CN201590030U - Integral heat radiation type computer mainframe - Google Patents
Integral heat radiation type computer mainframe Download PDFInfo
- Publication number
- CN201590030U CN201590030U CN2010201000896U CN201020100089U CN201590030U CN 201590030 U CN201590030 U CN 201590030U CN 2010201000896 U CN2010201000896 U CN 2010201000896U CN 201020100089 U CN201020100089 U CN 201020100089U CN 201590030 U CN201590030 U CN 201590030U
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- CN
- China
- Prior art keywords
- heat
- heat radiation
- conducting glue
- computer
- cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses an integral heat radiation type computer mainframe, which comprises a computer case with an upper cover and a lower cover, a computer mainboard installed inside the computer case, a variety of interfaces integrated on the mainboard, a CPU, a north bridge and a south bridge, a hard disk module for storing information and a memory for processing information. The CPU, the north bridge and the south bridge are used as a heating module and covered thereon with heat conducting glue, and a heat radiation module is bonded on the heat conducting glue, covered thereon with heat conducting glue and bonded with the wire drawing aluminum upper cover of the computer case. The computer mainframe provided by the utility model has simple structure, smart design, convenient carrying and low power consumption. The computer mainframe uses the entire computer case as a heat radiation medium, which can effectively solve heat radiation problem and reduce the volume of the computer case as much as possible.
Description
Technical field
The utility model relates to a kind of host computer, is specially a kind of integral heat sink formula mini computer main frame.
Background technology
The CPU of computing machine and other parts run up and can produce heat in the process, and heat radiation is exactly a process that heat is transmitted in fact, and purpose is that the heat that CPU produces is taken on other medium, is distributed in the air again, and cpu temperature is controlled within the range of stability.According to the environment of our life, the heat of CPU finally is to diffuse in the middle of the air.This process is exactly a computer heat radiation.
All heating radiators are that main mode is dispelled the heat with heat conduction, heat radiation all at present.According to the difference of heat conduction, heat radiation means, the heating radiator product can be divided into active and passive dual mode.Implication initiatively is, has with the irrelevant energy of heater to participate in carrying out forced heat radiation, and such as the water pump in fan, the liquid cooling, the compressor in the freezing by change of state, the popular feature of these heat dissipation is efficient height, but also needs the auxiliary of other energy simultaneously.In contrast, the passive meaning is exactly only to rely on dispersing voluntarily of heater or heat radiator to lower the temperature.
Because the mode of active heat removal has been introduced forced radiator, as fan, water pump etc., thus make the cabinet volume become big.But passive radiating mode, because the limitation of the heat-sinking capability of heat radiator causes radiating effect relatively poor.
How can volume less, can guarantee that again radiating effect is good, be that the present utility model people wants the problem that solves.
The utility model content
The purpose of this utility model is for a kind of integral heat sink formula host computer is provided, to solve the relevant issues of above-mentioned prior art.
The purpose of this utility model can be achieved through the following technical solutions.
A kind of integral heat sink formula host computer comprises the cabinet that has loam cake and lower cover, is installed on computer main board in the cabinet, integrated various interface, CPU and north and south bridge, the hard disk module of canned data, the internal memory of process information on the mainboard; As on the CPU of heating module and the north and south bridge coated with heat-conducting glue, be fitted with radiating module on the heat-conducting glue, coated with heat-conducting glue, and fit on the radiating module with the wire drawing aluminum loam cake of cabinet.
Described cabinet lower cover is a double-layer structure, is followed successively by outward by the lining: the plow-steel flaggy of bending and the baking vanish layer that steel plate layer outside surface is set.
Described cabinet is of a size of 157mm * 126mm * 157mm.
By the host computer that the utility model setting forms, simple in structure, deft design is easy to carry, and is low in energy consumption; Whole cabinet as heat eliminating medium, had both effectively been solved the problem of heat radiation, by the volume that can reduce cabinet as much as possible.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Among the figure: 1, loam cake 2, lower cover 3, interface.
Embodiment
Further set forth design feature of the present utility model below in conjunction with accompanying drawing and specific embodiment.
A kind of integral heat sink formula host computer as shown in Figure 1 comprises the cabinet that has loam cake 1 and lower cover 2, is installed on computer main board in the cabinet, integrated various interface 3, CPU and north and south bridge, the hard disk module of canned data, the internal memory of process information on the mainboard; As on the CPU of heating module and the north and south bridge coated with heat-conducting glue, be fitted with radiating module on the heat-conducting glue, coated with heat-conducting glue, and fit on the radiating module with the wire drawing aluminum loam cake 1 of cabinet.
Described cabinet lower cover 2 is a double-layer structure, is followed successively by outward by the lining: the plow-steel flaggy of bending and the baking vanish layer that steel plate layer outside surface is set.
Described cabinet is of a size of 157mm * 126mm * 157mm.
The utility model has only the fuselage of palm size, and loam cake adopts the wire drawing aluminium section bar, and lower cover adopts the high-strength steel sheet bending to add surperficial baking vanish technology, has only the ultra-thin fuselage of 32mm, looks succinct, sedate.From any angle, embody the favorable mechanical aesthetics invariably.
The about 1.5kg of complete machine is heavy.Have only the volume of 157mm*126mm*157mm integrated: 3945 mainboards, hard disk, internal memory, wireless network card, various interface, switch, pilot lamp etc., compact conformation and light and handy is convenient for carrying.The tyre fixed support, conveniently various environment for use is fixing.
Complete machine has low-power consumption, the characteristics of fan-free, and have the characteristics such as high temperature resistant, shockproof, dustproof, be highly suitable in the industrial environment and use.
Claims (3)
1. integral heat sink formula host computer comprises the cabinet that has loam cake (1) and lower cover (2), is installed on computer main board in the cabinet, integrated various interface (3), CPU and north and south bridge, the hard disk module of canned data, the internal memory of process information on the mainboard; It is characterized in that: as on the CPU of heating module and the north and south bridge coated with heat-conducting glue, be fitted with radiating module on the heat-conducting glue, coated with heat-conducting glue, and fit on the radiating module with the wire drawing aluminum loam cake (1) of cabinet.
2. a kind of integral heat sink formula host computer according to claim 1, it is characterized in that: described cabinet lower cover (2) is a double-layer structure, is followed successively by outward by the lining: the plow-steel flaggy of bending and the baking vanish layer that steel plate layer outside surface is set.
3. a kind of integral heat sink formula host computer according to claim 1, it is characterized in that: described cabinet is of a size of 157mm * 126mm * 157mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201000896U CN201590030U (en) | 2010-01-22 | 2010-01-22 | Integral heat radiation type computer mainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201000896U CN201590030U (en) | 2010-01-22 | 2010-01-22 | Integral heat radiation type computer mainframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201590030U true CN201590030U (en) | 2010-09-22 |
Family
ID=42749819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201000896U Expired - Fee Related CN201590030U (en) | 2010-01-22 | 2010-01-22 | Integral heat radiation type computer mainframe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201590030U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609041A (en) * | 2012-01-17 | 2012-07-25 | 姜华山 | All-in-one personal computer |
| CN105785832A (en) * | 2014-12-16 | 2016-07-20 | 天津天源科能自动化控制技术有限公司 | No-fan real-time controller without system time-delay |
-
2010
- 2010-01-22 CN CN2010201000896U patent/CN201590030U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609041A (en) * | 2012-01-17 | 2012-07-25 | 姜华山 | All-in-one personal computer |
| CN105785832A (en) * | 2014-12-16 | 2016-07-20 | 天津天源科能自动化控制技术有限公司 | No-fan real-time controller without system time-delay |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100922 Termination date: 20130122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |