CN103558657A - Array waveguide grating - Google Patents
Array waveguide grating Download PDFInfo
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- CN103558657A CN103558657A CN201310572853.8A CN201310572853A CN103558657A CN 103558657 A CN103558657 A CN 103558657A CN 201310572853 A CN201310572853 A CN 201310572853A CN 103558657 A CN103558657 A CN 103558657A
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- heating electrode
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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Abstract
The invention provides an array waveguide grating which comprises a heating electrode located on the back face of a grating zone of an AWG chip. The heating electrode is in direct contact with a base material in the grating zone and generates heat when the heating electrode is in the power on state. According to the array waveguide grating, use of a heating sheet and a heat conducting aluminum plate which are arranged so as to achieve the heating purpose in the prior art is avoided, the heating electrode is arranged on the back face of the grating zone of the AWG chip, the heating electrode is in direct contact with the base material in the grating zone, heat generated by the heating electrode in the power on state can be directly transmitted to the base material of the AWG chip, the time spent on the purpose that a device achieves heat balance is greatly shortened, and the starting time of the AWG is shortened. In addition, the heating electrode is directly integrated on the base material in the grating zone of AWG chip, so that compared with the heating sheet and the heat conducting aluminum plate which are independently arranged in the prior art, the heating electrode has the advantages that the size of the AWG is reduced and the structure is simplified.
Description
Technical field
The present invention relates to technical field of optical fiber communication, more particularly, relate to a kind of array waveguide grating.
Background technology
AWG(Arrayed Waveguide Grating, array waveguide grating) be generally used for the multiplexing and demultiplexing of dwdm system (Dense Wavelength Division Multiplexing, close packing type wavelength division multiplexer).AWG realizes partial wave by waveguide optical grating diffraction, wherein, ITU(Inter-national Telecommunication Union, International Telecommunications Union) centre wavelength is relevant to the Refractive Index of Material of waveguide optical grating, guarantee that ITU centre wavelength meets the demands, just need the Refractive Index of Material of waveguide optical grating stable.Because the base material of waveguide is quartzy, its refractive index and temperature correlation, therefore, controlling ITU centre wavelength just needs control temperature or carries out other compensation.
Hot type AWG is that method that adopt to control temperature realizes the control of ITU centre wavelength.As depicted in figs. 1 and 2, the basic structure of hot type AWG comprises at present: AWG core component, the output optical fibre array 103 that the input optical fibre array 102 that described AWG core component comprises AWG chip 101, be connected with the input end of described AWG chip 101 is connected with the output terminal with described AWG chip 101, wherein, the zone line of described AWG chip 101 is grating region; Be positioned at the aluminum heat conducting plate 104 of described AWG chip back; Be positioned at the heating plate 105 in the one side that described aluminum heat conducting plate 104 deviates from described AWG chip 101; For the stand frame 106 that described AWG chip 101, aluminum heat conducting plate 104 and heating plate 105 are fixed together.Except said structure, hot type AWG also comprises: the structures such as thermistor (not shown), circuit board (not shown).
When needs heat AWG, to heating plate 105 energisings, make the heat of its generation pass to AWG chip 101 by aluminum heat conducting plate 104, thereby the temperature of AWG is raise.But because above-mentioned heating means are conducted heat by heat conduction aluminium flake 104, therefore reaching heat balance time needs 10 to 15 minutes, causes the start-up time of AWG longer.
Summary of the invention
The invention provides a kind of array waveguide grating, to shorten the start-up time of AWG.
For achieving the above object, the invention provides following technical scheme:
A kind of array waveguide grating, comprise: AWG core component, described AWG core component comprises that zone line is the AWG chip of grating region, described array waveguide grating also comprises: the heating electrode that is positioned at the grating region back side of described AWG chip, described heating electrode directly contacts with the base material of described grating region, and described heating electrode produces heat when energising.
Preferably, the heater strip that described heating electrode distributes for bending.
Preferably, described heating electrode is S-type or be N-type bending and distribute.
Preferably, the structure that described heating electrode is full wafer.
Preferably, the material of described heating electrode is chromium, evanohm, tungsten or tungalloy.
Preferably, described array waveguide grating also comprises: be positioned at described AWG chip back, and the first pad and the second pad that are electrical connected with the two ends of described heating electrode respectively, described the first pad and described the second pad are electrical connected with anodal and negative pole respectively.
Preferably, described the first pad and described the second pad lay respectively at the two ends of described AWG chip.
Preferably, described the first pad and described the second pad are positioned at same one end of described AWG chip.
Preferably, the material of described the first pad and described the second pad is gold, aluminium or Alpax.
Preferably, described array waveguide grating also comprises: be positioned at the supporting construction of described AWG chip back, described supporting construction is used for supporting described AWG chip.
Compared with prior art, technical scheme provided by the present invention at least has the following advantages:
Array waveguide grating provided by the present invention, avoided using heating plate and the aluminum heat conducting plate arranging for realizing the object of heating in prior art, the back side at the grating region of AWG chip arranges heating electrode, heating electrode directly contacts with the base material of grating region, the heat that heating electrode produces when energising can be directly passed to the base material of AWG chip, thereby can make device reach the thermally equilibrated time, reduce greatly, shortened the start-up time of AWG.
And heating electrode is directly integrated on the grating region of AWG chip, this is with respect to the heating plate and the aluminum heat conducting plate that arrange separately in prior art, the volume of AWG is reduced, designs simplification.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the Facad structure figure of AWG in prior art;
Fig. 2 is the structure figure of AWG in prior art;
The Facad structure figure of the AWG that Fig. 3 provides for the embodiment of the present invention;
The structure figure of the AWG that Fig. 4 provides for the embodiment of the present invention;
The heating electrode of AWG and the structural drawing of pad that Fig. 5 provides for the embodiment of the present invention;
The heating electrode of AWG and the another kind of structural drawing of pad that Fig. 6 provides for the embodiment of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
A lot of details have been set forth in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization without prejudice to intension of the present invention in the situation that, so the present invention is not subject to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the present invention is described in detail in detail; for ease of explanation; the sectional view that represents device architecture can be disobeyed general ratio and be done local amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three-dimensional space that should comprise in addition, length, width and the degree of depth in actual fabrication.
The present embodiment provides a kind of array waveguide grating, as shown in Figure 3 and Figure 4, this array waveguide grating comprises: AWG core component, described AWG core component comprises that zone line is the AWG chip 201 of grating region 2011, this array waveguide grating also comprises: the heating electrode 204 that is positioned at grating region 2011 back sides of described AWG chip 201, described heating electrode 204 directly contacts with the base material of described grating region 2011, and described heating electrode 204 produces heat when energising.
It should be noted that, the base material of AWG chip grating region is the base material of AWG chip, is preferably silica-based.
Because heating electrode 204 and AWG chip 201 integrate, directly contact between the two, therefore, when heating electrode 204 energisings produce heat, can conduct heat the base material to AWG chip rapidly, realization is heated to AWG chip, reaches the thermally equilibrated time to be less than 10 minutes.And in prior art, heating plate is set separately, and by heating plate, producing heat, then conduct heat on AWG chip by heat conduction aluminium flake, heat conduction velocity is slower, reaches the thermally equilibrated time conventionally about 15 minutes.Therefore, the technical scheme that the present embodiment provides, it is shorter that device reaches the thermally equilibrated time, thereby shortened the start-up time of AWG greatly.
Why heating electrode 204 is arranged on to the back side of AWG chip grating region 2011, because AWG chip itself is heat-transfer device, device will be controlled grating region temperature, and the control accuracy that therefore heating electrode 204 electrodes is placed on to 2011 pairs of temperature of grating region is higher.
In addition, owing to directly heating electrode 204 being integrated on AWG chip 201, use heating plate and aluminum heat conducting plate have been avoided, used unit still less, therefore, the structure of the AWG in the present embodiment is simpler than of the prior art, when device breaks down maintenance time still less and standby storehouse parts still less, the reliability that device is used is higher, and when device system switches or upgrades, performance is more excellent.
The mode that heating electrode 204 and AWG chip 201 integrate is preferably on the base material that heating electrode 204 is attached to the AWG chip 201 grating region back sides.
This enforcement of concrete structure of heating electrode 204 does not limit, and can be preferably the structure of full wafer, as: the metal level of full wafer or metallic film can be also the heater strip of bending distribution.When heating electrode 204 is heater strip, its concrete bending form can design according to actual conditions, and in the present embodiment, heating electrode 204 preferably can be S-type or be N-type bending and distribute; Further, in order to improve heat conducting homogeneity, and increase heating surface (area) (HS, preferably can increase the distribution density of S type or N-type heater strip.
In the present embodiment, the material of described heating electrode 204 is preferably chromium, evanohm, tungsten or tungalloy, in other embodiments of the invention, also can select other material to form heating electrode 204.
The formation method of heating electrode 204 is in simple terms: at the grating region back side that makes complete AWG chip, form heating electrode, detail step can design according to actual conditions.The heater strip that the heating electrode 204 of take is bending distribution is example, its forming process preferably can be: adopt the techniques such as evaporation, sputter, chemical vapor deposition, plating at the back side of AWG chip grating region growth electrode layer, adopt photoetching process and etching process to remove a part of electrode layer material, to form the pattern of the heater strip of bending distribution on electrode layer, finally, to standard clean techniques such as AWG chip clean, obtain being integrated with the AWG chip of heating electrode.
Known through concrete accounting contrast, it is lower than the cost of manufacture of the array waveguide grating that heating plate and aluminum heat conducting plate are set separately in prior art that the present embodiment is made array waveguide grating.
In order to optimize the performance of AWG, heating electrode can be switched on more easily, the AWG that the present embodiment provides preferably also comprises: the back side that is positioned at described AWG chip 201, and the first pad 205 and the second pad 206 that are electrical connected with the two ends of described heating electrode 204 respectively, described the first pad 205 and described the second pad 206 are electrical connected with anodal and negative pole respectively.
Different according to the distribution form of heating electrode, the position of the first pad and the second pad also can be different.As shown in Figure 5, the two ends of heating electrode 301 are respectively near the two ends of AWG chip, and the first pad 302 and the second pad 303 lay respectively at the two ends (being input end and output terminal) of AWG chip.As shown in Figure 6, the two ends of heating electrode 401 are all near one end of AWG chip, and the first pad 402 and the second pad 403 are positioned at same one end (being input end or output terminal) of AWG chip, and this set form connecting line is shorter, compacter.
The material of the first pad and the second pad can be selected according to actual conditions, and the material of the first pad described in the present embodiment and described the second pad is preferably gold, aluminium or Alpax.
In addition, the AWG providing in the present embodiment preferably also comprises: be positioned at the supporting construction of described AWG chip back, described supporting construction is used for supporting described AWG chip.
Because the supporting construction in the present embodiment is only for supporting AWG chip, therefore, its volume is with respect to little many of the stand frame that is used for AWG chip, aluminum heat conducting plate and heating plate to be fixed together in prior art, thereby the volume of the AWG in the present embodiment reduces with respect to prior art.
It should be noted that, " front " described in the present embodiment and " back side " are only used to distinguish the relative both sides of AWG chip, do not represent actual meaning, can not the particular location of the structure of AWG chip itself, heating electrode, pad etc. be formed and be limited.
The AWG that the present embodiment provides, avoid adopting the mode that heating plate and aluminum heat conducting plate control device temperature are set separately, the grating region back side of its AWG chip is directly integrated heating electrode, thereby the heat that heating electrode energising produces can conduct on AWG chip more rapidly, realizes the control to AWG temperature.AWG compared to existing technology, it is shorter that the AWG in the present embodiment reaches the required time of thermal equilibrium, so device starts faster, and use parts to reduce, structure is simpler, and the probability that device breaks down still less, reliability strengthens, and when device system switches or upgrades, performance is more excellent.
Although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention.Any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (10)
1. an array waveguide grating, comprising: AWG core component, and described AWG core component comprises that zone line is the AWG chip of grating region, it is characterized in that, described array waveguide grating also comprises:
Be positioned at the heating electrode at the grating region back side of described AWG chip, described heating electrode directly contacts with the base material of described grating region, and described heating electrode produces heat when energising.
2. array waveguide grating according to claim 1, is characterized in that, the heater strip that described heating electrode distributes for bending.
3. array waveguide grating according to claim 2, is characterized in that, described heating electrode is S-type or be N-type bending and distribute.
4. array waveguide grating according to claim 1, is characterized in that, the structure that described heating electrode is full wafer.
5. array waveguide grating according to claim 1, is characterized in that, the material of described heating electrode is chromium, evanohm, tungsten or tungalloy.
6. array waveguide grating according to claim 1, it is characterized in that, also comprise: be positioned at described AWG chip back, and the first pad and the second pad that are electrical connected with the two ends of described heating electrode respectively, described the first pad and described the second pad are electrical connected with anodal and negative pole respectively.
7. array waveguide grating according to claim 6, is characterized in that, described the first pad and described the second pad lay respectively at the two ends of described AWG chip.
8. array waveguide grating according to claim 6, is characterized in that, described the first pad and described the second pad are positioned at same one end of described AWG chip.
9. array waveguide grating according to claim 6, is characterized in that, the material of described the first pad and described the second pad is gold, aluminium or Alpax.
10. according to the array waveguide grating described in claim 1～9 any one, it is characterized in that, also comprise: be positioned at the supporting construction of described AWG chip back, described supporting construction is used for supporting described AWG chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310572853.8A CN103558657B (en) | 2013-11-15 | 2013-11-15 | array waveguide grating |
| PCT/CN2014/089014 WO2015070692A1 (en) | 2013-11-15 | 2014-10-21 | Arrayed waveguide grating |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310572853.8A CN103558657B (en) | 2013-11-15 | 2013-11-15 | array waveguide grating |
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| CN103558657A true CN103558657A (en) | 2014-02-05 |
| CN103558657B CN103558657B (en) | 2016-06-22 |
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| CN201310572853.8A Active CN103558657B (en) | 2013-11-15 | 2013-11-15 | array waveguide grating |
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| WO (1) | WO2015070692A1 (en) |
Cited By (5)
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| WO2015070692A1 (en) * | 2013-11-15 | 2015-05-21 | 四川飞阳科技有限公司 | Arrayed waveguide grating |
| CN107562084A (en) * | 2017-08-31 | 2018-01-09 | 武汉光迅科技股份有限公司 | A kind of module and method for wavelength compensation based on chip temperature control and Heatless AWG technology |
| CN108369352A (en) * | 2015-07-24 | 2018-08-03 | 瞻博网络公司 | Planet phasing in waveguide array |
| CN111307910A (en) * | 2020-03-14 | 2020-06-19 | 深圳聚德寿科技有限公司 | Switch type zirconium-based oxygen core |
| CN112269276A (en) * | 2020-11-13 | 2021-01-26 | 中国科学院微电子研究所 | Optical device |
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| WO2015070692A1 (en) * | 2013-11-15 | 2015-05-21 | 四川飞阳科技有限公司 | Arrayed waveguide grating |
| CN108369352A (en) * | 2015-07-24 | 2018-08-03 | 瞻博网络公司 | Planet phasing in waveguide array |
| US10436981B2 (en) | 2015-07-24 | 2019-10-08 | Aurrion, Inc. | Phase tuning in waveguide arrays |
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| CN107562084A (en) * | 2017-08-31 | 2018-01-09 | 武汉光迅科技股份有限公司 | A kind of module and method for wavelength compensation based on chip temperature control and Heatless AWG technology |
| CN111307910A (en) * | 2020-03-14 | 2020-06-19 | 深圳聚德寿科技有限公司 | Switch type zirconium-based oxygen core |
| CN112269276A (en) * | 2020-11-13 | 2021-01-26 | 中国科学院微电子研究所 | Optical device |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2015070692A1 (en) | 2015-05-21 |
| CN103558657B (en) | 2016-06-22 |
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