CN201569346U - Heating panel - Google Patents
Heating panel Download PDFInfo
- Publication number
- CN201569346U CN201569346U CN2009202745282U CN200920274528U CN201569346U CN 201569346 U CN201569346 U CN 201569346U CN 2009202745282 U CN2009202745282 U CN 2009202745282U CN 200920274528 U CN200920274528 U CN 200920274528U CN 201569346 U CN201569346 U CN 201569346U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- cylinder
- reticulate body
- capillary structure
- sink according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title abstract 3
- 238000010276 construction Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 230000004308 accommodation Effects 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202745282U CN201569346U (en) | 2009-12-08 | 2009-12-08 | Heating panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202745282U CN201569346U (en) | 2009-12-08 | 2009-12-08 | Heating panel |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201569346U true CN201569346U (en) | 2010-09-01 |
Family
ID=42661637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009202745282U Expired - Fee Related CN201569346U (en) | 2009-12-08 | 2009-12-08 | Heating panel |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201569346U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103123236A (en) * | 2012-10-21 | 2013-05-29 | 大连三维传热技术有限公司 | Hot plate of metal fiber felt liquid absorption cores |
CN106918257A (en) * | 2015-12-28 | 2017-07-04 | 奇鋐科技股份有限公司 | Equalizing plate structure and its manufacture method |
CN112996346A (en) * | 2020-01-14 | 2021-06-18 | 荣耀终端有限公司 | High-strength vapor chamber, preparation method thereof and electronic equipment |
-
2009
- 2009-12-08 CN CN2009202745282U patent/CN201569346U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103123236A (en) * | 2012-10-21 | 2013-05-29 | 大连三维传热技术有限公司 | Hot plate of metal fiber felt liquid absorption cores |
CN103123236B (en) * | 2012-10-21 | 2014-09-24 | 大连三维传热技术有限公司 | Hot plate of metal fiber felt liquid absorption cores |
CN106918257A (en) * | 2015-12-28 | 2017-07-04 | 奇鋐科技股份有限公司 | Equalizing plate structure and its manufacture method |
CN106918257B (en) * | 2015-12-28 | 2019-05-03 | 奇鋐科技股份有限公司 | Equalizing plate structure and its manufacturing method |
CN112996346A (en) * | 2020-01-14 | 2021-06-18 | 荣耀终端有限公司 | High-strength vapor chamber, preparation method thereof and electronic equipment |
WO2021143674A1 (en) * | 2020-01-14 | 2021-07-22 | 荣耀终端有限公司 | Mobile terminal, vapor chamber and preparation method therefor, and electronic device |
CN112996346B (en) * | 2020-01-14 | 2022-08-02 | 荣耀终端有限公司 | Vapor chamber and mobile terminal |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI601933B (en) | Heat-conducting structure | |
CN201569346U (en) | Heating panel | |
TWM335720U (en) | Homeothermy plate and support structure thereof | |
TWI585357B (en) | Heat pipe | |
CN102865763A (en) | Capillary forming method and capillary forming structure for uniform temperature plate | |
CN201229543Y (en) | Temperature equalizing board and support construction thereof | |
CN202617585U (en) | Water-cooled heat dissipation device | |
CN202869351U (en) | Inner support body of uniform temperature plate and uniform temperature plate using the same | |
CN201119236Y (en) | Capillary structure for heat conductive device | |
CN201611233U (en) | Heating panel | |
CN203369041U (en) | Heat-dissipating module | |
CN201569345U (en) | Heating panel | |
CN106288891A (en) | Three-dimensional conductive structure and preparation method thereof | |
CN204991690U (en) | Radiator | |
CN201811624U (en) | Thin type heat pipe with composite capillary structure | |
CN202770289U (en) | Plate heat exchanger and supporting structure thereof | |
CN202486687U (en) | Water-cooling radiator for CPU (Central Processing Unit) | |
CN203537724U (en) | Heat dissipating device | |
CN201429350Y (en) | temperature equalizing plate with separation plate | |
TWI307765B (en) | ||
CN203857856U (en) | Crosswise-knitted capillary structure and heat pipe structure thereof | |
CN203224159U (en) | Heat pipe structure | |
CN106403674A (en) | Plate-shaped temperature equalization device | |
CN203534305U (en) | Heat pipe | |
CN203165938U (en) | LED (Light-Emitting Diode) superconductive plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: COOLER MASTER INTERNATIONAL CO., LTD. Free format text: FORMER OWNER: XUNKAI INTERNATIONAL CO., LTD. Effective date: 20131121 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131121 Address after: Chinese Taiwan New Taipei City Patentee after: Cooler Master International Co., Ltd. Patentee after: Cooler Master Co., Ltd. Address before: Taiwan County, Taipei, China Patentee before: Xunkai International Co., Ltd. Patentee before: Cooler Master Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100901 Termination date: 20141208 |
|
EXPY | Termination of patent right or utility model |