CN106405736B - A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology - Google Patents
A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology Download PDFInfo
- Publication number
- CN106405736B CN106405736B CN201610899427.9A CN201610899427A CN106405736B CN 106405736 B CN106405736 B CN 106405736B CN 201610899427 A CN201610899427 A CN 201610899427A CN 106405736 B CN106405736 B CN 106405736B
- Authority
- CN
- China
- Prior art keywords
- electrode
- polymer
- wave guide
- substrate
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
Abstract
A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology, belongs to polymer optical wave guide integrated chip preparation technical field.The present invention, which is specifically included, to be prepared polymer side electrode using 3D printing technique and is transferred electrode inside indentation polymer substrate by hot press printing technology, then ridge or rectangular waveguide are prepared by hot press printing technology in polymer substrate electrode side, last spin coating clad material, fiber waveguide device of the formation with side electrode and etc..Fiber waveguide device with side electrode of the invention may be used in 3D printing technique and prepare photoswitch polymer electrode, can provide thermal field in the side of waveguide, two lateral electrode of waveguide can also be used, and apply electric field in the horizontal direction of waveguide.
Description
Technical field
The invention belongs to polymer optical wave guide integrated chip preparation technical fields, and in particular to a kind of to use 3D printing and heat
The method that stamping technique prepares polymer optical wave guide side electrode.
Background technique
Electrode is the important component part of integrated light guide chip, and the integrated morphology of existing electrode and optical waveguide is broadly divided into
Waveguide top electrode, burial type hearth electrode and side electrode.Top electrode and hearth electrode can be real in the integrating process with optical waveguide
The heating on existing waveguide top and bottom, top electrode and hearth electrode combine the electric field that can apply vertical direction distribution in waveguide.
Polymer side electrode can heat optical waveguide in side, and the electrode of waveguide two sides can provide the electricity of horizontal direction
?.The preparation method of existing electrode predominantly stays in theoretical research stage mainly for top electrode and hearth electrode, side electrode.It is existing
Have processing method to prepare side electrode to have difficulties, main problem is embodied in: metal electrode usually requires to prepare electrode first
Film then prepares electrode pattern by photoetching development.The method that electrode film generallys use evaporation or sputtering, the film thickness
Usually nanometer scale, preparation is in waveguide side difficulty.In addition, metal electrode during the preparation process can waveguide to previously having prepared
It has an impact, polymer waveguide especially poor to heat resistance, so that the preparation of side electrode is more difficult.
Summary of the invention
The present invention, which is specifically included, to be prepared polymer side electrode using 3D printing technique and passes through hot press printing technology for electrode
Inside transfer indentation polymer substrate, ridge or rectangular wave are then prepared by hot press printing technology in polymer substrate electrode side
It leads, last spin coating clad material, forms the fiber waveguide device with side electrode.
The specific process steps are as follows:
1) electrode structure, electrode structure are designed by threedimensional model design software (Meshmixer of autodesk, inc.)
With the output of OBJ formatted file after the completion of design；Electrode structure schematic diagram is as shown in Fig. 1, electrode be it is sequentially connected it is left, in,
Right three-stage strip structure；Interlude strip structure is the effective heating area of electrode, and width is 0.8~1.5mm, the length is
5~30mm；One end of left section and right section strip structure is vertical with the both ends of interlude strip structure respectively to be connect, and is drawn as electrode
Area out；Left section and right section of strip structure are located at the ipsilateral of effective heating area, of same size, the length of width and effective heating area
Degree is 1000~10000 μm；The other end two electrode draw-out areas is respectively arranged with the electrode pin of rectangular configuration, rectangle knot
The length of structure and wide respectively 1~10mm, and its width is greater than the width of strip structure；The left, center, right three-stage bar shaped knot of electrode
Structure is identical as the height of electrode pin, is 0.02~0.7mm；
2) above-mentioned obj file is opened using corresponding 3D printing management software, and using 3D printing equipment 1 in inorganic substrate
(Si or SiO on 22) printed, obtain (the print speed: 1~30mm/s, thickness: 0.02 of electrode 3 of the step 1) structure
~0.7mm, compactedness: 80%~100%, printhead size: 0.3mm or 0.4mm)；Then acetone soln is added on hot plate
Thermosetting steam, in steam ambient, by electrode back dissolving processing (55~65 DEG C of temperature, the back dissolving of back dissolving processing of printing preparation
Time 30s~60s of processing) so that its surfacing, removes the non-uniform phenomenons such as corrugation fluctuating, to reach smooth electrodes
The purpose on surface；Electrode material is conduction ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene-benzene
Ethylene copolymer) commercial material, resistance is optional from 0.5~10000 Ω/cm), there is good chemical stability and electrical property
Energy；High-impact, high heat resistance；Mobility is better than PMMA, molecular formula are as follows:
3) polymer (such as polymetylmethacrylate) substrate polished with carbon dioxide laser cutting surfaces, two
The beam direction of carbon oxide laser device is cut into the polymeric substrates thin slice 4 of rectangular configuration perpendicular to substrate surface, laser
Cutting power is 40~60W, and feeding speed is 1~100mm/s, the thickness of the polymeric substrates thin slice 4 of obtained rectangular configuration
For 1~3mm, length is 2~8cm, and width is 1~6cm；
4) the polymeric substrates thin slice 4 of rectangular configuration is placed on electrode 3, hot pressing is carried out using nano marking press 5
Print, the pressed temperature of moulding process are 80~130 DEG C, and pressure maintaining temperature is 100~150 DEG C, and dwell pressure is 0.5~6kg/cm2,
Dwell time is 1~5min, and electrode 3 is all pressed into inside polymeric substrates thin slice 4 after coining, is constituted internal with electricity
The first polymer substrate 6 of pole 3；Due to coefficient of expansion difference, inorganic substrate 2 (Si or SiO2) can be with inside with electrode 3
First polymer substrate 6 is removed naturally.
5) optical waveguide is prepared, there are two types of structures for waveguide: ridge waveguide and rectangular waveguide.
Ridge waveguide the preparation method is as follows:
Side and impression block 7 (making ide of the first polymer substrate 6 that preceding step is obtained first with electrode 3
The width of the protrusion rectangular cross-section structure having on plate 7, rectangle is 1~50 μm, is highly 1~50 μm, impression block 7 is in water
Square to be projected as straight wave guide structure) accurately to version, straight wave guide groove 8 is obtained after hot padding on first polymer substrate 6,
The straight wave guide groove 8 is parallel with the effective heating area of electrode, and the two sides of effective heating area are located at electrode draw-out area,
Spacing with effective heating area is 1~20 μm, and the pressed temperature of moulding process is 80~150 DEG C, and pressure maintaining temperature is 80~150
DEG C, dwell pressure is 0.5~8kg/cm2, the dwell time is 1~20min, is prepared on first polymer substrate 6 after hot padding
Out simultaneous with the second polymer substrate 9 of straight wave guide groove 8 and electrode 3, the width of straight wave guide groove is 1~50 μm, depth
Mutually agree with for the template graphics on 1~50 μm, with impression block 7, the material of impression block 7 is Si, silica, nickel or glass
Glass state conversion temperature is higher than the polymer material of first polymer substrate 6；Then the spin on polymers on second polymer substrate 9
Core material, sandwich layer 10 is obtained after solidification, and (the spin on polymers core material is by core polymer layer droplets of material second
In polymer substrate 9, then second polymer substrate 9 is placed on spin coater, under the revolving speed of 1000~6000r/min
Rotation of substrate carries out film, and the time of spin coating is 20~60s, and polymer core layer material is made to fill up straight wave guide groove 8 and uniformly apply
On second polymer substrate 9, flat layer is formed, the groove and flat layer of filling collectively form the optical waveguide of ridge structure；Institute
The solidification stated is that the condition of cure for alloing polymer core layer material according to core material from liquid becomes solid-state (selected materials are adopted
It is heated such as SU-8 material using baking oven or hot plate with heat cure, ladder-elevating temperature, 55~65 DEG C of 3~15min of heating, then
It is warming up to 85~95 DEG C of 6~25min of heating), then require the solidification temperature of selected core material to be less than polymerization if it is heat cure
The fusion temperature of object base sheet 4), sandwich layer with a thickness of 1~50 μm；Then the spin on polymers clad material on sandwich layer 10
(the spin on polymers clad material is by polymer droplets of material on sandwich layer 10, then by second polymer substrate 9
It being placed on spin coater, rotation of substrate carries out film under the revolving speed of 1000~6000r/min, and time of spin coating is 20~
60s is evenly coated in polymer material on sandwich layer 10), according to the condition of cure of clad material (if selected materials use
Heat cure, then the solidification temperature of selected clad material is less than the fusion temperature of polymeric substrates thin slice 4 and core material) after solidification
Obtain covering 11, covering with a thickness of 1~50 μm；Finally obtain the ridge straight wave guide device 12 with lateral electrode；
Polymer core layer material is the optical polymerization that refractive index is greater than polymeric substrates (polymetylmethacrylate)
Object, such as SU-8 series material, the serial material of NOA (Norland Optical Adhesive, refractive index should be greater than polymeric substrates)
Material；Polymer material be refractive index be lower than core polymer layer optical polymer material, as polymethyl methacrylate,
NOA series material (Norland Optical Adhesive, refractive index should be lower than core polymer layer)；
Rectangular waveguide specific the preparation method is as follows:
In SiO2Spin on polymers core material on substrate 13, polymer core layer material are that refractive index is greater than polymeric substrates
The optic polymer with light sensitivity of (polymetylmethacrylate), such as SU-8 series material, so-called spin coating be by
Core polymer layer droplets of material is in SiO2On substrate, then by SiO2Substrate is placed on spin coater, in 1000~6000r/min
Revolving speed under rotation of substrate carry out film, time of spin coating is 20~60s, and polymer core layer material is made to be evenly coated in SiO2Substrate
On, 1~50 μm of core layer thickness；According to core material solidification, photoetching and development conditions, solidify simultaneously photoetching development, in SiO2Substrate
Polymer rectangular waveguide 14 is obtained on 13, and (if selected materials use heat cure, the solidification temperature of selected materials is less than polymerization
The fusion temperature of object base sheet 4, such as SU-8 material, condition of cure is to add under prior to 60~70 DEG C conditions (baking oven or hot plate)
3~15min of heat then heats 6~15min under the conditions of 80~90 DEG C, then to version light under the mercury lamp of 350W, 365nm wavelength
It carves (photolithography plate be bar shaped straight wave guide structure, 1~50 μm of strip width, 1~50 μm of bar height), the time for exposure is 5~300s；
3~15min is finally heated under 60~70 DEG C of conditions (baking oven or hot plate), heats 6~15min under the conditions of 85~95 DEG C；It is cooling
It is put into 30~50s of wet etching in propylene glycol methyl ether acetate (PGMEA) developer solution after to room temperature, is put into isopropanol after taking-up
Rinsing removes remaining glue, then cleans reaction solution with deionized water, is then dried with hot-air, thus in SiO2Gathered on substrate 13
Close object rectangular waveguide 14 (rectangular waveguide height is 1~50 μm, and width is 1~50 μm)).
By SiO2Side of side of the substrate 13 with rectangular waveguide 14 with first polymer substrate 6 with electrode 3 is accurate
To version, keep rectangular waveguide 14 parallel with the effective heating area of electrode, spacing is 1~20 μm, and is located at electrode draw-out area
The two sides of effective heating area, the pressed temperature for adjusting hot embossing process is 80~130 DEG C, and pressure maintaining temperature is 100~150 DEG C, is protected
Pressure pressure is 0.5~6kg/cm2, the dwell time is 1~5min, and rectangular waveguide 14 is pressed into first polymer substrate 6 after coining
Inside, then by SiO2Substrate desquamation.
The side spin on polymers clad material (polymerization for having rectangular waveguide 14 and electrode 3 is imprinted in first polymer substrate 6
Object clad material is the optical polymer material that refractive index is lower than core polymer layer, such as polymethyl methacrylate, NOA series material
Expect (Norland Optical Adhesive)；The spin on polymers clad material is by polymer droplets of material
In one polymer substrate 6, then first polymer substrate 6 is placed on spin coater, in the revolving speed of 1000~6000r/min
Lower rotation of substrate carries out film, and the time of spin coating is 20~60s, and polymer material is made to be evenly coated in first polymer substrate
On 6, and according to the curing mode of clad material solidification clad material (if selected materials use heat cure, selected covering material
The solidification temperature of material is less than the fusion temperature of polymeric substrates thin slice 4 and core material), obtain covering 15, the thickness 1 of covering~
50 μm, ultimately form the rectangular waveguide device 16 with lateral electrode.
6) finally using carbon dioxide laser to the ridge straight wave guide device 12 with lateral electrode or with lateral electrode
The both ends of rectangular waveguide device 16 are cut along the direction perpendicular to light propagation in straight wave guide, and obtained cutting end face is used
Ethyl alcohol and deionized water wiping cleaning, then can obtain the ridge with lateral electrode that end face processing is crossed in the polishing of fiber finish on piece
Straight wave guide device 12 or rectangular waveguide device 16；For cutting position away from 1~10mm of boundary, cutting power is 40~100W, feed
Speed is 8~50mm/s.
Compared with prior art, innovation of the invention is:
1. preparing conducting polymer electrode by 3D printing technique in inorganic substrate, 3D printing technique prepares electrode, work
Skill is simple and fast, low in cost, while the shape that printable planar technology is unable to reach.
2. by hot press printing technology, inside the electrode transfer indentation polymer substrate of preparation, polymer substrate and coining
Process costs are cheap, can directly form the side electrode of waveguide.
3. organic polymer material is at low cost, plasticity is strong, simple process, compared to metal electrode, polymer electrode is gathered around
There is bigger resistivity.
4. print groove in polymeric liner hearth electrode intermediate pressure, then spin coating sandwich layer prepares waveguide, coining waveguide precision is high, at
This is low, economical quick.
Fiber waveguide device with side electrode of the invention can be used for 3D printing technique and prepare photoswitch electrode, Ke Yi
The side of waveguide provides thermal field, can also apply horizontal component of electric field in waveguide horizontal direction using bipolar electrode structure.
Detailed description of the invention
Fig. 1: the electrode structural chart of 3D printing preparation；
Fig. 2: hot padding prepares the process flow chart of ridge optical waveguide side electrode；
Fig. 3: hot padding prepares the process flow chart of rectangular optical waveguide side electrode；
Specific embodiment
Embodiment 1
Print speed is 1mm/s, thickness of electrode 0.5mm, sandwich layer NOA88, ridge waveguide, covering NOA63
The specific process steps are as follows:
By using the material database that the threedimensional model design software Meshmixer that autodesk, inc. releases is carried, choose
Square body Model in geometrical model library.By Local Edit function, electrode structure is completed in design, and in-between strip structure width is
1mm, length 17mm；Left and right strip structure length is 8mm, width 1mm；Electrode pin is the square that side length is 5mm, electricity
The left, center, right three-stage strip structure of pole and the height of electrode pin are 0.5mm, and with the output of OBJ formatted file.
Silicon wafer 2 is cleaned using acetone, dehydrated alcohol and deionized water, the silicon wafer 2 cleaned is placed on work
On platform 45 DEG C at a temperature of, the corresponding 3D printing management software Cura developed by Ultimaker company controls 3D printing
Equipment 1, printhead size 0.4mm.Using conductive ABS material (sheet resistance 1 × 104Ω/cm, print speed 1mm/s, electricity
Pole is 100%) to be printed with a thickness of 0.5mm, extrusion rate, prints electrode pattern；Acetone soln is heated on hot plate
60 DEG C, in 60 DEG C of acetone steam environment, by the electrode pattern back dissolving 30s of printing preparation, to obtain the electricity of surfacing
Pole 3.
As shown in Fig. 2, methyl methacrylate (PMMA) thin slice (its of the surface polishing with laser cutting thickness 1mm
Glass transition temperature is 105 DEG C), cutting power 50W, feeding speed 10mm/s are cut into the PMMA base of rectangular configuration
Bottom thin slice 4 (thickness 1mm, long a are 4cm, and wide b is 3cm)；PMMA base sheet 4 is placed on electrode 3, and is put into nanometer
Marking press coining is melted the heating of PMMA base sheet 4 using alignment 5 hot padding PMMA base sheet 4 of formula nano hot stamping equipment
To change, gland is on 2 substrate of silicon wafer for being printed with electrode 3,120 DEG C of the pressed temperature of nanoimprinting process, and 140 DEG C of pressure maintaining temperature,
Dwell pressure 1kg/cm2, dwell time 3min, then cooling is so that polymeric substrates solidification, separation PMMA base sheet and silicon
Piece substrate, electrode 3 are pressed into inside PMMA base sheet 4, form first polymer substrate 6.Then the first of electrode 3 will be had
Side and impression block 7 of the polymer substrate 6 with electrode 3 to version, have the figure of protrusion on marking press 5 on impression block 7
Shape (substrate and protrusion of impression block 7 are silicon materials, to be prepared using conventional semiconductor processing chemical wet etching, 6 μm of line width,
Highly 6 μm) it is straight wave guide groove 8 after coining, the spacing of straight wave guide groove 8 and 3 effective heating area of electrode is 5 μm, nanometer pressure
120 DEG C of the pressed temperature of print process, 110 DEG C of pressure maintaining temperature, dwell pressure 4kg/cm2, dwell time 5min shells naturally after coining
It is poly- to prepare second with straight wave guide groove 8 (6 μm of line width, 6 μm of depth) and electrode 3 after coining for tripping die plate 7 in substrate
Close object substrate 9.
In the second polymer substrate 9 with fluted and electrode, (its glass transition temperature is 105 DEG C, long 4cm, wide
3cm, thick 1mm) on spin coating NOA88 core material, by NOA88 core material drip processed (cleaned and be cleaned by ultrasonic with ethyl alcohol)
Second polymer substrate 9 on, substrate is placed on spin coater, rotation of substrate is applied under the revolving speed of 3000r/min
Film, time of spin coating are 30s, are evenly coated in NOA88 core material on substrate, and NOA88 material fills wide 6 μm, deep 6 μm recessed
Slot, and have 4 μm of flat layer；Using ultraviolet light curing NOA88 material, exposure wavelength 365nm, time for exposure 3min, exposure is strong
Spend 40mW/cm2, photocuring obtains sandwich layer 10；
On sandwich layer 10, under the revolving speed of 4000r/min rotation of substrate continue spin coating NOA63 clad material, spin coating when
Between be 30s, be evenly coated in polymer NOA63 material on sandwich layer 10, then use ultraviolet light curing NOA63 material, expose wave
Long 365nm, time for exposure 5min, exposure intensity 40mW/cm2, the polymer 11 of photocuring 10 μ m-thicks of formation；
Finally the ridge straight wave guide device 12 with lateral electrode is cut using carbon dioxide laser, cut direction
Perpendicular to optical transmission direction in straight wave guide, 5mm is respectively cut at both ends, and (cutting power 60W, feeding speed 10mm/s) is obtained
Length and width is the print of 3cm, uses ethyl alcohol and deionized water wiping cleaning end face after cutting end face, then polishing can obtain endface
The straight wave guide device with lateral electrode managed, electrode conduction is good, and electrode resistance is 1.2 × 104Ω/cm, input, output are adopted
(9 μm of core diameter) is coupled with silica fibre, one end input optical fibre input power 1mW, other end is exported with fiber coupling, output
Other end connects the loss of light power meter measurement chip output optical fibre, and the chip of 3cm long measures insertion loss -8.5dB, is truncated
The transmission loss that method tests waveguide is 1.5dB/cm.
Embodiment 2
Print speed is 20mm/s, thickness of electrode 0.7mm, sandwich layer SU-8-2005 rectangular optical waveguide, covering NOA63
The specific process steps are as follows:
By using the material database that the threedimensional model design software Meshmixer that autodesk, inc. releases is carried, choose
Square body Model in geometrical model library.By Local Edit function, electrode structure is completed in design, and in-between strip structure width is
1mm, length 17mm；Left and right strip structure length is 8mm；The electrode pin of rectangular configuration is the square that side length is 5mm,
The left, center, right three-stage strip structure of electrode and the height of electrode pin are 0.7mm, and with the output of OBJ formatted file.
Silicon wafer 2 is cleaned using acetone, dehydrated alcohol and deionized water etc., the silicon wafer cleaned is placed on work
Make on platform 45 DEG C at a temperature of, developed by Ultimaker company corresponding 3D printing management software Cura control 3D beat
1 print head of printing apparatus, printhead size 0.4mm.Using conductive ABS material (sheet resistance 1 × 103Ω/cm) with print speed
It is printed for 20mm/s, thickness of electrode 0.7mm, prints electrode 3.Acetone soln is heated to 60 DEG C on hot plate,
In 60 DEG C of steam ambient, by the electrode back dissolving 30s of printing preparation.
As shown in figure 3, methyl methacrylate (PMMA) thin slice (its of the surface polishing with laser cutting thickness 1mm
Glass transition temperature is 105 DEG C), cutting power 50W, feeding speed 10mm/s are cut into the PMMA base of rectangular configuration
Bottom thin slice 4 (thick 1mm, long a are 4cm, and wide b is 3cm)；PMMA base sheet 4 is placed on electrode 3, and is put into nanometer pressure
Print machine coining is melted the heating of PMMA base sheet 4 using alignment 5 hot padding PMMA base sheet 4 of formula nano hot stamping equipment
To change, gland is on 2 substrate of silicon wafer for being printed with electrode 3,120 DEG C of the pressed temperature of nanoimprinting process, and 140 DEG C of pressure maintaining temperature,
Dwell pressure 1kg/cm2, dwell time 3min, then cooling separates PMMA substrate and silicon substrate so that polymeric substrates solidify,
Electrode 3 is pressed into inside PMMA base sheet 4, forms polymeric liner hearth electrode 6.
In SiO2Rotation of substrate under the revolving speed of spin on polymers core material SU-8-2000,4000r/min on substrate 13
Film is carried out, the time of spin coating is 30s, and polymer core layer material is made to be evenly coated in SiO2On substrate, 2 μm of core layer thickness, baking oven
Or 60 DEG C of heating 10min of hot plate, then after 90 DEG C of heating 10min, to version photoetching, (photolithography plate is under the mercury lamp of 365nm wavelength
Bar shaped straight wave guide structure, 2 μm of strip width), time for exposure 8s, baking oven or hot plate are in 65 DEG C of heating 10min, 95 DEG C of heating
10min is then cooled to room temperature, and is then placed in wet etching 45s in propylene glycol methyl ether acetate (PGMEA) developer solution, is placed into
Rinsing removes remaining glue in isopropanol, cleans reaction solution with deionized water and forms waveguide, reusable heat air drying, thus in SiO2Lining
Rectangular waveguide 14 is obtained on bottom 13 (rectangular waveguide height is identical as film thickness, is 2 μm, and width is identical as reticle, is 2 μm).
By SiO2Side of the substrate 13 with rectangular waveguide 14 has electrode 3 with the first polymer substrate 6 with electrode
Side accurately to version, keep rectangular waveguide 14 parallel with electrode middle section (effective heating area), spacing be 5 μm, adjust hot padding
The pressed temperature of journey is 110 DEG C, and pressure maintaining temperature is 110 DEG C, dwell pressure 2kg/cm2, dwell time 3min, square after coining
Shape waveguide 14 is pressed into the inside of the first polymer substrate 6 with electrode with electrode 3, SiO2Substrate can be removed voluntarily.
The side spin on polymers packet for having rectangular waveguide 14 and electrode 3 is imprinted in the first polymer substrate 6 with electrode
Layer material NOA63, the spin on polymers clad material are that rotation of substrate continues spin coating under the revolving speed of 4000r/min
The time of NOA63 material, spin coating is 30s, and polymer NOA63 material is made to be evenly coated in the first polymer substrate 6 with electrode
On, using ultraviolet light curing NOA63 material, exposure wavelength 365nm, time for exposure 5min, exposure intensity 40mw/cm2, photocuring
The polymer 15 for forming 10 μ m-thicks ultimately forms the rectangular waveguide device 16 with lateral electrode.
Finally the rectangular waveguide device 16 with lateral electrode is cut using carbon dioxide laser, cut direction
Perpendicular to optical transmission direction in straight wave guide, 5mm is respectively cut at both ends, and (cutting power 60W, feeding speed 10mm/s) is obtained
The print of 3cm long uses ethyl alcohol and deionized water wiping cleaning end face after cutting end face, and then polishing can obtain the band that end face processing is crossed
There is the rectangular waveguide device of lateral electrode, electrode conduction is good, electrode resistance 9*102Ω/cm, input, output are using quartz
Fiber coupling (9 μm of core diameter), one end input optical fibre input power 1mW, other end are exported with fiber coupling, and other the one of output
The loss of end connection light power meter measurement chip output optical fibre, the chip of 3cm long measure insertion loss -15.5dB, and intercept method is surveyed
The transmission loss for trying waveguide is 2dB/cm.
Claims (8)
1. a kind of method for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology, its step are as follows:
1) electrode structure is designed by threedimensional model design software, is exported after the completion of electrode structural designs with OBJ formatted file；Electricity
Extremely sequentially connected left, center, right three-stage strip structure；Interlude strip structure is the effective heating area of electrode, width
For 0.8~1.5mm, the length is 5~30mm；
One end of left section and right section strip structure is vertical with the both ends of interlude strip structure respectively to be connect, and is drawn as electrode
Area；Left section and right section of strip structure are located at the ipsilateral of effective heating area, of same size, the length of width and effective heating area
It is 1000~10000 μm；The other end two electrode draw-out areas is respectively arranged with the electrode pin of rectangular configuration, rectangular configuration
Length and it is wide be respectively 1~10mm, and its width be greater than strip structure width；The left, center, right three-stage strip structure of electrode
It is identical as the height of electrode pin, it is 0.02~0.7mm；
2) above-mentioned obj file is opened using corresponding 3D printing management software, and using 3D printing equipment (1) in inorganic substrate
(2) it is printed on, obtains the electrode (3) of the step 1) structure；Then acetone soln is thermally formed steam on hot plate,
In steam ambient, electrode (3) back dissolving of printing preparation is handled so that its surfacing, to reach smooth electrodes surface
Purpose；Electrode material is conductive acrylonitrile-butadiene-styrene copolymer, and resistance is 0.5~104Ω/cm；
3) polymeric substrates polished with carbon dioxide laser cutting surfaces, the beam direction of carbon dioxide laser perpendicular to
Substrate surface is cut into the polymeric substrates thin slice (4) of rectangular configuration, the polymeric substrates thin slice (4) of obtained rectangular configuration
With a thickness of 1~3mm, length is 2~8cm, and width is 1~6cm；
4) the polymeric substrates thin slice (4) of rectangular configuration is placed on electrode (3), carries out hot padding, electricity after coining
Pole (3) is all pressed into polymeric substrates thin slice (4) inside, obtains the internal first polymer substrate (6) for having electrode (3),
Inorganic substrate (2) is removed naturally；
5) side by first polymer substrate (6) with electrode (3) and impression block (7) are accurately to version, on impression block (7)
The width of the protrusion rectangular cross-section structure having, rectangle is 1~50 μm, is highly 1~50 μm, impression block (7) is in level
Direction is projected as straight wave guide structure；Straight wave guide groove (8) are obtained on first polymer substrate (6) after hot padding, the straight wave
It leads that groove (8) is parallel with electrode (3) effective heating area, and is located at the two sides of effective heating area with electrode draw-out area, with
The spacing of effective heating area is 1~20 μm, is prepared on first polymer substrate (6) after hot padding recessed simultaneous with straight wave guide
The second polymer substrate (9) of slot (8) and electrode (3), the width of straight wave guide groove (8) are 1~50 μm, and depth is 1~50 μm；
Then the spin on polymers core material on second polymer substrate (9), obtains sandwich layer (10) after solidification, sandwich layer with a thickness of 1
~50 μm；The spin on polymers clad material on sandwich layer (10) again, obtains covering (11) after solidification, covering with a thickness of 1~50 μ
M finally obtains the ridge straight wave guide device (12) with lateral electrode；
Alternatively, in SiO2Spin on polymers core material on substrate (13), makes polymer core layer material be evenly coated in SiO2Substrate
(13) on, sandwich layer, 1~50 μm of the thickness of sandwich layer are obtained after solidification；To version photoetching under the mercury lamp of 350W, 365nm wavelength, expose
It is 5~300s between light time；Photolithography plate is bar shaped straight wave guide structure, 1~50 μm of the width of strip structure, the height 1 of strip structure
~50 μm；Finally use the corresponding developing liquid developing of photoresist, hot-air drying, thus in SiO2Substrate obtains rectangle on (13)
Waveguide (14), the height of rectangular waveguide are 1~50 μm, and width is 1~50 μm；By SiO2Substrate (13) has rectangular waveguide (14)
Side and first polymer substrate (6) with electrode (3) side accurately to version, add rectangular waveguide (14) effectively with electrode
Hot-zone is parallel, and spacing is 1~20 μm, and rectangular waveguide (14) is pressed into the inside of first polymer substrate (6) after hot padding, then
By SiO2Substrate (13) removing；Continue the sidespin for having rectangular waveguide (14) and electrode (3) in first polymer substrate (6) coining
Polymer material is applied, is obtained after solidification covering (15), 1~50 μm of the thickness of covering ultimately forms the square with lateral electrode
Shape straight wave guide device (16)；
The refractive index of polymer core layer material is greater than the refractive index of first polymer substrate (6), the refraction of polymer material
Rate is lower than the refractive index of polymer core layer material；
6) using carbon dioxide laser to the ridge straight wave guide device (12) with lateral electrode or with the rectangular of lateral electrode
The both ends of waveguide device (16) are cut along the direction perpendicular to light propagation in straight wave guide, the cutting end face ethyl alcohol that will be obtained
It wipes and cleans with deionized water, then can obtain the straight wave of the ridge with lateral electrode that end face processing is crossed in the polishing of fiber finish on piece
Device (12) or rectangular waveguide device (16) are led, cutting position is away from first polymer substrate (6) 1~10mm of boundary.
2. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: inorganic substrate described in step 2) (2) is Si or SiO2。
3. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: the temperature of the processing of back dissolving described in step 2) is 55~65 DEG C, the time of back dissolving processing is 30s~60s.
4. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: the cutting power of laser described in step 3) is 40~60W, and feeding speed is 1~100mm/s.
5. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: polymeric base material described in step 3) is polymethyl methacrylate；Ridge described in step 5) is straight
The polymer core layer material of waveguide is the SU-8 series material or NOA series that refractive index is greater than polymethyl methacrylate refractive index
Material, polymer material are polymethyl methacrylate of the refractive index lower than core polymer layer Refractive Index of Material or NOA system
Column material；The polymer core layer material of rectangle straight wave guide described in step 5) is that refractive index is reflected greater than polymethyl methacrylate
The SU-8 series material of rate, polymer material are the polymethylacrylic acid that refractive index is lower than core polymer layer Refractive Index of Material
Methyl esters or NOA series material.
6. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: the pressed temperature of hot embossing process described in step 4) is 80~130 DEG C, and pressure maintaining temperature is 100~150
DEG C, dwell pressure is 0.5~6kg/cm2, the dwell time is 1~5min.
7. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: step 5) is described when preparing ridge waveguide, and the pressed temperature of hot embossing process is 80~130 DEG C, pressure maintaining temperature
Degree is 100~150 DEG C, and dwell pressure is 0.5~6kg/cm2, the dwell time is 1~5min.
8. a kind of side for preparing polymer optical wave guide side electrode using 3D printing and hot press printing technology as described in claim 1
Method, it is characterised in that: step 5) is described when preparing rectangular waveguide, and the pressed temperature of hot embossing process is 80~130 DEG C, pressure maintaining temperature
Degree is 100~150 DEG C, and dwell pressure is 0.5~6kg/cm2, the dwell time is 1~5min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610899427.9A CN106405736B (en) | 2016-10-17 | 2016-10-17 | A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610899427.9A CN106405736B (en) | 2016-10-17 | 2016-10-17 | A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106405736A CN106405736A (en) | 2017-02-15 |
| CN106405736B true CN106405736B (en) | 2019-04-05 |
Family
ID=58011775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610899427.9A Active CN106405736B (en) | 2016-10-17 | 2016-10-17 | A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106405736B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107621674A (en) * | 2017-10-17 | 2018-01-23 | 中北大学 | A kind of flexible optical waveguides of SU 8 applied to accelerometer and preparation method thereof |
| CN112848282B (en) * | 2021-01-07 | 2021-11-26 | 芯体素(杭州)科技发展有限公司 | Organic optical waveguide preparation method based on embedded 3D printing |
| CN114706163B (en) * | 2022-03-28 | 2023-08-08 | 深圳技术大学 | Suspended ridge optical waveguide device and 3D printing preparation method thereof |
| CN114895413B (en) * | 2022-03-28 | 2023-12-19 | 深圳技术大学 | Waveguide with pore cladding structure and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6499217B1 (en) * | 1999-03-26 | 2002-12-31 | Mitsubishi Plastics Inc. | Method of manufacturing three-dimensional printed wiring board |
| CN105346089A (en) * | 2015-12-02 | 2016-02-24 | 上海理工大学 | Method for manufacturing variable refractive index optical waveguide based on 3D printing |
| CN105487174A (en) * | 2016-02-02 | 2016-04-13 | 吉林大学 | Polymer flexible variable optical attenuator and preparation method thereof |
| CN105500719A (en) * | 2016-01-28 | 2016-04-20 | 北京交通大学 | Method for manufacturing terahertz waveguide preform by means of 3D printing technology |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3205227B2 (en) * | 1995-08-16 | 2001-09-04 | アルプス電気株式会社 | Optical waveguide element and manufacturing method thereof |
| US9190706B2 (en) * | 2010-09-29 | 2015-11-17 | Aviat U.S., Inc. | Passive waveguide components manufactured by three dimensional printing and injection molding techniques |
-
2016
- 2016-10-17 CN CN201610899427.9A patent/CN106405736B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6499217B1 (en) * | 1999-03-26 | 2002-12-31 | Mitsubishi Plastics Inc. | Method of manufacturing three-dimensional printed wiring board |
| CN105346089A (en) * | 2015-12-02 | 2016-02-24 | 上海理工大学 | Method for manufacturing variable refractive index optical waveguide based on 3D printing |
| CN105500719A (en) * | 2016-01-28 | 2016-04-20 | 北京交通大学 | Method for manufacturing terahertz waveguide preform by means of 3D printing technology |
| CN105487174A (en) * | 2016-02-02 | 2016-04-13 | 吉林大学 | Polymer flexible variable optical attenuator and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106405736A (en) | 2017-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106405736B (en) | A method of polymer optical wave guide side electrode is prepared using 3D printing and hot press printing technology | |
| CN105572795B (en) | A kind of polymer rectangular optical waveguide and micro-fluidic three-dimensionally integrated chip and preparation method thereof | |
| TW552441B (en) | Print-molding process for planar waveguides | |
| CN101339364B (en) | Method for manufacturing microlens array by soft mode impressing | |
| CN105589129B (en) | A kind of polymer light bleaching optical waveguide is exempted from micro-fluidic to version integrated chip and preparation method thereof | |
| CN104459886B (en) | A kind of method that polymer P MMA fiber waveguide device is prepared using electric printing technology | |
| Wang et al. | Fabrication of optical inverted-rib waveguides using UV-imprinting | |
| CN110441861B (en) | MZI type optical waveguide hybrid integrated thermo-optic switch with graphene doped trapezoidal cladding and preparation method thereof | |
| CN109883567A (en) | A kind of temperature sensor and preparation method thereof based on asymmetric MZI optical waveguide | |
| CN109799626A (en) | A kind of low-power consumption ridge waveguide thermo-optical switch and preparation method thereof based on burial graphene heating electrode | |
| CN103631086A (en) | Manufacturing method for micro-nano graphs used for integrated optoelectronic device | |
| CN104297948B (en) | Waveguide thermal optical switch based on long-period metal surface plasma and preparation method of waveguide thermal optical switch | |
| CN106154363A (en) | A kind of sunlight converges Fresnel Lenses that hot spot is strip plane and preparation method thereof | |
| JP2006154447A (en) | Manufacturing method of film-like optical waveguide | |
| CN103777283B (en) | Multi-mode interference-type photoswitch that a kind of input position controls and preparation method thereof | |
| CN105487174B (en) | A kind of variable optical attenuator of polymer flexibility and preparation method thereof | |
| CN104503024B (en) | A kind of preparation method of the polymer optical wave guide with inclined-plane coupling port | |
| US20110140130A1 (en) | Method for Forming a Thin-film Structure of a Light-Emitting Device via Nanoimprint | |
| CN110308572B (en) | M-Z type polymer thermo-optic switch with inverted triangular waveguide structure and preparation method thereof | |
| JP2004086175A (en) | Optical waveguide and its manufacturing method | |
| JP2008038027A (en) | Organic polymer composition and optical waveguide and method for producing optical waveguide | |
| JPH08271746A (en) | Optical waveguide and its production | |
| JP3609685B2 (en) | Manufacturing method of optical waveguide | |
| JP2000019337A (en) | Optical waveguide and its production | |
| Yin et al. | Low power consumption polymer/silica hybrid thermo-optic switch based on racetrack resonator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220110 Address after: 130000 building K11, industrial phase III, Changchun Beihu science and Technology Park, No. 3333, Shengbei street, Beihu science and Technology Development Zone, Changchun City, Jilin Province Patentee after: Changchun Huaxin Kerui Photoelectric Technology Co.,Ltd. Address before: 130012 No. 2699 Qianjin Street, Jilin, Changchun Patentee before: Jilin University |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method for preparing side electrodes of polymer optical waveguides using 3D printing and thermal imprinting technology Effective date of registration: 20230410 Granted publication date: 20190405 Pledgee: Jilin Bank Co.,Ltd. Changchun Science and Technology Sub branch Pledgor: Changchun Huaxin Kerui Photoelectric Technology Co.,Ltd. Registration number: Y2023220000025 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |