather use;Described lower floor positioning table is held in the mouth mutually by with described circular groove The stage body connect is constituted with center bearing bracket.
Lower floor's positioning table by existing PLC light branch to optical coupling board center dies support based on, with institute State lower floor's clamp system to be used in combination.
Described pressing plate 10 is made up of upper and lower two-layer plate body, and upper strata plate body is by the big lightweight speciality material of hardness Polishing forms, and described material includes that aluminium alloy, plastic-steel etc., center are provided with clamp system, with described clamping machine Structure is used in combination;Lower floor's plate body is made up of soft and that plasticity is big special material, and described material includes silicon Acid aluminum fiber, high silicon laminate material, rock wool, complex silicate salt material etc. have buffering to AWG chip Protective effect, can avoid AWG chip in clamping process or coupling process sustains damage.
With reference to Fig. 5, a kind of shaped form has the manufacture method of hot AWG array waveguide grating dense wave division multiplexer, Including:
One AWG chip coupling step,
One testing procedure, for the complete AWG chip of coupling being carried out the test of fiber-optic transfer data,
One encapsulation step, is packaged the product after test passes.
With reference to Fig. 6, Fig. 7 A, Fig. 7 B and Fig. 8, wherein AWG chip coupling step is specific as follows:
The first step: input adjustment
(1) have on hot AWG chip loading platform in shaped form and put this AWG chip, pass through clamp system Clamping (Fig. 4 A);
(2) regulation input CCD three-dimensional adjustable shelf, makes shaped form have hot AWG chip input upper surface Blur-free imaging is in the central authorities of display;
(3) input side-to-side movement axle 13 is turned clockwise until single fiber is near AWG chip.
(4) regulation input CCD three-dimensional adjustable shelf makes can clearly show on display single fiber end face and AWG The front situation of chip end face, the sextuple adjusting bracket of regulation seesaws axle 14 and front and back yawing axis 15 so that Single fiber end face reaches, with AWG chip end face, the effect that both sides are parallel.
(5) input CCD display system is moved on to be directed at AWG chip input end, regulate input CCD The definition of display system, until the side situation of single fiber end face and AWG chip end face can be clearly observed. Regulation up and down motion axle 16 and upper and lower yawing axis 17, make both ends of the surface reach the effect that both sides, side are parallel.
Second step: outfan adjustment
(1) light of monocrystal silicon fiber array FA corresponding to two outfan waveguides of AWG chip ragged edge is found out Fine passage.
(2) outfan Y-axis is turned clockwise until monocrystal silicon fiber array FA is near AWG chip.
(3) regulate the definition of outfan CCD display system, display can be clearly observable monocrystal silicon Fiber array FA end face and shaped form have a front situation in hot AWG chip output face, regulation antero posterior axis and Yawing axis front and back, makes both ends of the surface reach parallel.
(4) upper and lower axle and upper and lower yawing axis are regulated so that monocrystal silicon fiber array FA end face has with shaped form Both sides, hot AWG chip output face are parallel.
(5) outfan CCD display system is moved on to front.Regulate the clear of outfan CCD display system Degree, enables the situation being clearly observable AWG chip from display with monocrystal silicon fiber array FA front.
(6) single fiber loaded, AWG chip and monocrystal silicon fiber array FA are carried out waveguide alignment, I.e. single fiber input waveguide is directed at one by one with chip input waveguide, then by chip output waveguide and monocrystal silicon The waveguide of fiber array FA is directed at one by one, first adjusts upper and lower axle to adjust antero posterior axis to complete to look for light again.
3rd step: adjustment
(1) Y-axis of output system, monocrystal silicon fiber array FA rearwardly away are rotated counterclockwise.
(2) Y-axis of output system and upper and lower axle are regulated, until light power meter reading is about-30dB.
(3) turn clockwise outfan Y-axis so that monocrystal silicon fiber array FA and AWG chip away from From reduction, during shifting near forward, regulation Y-axis and upper and lower axle so that the absolute reading of luminous power Less than-30dB.
(4) there is the reading of array board optical fiber corresponding to hot AWG chip outfan waveguide foremost when shaped form Time suitable, start adjustment.
(5) regulation output system antero posterior axis and the axle up and down of left hand regulation output system so that shaped form has Array board optical fiber absolute reading corresponding to hot AWG chip Far Left outfan waveguide is minimum, turn clockwise on Lower axle, observing shaped form has the reading of the hot AWG chip array board optical fiber that the inside outfan waveguide is corresponding to become Change.When the upper and lower axle that turns clockwise, when shaped form has the hot AWG chip reading that the inside is corresponding to increase, inverse Rotary switch before and after hour hands regulation output system, otherwise, then rotary switch before and after regulating clockwise.
(6) repeating said steps (5) has two outfan ripples of hot AWG chip ragged edge to shaped form The array board optical fiber reading leading correspondence increases and decreases simultaneously, it is believed that monocrystal silicon fiber array FA and shaped form have heat AWG chip light is reached balance.
(7) input CCD display system is moved single fiber and chip input side, and regulation input CCD shows Show that the definition of system, observation single fiber end face and shaped form have the spacing of hot AWG chip end face, slowly up time Pin rotates the Y-axis of input system, advances single fiber.Before and after regulation input system, axle is to keep both ends of the surface side Bar parallel.The axle up and down of regulation input system, the reading again making two optical fiber of outermost end is minimum.
(8) outfan CCD display system is moved on to monocrystal silicon fiber array FA and AWG chip output At front, the definition of regulation outfan CCD display system, observe monocrystal silicon fiber array FA and curve Shape has the spacing of hot AWG chip end face.
(9) regulate the Y-axis of output system clockwise, make monocrystal silicon fiber array FA have near shaped form Hot AWG chip, axle and upper and lower axle before and after regulation output system so that shaped form has hot AWG chip outermost The array board optical fiber absolute reading that two outfan waveguides on limit are corresponding is minimum.
(10) there is array board optical fiber corresponding to two outfan waveguides of hot AWG chip ragged edge when shaped form The standard value time point UV glue of reading both less than regulation solidifies simultaneously, and coupling makes complete.
Above-mentioned input, outfan adjustment are containing N number of input waveguide, M outfan waveguide, wherein N, M are natural number.Described N is 1,2,3,4,5 or 6;Described M is 40,48,50 Or other wave numbers.
It is optimal that above-mentioned balance adjustment enables to all channels uniformity of AWG device after coupling, passage Insertion Loss Minimum.Described device all works in specific wave-length coverage, and can be for a long time in the environment of-40~85 DEG C At a temperature of steady operation.
With reference to Fig. 8, above-mentioned shaped form is used to have hot AWG array waveguide grating dense wavelength division multiplexing device to test device The method carrying out testing, the method comprises the following steps:
Step one, a wire jumper one end being connected into ASE wideband light source, one end is connected into spectrogrph OPTICAL INPUT end, carries out zero calibration;
Step 2, a kind of for step wire jumper central point being disconnected, the method using welding test, shaped form There are hot AWG array waveguide grating dense wavelength division multiplexing device input and outfan tie jumper source ends and light respectively Spectrometer OPTICAL INPUT end;
Step 3, spectrogrph pattern is switched to write mode, be then scanned test;
Step 4, there is hot AWG array waveguide grating every optical fiber reading of dense wavelength division multiplexing device the least when shaped form When the standard value of regulation, product is certified products.
Through the application of a period of time, carrying service operation is stable, and shaped form has hot AWG array waveguide grating close Wavelength division multiplex device qualification rate substantially rises.By this project of existing network application note optical device research and develop business, Shaped form has hot AWG array waveguide grating dense wavelength division multiplexing device to produce business and other model wavelength-division multiplex Device, the aspect such as processing test business of DWDM-PON optical device has broad application prospects, and can effectively promote Service fulfillment efficiency, the human cost of saving, it is achieved the extensive production to wavelength division multiplexer, solve close Collection wavelength-division multiplex (DWDM) system production capacity problem.
The ultimate principle of the present invention and principal character and advantages of the present invention have more than been shown and described.The industry Skilled person will appreciate that, the present invention is not restricted to the described embodiments, in above-described embodiment and description The principle that the present invention is simply described described, without departing from the spirit and scope of the present invention, the present invention Also having various changes and modifications, these changes and improvements both fall within scope of the claimed invention.This The claimed scope of invention is defined by appending claims and equivalent thereof.

Claims (8)

1. shaped form has a producing device for hot AWG array waveguide grating dense wave division multiplexer, and it is special Levy and be, including:
One AWG chip manufacture device, solid including an AWG chip cover glass cover board arrangement and an AWG chip Change and lapping device;
Described AWG chip cover glass cover board arrangement is used for increasing coupling area;Described AWG chip solidification dress Putting and be both secured on interlayer substrate by multiple AWG chips, the AWG chip after solidification is entered by lapping device simultaneously Row grinds,
One coupling device, for coupling the input of single fiber with AWG chip and by monocrystal silicon fiber array Couple with the outfan of AWG chip,
And an encapsulating housing, the product after test passes is packaged.
2. there is hot AWG array waveguide grating dense wavelength division multiple according to a kind of shaped form described in claim 1 With the producing device of device, it is characterised in that
Also include coupling the test device that complete AWG chip carries out the test of fiber-optic transfer data, described Test device includes:
One specimen holder, for placing the AWG chip that coupling is complete,
One ASE wideband light source and a photoswitch being connected with ASE bandwidth light source, this photoswitch and single fiber one end It is connected,
And a spectrogrph, this spectrogrph is connected with one end of monocrystal silicon fiber array.
3. there is hot AWG array waveguide grating dense wavelength division multiple according to a kind of shaped form described in claim 1 With the producing device of device, it is characterised in that described AWG chip cover glass cover board arrangement includes:
One clamping platform, described clamping platform arranges the structural feature of a curvilinear shaped recesses, described shaped form The structural feature of groove matches with the input/output terminal of AWG chip,
One is positioned at the locating platform directly over structural feature, and this locating platform includes what vertical clamping platform was arranged Two-dimensional adjustment balance axle, for being accurately positioned the bondline thickness of glass cover-plate and AWG chip,
And the zigzag alignment platform being positioned at structural feature side, it is used for blocking AWG chip, improves AWG Chip loads stability.
4. there is hot AWG array waveguide grating dense wavelength division multiple according to a kind of shaped form described in claim 1 With the producing device of device, it is characterised in that described coupling device includes:
One shaped form has hot AWG chip loading platform, is used for placing and clamp AWG chip,
One input CCD image intensifer and outfan CCD image intensifer,
One display being connected with input CCD image intensifer and outfan CCD image intensifer, this display Alignment picture during vision-control,
One be arranged at AWG chip input side to optical assembly, described optical assembly is included a photoswitch, And the tunable laser source being connected with photoswitch,
And the light power meter being arranged at AWG chip output side, this light power meter is used for measuring regulation During light power meter reading.
5. there is hot AWG array waveguide grating dense wavelength division multiple according to a kind of shaped form described in claim 4 With the producing device of device, it is characterised in that described shaped form has hot AWG chip loading platform to include:
One base, described base includes upper strata positioning table and lower floor's positioning table;
Described upper strata positioning table includes the bottom tub of a placement AWG chip, one is positioned at the upper strata in the middle part of bottom tub Clamp system and one is positioned at two circular grooves of clamp system both sides, upper strata, described circular groove with described under Layer positioning table is fixing to be connected;Described lower floor positioning table is propped up with center by the stage body being connected mutually with described circular groove It is configured to,
One pressing plate covering base, described pressing plate includes upper strata plate body and lower floor's plate body equally;
Described upper strata plate body uses a monoblock hardness sheet material big, lightweight, and middle part arranges lower floor's clamping machine On structure, with base arrange upper strata clamp system with the use of;Described lower floor plate body uses soft, plasticity Big sheet material.
6. shaped form has a manufacture method for hot AWG array waveguide grating dense wave division multiplexer, and it is special Levy and be, comprise the following steps:
One AWG chip coupling step, specific as follows:
Step one, the input adjustment of AWG chip;The three-dimensional that regulation is connected with input CCD image intensifer Adjusting bracket, makes can clearly show single fiber end face and AWG chip input end face on display,
Regulation input 6 DOF adjusting bracket so that it is parallel that single fiber end face reaches both sides with AWG chip input end face And the position that side is parallel;
Step 2, the outfan adjustment of AWG chip;The three-dimensional regulation being connected with outfan CCD image intensifer Frame, makes can clearly show monocrystal silicon fiber array end face and AWG chip output end face on display,
Regulation outfan 6 DOF adjusting bracket so that monocrystal silicon fiber array end face reaches with AWG chip output face Parallel to both sides and that side is parallel position;
Single fiber input waveguide is directed at one by one by above-mentioned steps one and step 2 with AWG chip input waveguide, Again AWG chip output waveguide is directed at one by one with the waveguide of monocrystal silicon fiber array;
Step 3, balance adjustment;Input CCD image intensifer moves to single fiber end face input with AWG chip End, and the reading combining light power meter is adjusted;
Outfan CCD image intensifer is moved at monocrystal silicon fiber array end face and AWG chip output face, Reading also in conjunction with light power meter is adjusted;
Until when shaped form has the optical fiber reading both less than regulation that the input of hot AWG chip is corresponding with outfan Standard value time, some UV glue solidify simultaneously;
One testing procedure, for the complete AWG chip of coupling being carried out the test of fiber-optic transfer data,
One encapsulation step, is packaged the product after test passes.
7. there is hot AWG array waveguide grating dense wavelength division multiple according to a kind of shaped form described in claim 6 By the manufacture method of device, it is characterised in that also included that before AWG chip coupling step an AWG chip adds Work step is rapid;
Step one, uses AWG chip cover glass cover board arrangement that AWG chip two ends are carried out cover glass lid Plate;
Step 2, has the AWG chip of glass cover-plate utilize the solidification of AWG chip and grind by the connection in step one Mill apparatus carries out solidifying and grinding;
In cure stage, AWG chip is passed through binding agent thermosetting on interlayer substrate, it is ensured that interlayer substrate is total Flatness is 2-15um, and angularity is that the bonded adhesives between 20-50um, and AWG chip and described substrate is thick Degree is less than 1um;After solidification, carry out 8 degree of angles and grind.
8. there is hot AWG array waveguide grating dense wavelength division multiple according to a kind of shaped form described in claim 7 By the manufacture method of device, it is characterised in that the grinding in described step 2 is divided into rough grinding pass and polishing process, Described rough grinding pass uses powder granularity to be 10nm-2000nm, and split Mohs' hardness is 7-9, has certain crystalline substance The grounds travel of trellis state;Described polishing process uses powder granularity to be 5nm-200nm, and split Mohs' hardness is The polishing powder of 5-9.
CN201410196496.4A 2014-05-09 2014-05-09 A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and producing device, manufacture method and method of testing CN103955029B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107462950A (en) * 2017-08-31 2017-12-12 武汉光迅科技股份有限公司 A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105278056B (en) * 2015-11-06 2017-05-03 武汉电信器件有限公司 Wavelength division multiplexing and de-multiplexing optical assembly
CN105676350A (en) * 2016-03-03 2016-06-15 博创科技股份有限公司 Packaging structure of arrayed waveguide grating module and preparation method
CN107390326B (en) * 2017-08-01 2019-11-12 江苏亨通光网科技有限公司 Dense wavelength division array optical waveguide channel is to light method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1548931A (en) * 2003-05-21 2004-11-24 华为技术有限公司 Automatic testing apparatus and method for comb type filter spectrum optical module
CN201607540U (en) * 2010-03-11 2010-10-13 武汉光迅科技股份有限公司 Package structure of center wavelength of stable curve array waveguide grating chip
CN201828682U (en) * 2010-10-20 2011-05-11 广东海粤集团有限公司 Planar waveguide array grating wavelength division multiplexer based on temperature control
CN203930120U (en) * 2014-05-09 2014-11-05 上海亨通宏普通信技术有限公司 A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and producing device thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6690852B2 (en) * 2000-06-22 2004-02-10 Fujikura Ltd. Optical multiplexer/demultiplexer
US6424760B1 (en) * 2000-12-29 2002-07-23 Sumitomo Electric Industries, Ltd. Optical multiplexer/demultiplexer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1548931A (en) * 2003-05-21 2004-11-24 华为技术有限公司 Automatic testing apparatus and method for comb type filter spectrum optical module
CN201607540U (en) * 2010-03-11 2010-10-13 武汉光迅科技股份有限公司 Package structure of center wavelength of stable curve array waveguide grating chip
CN201828682U (en) * 2010-10-20 2011-05-11 广东海粤集团有限公司 Planar waveguide array grating wavelength division multiplexer based on temperature control
CN203930120U (en) * 2014-05-09 2014-11-05 上海亨通宏普通信技术有限公司 A kind of shaped form has hot AWG array waveguide grating dense wave division multiplexer and producing device thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
基于阵列波导光栅的单纤三重波分复用器;郎婷婷等;《半导体学报》;20060228;第27卷(第2期);368-372 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107462950A (en) * 2017-08-31 2017-12-12 武汉光迅科技股份有限公司 A kind of wide temperature, low-power consumption array waveguide grating module and wavelength control method

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